User's Guide
SLAU686 – May 2016
TAS2560 Evaluation Module
This user's guide describes the characteristics, operation, and use of the TAS2560 Evaluation Module
(EVM). The complete schematic diagrams, printed-circuit board layouts, and bill of materials (BOM) are
included in this document.
1
2
3
4
5
6
Contents
Description ....................................................................................................................
Software .......................................................................................................................
Mono Setup ...................................................................................................................
Digital Audio Interfaces .....................................................................................................
PurePath™ Console 3 Software ...........................................................................................
Schematics, Layout and BOM .............................................................................................
2
2
3
4
7
7
List of Figures
1
Sound Card ................................................................................................................... 3
2
Sound dialog from the Windows Control Panel .......................................................................... 4
3
USB Interface ................................................................................................................ 5
4
Direct (AP/PSIA) ............................................................................................................. 6
5
Schematic Page 1 ........................................................................................................... 7
6
Schematic Page 2 ........................................................................................................... 8
7
Schematic Page 3 ........................................................................................................... 9
8
Schematic Page 4 ........................................................................................................... 9
9
Schematic Page 5 .......................................................................................................... 10
10
Schematic Page 6 .......................................................................................................... 11
11
PCB Layer 1 ................................................................................................................ 11
12
PCB Layer 2 ................................................................................................................ 12
13
PCB Layer 3 ................................................................................................................ 12
14
PCB Layer 4 ................................................................................................................ 12
15
PCB Layer 5 ................................................................................................................ 13
16
PCB Layer 6 ................................................................................................................ 13
17
PCB Layer 7 ................................................................................................................ 13
18
PCB Layer 8 ................................................................................................................ 14
19
PCB Layer 9 ................................................................................................................ 14
20
PCB Layer 10 ............................................................................................................... 14
21
PCB Layer 11 ............................................................................................................... 15
22
PCB Layer 12 ............................................................................................................... 15
List of Tables
1
Specifications ................................................................................................................. 2
2
Bill of Materials
.............................................................................................................
16
PurePath is a trademark of Texas Instruments.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
All other trademarks are the property of their respective owners.
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TAS2560 Evaluation Module
Copyright © 2016, Texas Instruments Incorporated
1
Description
1
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Description
The TAS2560 is an amplifier with an integrated 8.5V boost converter supporting Class-D, Class-G, and
Class-H. The device supports up to 5.7W output while using a 4 Ohm driver and includes on-chip voltage
and current sensing. Users can utilize this sensing to implement an advanced algorithm to provide realtime speaker protection against overheating and excessive excursion.
The TAS2560 EVM supports evaluation and development with the TAS2560 through the following
interfaces:
1. USB interface
(a) TAS2560 control through PurePath™ Console 3 GUI, USB-HID
(b) USB-class Audio Device, compatible with Microsoft® Windows® 7
2. Digital audio AP/PSIA interface through 100-mil headers
3. TI Learning Board 2 for speaker characterization
4. SPI interface for TAS2560 control
5. I2C interface for TAS2560 control
Table 1. Specifications
2
Amplifier power supply (VBAT)
+2.7 V to +5.5 V
EVM power supply
+5 V
I/O power supply (I/OVDD)
+1.62 V to +3.6 V
Output power
4W
USB, USB class-audio
Micro-USB B
Software
The EVM requires PurePath™ Console 3 with the TAS2560 EVM App.
2
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Mono Setup
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3
Mono Setup
•
•
•
•
Install PurePath™ Console 3 and the TAS2560 App
Connect a speaker to J8 on the EVM.
Attach a +5-V, 2-A power supply to connector J29 (inner = +5 V, outer = GND).
Connect the EVM to a Windows 7 PC with a micro USB cable (J23). It enumerates as a USB classaudio device (sound card).
Figure 1. Sound Card
Default jumper settings:
J1: inserted
J2: inserted (VBAT = from +5 V)
J3: removed (DATA from TAS2560 access header)
J4: inserted (or wire loop)
J5: inserted bottom (I2C address = 0x98 (0x4C 7bit))
J6: inserted
J7: inserted (or wire loop)
J9: inserted (select USB audio)
J10: inserted (select USB audio)
J11: inserted
J15: inserted left (DIN = on-board)
J16:
J17:
J18:
J19:
J20:
inserted
inserted
inserted
inserted
inserted
left
left
left
left
left
J24:
J26:
J27:
J30:
J32:
removed (EEPROM write protect = off)
inserted (select USB audio)
inserted (select USB audio)
inserted bottom (IOVDD = 1.8 V)
removed
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(WCLK = on-board)
(BCLK = on-board)
(MCLK = on-board)
(SCL = on-board)
(SDA = on-board))
TAS2560 Evaluation Module
Copyright © 2016, Texas Instruments Incorporated
3
Digital Audio Interfaces
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Verify that the EVM is the default playback device (open the Sound dialog from the Windows Control
Panel):
Figure 2. Sound dialog from the Windows Control Panel
The EVM firmware enumerates as a USB-miniEVM. It supports 48kHz sampling rate by default. Check if
the sampling rate matches the Windows setting via Properties->Advanced.
This setting must match the EVM (2 channel, 16 bit, 48000 Hz)
4
Digital Audio Interfaces
The various digital audio interfaces on the TAS2560 EVM can be selected through hardware settings and
software settings.
Several headers close to the TAS2560 allow access to the following digital audio signals:
• J3: Data Out (DOUT) from the TAS2560 (that is, current and voltage sense data)
• J15: Data In (DIN) to the TAS2560
• J16: Word Clock / Frame Sync (WCLK)
• J17: Bit Clock (BCLK)
• J18: Master Clock (MCLK) – optional if TAS2560 PLL is not used
J3 has two pins:
1. Digital data (that is, I and V sense data) from the TAS2560
2. Ground
J15, J16, J17 and J18 have three pins:
1. Digital audio interface signals from the EVM
2. Digital audio interface signals to the TAS2560
3. Ground
4
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Digital Audio Interfaces
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A jumper inserted in position 1-2 connects the TAS2560 to the digital audio signals from the board (e.g.
USB or Learning Board 2). Replacing the jumper with a connector from an external source connects the
TAS2560 to the external source (that is, AP/PSIA).
The selection between the two on-board digital audio sources (USB or Learning Board 2) is controlled by:
(a) Hardware: J26, J27:
(a) J26 = inserted, J27 = inserted selects USB
(b) J26 = inserted, J27 = removed selects Learning Board 2
(b) Software: The PPC3 GUI controls the digital audio routing during speaker characterization. This has
priority over the hardware settings from point a.
4.1
4.1.1
Digital Audio Interface Selection
USB
The TAS2560 EVM contains a microcontroller (TAS1020b) that acts as a USB HID and USB class audio
interface. To select USB, insert J26, J27, J9, J10 and insert J15, J16, J17, J18 in the 1-2 position.
Figure 3. USB Interface
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Digital Audio Interfaces
4.1.2
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Direct (AP/PSIA)
Remove the jumpers from J15, J16, J17, J18 and connect the external digital audio source (that is,
AP/PSIA) to pin 2 of each header. Pin 3 provides a ground connection.
Figure 4. Direct (AP/PSIA)
6
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PurePath™ Console 3 Software
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5
PurePath™ Console 3 Software
The graphical user interface software, PurePath™ Console 3 with the TAS2560 App, controls the
TAS2560 EVM.
NOTE: The TAS2560 must be configured using this software. It will not function without
configuration.
6
Schematics, Layout and BOM
6.1
Schematic
Figure 5 through Figure 10 illustrate the EVM schematic diagrams.
I2S
DIN
STEREO
MUX
I2S
LEARNING
BOARD 2
I2S
DIN
VBAT
I2S
ASI
IOVDD
AVDD
I2S
USB JACK
USB
HEADER
BLOCK
TAS1020B
RESET
DIN
TAS2560
HEADERS
EEPROM
I2C
IRQZ
ADDR
I2C
SPKL
SPKR
SPEAKER JACK
Copyright © 2016, Texas Instruments Incorporated
Figure 5. Schematic Page 1
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Schematics, Layout and BOM
FROM LB2 CONN
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R41
USB_I2CEN
USB_I2CEN
IOVDD
0
+3.3V
J24
WP
+3.3V
R15
10.0k
+3.3V
IOVDD
IOVDD
+3.3V
U2
1
2
3
4
NC
NC
VCC
WP
A2
SCL
VSS
SDA
R16
8
SCL
4.99k
7
GND
R17
10.0k
SDA
TP12
R9
R10
DNP2.00k DNP2.00k
DNP
DNP
R18
10.0k
U3
TP13
SCL-USB
SDA-USB
6
8
1
SCL_B
SDA_B
5
SCL_A
SDA_A
OE
24LC256-I/MS
GND
2
GND
VCCA
VCCB
I2C
5
4
6
SCL
SDA
IOVDD +3.3V
3
7
TCA9406DCUR
GND
I2C-USB
SCL-USB
SDA-USB
+3.3V
+5V-USB
+3.3V
R20
Q1
6
1
J23
USB-IN
2
E/D
1
GND
4
3
OUT
3
47
GND
R23
3.09k
1
C48
1000pF
C45
47pF
5
C46
47pF
48
PUR
DM
DP
44
43
SCL-USB
SDA-USB
39
40
37
35
38
36
MCLK01
R19
49.9
1
1A
CSCLK
CSYNC
CDATO
SDIN-USB
R21
R22
R24
49.9
49.9
49.9
2
GND
3
2A
CRESET
CSCHNE
34
32
PLLFILO
P1-7
P1-6
P1-5
P1-4
P1-3
P1-2
P1-1
P1-0
7
GND
FB2
PLLFILI
5
7
6
MRESET
9
XTALO
SCL
SDA
MCLKO1
MCLKO2
CSCLK
CSYNC
CDATO
CDATI
C47
100pF
4
ID
GND
MCLKI
XTALI
46
R26
27.4
R27
27.4
3
D+
R25
1.50k
FB1
2
D-
DVDD
DVDD
DVDD
VCC
6MHz
VBUS
AVDD
8
21
33
Y1
15.0k
8
+3.3V
U19
2
9
10
11
GND
42
41
12
GND
20
22
PUR
DM
DP
P3-5
P3-4
P3-3
P3-2/XINT
P3-1
P3-0
MRESET
TEST
EXTEN
VREN
RESET
RSTO
AVSS
DVSS
DVSS
DVSS
NC
NC
+3.3V
31
30
29
27
26
25
24
23
1
2
GND
3
R29
5
2Y
4
MCLKIN-LB2
1A
6
BCLK-USB
GND
2A
1Y
VCC
2Y
MCLK-USB
BCLK-USB
LRCLK-USB
SDOUT-USB
SDIN-USB
5
4
BCLKIN-LB2
3
+3.3V
D1
Blue
USB LOCK
45
1A
GND
2A
1Y
VCC
2Y
6
LRCLK-USB
5
4
LRCLKIN-LB2
6
SDOUT-USB
SN74LVC2G34DRLR
U18
R28
1
360
2
28
16
4
3
1A
GND
2A
1Y
VCC
2Y
5
SDIN0-LB2
4
I2S
LEARNING BOARD2
MCLKIN-LB2
BCLKIN-LB2
SN74LVC2G34DRLR
LRCLKIN-LB2
GND
GND
USB RESET
6
SN74LVC2G34DRLR
U17
1
2
19
18
17
15
14
13
MCLK-USB
1Y
VCC
SN74LVC2G34DRLR
U16
TAS1020BPFBR
+3.3V
I2S-USB
U15
SDIN0-LB2
GND
MRESET
100k
S2
C49
0.1µF
16V
+3.3V
DECOUPLING
GND
C33
0.1µF
16V
C34
0.1µF
16V
C35
0.1µF
16V
C36
0.1µF
16V
C37
0.1µF
16V
C38
0.1µF
16V
C39
0.1µF
16V
C40
0.1µF
16V
C41
0.1µF
16V
IOVDD
C42
0.1µF
16V
C43
0.1µF
16V
C56
0.1µF
16V
C57
0.1µF
16V
C15
0.1µF
16V
C16
0.1µF
16V
C17
0.1µF
16V
C44
0.1µF
16V
GND
GND
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Figure 6. Schematic Page 2
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Schematics, Layout and BOM
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+3.3V
+3.3V
IOVDD
IOVDD
IOVDD
VCC
MCLK-USB
C50
0.1uF
C53
0.1uF
C51
0.1uF
C54
0.1uF
C52
0.1uF
C55
0.1uF
6
5
4
3
MCLK-from-LB2
SDOUT-USB
GND
GND
GND
GND
GND
GND
SDOUT3-from-LB2
1B1
1B2
1B3
1B4
10
11
12
13
1A
S0
2B1
2B2
2B3
2B4
16
14
+3.3V
1
2A
9
S1
MCLK_MUX
7
1OE
2OE
8
17
MCLK-USB
SDOUT-USB
BCLK-USB
LRCLK-USB
SDIN-USB
I2S-USB
+3.3V
U5
DECOUPLING
+3.3V
IOVDD
U6
SDOUT_MUX
14
2
15
16
5
6
15
GND
EP
MCLK_MUX
SDOUT_MUX
BCLK_MUX
LRCLK_MUX
GND
SN74CB3Q3253RGYR
GND
VCCB
13
A1
A2
A3
A4
B1
B2
B3
B4
12
11
10
9
OE
GND
VCCA
1
2
3
4
7
DIR1
DIR2
DIR3
DIR4
I2S-USB-LB2
R30
R31
R32
R33
0
0
0
0
MCLK-USB-LB2
DOUT-USB-LB2
BCLK-USB-LB2
WCLK-USB-LB2
8
SN74AVC4T774RSVR
R38
10.0k
+3.3V
R34
R35
47k
2.2k
R36
R37
47k
2.2k
VCC
BCLK-USB
6
5
4
3
BCLK-from-LB2
J26
J27
1B1
1B2
1B3
1B4
GND
P1
1A
S0
1OE
P0
LRCLK-USB
10
11
12
13
WCLK-from-LB2
+3.3V
U8
14
15
VCCP
VCCI
12
13
SCL-USB
SDA-USB
SCL
SDA
11
R39
10.0k
I2C-USB
INT
16
1
P0
P1
P2
P3
P4
P5
P6
P7
ADDR
RESET GND
2
3
4
5
7
8
9
10
2B1
2B2
2B3
2B4
2A
S1
2OE
8
17
GND
+3.3V
U7
16
BCLK_MUX
7
GND
14
+3.3V
1
LRCLK_MUX
9
2
15
R13
R14
47k
2.2k
R47
R48
47k
2.2k
GND
EP
J9
GND
J10
GND
P8
SN74CB3Q3253RGYR
P9
GND
TCA6408-P8
TCA6408-P9
6
DOUT_ICC-GPI3
TCA6408ARSVR
+3.3V
GND
USB_I2CEN
I2C
EXPANDER
GND
+3.3V
8
U9
8
LEARNING BOARD 2
+5.0V
SDIN-USB
+3.3V
+3.3V
GND
VCC
B
2
Y
A/B
6
G
GND
7
R44
10.0k
5
SDOUT1-from-LB2
2
1A
VCC
GND
2Y
2A
3Y
3A
1
4
3
6
SN74LVC3G34DCUR
+3.3V
4
GND
SN74LVC2G157DCTR
5
SCL-USB
SDA-USB
LRCLKIN-LB2
BCLKIN-LB2
MCLKIN-LB2
WCLK-from-LB2
BCLK-from-LB2
MCLK-from-LB2
SDIN0-LB2
SDOUT1-from-LB2
SDIN2-to-LB2
SDOUT3-from-LB2
BCLK-to-LB2
LRCLK-to-LB2
USB_I2CEN
1
Y
3
1Y
GND
GND
U14
SN74LVC1G125DCKR
1
4
+3.3V
2
IOVDD
U11
14
SDOUT1-from-LB2
SDIN2-to-LB2
SDOUT3-from-LB2
3
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
A
5
J28
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
U21
7
R43
10.0k
R45
15
16
5
6
49.9
GND
BCLK-to-LB2
LRCLK-to-LB2
GND
1
2
3
4
BCLK-to-LB2
LRCLK-to-LB2
7
VCCB
13
A1
A2
A3
A4
B1
B2
B3
B4
12
11
10
9
OE
GND
VCCA
DIR1
DIR2
DIR3
DIR4
I2S-TAS2560
DOUT-TAS2560
DIN
BCLK
WCLK
8
SN74AVC4T774RSVR
I2S
LEARNING
BOARD 2
GND
SDIN0-LB2
GND
MCLKIN-LB2
BCLKIN-LB2
LRCLKIN-LB2
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Figure 7. Schematic Page 3
DECOUPLING
IOVDD
IOVDD
C1
0.1uF
GND
C2
0.1uF
GND
IOVDD
+3.3V
C58
0.1uF
GND
C59
0.1uF
GND
U4
IOVDD
VCC
MCLK-USB-LB2
6
5
4
3
1B1
1B2
1B3
1B4
1A
S0
1OE
DOUT-USB-LB2
I2S-USB-LB2
10
11
12
13
ICC-GPIO10
MCLK-USB-LB2
DOUT-USB-LB2
BCLK-USB-LB2
WCLK-USB-LB2
8
17
2B1
2B2
2B3
2B4
2A
S1
2OE
16
7
14
1
9
2
I2S-TAS2560
15
GND
EP
GND
SN74CB3Q3253RGYR
GND
U10
BCLK-USB-LB2
IOVDD
U20
14
15
16
5
6
1
2
3
4
TCA6408-P8
TCA6408-P9
DOUT_ICC-GPI3
R49
7
10.0k
VCCA
VCCB
6
5
4
3
ICC-GPIO9
13
1B1
1B2
1B3
1B4
1A
S0
1OE
DIR1
DIR2
DIR3
DIR4
WCLK-USB-LB2
10
11
DIN2_GPIO8_TAS2555 12
13
A1
A2
A3
A4
B1
B2
B3
B4
OE
GND
12
11
10
9
8
17
2B1
2B2
2B3
2B4
0
0
0
0
MCLK-TAS2560
DIN-TAS2560
BCLK-TAS2560
WCLK-TAS2560
IOVDD
VCC
+3.3V
R4
R5
R11
R12
2A
S1
2OE
16
7
14
1
9
2
15
GND
EP
GND
SN74CB3Q3253RGYR
8
GND
SN74AVC4T774RSVR
GND
GND
J11
DIN2_GPIO8_TAS2555
GND
J21
STEREO-M
8
7
6
5
4
3
2
1
ICC-GPIO10
ICC-GPIO9
ICC-GPI3
GND
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Figure 8. Schematic Page 4
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Schematics, Layout and BOM
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J2
+5.0V
C10
1uF
16V
I2S
I2C
J15
J16
J17
J18
J19
J20
1
2
3
1
2
3
1
2
3
1
2
3
1
2
3
J3
1
2
3
C9
0.1uF
GND
GND
C60
10µF
10V
C8
22µF
16V
GND
DOUT-TAS2560
DIN-TAS2560
WCLK-TAS2560
BCLK-TAS2560
MCLK-TAS2560
C4
DNP 22µF
16V
DNP
GND
GND
GND
TP14
C3
0.1µF
16V
SCL
SDA
TP1
MCLK
TP2
TP3
BCLK
WCLK
TP4
DIN
TP5
GND
U1
DOUT
B1
MCLK
BCLK
LB2
CONN
VBAT
WCLK
DIN
TP15
E4
E5
SW
BCLK
D2
BCLK
WCLK
C1
WCLK
VBOOST
VBOOST
D4
D5
VBOOST
DIN
D1
DIN
DOUT-TAS2560
E2
DOUT
VBAT
F3
VBAT
VDD
B3
VDD
PDMCLK
E1
SCL-TAS2560
E3
A2
IOVDD-U1
PDMCLK
IOVDD
VREG
J1
SDA-TAS2560
F2
ADDR
A1
SCL
SPK_P
SDA
SPK_N
ADDR
VSENSE_P
J32
VSENSE_N
R2
22.0k
PDMCLK
IRQZ
A3
RESET
F1
IRQZ
RESET
PGND_B
PGND_B
PGND_B
TEST1
TEST2
GND
GND
GND
TEST1
R1
10.0k TEST2
IOVDD
J5
1
2
3
GND
TP6
TP10 C2
TP11 B2
GND
GND
J4
2.2uH
+1.8V
GND
C4
VREG
C5
SPK_P
A5
SPK_N
A4
SPK+
B4
SPK-
C12
1uF
6.3V
C11
0.1uF
C13
10µF
10V
GND
GND
C14
0.01uF
R42
0
R46
0
J7
IOVDD
C18
0.1uF
C19
1uF
6.3V
B5
F4
F5
GND
GND
C3
D3
TAS2560YFF
SPEAKER
OUT
TP7
ADDR SEL
GND
GND
C5
22µF
16V
L1
SW
SW
MCLK
PDMCLK
ADDR
VBST
GND
GND
J8
GND
SPK+
SPKR7
DNP
1.00k
DNP
SPK_P
DNP
IOVDD
R6
10.0k
IOVDD
S1
C21
DNP 1000pF
DNP
TP8
TP9
C23
DNP 4700pF
DNP
GND
GND
C22
DNP 1000pF
DNP
R8
DNP
1.00k
DNP
SPK_N
C24 DNP
DNP 4700pF
DNP
GND
GND
RESET
R3
10.0k
C20
0.1µF
IRQZ
J6
GND
RESET
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 9. Schematic Page 5
10
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+5V
+5.0V
J29
+3.3V
U12
TPS73733DCQ
1
5
C7
1µF
6.3V
+5V
OUT
EN
NR
+5.0V
J13
4
GND
3
J12
IN
GND
+3.3V IOVDD +1.8V
2
C27
0.1µF
C26
1µF
6.3V
C25
0.01µF
6
C6
10µF
10V
3
2
J14
1
2
3
1
J30
IOVDD SEL
GND
GND
GND
GND
+5V
VBAT
GND
J22
GND
U13
TPS73618DBVR
GND
1
3
OUT
EN
NR
+1.8V
GND
4
C30
0.1µF
C29
0.01µF
GND
GND
GND
VBAT
VBAT
J31
1
2
3
4
5
GND
2
C28
1µF
6.3V
IN
J25
4
3
2
1
+3.3V
GND
D2
R40
C31
22µF
16V
VBAT
GND
GND
C32
0.1µF
Green
3.3V
360
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 10. Schematic Page 6
6.2
PCB Layout
Figure 11 through Figure 22 illustrate the EVM PCB layouts.
Figure 11. PCB Layer 1
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Schematics, Layout and BOM
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Figure 12. PCB Layer 2
Figure 13. PCB Layer 3
Figure 14. PCB Layer 4
12
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Schematics, Layout and BOM
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Figure 15. PCB Layer 5
Figure 16. PCB Layer 6
Figure 17. PCB Layer 7
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Schematics, Layout and BOM
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Figure 18. PCB Layer 8
Figure 19. PCB Layer 9
Figure 20. PCB Layer 10
14
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Schematics, Layout and BOM
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Figure 21. PCB Layer 11
Figure 22. PCB Layer 12
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15
Schematics, Layout and BOM
6.3
www.ti.com
Bill of Materials
Table 2 details the EVM BOM.
Table 2. Bill of Materials
Designator
Quantity
Value
Description
PCB
1
C1, C2, C9, C11, C18,
C27, C30, C32, C50,
C51, C52, C53, C54,
C55, C58, C59
16
0.1uF
CAP, CERM, 0.1uF, 10V, +/-10%, X7R, 0402
C3
1
0.1uF
CAP, CERM, 0.1 µF, 16 V, +/- 10%, X7R, 0402
Package Reference
Printed Circuit Board
Part Number
Manufacture
AAP062
Any
0402
GRM155R71A104KA0
1D
MuRata
0402
GRM155R71C104KA8
8D
MuRata
TDK
C5, C8, C31
3
22uF
CAP, CERM, 22 µF, 16 V, +/- 10%, X5R, 0805
0805
C2012X5R1C226K125
AC
C6, C13, C60
3
10uF
CAP, CERM, 10 µF, 10 V, +/- 20%, X5R, 0603
0603
C1608X5R1A106M080
AC
TDK
C7, C10, C12, C19, C26,
C28
6
1uF
CAP, CERM, 1uF, 6.3V, +/-20%, X5R, 0402
0402
C1005X5R0J105M
TDK
C14, C25, C29
3
0.01uF
CAP, CERM, 0.01uF, 6.3V, +/-10%, X7R, 0402
0402
GRM155R70J103KA0
1D
MuRata
18
0.1uF
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
0402
GRM155R71C104KA8
8D
MuRata
C20
1
0.1uF
CAP, CERM, 0.1 µF, 10 V, +/- 10%, X7R, 0402
0402
GRM155R71A104KA0
1D
MuRata
C45, C46
2
47pF
CAP, CERM, 47pF, 25V, +/-5%, C0G/NP0, 0402
0402
GRM1555C1E470JA0
1D
MuRata
MuRata
C15,
C34,
C38,
C42,
C16, C17,
C35, C36,
C39, C40,
C43, C44,
C56, C57
C33,
C37,
C41,
C49,
C47
1
100pF
CAP, CERM, 100pF, 50V, +/-5%, C0G/NP0, 0402
0402
GRM1555C1H101JA0
1D
C48
1
1000pF
CAP, CERM, 1000pF, 50V, +/-5%, C0G/NP0, 0402
0402
GRM1555C1H102JA0
1D
MuRata
D1
1
Blue
D2
1
Green
FB1, FB2
2
220 ohm
H1, H2, H3, H4
4
LED, Blue, SMD
Blue LED
SMLP12BC7TT86
Rohm
LED, Green, SMD
LED_0805
LTST-C171GKT
Lite-On
0603
MPZ1608S221A
TDK
PMSSS 440 0025 PH
B&F Fastener Supply
2027
Keystone
CBL007
Any Shop
2.2A Ferrite Bead, 220 ohm at 100MHz, SMD
MACHINE SCREW PAN PHILLIPS 4-40
Machine Screw, 4-40,
1/4"
ROUND STANDOFF 440 ALUM 1/2"
H5, H6, H7, H8
4
ROUND STANDOFF 4-40 ALUM 1/2"
H9
1
Custom Cable For Connecting Stereo EVM Boards.
IDC34 Ribbon Cable With Offset Pins.
J1, J2, J3, J4, J6, J7, J9,
J10, J11, J24, J26, J27,
J32
13
Header, 2.54 mm, 2x1, Tin, TH
Header, 2.54 mm, 2x1,
TH
TSW-102-07-T-S
Samtec
J5, J30
2
Header, 2.54 mm, 3x1, Tin, TH
Header, 2.54 mm, 3x1,
TH
TSW-103-07-T-S
Samtec
Terminal Block, 5 mm, 2x1, Tin, TH
Terminal Block, 5 mm,
2x1, TH
691 101 710 002
Wurth Elektronik eiSos
J8, J12, J31
(1)
16
3
IDC34 Custom Cable
Alternate Part
Number (1)
Alternate
Manufacturer
Unless otherwise noted in the Alternate Part Number and/or Alternate Manufacturer columns, all parts may be substituted with equivalents.
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Table 2. Bill of Materials (continued)
Designator
Quantity
Value
Description
J13, J14
2
J15, J16, J17, J18, J19,
J20
6
J21
1
Receptacle, 50 mil, 8x1, Gold, R/A, TH
J22, J25
2
SOCKET .050" GRID SIP 4 POS R/A, TH
J23
1
Connector, Receptacle, Micro-USB Type AB, R/A,
Bottom Mount SMT
J28
1
Header (shrouded), 2.54 mm, 17x2, Gold, TH
J29
1
L1
1
LS1
1
Q1
1
0.3V
Transistor, NPN, 40V, 0.15A, SOT-23
SOT-23
R1, R3, R6, R15, R38,
R39, R43, R44, R49
9
10.0k
RES, 10.0k ohm, 1%, 0.063W, 0402
22.0k
Receptacle, 50 mil, 2x1, Gold, R/A, TH
1x3
Header, 100mil, 3x1, Gold, TH
Power Jack, mini, 2.5mm OD, R/A, TH
2.2uH
Package Reference
Part Number
Receptacle, 2x1, 50mil,
R/A
851-43-002-20-001000
Mill-Max
PBC03SAAN
Sullins Connector
Solutions
Receptacle, 8x1, 50mil,
R/A
851-43-008-20-001000
Mill-Max
R/A 4x1 receptacle
851-43-004-20-001000
Mill-Max
DX4R205JJAR1800
JAE Electronics
N2534-6002-RB
3M
PBC03SAAN
Connector, USB Micro
AB
Header (shrouded), 2.54
mm, 17x2, TH
RAPC712X
Switchcraft
4x2x4mm
XFL4020-222MEB
Coilcraft
Speaker, 20x26mm.
DMSP1217P-J-01
AAC Technologies
MMBT2222A
Fairchild
Semiconductor
0402
CRCW040210K0FKED
Vishay-Dale
RES, 10.0k ohm, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
Inductor, Shielded, Composite, 2.2uH, 3.7A, 0.02
ohm, SMD
TAS2555 EVM Speaker
Jack, 14.5x11x9mm
Manufacture
R2
1
R4, R5, R11, R12, R30,
R31, R32, R33
8
0
RES, 0 ohm, 5%, 0.063W, 0402
0402
CRCW04020000Z0ED
Vishay-Dale
R13, R34, R36, R47
4
47k
RES, 47 k, 5%, 0.063 W, 0402
0402
CRCW040247K0JNED
Vishay-Dale
R14, R35, R37, R48
4
2.2k
RES, 2.2 k, 5%, 0.063 W, 0402
0402
CRCW04022K20JNED
Vishay-Dale
R16
1
4.99k
RES, 4.99k ohm, 1%, 0.063W, 0402
0402
CRCW04024K99FKED
Vishay-Dale
R17, R18
2
10.0k
RES, 10.0 k, 1%, 0.063 W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R19, R21, R22, R24, R45
5
49.9
RES, 49.9 ohm, 1%, 0.063W, 0402
0402
CRCW040249R9FKED
Vishay-Dale
R20
1
15.0k
RES, 15.0k ohm, 1%, 0.063W, 0402
0402
CRCW040215K0FKED
Vishay-Dale
R23
1
3.09k
RES, 3.09k ohm, 1%, 0.063W, 0402
0402
CRCW04023K09FKED
Vishay-Dale
R25
1
1.50k
RES, 1.50k ohm, 1%, 0.063W, 0402
0402
CRCW04021K50FKED
Vishay-Dale
R26, R27
2
27.4
RES, 27.4 ohm, 1%, 0.063W, 0402
0402
CRCW040227R4FKED
Vishay-Dale
R28, R40
2
360
RES, 360 ohm, 5%, 0.063W, 0402
0402
CRCW0402360RJNED
Vishay-Dale
R29
1
100k
RES, 100k ohm, 1%, 0.063W, 0402
0402
CRCW0402100KFKED
Vishay-Dale
R41
1
0
RES, 0, 5%, 0.063 W, 0402
0402
CRCW04020000Z0ED
Vishay-Dale
R42, R46
2
0
RES, 0, 5%, 0.1 W, 0603
0603
CRCW06030000Z0EA
Vishay-Dale
S1, S2
2
TL1015AF160QG
E-Switch
SHUNT1, SHUNT2,
SHUNT3, SHUNT4,
SHUNT5, SHUNT6,
SHUNT7, SHUNT8,
SHUNT9, SHUNT10,
SHUNT11, SHUNT12,
SHUNT13, SHUNT14,
SHUNT15, SHUNT16,
SHUNT17, SHUNT18,
SHUNT19
19
SNT-100-BK-G
Samtec
Switch, Tactile, SPST-NO, 0.05A, 12V, SMT
1x2
Shunt, 100mil, Gold plated, Black
Switch, 4.4x2x2.9 mm
Shunt
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Number (1)
969102-0000-DA
Alternate
Manufacturer
3M
TAS2560 Evaluation Module
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17
Schematics, Layout and BOM
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Table 2. Bill of Materials (continued)
Designator
Quantity
Value
TP1, TP2, TP3, TP4,
TP5, TP8, TP9, TP10,
TP11, TP12, TP13,
TP14, TP15
13
Orange
TP6, TP7
2
Black
U1
1
WCSP30-YFF
U2
1
EEPROM, 256KBIT, 400KHZ, MSOP8
U3
1
TCA9406 Dual Bidirectional 1-MHz I2C-BUS and
SMBus Voltage Level-Translator, 1.65 to 3.6 V, -40 to
85 degC, 8-pin US8 (DCU), Green (RoHS & no
Sb/Br)
U4, U5, U7, U10
4
U6, U11, U20
18
Description
Test Point, Miniature, Orange, TH
Part Number
Manufacture
Orange Miniature
Testpoint
5003
Keystone
Black Miniature Testpoint
Alternate Part
Number (1)
Alternate
Manufacturer
5001
Keystone
YFF00030BFBA
TAS2560YFF
Texas Instruments
MSOP-8
24LC256-I/MS
Microchip
DCU0008A
TCA9406DCUR
Texas Instruments
Dual 1-of-4 FET Multiplexer / Demultiplexer 2.5-V /
3.3-V Low-Voltage High-Bandwidth Bus Switch,
RGY0016A
RGY0016A
SN74CB3Q3253RGYR
Texas Instruments
Texas Instruments
3
4-BIT DUAL-SUPPLY BUS TRANSCEIVER WITH
CONFIGURABLE VOLTAGE TRANSLATION AND 3STATE OUTPUTS, RSV0016A
RSV0016A
SN74AVC4T774RSVR
Texas Instruments
None
U8
1
Low-Voltage 8-Bit I2C and SMBus I/O Expander, 1.65
to 5.5 V, -40 to 85 degC, 16-pin UQFN (RSV), Green
(RoHS & no Sb/Br)
RSV0016A
TCA6408ARSVR
Texas Instruments
U9
1
Single 2-Line to 1-Line Data Selector Multiplexer,
DCT0008A
DCT0008A
SN74LVC2G157DCTR
Texas Instruments
U12
1
Single Output LDO, 1 A, Fixed 3.3 V Output, 2.2 to
5.5 V Input, with Reverse Current Protection, 6-pin
SOT-223 (DCQ), -40 to 125 degC, Green (RoHS &
no Sb/Br)
DCQ0006A
TPS73733DCQ
Texas Instruments
Equivalent
None
U13
1
Single Output Low Noise LDO, 400 mA, Fixed 1.8 V
Output, 1.7 to 5.5 V Input, with Reverse Current
Protection, 5-pin SOT-23 (DBV), -40 to 85 degC,
Green (RoHS & no Sb/Br)
DBV0005A
TPS73618DBVR
Texas Instruments
Equivalent
None
U14
1
Single Bus Buffer Gate With 3-State Output,
DCK0005A
DCK0005A
SN74LVC1G125DCKR
Texas Instruments
SN74LVC1G125DCKT
Texas Instruments
U15, U16, U17, U18
4
DUAL BUFFER GATE, DRL0006A
DRL0006A
SN74LVC2G34DRLR
Texas Instruments
U19
1
USB Streaming Controller, PFB0048A, NRND
PFB0048A
TAS1020BPFBR
Texas Instruments
U21
1
Triple BUFFER GATE
DRL0006A
SN74LVC3G34DCUR
Texas Instruments
625L3I006M00000
CTS
Electrocomponents
0805
C2012X5R1C226K125
AC
TDK
MuRata
Y1
1
C4
0
Test Point, Miniature, Black, TH
Package Reference
Oscillator, 6MHz, 3.3V, SMD
22uF
CAP, CERM, 22 µF, 16 V, +/- 10%, X5R, 0805
2.5x1x2.5mm
C21, C22
0
1000pF
CAP, CERM, 1000pF, 50V, +/-5%, C0G/NP0, 0402
0402
GRM1555C1H102JA0
1D
C23, C24
0
4700pF
CAP, CERM, 4700 pF, 50 V, +/- 10%, X7R, 0402
0402
GRM155R71H472KA0
1D
MuRata
FID1, FID2, FID3
0
Fiducial mark. There is nothing to buy or mount.
Fiducial
N/A
N/A
R7, R8
0
1.00k
RES, 1.00 k, 1%, 0.063 W, 0402
0402
CRCW04021K00FKED
Vishay-Dale
R9, R10
0
2.00k
RES, 2.00 k, 1%, 0.063 W, 0402
0402
CRCW04022K00FKED
Vishay-Dale
TAS2560 Evaluation Module
Texas Instruments
Equivalent
Equivalent
Texas Instruments
None
None
None
TAS1020BPFB
Texas Instruments
None
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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
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supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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