SN74SSTV32867
26-BIT REGISTERED BUFFER
WITH SSTL_2 INPUTS AND LVCMOS OUTPUTS
SCES362B – OCTOBER 2001 – REVISED MAY 2002
D
D
D
D
D
Member of the Texas Instruments
Widebus+ Family
Output Edge-Control Circuitry Minimizes
Switching Noise in an Unterminated DIMM
Load
Supports SSTL_2 Data Inputs
Differential Clock (CLK and CLK) Inputs
Supports LVCMOS Switching Levels on the
RESET Input
D
D
D
RESET Input Disables Differential Input
Receivers, Resets All Registers, and
Forces All Outputs Low
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
description
This 26-bit registered buffer is designed for 2.3-V to 2.7-V VCC operation.
All inputs are SSTL_2, except the LVCMOS reset (RESET) input. All outputs are edge-controlled LVCMOS
circuits optimized for unterminated DIMM loads.
The SN74SSTV32867 operates from a differential clock (CLK and CLK). Data are registered at the crossing
of CLK going high and CLK going low.
The device supports low-power standby operation. When RESET is low, the differential input receivers are
disabled, and undriven (floating) data, clock, and reference voltage (VREF) inputs are allowed. In addition, when
RESET is low, all registers are reset and all outputs are forced low. The LVCMOS RESET always must be held
at a valid logic high or low level.
To ensure defined outputs from the register before a stable clock has been supplied, RESET must be held in
the low state during power up.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus+ is a trademark of Texas Instruments.
Copyright 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74SSTV32867
26-BIT REGISTERED BUFFER
WITH SSTL_2 INPUTS AND LVCMOS OUTPUTS
SCES362B – OCTOBER 2001 – REVISED MAY 2002
GKE PACKAGE
(TOP VIEW)
1
2
3
4
5
terminal assignments
6
1
2
3
4
5
6
A
A
D1
GND
Q2
B
D3
Q3
Q4
C
C
D5
D4
VREF
NC
VDDQ
GND
Q1
B
VCC
D2
GND
Q5
Q6
D
D
D7
D6
GND
Q7
Q8
VCC
GND
VDDQ
GND
Q9
VDDQ
VDDQ
Q10
VDDQ
GND
Q12
Q11
GND
GND
Q13
Q14
E
F
G
H
J
E
D9
D8
F
D11
D10
G
D13
D12
H
D15
D14
VCC
GND
J
CLK
NC
GND
GND
GND
VCC
GND
VDDQ
VDDQ
Q15
Q16
Q17
GND
GND
Q18
VDDQ
GND
Q20
VDDQ
Q19
Q22
Q21
K
CLK
RESET
K
L
D16
D17
L
M
D18
D19
M
N
D20
D21
VCC
GND
N
P
D22
D23
NC
P
R
D24
D25
NC
GND
Q24
Q23
R
T
D26
VCC
GND
VDDQ
Q26
Q25
T
ORDERING INFORMATION
ORDERABLE
PART NUMBER
PACKAGE†
TA
TOP-SIDE
MARKING
0°C to 70°C
LFBGA – GKE
Tape and reel
SN74SSTV32867GKER
SV867
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
2
RESET
CLK
CLK
D
OUTPUT
Q
H
↑
↓
H
H
H
↑
↓
L
L
H
L or H
L or H
X
Q0
L
X or floating
X or floating
X or floating
L
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74SSTV32867
26-BIT REGISTERED BUFFER
WITH SSTL_2 INPUTS AND LVCMOS OUTPUTS
SCES362B – OCTOBER 2001 – REVISED MAY 2002
logic diagram (positive logic)
RESET
CLK
CLK
VREF
D1
K2
J1
K1
B3
A1
1D
C1
A5
Q1
R
To 25 Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC or VDDQ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 3.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VDDQ + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Output clamp current, IOK (VO < 0 or VO > VDDQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VDDQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through each VCC, VDDQ, or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This value is limited to 3.6 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
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• DALLAS, TEXAS 75265
3
SN74SSTV32867
26-BIT REGISTERED BUFFER
WITH SSTL_2 INPUTS AND LVCMOS OUTPUTS
SCES362B – OCTOBER 2001 – REVISED MAY 2002
recommended operating conditions (see Note 4)
MIN
NOM
VDDQ
2.3
MAX
UNIT
VCC
VDDQ
Supply voltage
VREF
VTT
Reference voltage (VREF = VDDQ/2)
VI
VIH
Input voltage
AC high-level input voltage
Data input
VIL
VIH
AC low-level input voltage
Data input
DC high-level input voltage
Data input
VIL
VIH
DC low-level input voltage
Data input
High-level input voltage
RESET
VIL
VICR
Low-level input voltage
RESET
Common-mode input voltage range
CLK, CLK
0.97
VI(PP)
IOH
Peak-to-peak input voltage
CLK, CLK
360
High-level output current
–8
mA
IOL
TA
Low-level output current
8
mA
70
_C
Output supply voltage
1.15
Termination voltage
VREF–40mV
0
1.25
VREF
2.7
V
2.7
V
1.35
V
VREF+40mV
VCC
V
VREF+310mV
V
VREF–310mV
VREF+150mV
Operating free-air temperature
V
V
VREF–150mV
1.7
V
V
0.7
0
V
1.53
V
V
mV
NOTE 4: The RESET input of the device must be held at VCC or GND to ensure proper device operation. The differential inputs must not be floating
unless RESET is low. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74SSTV32867
26-BIT REGISTERED BUFFER
WITH SSTL_2 INPUTS AND LVCMOS OUTPUTS
SCES362B – OCTOBER 2001 – REVISED MAY 2002
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
II = –18 mA
IOH = –100 µA
VOH
IOH = –8 mA
IOL = 100 µA
VOL
II
ICC
ICCD
All inputs
Static standby
RESET = GND
Static operating
RESET = VCC,
VI = VIH(AC) or VIL(AC)
Dynamic
operating –
clock only
RESET = VCC,
VI = VIH(AC) or VIL(AC),
CLK and CLK switching
50% duty cycle
Dynamic
operating –
per each data
input
RESET = VCC,
VI = VIH(AC) or VIL(AC),
CLK and CLK switching
50% duty cycle,
One data input switching at
one-half clock frequency,
50% duty cycle
CLK, CLK
VCC
2.3 V
MIN
2.3 V to 2.7 V
VDDQ–0.2
1.7
2.3 V
IOL = 8 mA
VI = VCC or GND
Data inputs
Ci‡
TEST CONDITIONS
TYP†
VI = VREF ± 310 mV
VICR = 1.25 V,
IO = 0
VI(PP) = 360mV
UNIT
–1.2
V
V
2.3 V to 2.7 V
0.2
2.3 V
0.4
2.7 V
IO = 0
MAX
2.7 V
±5
µA
40
µA
95
mA
44
µA/
MHz
5
µA/
clock
MHz/
D input
2.5 V
2.5
3.5
4.5
4
4.5
5
3.9
5
5.5
2.5 V
RESET
VI = VCC or GND
† All typical values are at VCC = 2.5 V, TA = 25°C.
‡ Measured with 50-MHz input frequency
V
pF
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
VCC = 2.5 V
± 0.2 V
MIN
fclock Clock frequency
tw
Pulse duration
200
CLK, CLK high or low
2.5
tact
Differential inputs active time (see Note 5)
tinact Differential inputs inactive time (see Note 6)
tsu
Setup time
th
Hold time
Fast slew rate (see Notes 7 and 9)
Slow slew rate (see Notes 8 and 9)
Fast slew rate (see Notes 7 and 9)
NOTES: 5.
6.
7.
8.
9.
Slow slew rate (see Notes 8 and 9)
MHz
ns
22
ns
22
ns
0.75
D t before
Data
b f
CLK↑,
CLK↑ CLK↓
UNIT
MAX
0.9
ns
0.75
Data after CLK↑,
CLK↑ CLK↓
0.9
ns
Data inputs must be low a minimum time of tact min, after RESET is taken high.
Data and clock inputs must be held at valid levels (not floating) a minimum time of tinact min, after RESET is taken low.
Data signal input slew rate ≥1 V/ns
Data signal input slew rate ≥0.5 V/ns and