SCLS224B − DECEMBER 1982 − REVISED SEPTEMBER 2003
15 LSTTL Loads
D Low Power Consumption, 80-µA Max ICC
D ’HC257 . . . Typical tpd = 9 ns
SN54HC257, SN54HC258 . . . J PACKAGE
SN74HC257, SN74HC258 . . . D, N, NS, OR PW PACKAGE
(TOP VIEW)
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
’HC258 . . . Typical tpd = 12 ns
±6-mA Output Drive at 5 V
Low Input Current of 1 µA Max
Provides Bus Interface from Multiple
Sources in High-Performance Systems
SN54HC257, SN54HC258 . . . FK PACKAGE
(TOP VIEW)
VCC
G
4A
4B
4Y
3A
3B
3Y
1B
1Y
NC
2A
2B
4
3
2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4A
4B
NC
4Y
3A
2Y
GND
NC
3Y
3B
A/B
1A
1B
1Y
2A
2B
2Y
GND
D
D
D
D
1A
A/B
NC
VCC
G
D Wide Operating Voltage Range of 2 V to 6 V
D High-Current Inverting Outputs Drive Up To
NC − No internal connection
description/ordering information
ORDERING INFORMATION
PACKAGE†
TA
PDIP − N
Tube of 25
SOIC − D
−40°C
−40
C to 85
85°C
C
SOP − NS
TSSOP − PW
CDIP − J
SN74HC257N
SN74HC258N
SN74HC258N
SN74HC257D
Reel of 2500
SN74HC257DR
Reel of 250
SN74HC257DT
Tube of 40
SN74HC258D
Reel of 2500
SN74HC258DR
Reel of 2000
HC258
HC257
SN74HC258NSR
HC258
SN74HC257PW
Reel of 2000
SN74HC257PWR
Reel of 250
SN74HC257PWT
Tube of 90
SN74HC258PW
Reel of 2000
SN74HC258PWR
Reel of 250
SN74HC258PWT
Tube of 55
HC257
SN74HC257NSR
Tube of 90
−55°C to 125°C
TOP-SIDE
MARKING
SN74HC257N
Tube of 40
Tube of 25
LCCC − FK
ORDERABLE
PART NUMBER
HC257
HC258
SNJ54HC257J
SNJ54HC257J
SNJ54HC258J
SNJ54HC258J
SNJ54HC257FK
SNJ54HC257FK
SNJ54HC258FK
SNJ54HC258FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
!"#$%! & '("")% $& ! *(+,'$%! -$%).
"!-('%& '!!"# %! &*)''$%!& *)" %/) %)"#& ! )0$& &%"(#)%&
&%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-)
%)&%3 ! $,, *$"$#)%)"&.
*"!-('%& '!#*,$% %! 4
$,, *$"$#)%)"& $") %)&%)(,)&& !%/)"1&) !%)-. $,, !%/)" *"!-('%& *"!-('%!
*"!')&&3 -!)& !% )')&&$",2 ',(-) %)&%3 ! $,, *$"$#)%)"&.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS224B − DECEMBER 1982 − REVISED SEPTEMBER 2003
description/ordering information (continued)
These devices are designed to multiplex signals from 4-bit data sources to 4-output data lines in bus-organized
systems. The 3-state outputs do not load the data lines when the output-enable (G) input is at a high logic level.
To ensure the high-impedance state during power up or power down, G should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
INPUTS
OUTPUT Y
G
A/B
A
B
’HC257
’HC258
H
X
X
X
Z
Z
L
L
L
X
L
H
L
L
H
X
H
L
L
H
X
L
L
H
L
H
X
H
H
L
’HC257 logic diagram (positive logic)
G
A/B
1A
1B
2A
2B
3A
3B
4A
4B
15
1
2
4
3
5
7
2Y
6
11
9
3Y
10
14
12
13
Pin numbers shown are for the D, J, N, NS, and PW packages.
2
1Y
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
4Y
SCLS224B − DECEMBER 1982 − REVISED SEPTEMBER 2003
’HC258 logic diagram (positive logic)
G
A/B
1A
1B
2A
2B
3A
3B
4A
4B
15
1
2
4
1Y
3
5
7
2Y
6
11
9
3Y
10
14
12
4Y
13
Pin numbers shown are for the D, J, N, NS, and PW packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 1): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCLS224B − DECEMBER 1982 − REVISED SEPTEMBER 2003
recommended operating conditions (see Note 2)
SN54HC257,
SN54HC258
VCC
VIH
Supply voltage
VCC = 2 V
VCC = 4.5 V
High-level input voltage
VCC = 6 V
VCC = 2 V
VIL
VI
VO
∆t/∆v
MIN
NOM
MAX
2
5
6
Input voltage
Output voltage
MAX
2
5
6
3.15
3.15
4.2
4.2
0
V
V
0.3
0.5
0.9
1.35
1.2
1.8
VCC
VCC
VCC = 2 V
VCC = 4.5 V
Input transition rise/fall time
NOM
1.5
0
UNIT
MIN
1.5
VCC = 4.5 V
VCC = 6 V
Low-level input voltage
SN74HC257,
SN74HC258
0
VCC
VCC
0
1000
1000
500
500
V
V
V
ns
VCC = 6 V
400
400
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = −20 µA
VOH
VI = VIH or VIL
IOH = −6 mA
IOH = −7.8 mA
VOL
4
VI = VCC or 0
VO = VCC or 0
ICC
Ci
VI = VCC or 0,
MAX
MIN
TYP
2V
1.9
1.998
1.9
1.9
4.5 V
4.4
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
MIN
MAX
SN74HC257,
SN74HC258
5.2
MIN
UNIT
MAX
V
5.34
2V
0.002
0.1
0.1
0.1
IOL = 20 µA
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
IOL = 6 mA
IOL = 7.8 mA
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
6V
±0.1
±100
±1000
±1000
nA
6V
±0.01
±0.5
±10
±5
µA
8
160
80
µA
3
10
10
10
pF
VI = VIH or VIL
II
IOZ
SN54HC257,
SN54HC258
TA = 25°C
VCC
IO = 0
6V
2 V to 6 V
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
V
SCLS224B − DECEMBER 1982 − REVISED SEPTEMBER 2003
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
SN74HC257
VCC
2V
50
100
150
125
A or B
Any Y
4.5 V
10
20
30
25
6V
9
17
25
21
2V
50
100
150
125
4.5 V
10
20
30
25
6V
9
17
25
21
A/B
tdis
SN54HC257
TO
(OUTPUT)
tpd
ten
TA = 25°C
TYP
MAX
FROM
(INPUT)
G
G
tt
Any Y
Any Y
Any Y
Any Y
MIN
MIN
MAX
MIN
MAX
2V
75
150
225
190
4.5 V
15
30
45
38
6V
13
26
38
32
2V
75
150
225
190
4.5 V
15
30
45
38
6V
13
26
38
32
2V
28
60
90
75
4.5 V
8
12
18
15
6V
6
10
15
13
UNIT
ns
ns
ns
ns
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
A or B
TO
(OUTPUT)
Any Y
tpd
A/B
ten
tt
G
Any Y
Any Y
Any Y
VCC
TA = 25°C
MIN
TYP
MAX
SN54HC257
MIN
MAX
SN74HC257
MIN
MAX
2V
75
150
245
190
4.5 V
15
30
45
38
6V
13
26
38
32
2V
75
150
245
190
4.5 V
15
30
45
38
6V
13
26
38
32
2V
100
200
300
250
4.5 V
24
40
60
50
6V
18
34
51
43
2V
45
210
315
265
4.5 V
17
42
63
53
6V
13
36
53
45
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
5
SCLS224B − DECEMBER 1982 − REVISED SEPTEMBER 2003
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
SN74HC258
VCC
2V
60
100
150
125
A or B
Any Y
4.5 V
13
20
30
25
6V
12
17
25
21
2V
60
115
175
145
4.5 V
13
23
35
29
6V
12
20
30
25
A/B
G
tdis
SN54HC258
TO
(OUTPUT)
tpd
ten
TA = 25°C
TYP
MAX
FROM
(INPUT)
G
tt
Any Y
Any Y
Any Y
Any Y
MIN
MIN
MAX
MIN
MAX
2V
70
150
225
190
4.5 V
15
30
45
38
6V
13
26
38
32
2V
75
150
225
190
4.5 V
15
30
45
38
6V
13
26
38
32
2V
28
60
90
75
4.5 V
8
12
18
15
6V
6
10
15
13
UNIT
ns
ns
ns
ns
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
A or B
TO
(OUTPUT)
Any Y
tpd
A/B
ten
tt
G
Any Y
Any Y
Any Y
VCC
TA = 25°C
MIN
TYP
MAX
SN54HC258
MIN
MAX
SN74HC258
MIN
MAX
2V
95
150
245
190
4.5 V
23
30
45
38
6V
21
26
38
32
2V
95
165
240
210
4.5 V
23
33
48
42
6V
21
28
41
36
2V
100
200
300
250
4.5 V
24
40
60
50
6V
18
34
51
43
2V
45
210
315
265
4.5 V
17
42
63
53
6V
13
36
53
45
UNIT
ns
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
6
TEST CONDITIONS
Power dissipation capacitance per multiplexer
POST OFFICE BOX 655303
No load
• DALLAS, TEXAS 75265
TYP
40
UNIT
pF
SCLS224B − DECEMBER 1982 − REVISED SEPTEMBER 2003
PARAMETER MEASUREMENT INFORMATION
VCC
PARAMETER
Test
Point
From Output
Under Test
S1
tPZH
ten
RL
CL
(see Note A)
1 kΩ
tPZL
tPHZ
tdis
S2
RL
1 kΩ
CL
S1
S2
50 pF
or
150 pF
Open
Closed
Closed
Open
Open
Closed
Closed
Open
Open
Open
50 pF
tPLZ
tpd or tt
−−
LOAD CIRCUIT
50 pF
or
150 pF
VCC
Input
50%
50%
0V
tPLH
In-Phase
Output
50%
10%
tPHL
90%
VOH
50%
10% V
OL
tf
90%
tr
tPHL
Out-of-Phase
Output
90%
tPLH
50%
10%
50%
10%
90%
VOH
VOL
tf
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
Output
Control
(Low-Level
Enabling)
VCC
50%
50%
0V
tPZL
Output
Waveform 1
(See Note B)
tPLZ
≈VCC
≈VCC
50%
10%
VOL
tPZH
Input
50%
10%
90%
VCC
90%
50%
10% 0 V
tr
Output
Waveform 2
(See Note B)
90%
VOH
≈0 V
tPHZ
tf
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
50%
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
85124012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
85124012A
SNJ54HC
257FK
8512401EA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
8512401EA
SNJ54HC257J
SN54HC257J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54HC257J
SN74HC257D
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257DE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257DG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257DR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257DRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257DRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257DT
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257DTE4
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257DTG4
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC257N
SN74HC257NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC257N
SN74HC257NSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257NSRE4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257NSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
25-Sep-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
SN74HC257PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257PWLE
OBSOLETE
TSSOP
PW
16
TBD
Call TI
Call TI
-40 to 85
SN74HC257PWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257PWRE4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257PWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC257PWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC257
SN74HC258D
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258DE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258DG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258DR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258DRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258DRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258DT
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258DTE4
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
25-Sep-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
SN74HC258DTG4
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC258N
SN74HC258NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC258N
SN74HC258NSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258NSRE4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258NSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258PWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258PWRE4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258PWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SN74HC258PWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC258
SNJ54HC257FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
85124012A
SNJ54HC
257FK
SNJ54HC257J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
8512401EA
SNJ54HC257J
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC257, SN74HC257 :
• Catalog: SN74HC257
• Military: SN54HC257
NOTE: Qualified Version Definitions:
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74HC257DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74HC257PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74HC257PWT
TSSOP
PW
16
250
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74HC258DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74HC258NSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
SN74HC258PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74HC258PWT
TSSOP
PW
16
250
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74HC257DR
SOIC
D
16
2500
333.2
345.9
28.6
SN74HC257PWR
TSSOP
PW
16
2000
367.0
367.0
35.0
SN74HC257PWT
TSSOP
PW
16
250
367.0
367.0
35.0
SN74HC258DR
SOIC
D
16
2500
333.2
345.9
28.6
SN74HC258NSR
SO
NS
16
2000
367.0
367.0
38.0
SN74HC258PWR
TSSOP
PW
16
2000
367.0
367.0
35.0
SN74HC258PWT
TSSOP
PW
16
250
367.0
367.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated