TDC1000-GASEVM User’s Guide
User's Guide
Literature Number: SNIU026A
March 2015 – Revised December 2015
Contents
1
2
3
4
5
6
General Overview .................................................................................................................
TDC1000-GASEVM vs. TDC1000-TDC72000EVM ......................................................................
EVM Package Contents .........................................................................................................
Software .............................................................................................................................
Setup ..................................................................................................................................
Software Installation .............................................................................................................
7
TDC1000-BSTEVM Setup and Operation ................................................................................. 9
8
9
Launching the Software ...................................................................................................... 10
Clock Selection .................................................................................................................. 14
6.1
7.1
Graphical User Interface (GUI) ......................................................................................... 8
Connections ............................................................................................................... 9
......................................................................................
10
Possible Excitation Pulses .................................................................................................
11
Troubleshooting .................................................................................................................
11.1 Boost converter .........................................................................................................
11.2 Jumper ...................................................................................................................
11.3 Firmware Upgrade ......................................................................................................
12
TDC1000-GASEVM Board Layout .........................................................................................
13
TDC1000-GASEVM Schematic ..............................................................................................
14
TDC1000-BSTEVM Board Layout ..........................................................................................
15
BSTEVM Schematic ............................................................................................................
Revision History ..........................................................................................................................
9.1
2
5
5
5
5
6
8
Steps to Select the CPU Clock
Table of Contents
14
17
18
18
18
19
21
29
32
33
34
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
www.ti.com
List of Figures
1
TDC1000-GASEVM ......................................................................................................... 6
2
TDC1000-BSTEVM Board .................................................................................................. 7
3
TDC1000-7200EVM Installation Directory ................................................................................ 8
4
TDC1000-BSTEVM Plugged into TDC1000-TDC7200EVM ........................................................... 9
5
SETUP Tab in TDC1000-TDC7200EVM ................................................................................ 11
6
Top to Bottom: START Pulse, Voltage on VDD Pin of UCC Driver, Voltage Across Connector J1, EN1
Signal on Oscilloscope .................................................................................................... 12
7
Top to Bottom: TDC1000's START Pulse (Dark Blue), TDC1000's Tx Signal (Light Blue), and the
Boosted 30 V of TD1000's Tx Signal (Green) .......................................................................... 13
8
Place Jumper on JP6 to Use the CPU Clock ........................................................................... 14
9
Select CPU-CLK ............................................................................................................ 15
10
Clock Options ............................................................................................................... 16
11
Excitation Pulses Chart .................................................................................................... 17
12
Jumper ....................................................................................................................... 18
13
Connection Error Pop-up Window
14
USB Firmware Upgrade Window ......................................................................................... 20
15
Top Overlay ................................................................................................................. 21
16
Top Solder Mask ........................................................................................................... 22
17
Top Layer.................................................................................................................... 23
18
Mid Layer 1.................................................................................................................. 24
19
Mid Layer 2.................................................................................................................. 25
20
Bottom Layer ................................................................................................................ 26
21
Bottom Solder Mask
22
Board Dimensions .......................................................................................................... 28
23
TDC1000-GASEVM Schematic 1 ........................................................................................ 29
24
TDC1000-GASEVM Schematic 2 ........................................................................................ 30
25
TDC1000-GASEVM Schematic 3 ........................................................................................ 31
26
BSTEVM Layout ............................................................................................................ 32
27
TDC1000-BSTEVM ........................................................................................................ 33
.......................................................................................
.......................................................................................................
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
List of Figures
19
27
3
www.ti.com
List of Tables
1
4
Jumper ....................................................................................................................... 18
List of Tables
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
User's Guide
SNIU026A – March 2015 – Revised December 2015
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s
Guide
1
General Overview
This user's guide details the use of the TDC10000-GASEVM, which is comprised of two boards. The first
board is the main TDC1000-GASEVM, which includes an on-board TDC1000 (ultrasonic analog-frontend), TDC7200 (time-to-digital converter), and MSP430 microcontroller. The purpose of this board is to
excite the transducers, receive the returned echo, generate the STOP pulses, and digitize the time-of-flight
to the MSP430 for further processing. This main board connects with a separate TDC1000-BSTEVM
board (referred to as HV board for the remainder of this document). The purpose of the HV board is to
boost the transmit pulses from 3.7V-to-30V to get a better received echo for applications where a higher
range is necessary or when the ultrasonic medium is a gas or is exposed to vibration.
2
TDC1000-GASEVM vs. TDC1000-TDC72000EVM
The TDC1000-GASEVM is compatible with the Firmware and GUI of the TDC1000-TDC72000EVM since
all the components are the same. However, the TDC1000-GASEVM has the following component
changes to facilitate rapid evaluation for water/gas flow applications.
1. The TDC1000-GASEVM has been designed for Gas Flow applications. The passive components that
determine the first order filter of the Rx signal path have been tuned for frequencies between 58 kHz to
300 KHz.
2. The resistors connecting the TX2/RX1 and TX1/RX2 channel have been removed to enable the
TDC1000-GASEVM to be used with the TDC1000-BSTEVM. When resistors have been removed, the
transmitting pulses increase from 3.7 V to 30 V.
3
EVM Package Contents
The TDC1000-GASEVM evaluation kit contains the following:
• On board TDC1000 (ultrasonic analog-front-end) and TDC7200 (time-to-digital converter)
• On board MPS430 microcontroller
• USB Mini-B to USB-A plug cable
The TDC1000-BSTEVM kit contains the following:
• On board LM2733XMF boost converter
• On board UCC27531 Gate drivers
• Connectors to plug into the TDC1000-GASEVM or TDC1000-TDC7200EVM
4
Software
The firmware and GUI is the same as the TDC1000-TDC7200 EVM. For detail information about the GUI
and troubleshooting the software, see the TDC100-TDC7200EVM User's Guide SNIU021.
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
5
Setup
5
www.ti.com
Setup
1.
2.
3.
4.
5.
6.
7.
Download TDC1000-TDC7200 Software (same software for TDC1000_GASEVM)
Install the GUI. For detailed information, see Section 6.
Connect TDC1000-BSTEVM to TDC1000-GASEVM
Connect a gas pipe transducers to the TDC1000-BSTEVM
Connect the EVM board to the computer with a USB cable (J2).
Launch the GUI. See Section 8
On the GUI's “SETUP” tab, select the "TDC1000-HV Boost Power Enable", “TDC1000-HV Driver EN1”
and/or “TDC1000-HV Driver EN2” depending on which TX port your transducer is connected to.
8. On the “GRAPH” tab, press the “START GRAPH” button.
9. Select an "EN period (us)" in that matches your excitation duration in μs. For instance if you are using
a 200Khz transducer with 10 excitation pulses the duration = (# pulses/Xmit freq)*1e6+30us or 80 us.
10. Run the GUI as explained in SNIA020
Figure 1. TDC1000-GASEVM
6
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Setup
www.ti.com
Figure 2. TDC1000-BSTEVM Board
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
7
Software Installation
www.ti.com
6
Software Installation
6.1
Graphical User Interface (GUI)
Installing the TDC1000-GASEVM GUI software:
1. Download the GUI http://www.ti.com/product/TDC1000/toolssoftware
2. Unzip the downloaded file into a known directory and run it
3. Follow the pop-up screen instructions. Click “Next” to install the software.
Figure 3. TDC1000-7200EVM Installation Directory
4. When the installation is done, click “Finish”.
8
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
TDC1000-BSTEVM Setup and Operation
www.ti.com
7
TDC1000-BSTEVM Setup and Operation
7.1
Connections
1. Connect the USB cable (J2) from the TDC1000-GASEVM to the PC.
2. Plug the TDC1000-BSTEVM (HV board) into the TDC1000-GASEVM (see Figure 4).
3. Attach the transducer wires to the connectors J1 and J2 on the HV board.
On the TDC1000-GASEVM, make sure the following jumpers are in place.
1. JP1: TDC7200 - connect pin 1 to pin 2 (via a jumper)
2. JP2: CPU - connect pin 1 to pin 2 (via a jumper)
3. JP3: TDC1000 - connect pin 1 to pin 2
4. JP4: VIO - connect pin 1 to pin 2
5. JP5: Trigger - connect pin 2 to pin 3
6. JP6: CLOCK - connect pin 5 to pin 6
Figure 4. TDC1000-BSTEVM Plugged into TDC1000-TDC7200EVM
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
9
Launching the Software
8
www.ti.com
Launching the Software
1. The TDC1000_TDC7200EVM GUI software can be run by clicking on Start >> All Programs >>
Texas Instruments >> TDC1000_7200.
2. See TDC100-TDC7200EVM_Users_Manual (SNIA020) on how to use the GUI
3. When using the HV board: Go to the “SETUP” tab on the TDC1000-7200EVM GUI and select
"TDC1000-HV Boost Power Enable" to enable the 30V boost supply. The supply will remain on
constantly (Always ON) unless a different time period is selected via the pulldown box. The capacity to
reduce the Boost power supply active time is to enable very low power applications testing so the
BOOST supply is only active during the measurement cycle time. Next make sure to select either
“TDC1000-HV Driver EN1” or “TDC1000-HV Driver EN2” -- or both of them by checking the respective
box.
(a) Select an "EN period (us)" in µs. This is the time the EN will stay HIGH after the START pulse of
the EVM. EN will go high about 30 µs before START to ensure that the driver ICs on the HV
interface board are powered up in time for the first Tx pulses. Example: If you choose an EN period
of 40 µs (default = 30 µs), you will see a EN pulse with the length of 70 µs, because it consists of
the constant 30 µs before the START signal plus whatever you choose for EN period.
(b) A longer EN period can be used to dampen the oscillation of the ultrasonic transducers. After the
last Tx pulse, the output of the driver IC will be pulled to ground via the 110-Ω resistor that is on the
board until the voltage on the VDD pin drops below about 3 V.
4. You can set the “EN period” for EN1 and EN2 separately, but whichever is higher will be applied to
BOTH enables if EN1 and EN2 are checked.
5. If you choose to use one channel with 5V pulses and the other with 30V, you can bypass the HV driver
of Channel 2. Make sure to uncheck the box "TDC1000-HV Driver EN2" in the GUI and to also place
the jumper JP1 on the HV board to "LV" for low voltage.
10
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Launching the Software
www.ti.com
Figure 5. SETUP Tab in TDC1000-TDC7200EVM
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
11
Launching the Software
www.ti.com
Figure 6. Top to Bottom:
START Pulse,
Voltage on VDD Pin of UCC Driver,
Voltage Across Connector J1,
EN1 Signal on Oscilloscope
6. Observe the following signals: TDC1000's START (dark blue) on the TDC1000-GASEVM, VDD of
driver IC U2(light blue) on the HV board, transmit pulses on transducer connector J1 (green) and EN1
(pink) signals on the oscilloscope as shown in Figure 6. This shows that the VDD of the driver is turned
on in time and long enough for this number of pulses. If the last pulses are reduced in amplitude,
increase EN period in the “SETUP” tab of the GUI.
7. EN signal should go high about 30µs before START goes high.
8. Observe Tx pulses and voltage at the output of the high voltage drivers as shown in Figure 7. Tx and
transducer voltage at connectors J1/2 should be in phase. Tx should have an amplitude of 3.7Vpk-pk
and transducer voltage 30Vpk-pk.
12
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Launching the Software
www.ti.com
Figure 7. Top to Bottom:
TDC1000's START Pulse (Dark Blue),
TDC1000's Tx Signal (Light Blue),
and the Boosted 30 V of TD1000's Tx Signal (Green)
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
13
Clock Selection
9
www.ti.com
Clock Selection
In order to excite the transducer with its resonant frequency and to achieve the maximum energy transfer
and therefore generate a big echo, the EVM allows you to apply the external clock, use the onboard
oscillator, or to use the CPU clock.
For gas flow applications, we recommend using the CPU clock. The steps to select the CPU clock can be
seen in the following subsections.
9.1
Steps to Select the CPU Clock
1. On the TDC1000-GASEVM, place the JP6 Jumper on the CPU position
Figure 8. Place Jumper on JP6 to Use the CPU Clock
14
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Clock Selection
www.ti.com
2. Select CPU_CLK on the SETUP tap of the GUI. A message will pop up. Click "OK".
Figure 9. Select CPU-CLK
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
15
Clock Selection
www.ti.com
3. Check the CPU-CLK EN box and Select desired frequency from the drop down menu.
Figure 10. Clock Options
4. In the GUI and on the TDC1000 tab, select a clock divider from the TX_FREQ_DIV register. Note the
transducer's resonant frequency = (external clock) / (TX_FREQ_DIV). For example, if the transducer's
resonant frequency is 500kHz, and a CPU clock of 2MHz is chosen, then the TX_FREQ_DIV needs to
be 4. Figure 11 shows possible excitation pulses using the CPU clock or on-board oscillator of 8MHz.
16
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Possible Excitation Pulses
www.ti.com
10
Possible Excitation Pulses
TX-Frequency
Division
CPU Clock (Hz)
On Board
Oscilator
8,000,000
1,000,000
1,043,500
1,090,900
1,142,900
1,200,000
1,263,200
1,333,300
1,411,800
1,500,000
1,600,000
1,714,300
1,846,200
2,000,000
2
4,000,000
500,000
521,750
545,450
571,450
600,000
631,600
666,650
705,900
750,000
800,000
857,150
923,100
1,000,000
4
2,000,000
250,000
260,875
272,725
285,725
300,000
315,800
333,325
352,950
375,000
400,000
428,575
461,550
500,000
8
1,000,000
125,000
130,438
136,363
142,863
150,000
157,900
166,663
176,475
187,500
200,000
214,288
230,775
250,000
16
500,000
62,500
65,219
68,181
71,431
75,000
78,950
83,331
88,238
93,750
100,000
107,144
115,388
125,000
32
250,000
31,250
32,609
34,091
35,716
37,500
39,475
41,666
44,119
46,875
50,000
53,572
57,694
62,500
64
125,000
15,625
16,305
17,045
17,858
18,750
19,738
20,833
22,059
23,438
25,000
26,786
28,847
31,250
128
62,500
7,813
8,152
8,523
8,929
9,375
9,869
10,416
11,030
11,719
12,500
13,393
14,423
15,625
256
31,250
3,906
4,076
4,261
4,464
4,688
4,934
5,208
5,515
5,859
6,250
6,696
7,212
7,813
Figure 11. Excitation Pulses Chart
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
17
Troubleshooting
11
www.ti.com
Troubleshooting
11.1 Boost converter
The DC/DC converter on the HV board is a LM2733X 1.6 MHz boost converter with integrated switch.
Test point TP2 should show a voltage of 30 V. If this is not the case, check if TP3 shows the required
input voltage of 5 V.
11.2 Jumper
Table 1. Jumper
JUMPERS
JP1
DESCRIPTION
Tx2 voltage selector: bypass HV driver when placed in “LV” position
For default operation (use high voltage for both channels), place jumper on the following:
1. JP1.P2 and JP1.P3 – HV
Figure 12. Jumper
When placing the jumper in LV position (on pins 1 and 2), “TDC1000-HV Driver EN2” should be
unchecked in the GUI. Otherwise the UCC27531 will pull its output to ground.
18
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Troubleshooting
www.ti.com
11.3 Firmware Upgrade
Note: This section is only necessary if the firmware needs to be changed. The TDC1000-TDC7200EVM
comes pre-loaded with firmware already. The HV board needs firmware TDC1000_7200_FW-v1.16-1MHz
or newer.
To change the firmware, complete the following steps:
1. Connect the TDC1000-TDC7200EVM to a PC.
2. Open the TDC1000-7200EVM GUI then go to the “DEBUG” tab. Press “OK” if a connection error
window pops up. Click on the Update Firmware button.
Figure 13. Connection Error Pop-up Window
3. The MSP430 USB Firmware Upgrade windows will pop up. Click “Next” to proceed on the first prompt.
Read and accept the license agreement and click “Next” to continue.
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
19
Troubleshooting
www.ti.com
Figure 14. USB Firmware Upgrade Window
1. Disconnect and reconnect the LaunchPad to PC while holding the BSL button down.
2. Select the Select Firmware button and browse to the firmware file.
3. Click on the Upgrade Firmware button to program the EVM. Close the application when done and
restart the TDC1000_7200EVM GUI.
20
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
TDC1000-GASEVM Board Layout
www.ti.com
12
TDC1000-GASEVM Board Layout
Figure 15. Top Overlay
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
21
TDC1000-GASEVM Board Layout
www.ti.com
Figure 16. Top Solder Mask
22
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
TDC1000-GASEVM Board Layout
www.ti.com
Figure 17. Top Layer
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
23
TDC1000-GASEVM Board Layout
www.ti.com
Figure 18. Mid Layer 1
24
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
TDC1000-GASEVM Board Layout
www.ti.com
Figure 19. Mid Layer 2
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
25
TDC1000-GASEVM Board Layout
www.ti.com
Figure 20. Bottom Layer
26
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
TDC1000-GASEVM Board Layout
www.ti.com
Figure 21. Bottom Solder Mask
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
27
TDC1000-GASEVM Board Layout
www.ti.com
Figure 22. Board Dimensions
28
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
TDC1000-GASEVM Schematic
www.ti.com
TDC1000-GASEVM Schematic
1
V3p3
V3p3
TX2
200
R31
R32
TX1
C25
0.01µF
VCOM
C26
0.1µF
GND
START
TP9
DNP
C28
R35
10.0Meg
V3p3
1.00k
510pF
C32
510pF
GND
START
VDD
Y0
CLKIN
Y1
NC
NC
V3p3
2
C33
0.01µF
GND
R29
33
5
7
J3
GND
1
STOP_OUT
142-0701-201
4
Buffered STOP and START traces
from the buffers to the connectors
must be completely symmetrical to
avoid introducing timing delay
DNP
U8
1
C27
R34
0.01µF
1G
TP5
TDC1000_MCU_STOP
8
GND
6
VCOM
Y1
3
CDCLVC1102PW
V3p3
5.36k
200
CLKIN
Y0
NC
NC
2
R30
VDD
2
3
4
5
Directly connected STOP and START traces from
TDC71000 to TDC7200 must be completely
symmetrical and as short as possible to avoid
introducing timing delay
6
STOP
TP6
U7
V3p3
Buffered STOP and START traces
from the buffers to the MCU must
be completely symmetrical to avoid
introducing timing delay
C34
0.1µF
1G
GND
3
GND
TP7
TDC1000_MCU_START
TP8
V5p0
R33
8
33
5
7
J4
C30
0.1µF
C31
1µF
DNP
142-0701-201
4
C29
0.1µF
GND
1
START_OUT
2
3
4
5
13
GND
CDCLVC1102PW
GND
GND
R36
10.0Meg
GND
GND
STOP
C35
C36
COMPIN
START
STOP
RTD2
RTD1
14
R38
1.00k
13
GND
10pF
5600pF
R37
Interstage Passive Filters:
Configured for 1MHz
1.00k
5
4
7
6
27
28
C40
0.01µF
V3p3
DNP
EP
TP13
EN
TRIGGER
RESET
CHSEL
ERRB
C41
0.1µF
TDC1000_ERRB
C39
TDC1000_CHSEL
10pF
VIO
FB3
60 ohm
R45 33
MSP430_TRIGGER
9
R47
10.0k
V5p0
3
V+
V-
1
TP16
0
GND
C47
BUFF_PGAR46
50
CPU_CMP_OUT
10pF
J7
5
1
142-0701-201
TP17
DNP
R43
GND
U12
LMH6601MG
4
COMPIN
JP5
TRIGGER_SOURCE_SEL
0
RX2
TDC7200_TRIGGER
TDC1000_ENABLE
R42
TPD8E003DQDR
TP15
V5p0
CLK
SPI_MISO
SPI_MOSI
RX1
TDC1000_RESET
TRIGGER_IN
C/R42& 42 must be close to TDC1000
SPI_SCLK
RX pins. Place minimal parasitic
TDC1000_SPI_CSB
capacitances onto RX1&RX2
TDC1000_CHSEL
GPIO7
GPIO6
GPIO5
R44
1.00k
DNP
GND
6
GND
1
2
GND
5
6
7
8
GND
DNP
TP14
SH-JP4 VIO
IO5
IO6
IO7
IO8
VCOM_OUT
2
PGAIN
LNAOUT
PGAOUT
COMPIN
STOP
TX1
RX2
GND
TP12
GND
3
2
1
IO1
IO2
IO3
IO4
TP18
GND
JP4
1
2
3
4
5
50
SH-JP3 VDD
GPIO7
GPIO6
TDC1000_CHSEL
USB_5V
U11
GPIO4
GPIO3
GPIO2
GPIO1
TP10
R39
1
V3p3
R53
10.0k
GND
GND
GND
VDD_TDC1000 FB2
1
2
60 ohm
PPPC052LJBN-RC
Pin 1 and pin 10 of the connector
must be marked on the PC board
3
GND
COMPIN_OUT
DNP
2
3
4
5
1
3
5
7
9
R40
V+
V-
2
2
4
6
8
10
TX2
6
JP3
J6
GPIO5
GPIO4
GPIO3
GPIO2
GPIO1
VCOM
26
GND
15
16
17
11
12
RTD1
RTD2
23
24
SSW-107-02-G-D-RA
RX1
C38
0.1µF
CLKIN
C37
0.01µF
2
C46
10µF
AVDD
1
TX1/RX2 or RX2
25
R52
DNP
0
U9
LMH6601MG
4
V5p0
SDO
SDI
SCLK
CSB
TX1/RX2 or TX1
U10
TDC1000PW
10.0k
Place filter caps
to VDD pins
Place the ground TP
close to VDD jumper
JP
AVDD
TP11
21
20
18
19
TX2/RX1or RX1
VIO
14
12
10
8
6
4
2
VDD
VDD
13
11
9
7
5
3
1
VCOM
R41
DNP
0
J5
GND
START
TX2/RX1or TX2
RTD1
RTD2
RREF
GND
22
Pin 1 and pin 14 of the connector
must be marked on the PC board
3
8
9
10
V5p0
All the labels appearing on pin 2, 4, 6, 8, 10,
12 and 14 must be marked on the PC board
SH-JP5
GND
V3p3
Y2
FB4
4
60 ohm
C44
0.01µF
C45
0.1µF
1
OSC_ENABLE
VDD
OUT
3 OSC_OUT
STANDBY
GND
2
SG-210STF13.000000MHZS
13 MHz
GND
GND
R48
33
SH-JP6
CPU_CLK_OUT
J8
R49
1
EXT_OSC
2
3
4
5
142-0701-201
GND
R50
51.1
0
ExtClock
6
4
2
5
3
1
JP6
OSC_SOURCE_SEL
CLK
Component value = DNP means do not populate
GND
Figure 23. TDC1000-GASEVM Schematic 1
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
29
TDC1000-GASEVM Schematic
www.ti.com
Place the TP close to the
TDC7200 Power JP
SH-JP1
JP1
TP1
2
1
GND
V3p3
FB1
60 ohm
Place caps close
to the pin
GND
C2
0.1µF
GND
U1
6
SPI_SCLK
V3p3
SPI_MOSI
R2
10.0k
MSP_TDC_INT
DNP TP19
SPI_MISO
TP2
DNP TP20
DNP TP21
10
R1
33
TDC7200_SPI_CSB
DNP
MSP_TDC7200_EN
12
9
11
8
DNP TP3
1
FLAG
VDD
SCLK
VREG
DIN
DOUT
CS
INT
ENABLE
CLOCK
STOP
START
TRIGG
GND
14
VDD_TDC7200
C1
0.01µF
Place cap close
to the pin
13
5
CLK
4
STOP
3
2
7
C3
1µF
GND
START
R3
33
TDC7200_TRIGGER
TDC7200PW
R4
DNP
CPU_CLK
GND
Component value = DNP means do not populate
Figure 24. TDC1000-GASEVM Schematic 2
30
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
TDC1000-GASEVM Schematic
www.ti.com
STOP is connected to TA0.0, as this has quickest
responding ISR. In this way STOP pulses can be
closer together.
START is connected to TA0.1, which is slower.
This produces a delay to timestamp, but this can
be compensated.
TRIGGER is on TA0.2, used to reset counter so
there are no rollover issues.
U2
18
19
20
21
22
23
24
25
TDC1000_MCU_STOP
TDC1000_MCU_START
MSP430_TRIGGER
AFE SPI uses MCU
GPIO7
USCI_B0 SPI
MSP_TDC_INT
OSC_ENABLE
SPI_MOSI
SPI_MISO
SPI_SCLK
Place holes on the SPI
lines for probing
R6
33
CPU_MOSI
R7
33
CPU_SCLK
34
35
36
37
38
GPIO6
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
R11
DNP
2
4
R13
1
3
G
G
ABMM-24.000MHZ-B2-T
24.000MHz
GND
9
10
57
58
12
13
0
C6
30pF
DP
DM
C7
30pF
GND
V3p3
V18
VCORE
VUSB
JP2
C8
0.22µF
GND
50
52
C10
0.47µF
GND
51
PUR
V18
VCORE
55
17
V18
VCORE
VBUS
VUSB
53
54
11
15
40
GND
C12
0.1µF
SH-JP2
C14
0.1µF
MSP_TDC7200_EN
TDC1000_ENABLE
TDC1000_CHSEL
TDC1000_RESET
TDC1000_ERRB
CPU_CLK_OUT
TDC7200_SPI_CSB
TDC1000_SPI_CSB
33.0
LINK
R9
261
GPIO5
D2
R8
DNP
CPU_CMP
PEAK_DET
Place Cap as
close as possible DNPC5
to the MCU pin
Green
261
D3
CPU_CMP_OUT
Choose proper resistor
values to comply with
the MSP430 ADC input
requirements
R10
DNP
MEAS
R12
GND
Orange
GND
EN_EX_VDD
EX_VDD_FAULTB
JTAG Programming Interface
J1
V3p3
GND
JTAG_TDO
JTAG_TDI
JTAG_TMS
JTAG_TCK
RST/NMI/SBWTDIO
TEST/SBWTCK
64
59
JTAG_RST
JTAG_TEST
R14
33k
V3p3
JTAG_TEST
R15
0
14
12
10
8
6
4
2
R16
65
49
14
56
16
39
QFN PAD
VSSU
AVSS1
AVSS2
DVSS1
DVSS2
R5
GND
60
61
62
63
AVCC1
DVCC1
DVCC2
DNP
1N4148W-7-F
DNPC4
CPU_CMP
GPIO3
GPIO4
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
VBUS
VUSB
D1
PEAK_DET
GPIO1
GPIO2
1
2
3
4
5
6
7
8
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
PU.0/DP
PU.1/DM
PUR
1
2
C11
0.22µF
P5.0/A8/VREF+/VEREF+
P5.1/A9/VREF-/VEREFP5.2/XT2IN
P5.3/XT2OUT
P5.4/XIN
P5.5/XOUT
R51
41
42
43
44
45
46
47
48
P4.0/PM_UCB1STE/PM_UCA1CLK
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P4.3/PM_UCB1CLK/PM_UCA1STE
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P4.6/PM_NONE
P4.7/PM_NONE
CPU_CLK
Y1
26
27
28
29
30
31
32
33
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UCB0STE/UCA0CLK
13
11
9
7
5
3
1
DNP
JTAG_RST
JTAG_TCK
JTAG_TMS
JTAG_TDI
JTAG_TDO
GND
TSW-107-07-G-D
0
C9
2200pF
MSP430F5528IRGC
C13
0.1µF
GND
GND
GND
GND
GND
AVDD
R17
51.1k
U3
3
USB Physical Interface
V5p0
4
Radj
C15
ON/OFF
R18
102k
GND
TP4
V5p0
U4
5
VOUT
1
IN
OUT
FAULT
ILIM
6
USB_5V
9
8
ADJ
6.8pF
1
33
33
J2
651-305-142-821
1
2
3
4
5
R21
R22
R19
1.0k
1
2
6
C19
0.1µF
IO1
IO2
VCC
IO3
IO4
GND
4
5
LP2980IM5X-ADJ
3
EN
GND
5
R20
240k
2
TPS2553DBV-1
GND
GND
V3p3
GND
V3p3
R26
33k
GND
GND
R25
1.0Meg
EX_VDD_FAULTB
1
BSL
VBUS
VUSB
2
C20
220pF
744043220
GND
D5
1SMB5922BT3G
7.5V
C22
22µF
GND
GND
GND
U6
LP2985AIM5-3.3/NOPB
L1
SW1
TPD4E004DRYR
GND
C23
1µF
C17
1µF
R23
100k
GND
3
R28
1.2M
GND
4
C18
10µF
D4
Green
6
7
PUR
GND
GND
Board Power
R24
1.5k
U5
VIN
1
IN
3
ON/OFF
R27
OUT
5
CBYP
4
EN_EX_VDD
0
C21
2.2µF
GND
2
VBUS
DM
DP
C16
2.2µF
2
C24
0.01µF
GND
GND
GND
GND
GND
GND
Component value = DNP means do not populate
Figure 25. TDC1000-GASEVM Schematic 3
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
31
TDC1000-BSTEVM Board Layout
14
www.ti.com
TDC1000-BSTEVM Board Layout
Figure 26. BSTEVM Layout
32
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
BSTEVM Schematic
www.ti.com
BSTEVM Schematic
TP2
AVDD
TP3
AVDD
TP1
GND
TP5
GND
30V
Channel 1 TX1 / RX2
Channel 2 TX2 / RX1
R13
30V
U2
SD103AWS-TP
D1
L1
5V
R3
51.1k
EN_Boost
DNP
R4 100
C3
4.7µF
4
3
VIN
SW
FB
SHDN
GND
1
1
R1
3
316k
C2
4.7µF
C12
0.1µF
LMR64010 is pin compatable
OUTH
6
EN
OUTL
5
110
GND
Tx1
68pF
R2
13.3k
GND
2
IN
GND
3
1
OUTH
6
5
R22
EN
OUTL
R20
10k
2
IN
GND
4
JP1
1
DNP
Tx2 2
Tx2_IN 3
GND
2
GND
1.00k
R23
UCC27531DBVR
GND
Rx1
AVDD
D3
BAS40-04-7-F
110
UCC27531DBVR
GND
300
C10
2000pF
1
GND
Tx2_IN
Transducer_1
VDD
R21 110
C9
0.1µF
GND
OUT1
J1
1.00k
2
DNP
R24
GND
GND
Vdd2
2
1
4
R9
10k
GND
AVDD
D2
BAS40-04-7-F
R12
R18
U3
1
C1
2
LM2733XMF
VDD
Rx2
300
C7
2000pF
R11 110
EN uses internal pull-up
C5
0.1µF
10 uH
U1
5
Vdd1
GND
3
GND
L2
EN uses internal pull-up
3
15
OUT2
J2
1
2
Transducer_2
TSW-103-07-G-S
GND
HV bypass
GND
GND
SH-JP1
30V
30V
J3
Tx2
Rx1
Tx1
Rx2
AVDD
RTD1
RTD2
C6
1µF
Vdd1
GND
J4
Vdd1_EN
GPIO6
TDC1000_CHSEL
USB_5V
R16
10k
C4
R15
51.1k
3
R5
10k
GND
C8
R7
DNP
100k
R14
10k
100pF
Q3
2N7002-7-F
Vdd2_EN1
R17
DNP
100k
2
Q1
2N7002-7-F
Vdd1_EN1
Q4
BSS84-7-F
1
100pF
2
GND
R19
DNP
0
3
R6
51.1k
GND
Q2
BSS84-7-F
1
3
1
3
5
7
9
Vdd2
R10
DNP
0
2
R8
10k
GND
Vdd2_EN 2
GPIO4
4
GPIO3
6
GPIO2
8
EN_Boost 10
C11
1µF
2
14
12
10
8
6
4
2
3
13
11
9
7
5
3
1
GND
GND
GND
Figure 27. TDC1000-BSTEVM
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
TDC1000-GASEVM and TDC1000-BSTEVM Kit User’s Guide
Copyright © 2015, Texas Instruments Incorporated
33
Revision History
www.ti.com
Revision History
Changes from Original (March 2015) to A Revision ....................................................................................................... Page
•
•
•
Changed SETUP Tab..................................................................................................................... 3
Changed SETUP Tab ................................................................................................................... 11
Changed Schematic ..................................................................................................................... 29
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
34
Revision History
SNIU026A – March 2015 – Revised December 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
SPACER
SPACER
SPACER
SPACER
SPACER
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
SPACER
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
spacer
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
