SN75LP1185
LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS335A – JANUARY 1999 – REVISED JANUARY 2001
D
D
D
D
D
D
D
D
D
D
D
DB, DW, OR N PACKAGE
(TOP VIEW)
Single-Chip TIA/EIA-232-F Interface for
IBM PC/AT Serial Port
Designed to Transmit and Receive 4-µs
Pulses (Equivalent to 256 kbit/s)
Less Than 21-mW Power Consumption
Wide Supply-Voltage Range . . . 4.75 V to
15 V
Driver Output Slew Rates Are Internally
Controlled to 30 V/µs Max
Receiver Input Hysteresis . . . 1000 mV
Typical
TIA/EIA-232-F Bus-Pin ESD Protection
Exceeds:
– 15-kV, Human-Body Model
Three Drivers and Five Receivers Meet or
Exceed the Requirements of TIA/EIA-232-F
and ITU V.28
Complements the SN75LP196
Designed to Replace the Industry-Standard
SN75185 and SN75C185 With the Same
Flow-Through Pinout
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Dual-In-Line (N) Packages
VDD
RA1
RA2
RA3
DY1
DY2
RA4
DY3
RA5
VSS
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
RY1
RY2
RY3
DA1
DA2
RY4
DA3
RY5
GND
description
The SN75LP1185 is a low-power bipolar device containing three drivers and five receivers, with 15 kV of ESD
protection on the bus pins with respect to each other. Bus pins are defined as those pins that tie directly to the
serial-port connector, including GND. The pinout matches the flow-through design of the industry-standard
SN75185 and SN75C185. The flow-through pinout of the SN75LP1185 allows easy interconnection of the
UART and serial-port connector of the IBM PC/AT and compatibles. The SN75LP1185 provides a rugged,
low-cost solution for this function with the combination of the bipolar processing and 15 kV of ESD protection.
The SN75LP1185 has internal slew-rate control to provide a maximum rate of change in the output signal of
30 V/µs. The driver output swing is nominally clamped at ±6 V to enable the higher data rates associated with
this device and to reduce EMI emissions. Even though the driver outputs are clamped, they can handle voltages
up to ±15 V without damage. All the logic inputs can accept 3.3-V or 5-V input signals.
The SN75LP1185 complies with the requirements of TIA/EIA-232-F and ITU V.28. These standards are for data
interchange between a host computer and peripheral at signaling rates up to 20 kbit/s. The switching speeds
of the SN75LP1185 support rates up to 256 kbit/s.
The SN75LP1185 is characterized for operation from 0°C to 70°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
IBM and PC/AT are trademarks of International Business Machines Corporation.
Copyright 2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN75LP1185
LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS335A – JANUARY 1999 – REVISED JANUARY 2001
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
PLASTIC SHRINK
SMALL-OUTLINE
(DB)
PLASTIC
SMALL OUTLINE
(DW)
PLASTIC
DIP
(N)
0°C to 70°C
SN75LP1185DBR
SN75LP1185DW
SN75LP1185N
The DB package is only available taped and reeled. The DW package also is available
taped and reeled. Add the suffix R to device type (e.g., SN75LP1185DWR).
Function Tables
DRIVER
INPUT
DA
OUTPUT
DY
H
L
L
H
Open
L
RECEIVER
INPUT
RA
OUTPUT
RY
H
L
L
H
Open
H
logic diagram (positive logic)
2
19
RA1
RY1
3
18
RA2
RY2
4
17
RA3
RY3
5
16
DY1
DY2
RA4
DY3
DA1
6
15
7
14
8
13
9
12
DA2
RA5
2
POST OFFICE BOX 655303
RY4
DA3
RY5
• DALLAS, TEXAS 75265
SN75LP1185
LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS335A – JANUARY 1999 – REVISED JANUARY 2001
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Positive supply-voltage range (see Note 1): VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 15 V
Negative supply-voltage range, VSS (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to –15 V
Input-voltage range, VI: Receiver (RA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –30 V to 30 V
Driver (DA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.4 V
Output-voltage range, VO: Receiver (RY) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V
Driver (DY) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –15 V to 15 V
Electrostatic discharge: Bus pins (human-body model) (see Note 2) . . . . . . . . . . . . . . . . . . . . . Class 3: 15 kV
Bus pins (machine model) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 V
All pins (human-body model) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . Class 3: 5 kV
All pins (machine model) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 V
Package thermal impedance, θJA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to network ground terminal, unless otherwise noted.
2. Per MIL-STD-883, Method 3015.7
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN
NOM
MAX
UNIT
VCC
VDD
Supply voltage (see Note 4)
4.75
5
5.25
V
Supply voltage (see Note 5)
9
12
15
V
VSS
VIH
Supply voltage (see Note 5)
–9
–12
–15
V
High-level input voltage
DA
VIL
VI
Low-level input voltage
DA
Receiver input voltage
RA
IOH
IOL
High-level output current
Low-level output current
2
V
0.8
–25
V
25
V
RY
–1
mA
RY
2
mA
TA
Operating free-air temperature
0
70
°C
NOTES: 4. VCC cannot be greater than VDD.
5. The device operates down to VDD = VCC and |VSS| = VCC, but supply currents increase and other parameters may vary slightly from
the data sheet limits.
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SN75LP1185
LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS335A – JANUARY 1999 – REVISED JANUARY 2001
supply currents over the recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Supply current for VCC,
CC ICC
Supply current for VDD,
DD IDD
No load,
All in
uts at minimum VOH or
inputs
maximum VOL
Supply current for VSS,
SS ISS
MIN
TYP
MAX
VDD = 9 V,
VDD = 12 V,
VSS = –9 V
VSS = –12 V
1000
VDD = 9 V,
VDD = 12 V,
VSS = –9 V
VSS = –12 V
800
VDD = 9 V,
VDD = 12 V,
VSS = –9 V
VSS = –12 V
–625
UNIT
1000
800
µA
–625
driver electrical characterisitics over the recommended operating conditions (unless otherwise
noted)
PARAMETER
VOH
High level output voltage
High-level
VOL
Low level output voltage
Low-level
IIH
IIL
High-level input current
TEST CONDITIONS
VIL = 0.8 V,
RL = 3 kΩ
kΩ,
See Figure 1
VDD = 9 V,
VSS = –9 V
VDD = 12 V,
VSS = –12 V,
VIH = 2 V,
RL = 3 kΩ
kΩ,
See Figure 1
VDD = 9 V,
VSS = –9 V
VDD = 12 V,
VSS = –12 V,
MIN
TYP
MAX
5
5.8
6.6
5
5.8
6.6
–5
–5.8
–6.9
–5
–5.9
–6.9
UNIT
V
See Note 6
V
See Note 6
Low-level input current
VI at VCC
VI at GND
IOS(H)
Short-circuit
high-level output current
VO = GND or VSS,
See Figure 2 and Note 7
IOS(L)
Short-circuit
low-level output current
VO = GND or VDD,
See Figure 2 and Note 7
1
µA
–1
µA
–30
–55
mA
30
55
mA
ro
Output resistance
VDD = VSS = VCC = 0,
VO = 2 V
300
Ω
NOTES: 6. Maximum output swing is clamped nominally at ±6 V to enable the higher data rates associated with this device and to reduce EMI
emissions. The driver outputs may slightly exceed the maximum output voltage over the full VCC and temperature ranges.
7. Not more than one output should be shorted at one time.
4
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SN75LP1185
LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS335A – JANUARY 1999 – REVISED JANUARY 2001
driver switching characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tPHL
Propagation delay time,
high- to low-level output
PARAMETER
RL = 3 kΩ to 7 kΩ, CL = 15 pF, See Figure 1
300
800
1600
ns
tPLH
Propagation delay time,
low- to high-level output
RL = 3 kΩ to 7 kΩ, CL = 15 pF, See Figure 1
300
800
1600
ns
tTLH
Transition time,
lowlow to high-level
high level output
VCC = 5 V,
VDD = 12 V,
VSS = –12 V,
RL = 3 kΩ to 7 kΩ
kΩ,
See Figure 1 and
Note 9
Using VTR = 10%-to-90% transition region,
Driver speed = 250 kbit/s, CL = 15 pF,
See Note 8
375
2240
Using VTR = ±3 V transition region,
Driver speed = 250 kbit/s, CL = 15 pF
200
1500
Using VTR = ±2 V transition region,
Driver speed = 250 kbit/s, CL = 15 pF
133
1000
Using VTR = ±3 V transition region,
Driver speed = 125 kbit/s, CL = 2500 pF
tTHL
Transition time,
highhigh to low-level
low level output
VCC = 5 V,
VDD = 12 V,
VSS = –12 V,
RL = 3 kΩ to 7 kΩ
kΩ,
See Figure 1 and
Note 9
2750
Using VTR = 10%-to-90% transition region,
Driver speed = 250 kbit/s, CL = 15 pF,
See Note 8
375
2240
Using VTR = ±3 V transition region,
Driver speed = 250 kbit/s, CL = 15 pF
200
1500
Using VTR = ± 2 V transition region,
Driver speed = 250 kbit/s, CL = 15 pF
133
1000
Using VTR = ±3 V transition region,
Driver speed = 125 kbit/s, CL = 2500 pF
SR
Output slew rate
VCC = 5 V,
VDD = 12 V,
VSS = –12 V
Using VTR = ±3 V transition region,
Driver speed = 0 to 250 kbit/s, CL = 15 pF
ns
ns
2750
4
20
30
V/µs
NOTES: 8. Equivalent to the SN75C185. The SN75LP1185 output-voltage swing is clamped to about 70% of the typical SN75C185
output-voltage swing, and the specified limits reflect the reduced output swing.
9. Maximum output swing is limited to ±6 V to enable the higher data rates associated with this device and to reduce EMI emissions.
receiver electrical characteristics over recommended operating free-air temperature range
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIT+
VIT–
Positive-going input threshold voltage
See Figure 3
1.6
2
2.55
V
Negative-going input threshold voltage
See Figure 3
0.6
1
1.45
V
VHYS
VOH
Input hysteresis, VIT+ VIT–
See Figure 3
600
1000
High-level output voltage
2.5
3.9
VOL
Low-level output voltage
IOH = –1 mA
IOL = 2 mA
IIH
High level input current
High-level
VI = 3 V
VI = 25 V
0.43
0.6
1
3.6
5.1
8.3
IIL
Low level input current
Low-level
VI = –3 V
VI = –25 V
–0.43
–0.6
–1
–3.6
–5.1
–8.3
IOS(H)
IOS(L)
Short-circuit high-level output current
Short-circuit low-level output current
0.33
VO = 0,
VO = VCC,
See Figure 5 and Note 7
See Figure 5 and Note 7
VI = ±3 V to ±25 V
NOTE 7: Not more than one output should be shorted at one time.
RIN
Input resistance
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3
5
mV
V
0.5
V
mA
mA
–20
mA
20
mA
7
kΩ
5
SN75LP1185
LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS335A – JANUARY 1999 – REVISED JANUARY 2001
receiver switching characteristics over recommended operating free-air temperature range,
CL = 50 pF (unless otherwise noted) (see Figure 4)
PARAMETER
TYP
MAX
UNIT
tPHL
tPLH
Propagation delay time, high- to low-level output
MIN
400
900
ns
Propagation delay time, low- to high-level output
400
900
ns
tTLH
tTHL
Transition time, low- to high-level output
200
500
ns
Transition time, high- to low-level output
200
400
ns
tSK(p)
Pulse skew |tPLH – tPHL|
200
425
ns
PARAMETER MEASUREMENT INFORMATION
tw
Inputs
50%
VI
Outputs
3V
50%
0V
II
IO
tPLH
CL
50%
VTR–
VO
VI
VO
RL
VTR+ VTR+
tTLH
NOTES: A. The pulse generator has the following characteristics:
For CL < 1000 pF: tw = 4 µs, PRR = 250 kbit/s, ZO = 50 Ω, tr and tf < 50 ns.
For CL = 2500 pF: tw = 8 µs, PRR = 125 kbit/s, ZO = 50 Ω, tr and tf < 50 ns.
B. CL includes probe and jig capacitance.
Figure 1. Driver Parameter Test Circuit and Waveform
Inputs
Outputs
II
VDD
VCC
IO
VI
GND
VSS
VO
Figure 2. Driver IOS Test
Inputs
Outputs
II
VI
IO
VO
Figure 3. Receiver VIT Test
6
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tPHL
50%
VTR–
VOH
VOL
tTHL
SN75LP1185
LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS335A – JANUARY 1999 – REVISED JANUARY 2001
PARAMETER MEASUREMENT INFORMATION
tw
4V
VI
Inputs
Outputs
II
IO
VI
50%
50%
0V
tPLH
VO
50%
10%
VO
CL
90%
tPHL
90%
tTLH
50%
10%
VOH
VOL
tTHL
NOTES: A. The pulse generator has the following characteristics: tw = 4 µs, PRR = 250 kbit/s, ZO = 50 Ω, tr and tf < 50 ns.
B. CL includes probe and jig capacitance.
Figure 4. Receiver Parameter Test Circuit and Waveform
Inputs
Outputs
II
IO
VI
VCC
GND
VO
Figure 5. Receiver IOS Test
APPLICATION INFORMATION
Diodes placed in series with the VDD and VSS leads protect the SN75LP1185 in the fault condition when the device
outputs are shorted to ±15 V and the power supplies are at low voltage and provide low-impedance paths to ground
(see Figure 6).
VDD
Output
SN75LP1185
Output
SN75LP1185
VSS
Figure 6. Power-Supply Protection to Meet Power-Off Fault Conditions of TIA/EIA-232-F
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN75LP1185DBR
ACTIVE
SSOP
DB
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
5LP1185
SN75LP1185DW
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
75LP1185
SN75LP1185DWR
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
75LP1185
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of