TLV320AIC3263EVM-U Evaluation Module
User's Guide
Literature Number: SLAU528
June 2013
Contents
1
EVM Overview
1.1
1.2
1.3
2
.................................................................................................................... 4
Features ...................................................................................................................... 4
Introduction .................................................................................................................. 4
Getting Started .............................................................................................................. 4
AIC3263 CC Software
2.1
2.2
........................................................................................................... 5
Installation ....................................................................................................................
Graphical User Interface (GUI) ............................................................................................
2.2.1 Main panel window ................................................................................................
2.2.2 Typical Configuration ..............................................................................................
2.2.3 Command Line Interface Panel ..................................................................................
2.2.4 Register Inspector ..................................................................................................
5
6
6
6
8
9
A
TLV320AIC3263EVM-U Default Jumper Locations .................................................................. 11
B
TLV320AIC3263EVM-U EVM Schematics
E
..............................................................................
TLV320AIC3263EVM-U EVM Layout Views ............................................................................
TLV320AIC3263EVM-U Bill of Materials ................................................................................
Writing Scripts ..................................................................................................................
2
Contents
C
D
13
19
22
28
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List of Figures
2-1.
Main Panel ................................................................................................................... 6
2-2.
.........................................................................................
Analog Outputs Window ...................................................................................................
Command Line Window ....................................................................................................
Command Line Window ....................................................................................................
Register Inspector Window ................................................................................................
TLV320AIC3263YZF ......................................................................................................
TAS1020B USB Controller ...............................................................................................
Data, Sample Rate Converter ...........................................................................................
Data and Clocks ...........................................................................................................
LDO Supplies, Analog Supplies, Digital Supplies, and Analog Inputs..............................................
Headphone Amplifier, Class D Amplifier, and Receiver Amplifier...................................................
Digital .......................................................................................................................
Analog and Digital Interface Connectors ...............................................................................
Silkscreen Top .............................................................................................................
Silkscreen Bottom .........................................................................................................
Routing ......................................................................................................................
2-3.
2-4.
2-5.
2-6.
B-1.
B-2.
B-3.
B-4.
B-5.
B-6.
B-7.
B-8.
C-1.
C-2.
C-3.
Example Configurations Window
7
7
8
9
9
13
14
14
15
16
17
18
18
19
20
21
PurePath is a trademark of Texas Instruments.
Windows is a registered trademark of Microsoft Corporation.
I2C is a trademark of Philips Semiconductor Corp.
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List of Figures
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3
Chapter 1
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EVM Overview
This user’s guide describes the operation, use, features and characteristics of the TLV320AIC3263EVM-U.
1.1
Features
•
•
•
1.2
Full featured EVM with the TLV320AIC3263 Audio Codec
USB connection to PC provides power, control and streaming audio for quick evaluation
Easy-to-use AIC3263 Codec Control (CC) software provides graphical user interface to configure and
control AIC3263
Introduction
This specific evaluation module (EVM) is a programmable USB audio device that features the
TLV320AIC3263 Audio Codec with miniDSP.
1.3
Getting Started
1. Download the CC software located in the EVM product folder on the web.
2. Connect the EVM to USB port, LED lights LED1 and LED2 should illuminate once the EVM is detected
by Windows® PC. Also, in the Windows Device Manager, the EVM should be recognized as a USB
composite device, a USB audio device and an HID-compliant device.
3. Connect the headphones to jack J14.
4. Open CodecControl.exe and click View → Example Configurations…
5. Select HP Playback and click ProgramCodec.
• The list of I2C™ commands for this configuration is available in the Script tab.
6. Play audio through any media tool. Make sure that the playback (and recording) device is USBminiEVM in the Windows control panel.
• To adjust playback volume, open Sound in control panel, select the USB-miniEVM device and click
properties.
• Similarly, the other example configurations can be tried and sound can be recorded using the
microphone available on the board.
7. Install jumpers on the EVM as per the requirements to make the right signal connections.
4
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Chapter 2
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AIC3263 CC Software
This section provides setup instructions for the AIC3262 EVM control software.
2.1
Installation
1.
2.
3.
4.
Download the AIC3263 EVM control software located in the TLV320AIC3263 product folder.
Open the self-extracting installation file, and extract contents to a known folder.
Install the software by double clicking the CodecControl.exe and follow the directions.
Connect the EVM to a USB port using a cable and open up the control software. If prompted, select
the appropriate EVM name.
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Graphical User Interface (GUI)
2.2
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Graphical User Interface (GUI)
2.2.1 Main panel window
Refresh button
Status
Figure 2-1. Main Panel
The main panel, shown in Figure 2-1, provides a high-level block diagram of AIC3263. On the main panel,
users can configure the analog input and output routings by simply clicking on the switches. The analog
setup, digital setup, audio inputs, audio outputs, DRC, AGC, SAR and headset detection provide
additional control of many registers and other features of the AIC3263. The user can click on the colored
blocks on the main panel to gain access to these categories (intended for advanced users). Left ADC and
Right ADC blocks provide the detailed settings for device analog input, whereas Left DAC and Right DAC
blocks provide the detailed settings for device analog output. The yellow block in the middle provides
settings for the digital interface.
The Refresh button on the top reads the current state of the AIC3263 register settings and reflects it on
the user interface. The EVM status, which reflects the hardware connection of the EVM, is shown on the
bottom of the main panel. USB Fs reflects the current sample rate of the EVM.
2.2.2 Typical Configuration
The AIC3263 control software provides example scripts for typical playback and record applications.
These configurations can be accessed by choosing Example Configurations… under View. Once the
typical configuration is selected, click ProgramCodec to download the script into the EVM.
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Graphical User Interface (GUI)
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Figure 2-2. Example Configurations Window
In Figure 2-3, the checked boxes show enabled functions after programming the HP Playback from the
above example configurations. Similarly, if the device is programmed using PurePath™ Studio (a tool for
programming TI miniDSP enabled devices), these window controls can be updated by pressing the
Refresh button in the control software.
Figure 2-3. Analog Outputs Window
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Graphical User Interface (GUI)
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2.2.3 Command Line Interface Panel
Figure 2-4. Command Line Window
The command-line interface allows users to communicate with the TLV320AIC3263 using a simple
scripting language (described in Appendix E). The TAS1020B USB controller handles all communication
between the PC and the codec. A script is loaded into the command buffer, either by loading a script file
using the Open button or by pasting text from the clipboard. Click Run to execute the command buffer.
All
•
•
•
controls update their status with respect to the register contents in the following conditions:
Whenever a panel is open by selecting from View menu
The Run button in the command-line interface is pressed
The Refresh button on the main panel window is pressed
The Decode function is a feature in the command-line interface. When the Decode button is clicked, the
script is decoded line by line, and the decoded content can be cleared by clicking ClearDecoded. This
decode feature provides users an easy method of understanding the script without referring to the register
map.
The Record function is another feature in the command-line interface. The command window records all
register writes sent to the codec when the Record box is checked. The recorded register values along with
their page numbers are displayed in the command buffer. The recorded register values can also be
decoded by clicking the Decode button on the command-line interface window. Pressing the Clear button
clears the content of the command buffer.
8
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Graphical User Interface (GUI)
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Figure 2-5. Command Line Window
2.2.4 Register Inspector
Figure 2-6. Register Inspector Window
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Graphical User Interface (GUI)
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The contents of the TLV320AIC3263 register map can be accessed through the Register Inspector. The
Page number control selects the page to be displayed in the register table. The register table contains
information such as register name, current register value and the bit field of the current register value.
Specify the page number when using the register inspector table. Once the page is specified, the register
value can then be inspected or changed by either entering the hex value of the register or changing the
corresponding bits for that register.
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Appendix A
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TLV320AIC3263EVM-U Default Jumper Locations
Jumper
Color
Position
W1
Red
Shorted
W2
Red
Shorted
W4
Red
Shorted
W5
Red
Shorted
W6
Red
Shorted
W7
Red
Shorted
W8
Red
Not_Installed
W9
Red
Shorted
JP1
Black
Not_Shorted
JP2
Black
Not_Shorted
JP7
Black
Not_Shorted
JP8
Black
Not_Shorted
JP9
Black
Not_Shorted
W10
Red
Shorted
W12
Red
Shorted
Shorted
W13
Red
JP10
Blue
Shorted
JP15
Blue
Not_Shorted
JP19
Black
Not_Shorted
JP20
Black
Shorted
JP24
Black
Not_Shorted
JP25
Black
Not_Shorted
JP26
Black
Not_Shorted
JP27
Black
Shorted
JP39
Black
Shorted
JP40
Black
Shorted
JP51
Black
Shorted
JP52
Black
Not_Shorted
JP60
Black
Shorted
JP61
Blue
Shorted
JP62
Blue
Not_Shorted
J1
Black
1-2
J2
Black
1-2
J17
Blue
2-3
J18
Blue
2-3
J19
Blue
2-3
J20
Blue
2-3
JP28
Blue
2-3
JP29
Blue
2-3
JP30
Blue
2-3
JP31
Blue
2-3
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Appendix A
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Jumper
12
Color
Position
JP32
Red
1-2
JP33
Black
Not_Shorted
JP34
Black
Not_Shorted
JP35
Blue
1-2
JP36
Blue
1-2
JP37
Red
1-2
JP38
Red
2-3
JP41
Blue
2-3
JP42
Blue
2-3
JP43
Blue
2-3
JP44
Blue
2-3
JP45
Blue
2-3
JP46
Blue
2-3
JP47
Blue
2-3
JP49
Blue
2-3
JP50
Red
1-2
JP53
Black
1-2
JP54
Black
1-2
JP55
Red
2-3
JP57
Red
1-2
JP58
Red
2-3
TLV320AIC3263EVM-U Default Jumper Locations
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Appendix B
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TLV320AIC3263EVM-U EVM Schematics
TAS1020B
USB CONTROLLER
AUDIO
I2C & SPI
CONTROL
I2C & SPI
CONTROL INTERFACE
TLV320AIC3263YZF
YZF 81 BALL, Top View
I2S #1
AUDIO INTERFACE
ASI#1
I2S #2
AUDIO INTERFACE
J
DIN1
WCLK1
DVDD
IOVSS
SDA
BCLK3
H
BCLK1
DOUT1
IOVDD1
SCL
GPIO5
IOVDD3
G
MCLK
GPIO1
GPIO2
RESETz
GPIO6
GPO1
F
IN2L
IN2R
AVDD_18
DVSS
E
IN3R
IN3L
AVSS
AVSS1
D
VREF_AUDIO VREF_SAR IN1L_AUX1
C
IN4L
AVDD1_18
B
MICDET
RECP
A
MBIAS_VDD RECVSS
1
2
MBIAS_EXT
RECM
RECVDD_33
3
I2C_ADDR/
SPI_SELECT
SCLK
AVSS3
DVSS
HPVSS_
SENSE
LOR
VBAT
DVSS
AVDD4_18
LOL
CPVSS
5
BCLK2
DVSS
HPL
CPFCM
6
SPKM
SPK_V
CPFCP
SVDD
SVSS
CPVDD_18
AVSS4
SPKP
7
8
B
A
ASI#2
9
I2S #3
AUDIO INTERFACE
ASI#3
OPTICAL
AUDIO INPUT
I2C
SRC4392
IOVDD2
IOVSS
GPIO4
AVDD2_18
VNEG
DIN2
DOUT2
MBIAS
4
DIN3
DOUT3
DVDD
GPIO3
IN4R
HPR
WCLK2
DVDD
AVSS2
IN1R_AUX2
HPVDD_18
WCLK3
B
SRC #1
OPTICAL
AUDIO OUTPUT
OPTICAL
AUDIO INPUT
I2C
SRC4392
A
SRC #2
OPTICAL
AUDIO OUTPUT
6 WIRE
AUDIO I/F
ANALOG
OUTPUTS
ANALOG
INPUTS
Figure B-1. TLV320AIC3263YZF
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Appendix B
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+3.3VIO
Y1
4
+3.3VIO
1
2
3
C28
GND
120TAIL
SIT8002AI-13-33E-6.00000T
C24
0.1ufd/16V
JP10
R103
R121
2
JP61
7
3
2
GND
GND
GND
6
4
1
1
8
2
1
0.1ufd/16V
R87
2.7K/5% 2.7K/5%
4.7K/5%
U44
4.7K/5%
R88
6MHz/3.3V
TAS_SCL
5
TAS_SDA
24FC512-I/MF
GND
+3.3VIO
+3.3VIO
512K
U9
C27
5
GND
2
U35
0.1ufd/16V
3
TAS_MCLK
4
ASI_S1
SN74LVC1G126DBVR
TAS_DIN
GND
C102
C103
1000pfd/50V
100pfd/50V
TAS_BCLK
+3.3VIO
GND
GNDGND
GND
5
8
4
9
3
10
2
11
1
GND
0.1ufd/16V
7
R1
R2
46
45
44
42
34
33
0.1ufd/16V
14
4
13
5
12
6
11
7
10
8
9
R28
10K/5%
0.1ufd/16V
ASI_S0
R29
10K/5%
GND
SN74CBTLV3253DBQR
GND
GND
C26
TAS_MISO
GND
TAS_MOSI
30
8
29
TAS_SSz
9
28
TAS_SCLK
10
27
C2
15
3
I2S1_DOUT
TAS_WCLK
31
U2
2
I2S3_DOUT_SRC
+3.3VIO
32
TAS1020BPFB
16
I2S2_DOUT_SRC
TAS_DOUT
37
35
UX60-MB-5ST
C1
38
5
+3.3VIO
47pfd/50V
39
2
7
27.4
40
36
6
+5V
41
4
R3
C23
47pfd/50V
11
USB MINIB
GND
26
12
0.1ufd/16V
GND
43
3
1.50K
27.4
47
GND
C25
J12
6
48
1
GND
R63
GND
USB INPUT
C41
1
GND
1
GND
GND
GND
120TAIL
I2S_ENABLE
25
+3.3VIO
13
GND GND
14
15
16
17
18
19
20
21
22
23
24
R7
1
10K/5%
GND
2
R4
100K
USB RESET
JP15
2
C7
1
RESETz
1.0ufd/16V
+3.3VIO
GND
R9
R10
120TAIL
C29
DUT_RESETz
0.1ufd/16V
GND
Yellow/2.0V
10K/5% 10K/5% 10K/5%
R8
LED1
LED2
S4
Yellow/2.0V
R59
R58
649
GND
649
PATCH
2
GND
1
S1
APP
1
2
GND
+3.3VIO
S2
DUT RESET
2
GND
1
S3
GND
C85
C84
GND
0.1ufd/50V
0.1ufd/50V
0.1ufd/50V
C86
GND
Figure B-2. TAS1020B USB Controller
IOVD1
+3.3VIO
U47
14
13
0.1ufd/16V
I2S1_DOUT
12
11
10
9
+3.3VIO
10K/5%
8
R116
VCCB
VCCA
B1
A1
B2
A2
A3
B3
B4
A4
NC
NC
OE
GND
0.1ufd/16V
1
2
GND
GND
C186
DOUT1
C187
3
DIN1
4
WCLK1
5
BCLK1
6
7
TXS0104EPWR
GND
I2S3_DOUT_SRC
IOVD2
+3.3VIO
+3.3VIO
13
0.1ufd/16V
I2S2_DOUT_SRC
12
11
TAS_DIN
10
TAS_WCLK
9
TAS_BCLK
+3.3VIO
R43
10K/5%
8
B1
A1
B2
A2
B3
A3
B4
2
NC
OE
GND
GND
C38
12
11
WCLK2
5
10
BCLK2
9
6
+3.3VIO
7
C90
36
2
35
3
34
3
GND
INPUT
10ufd/6.3V
A4
NC
NC
OE
GND
DIN3
DOUT3
WCLK3
BCLK3
6
7
2
C42
Vcc
+3.3VIO
GND
OUT
0.1ufd/16V
GND GND
1
R18
0.1ufd/16V
GND
C88
GND
38
37
41
40
39
44
GND
C10
10ufd/6.3V
VCC
GND
SHIELD
TOTX147PL
43
2
1
0
U19
42
38
37
41
40
39
44
43
42
45
48
47
VCC
C18
0.1ufd/16V
B4
C44
5
TXS0104EPWR
0
GND
1
C11
SHIELD
R16
U18
GND
3
+3.3VIO
0.1ufd/16V
GND
47
GND
46
1
46
GND
OUT
0.1ufd/16V
45
SHIELD
A3
4
0.1ufd/16V
1
36
2
35
3
34
3
C19
0.1ufd/16V
GND
INPUT
2
GND
C35
Vcc
GND
B3
3
TORX147PL(F,T)
48
2
A2
U16
0
GND
C9
A1
B2
2
GND
R17
GND
GND
3
C89
10ufd/6.3V
B1
0.1ufd/16V
1
VCCA
C185
10ufd/6.3V
10ufd/6.3V
U15
8
VCCB
GND
TORX147PL(F,T)
0
R115
10K/5%
+3.3VIO
+3.3VIO
GND
R15
13
DOUT2
4
+3.3VIO
C184
14
0.1ufd/16V
DIN2
TXS0104EPWR
+3.3VIO
U23
C45
3
A4
NC
0.1ufd/16V
1
VCCA
VCCB
GND
GND
14
GND
IOVD3
U22
C39
1
C91
C12
SHIELD
0.1ufd/16V
10ufd/6.3V
TOTX147PL
GND
GND
+3.3VIO
4
+3.3VIO
33
4
1k
GND
GND
R62
GND
29
28
23
GND
SRC2_MCLK
24
20
17
18
21
25
22
26
12
19
27
11
13
10
SRC2_LOCKz
SRC2_RXCXO
GND
30
9
SRC1_MCLK
R24 R25
GND
GND
1k
SRC2_RDYz
R60
GND
4.7K/5%
GND
GND
8
10K/5%
GND
SRC1_RDYz
SRC1_MCLK
24
23
R23
0.1ufd/16V
C43
0.1ufd/16V
31
SRC4392IPFBR
7
C40
GND
4.7K/5%
20
21
19
22
25
17
26
12
18
27
11
16
10
14
SRC2_MCLK
28
13
SRC1_LOCKz
SRC1_RXCXO
9
15
GND
GND
GND
29
32
6
C100
GND
10ufd/6.3V
8
14
30
0.1ufd/16V
15
SRC4392IPFBR
7
GND
C31
0.1ufd/16V
31
6
C94
U14
5
C30
32
16
U12
5
10ufd/6.3V
33
+3.3VIO
+3.3VIO
+3.3VIO
+3.3VIO
+1.8VIO
+1.8VIO
C21
C16
0.1ufd/16V
0.1ufd/16V
GND
GND
TAS_SCL
TAS_SDA
RESETz
Figure B-3. Data, Sample Rate Converter
14
TLV320AIC3263EVM-U EVM Schematics
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Appendix B
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DATA
CLOCKS
+3.3VIO
U36
TAS_MCLK
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
GND
C57
1
GND
SRC1_MCLK_S1
0.1ufd/16V
SRC1_MCLK_S0
R39
10K/5%
10K/5%
R38
GND
3
GND
2A
VCC
2Y
6
5
Green/2.0V
LED3
4
357
R64
SRC2_RDYz
2
3
1A
GND
2A
LED4
1Y
VCC
2Y
5
4
Green/2.0V
LED5
R52
357
1
4
2
3
C51
Green/2.0V
C55
SM7745HSV-22.5792M
22.5792MHz
R66
357
357
C52
0.1ufd/16V
+3.3VIO 10K/5%
R65
6
GND
2
1Y
1
SRC2_LOCKz
GND
GND
SRC1_RDYz
1A
R69
GND
1
SRC1_LOCKz
OSC2
U27
LED8
GND
GND
0.1ufd/16V
SN74LVC2G17DBVR
U25
GND
+3.3VIO
+3.3VIO
+3.3VIO
SN74LVC2G17DBVR
SN74CBTLV3253DBQR
GND
+3.3VIO10K/5%
Green/2.0V
SRC1_MCLK
U28
1
8
2
7
3
6
4
R35
R34
5
10K/5%
ICS542
0.1ufd/16V
+3.3VIO
CLK1_DIV_S0
CLK1_DIV_S1
GND
U37
C56
0.1ufd/16V
1
16
2
15
3
14
4
13
5
12
GND
SRC2_MCLK_S1
GND
+3.3VIO
GND
SRC2_MCLK_S0
+3.3VIO
GND
0.1ufd/16V
OSC1
R51
GND
+3.3VIO 10K/5%
1
4
2
3
6
11
1
8
7
10
2
7
8
9
3
6
C53
24.576MHz
+3.3VIO 10K/5%
GND
SM7745HSV-24.576M
U29
4
R31
R33
10K/5%
R32
+3.3VIO
R30
5
SN74CBTLV3253DBQR
10K/5%
GND
GND
10K/5%
ICS542
GND
CLK2_DIV_S0
GND
CLK2_DIV_S1
+3.3VIO
SRC2_MCLK
U30
0.1ufd/16V
20
CLK2_DIV_S1
19
CLK2_DIV_S0
18
CLK1_DIV_S1
17
CLK1_DIV_S0
16
I2C_ADDR_SEL
MCLK_SEL
15
TAS_SCL
22
14
TAS_SDA
23
13
MCLK_S0
11
SPI_SELECT
1
10
6Wire1_EN
3
9
RESETz
+3.3VIO
MCLK_S1
ASI_S1
8
ASI_S0
U38
0.1ufd/16V
1
16
2
15
3
14
SRC2_MCLK
4
13
SRC1_MCLK
5
12
TAS_MCLK
6
11
MCLK_S1
7
SRC2_MCLK_S1
21
6
SRC2_MCLK_S0
7
10
2
5
SRC1_MCLK_S1
8
9
4
SRC1_MCLK_S0
12
R40
GND
24
GND
GND
C60
C64
MCLK_S0
SRC2_RXCXO
SRC1_RXCXO
R41
SN74CBTLV3253DBQR
10K/5%
10K/5%
TCA9539PWR
IOVD1
GND
GND
U40
GND
C63
GND
GND
8
1
0.1ufd/16V
5
MCLK
7
3
6
4
R101
10K/5%
GND
MCLK_SEL
GND
2
SN74LVC2G157DCTR
GND
Figure B-4. Data and Clocks
SLAU528 – June 2013
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Copyright © 2013, Texas Instruments Incorporated
15
Appendix B
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LDO SUPPLIES
DIGITAL SUPPLIES
ANALOG SUPPLIES
W5
W1
1.8VA
2
GND
G8
H3
VR6
1.8V_CP
C34
5
R11
3
10K/5%
10ufd/6.3V
AV_ENABLE
0.1ufd/16V
GND
F4
TLV320AIC3263YZF
C7
A8
+1.8VD
3
0.1ufd/16V
C131
4
GND
GND
47ufd/6.3V
TPS73618DBVT
GND
C161
TLV320AIC3263YZF
2
R14
C32
10K/5%
0.1ufd/16V
C165
GND
D9
W4
GND
E5
VR1
C96
C160
GND
+3.3VA
E6
GND
1.8VD
5
GND
0.1ufd/16V10ufd/10V
C140
1
+1.8VIO
W9
+1.8VD
J9
Vsys_ext
A1
1.8V/400mA
10ufd/6.3V
GND
47ufd/6.3V
GND
+5V
W13
J3
2
GND
+1.8VA
C130
4
3
C163
0.1ufd/16V1.0ufd/16V
2
+1.8V_CP
TPS73618DBVT
0.1ufd/16V
W8
GND
C159
JP57
3
GND
C95
2
GND
E7
1
GND
VR2
1
C151
C141
0.1ufd/16V
3.3V/400mA
+5V
1
2
C5
GND
GND
IOVD3
C138
0.1ufd/16V1.0ufd/16V
H6
DV_ENABLE
GND
GND
2
W2
E4
47ufd/6.3V
TPS73633DBVT
GND
H9
GND
+3.3VA
C133
4
1
10K/5%
0.1ufd/16V
10ufd/6.3V
5
2
3
1
GND
2
R13
W7
2
1
C46
C154
0.1ufd/16V1.0ufd/16V
3.3VA
C99
IOVD2
C136
J4
1.8V/400mA
+5V
W6
GND
U1
GND
GND
GND
C155
2
AV_ENABLE
GND
C135
0.1ufd/16V1.0ufd/16V
1
C142
0.1ufd/16V
1
TPS73618DBVT
C129
47ufd/6.3V
1
10ufd/6.3V
4
+1.8VA
2
3
1
2
R12
10K/5%
0.1ufd/16V
C2
1
C33
GND
C93
U1
+1.8VA
2
5
1
IOVD1
VR3
1
+5V
DV_ENABLE
GND
GND
GND
1.8V/400mA
W10
ANALOG INPUTS
0.1ufd/16V
1
IN3L
1.0ufd/16V
MBIAS_EXT
JP40
IN3L
1ufd
MICDET
IN3L
C3
E2
GND
2
1
1.8VIO
JP51
C167
U1
D1
1ufd
JP20
GND
IN3R
B1
C105
VR4
1ufd
IN3R
2
IN1L
2.1k
Vsys_ext
C108
1.8V/400mA
1ufd
IOVD3
120TAIL
IN1R
Headset_Mic
D8
0.1ufd/16V
+3.3VIO
+1.8VIO
GND
+3.3VIO
EXT_IN1R
EXT_AUX2
C4
2
1
3
2
3
1
2
1
3
C176
C175
0.1ufd/16V
0.1ufd/16V
GND4
GND1
GND7 GND3 GND2
4
GND
R110
JP52
J13
R95
GND
GND
GND
JP27
2
1ufd
IN4R
1
C179
D5
1ufd
R102
1k
TLV320AIC3263YZF
MIC1
WM-63PRT
GND5
3
C178
JP19
C1
IN4R
JP32
6
F1
MICBIAS
100
IN4L
JP37
IN2L
C180
EXT_AUX1
JP50
AVSS
1
R107
IN4L
R112
5
1ufd
E3
MBIAS
1ufd
R113
2
C177
IN2L
2
+3.3VIO
F2
IN2L
1
+1.8VIO
IN2R
TLV320AIC3263YZF
D4
+1.8VIO
VBAT
C174
IN1R
C109
C106
IN2R
1ufd
R114
1
IOVD2
IN2R
IN1L
D3
GND
IOVD1
R111
JP54
1
3
1
JP53
47ufd/6.3V
3
4
TPS73618DBVT
DV_ENABLE
2
3
10K/5%
GND
E1
JP9
2
R21
C36
0.1ufd/16V
GND
+1.8VIO
C132
2
GND
C97
10ufd/6.3V
5
2
1
1
+5V
JP39
IN3R
2
GND
3.3V/400mA
GND
1
VREF
C110
DV_ENABLE
GND
VREF_SAR
1
D2
47ufd/6.3V
TPS73633DBVT
0.1ufd/16V
GND
C166
1.0ufd/16V
C134
4
+1.8VA
C162
2
10ufd/6.3V
F3
VREF_SAR
2.1k
3
AVDD_18
100
1
U1
R98
MICBIAS_EXT
+3.3VIO
2.1k
R22
10K/5%
5
GND
C37
2
2
C98
GND
+5V
2
3.3VIO
VR5
1
GND6
1
2
R106
1k
GND
GND
Figure B-5. LDO Supplies, Analog Supplies, Digital Supplies, and Analog Inputs
16
TLV320AIC3263EVM-U EVM Schematics
Copyright © 2013, Texas Instruments Incorporated
SLAU528 – June 2013
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Appendix B
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HEADPHONE AMPLIFIER
+1.8VA
1
2
3
JP55
U1
+1.8V_CP
B7
5
B4
C145
3
W12
2
A6
A7
4
1
2
2.2ufd
1
HPL
2.2ufd
GND
GND
C156
GND
J22
10ufd/10V
C143
C137
10ufd/10V
0.1ufd/16V
VNEG
C168
0.1ufd/16V
C173
A5
SJ-435105
GND
GND
B5
2
GND
B6
HPR
5
6
A4
3
VSS_SNS
4
1
J14
R104
2
3
2
J1
J2
GND
16.0
32.4
GND
R74
C124
R71
16.0
JP34
GND
R80
R70
1
R73
3
C123
2200pfd/50V
TP72
1
R79
2
TP71
HPR
2
FB4
220ohms/2A
HPL
1
DNP
1
2
Headset_Mic
1
TLV320AIC3263YZF
3
D6
3
2
JP60
1
GND
32.4
2200pfd/50V
JP33
GND
GND
GND
GND
RECEIVER AMPLIFIER
CLASS D AMPLIFIER
JP58
+1.8VA
3
C147
0.1ufd/16V
10ufd/10V
U1
J16
+3.3VA
1
C169
120TAIL2
GND
U1
B9
10ufd/10V
GND
GND
GND
3
A3
RECP
6A/125V
GND
C172
0.1ufd/16V
C153
1.0ufd/16V
C164
1
+5V
BLM18AG601SN1
2
1
FB3
2
JP38
Vsys_ext
1
GND
2
C9
B2
R72
SPKP
GND
120 OHMS/1.5A
J15
A9
1 FB1 2
RECM
1
SPKM
C121
JP7
1k
C122
JP8
2200pfd/50V
2200pfd/50V
GND
GND
C5
2
1 FB2 2
TP23
C127
C128
2200pfd/50V
2200pfd/50V
GND
GND
C117
DNP
5
6
C6
1.0ufd/16V
TLV320AIC3263YZF
C118
R92
TP26
1k
TP35
DNP
GND
GND
JP24
C157
JP25
3
4
1k
LLOUT
RLOUT
GND
R91
2
2
D7
A2
R78
1
TP22
2
2
1.0ufd/16V
1
R77
RLOUT
6A/125V
120 OHMS/1.5A
JP2
1
1
JP1
J7
3
6A/125V
C8
TLV320AIC3263YZF
2
GND
JP26
TP28
2
1
1k
LLOUT
C6
2
R82
TP27
RECP
2
B3
1
R81
SPKM
SPKP
1
32.4
RECM
B8
1
C158
2200pfd/50V
2200pfd/50V
GND
GND
J6
GND
Figure B-6. Headphone Amplifier, Class D Amplifier, and Receiver Amplifier
SLAU528 – June 2013
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17
Appendix B
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GND
C77
IOVD2
0.1ufd/16V
GND
A1
OE
VCCB
B1
8
7
6
5
1
3
GND
GND
JP36
120TAIL
120TAIL
JP49
2
1
JP35
U41
TXB0102DCUR
TAS_BCLK
3
2
4
3
2
B2
GND
VCCA
A2
1
TAS_WCLK
GND
G9
J2
J8
J1
H8
H2
E8
0.1ufd/16V
1
GND
1
2
1
2
1
2
2
1
DOUT2
DIN2
1
2
1
2
BCLK3
2
DIN3
DOUT3
J23
R119
SPI_SEL
3
R120 0
1
0
2
J21
F9
1
2
3
E9
3
4
4
5
6
5
F6
G4
75869-131LF GND
7
6
6
7
TLV320AIC3263YZF
GND
4
0.1ufd/16V
0.1ufd/16V
GND
A+
AGND
BB+
GND
Case
GND
SN74LVC2G157DCTR
5607-4200-SH
7
GND
RESET
2
GND
GND
3
GNDGND
6
1
C66
C68
SPM0423HD4H-WB
0.1ufd/16V
GND
IOVD1
GND
+3.3VIO
2
4
5
MIC4
WCLK3
GND
SB_DATA SB_CLK
G6
0.1ufd/16V
5
AIC_SCLK
GNDGND
C189
BCLK3
GND
J5
C190
8
3
GND
6
3
GND
H4
U48
AIC_ADDRESS 1
1
JP30
3
F5
SPM0423HD4H-WB
GND
MIC5
JP46
3
G7
GND
2
4
5
0.1ufd/16V
JP31
3
H7
IOVD1
IOVD1
DIN2
DOUT2
GND
J7
3
GNDGND
6
JP47
1
GPIO4
GPIO6
C188
WCLK2
2
GPIO3
F8
1
F7
G3
WCLK3
G2
AD/SCLK
GPIO5
SPM0423HD4H-WB
BCLK2
GND
J6
SCL/SSZ
GPIO2
2
4
5
SDA/MOSI
6
GP01/MISO
C79
MIC2
GPIO1
3
GND
G5
GNDGND
IOVD1
JP44
3
GND
DIN3
3
GND
JP28
3
GPIO4 GPIO3
GPIO1
GPIO2
H1
H5
1
WCLK2
BCLK2
BCLK1
WCLK1
1
DIN1
DOUT1
1
3
GND
SPM0423HD4H-WB
2
4
5
GPIO5
2
GND
GPIO6
GND
6
MIC3
GND
GND
DOUT1
1
1
2
3
1
3
3
2
JP43
JP45
3
GND
GND
DIN1
JP42
JP29
GND
WCLK1
JP41
J20
2
3
1
J19
2
3
1
J18
2
BCLK1
2
3
J17
GNDGND
C82
U1
G1
10K/5%
0.1ufd/16V
0.1ufd/16V
1
3
MCLK
R57
DOUT3
C78
2
MCLK
6Wire1_EN
+3.3VIO
SN74AVC2T245RSWR
TAS_SSz
5
TAS_MOSI
4
8
9
U32
10
3
+3.3VIO
1
2
GND
JP62
+3.3VIO
2
4
3
GND
14
R118
13
0.1ufd/16V
DUT_RESETz
SN74LVC2G04DBVR
12
11
I2C_ADDR_SEL
GND
+3.3VIO
+5V
10
TP110
0.1ufd/16V GND
2
3
VCCA
GND
A
VCCB
OE
B
6
5
R49
4
10K/5%
R56
IOVD1
GND
0.1ufd/16V
10K/5%
GND
R89
5
C22
U31
Green/2.0V
7
TAS_SCL
6
TAS_SDA
5
R90
C17
EN
VREF2
GND
VREF1
SCL2
SCL1
SDA2
SDA1
1
2
GND
4
3
VCCB
VCCA
B1
A1
B2
A2
B3
A3
B4
A4
NC
NC
OE
GND
0.1ufd/16V
1
2
AIC_RESETz
3
AIC_ADDRESS
4
R109
5
6 10K/5%
7
+3.3VIO
GND
GND
1k
C170
C171
0.1ufd/16V
0.1ufd/16V
GND
GND
GND
SN74LVC1G126DBVR
U6
R85 R86
IOVD1
TXS0104EPWR
R100
2
8
8
10K/5%
1
200K/5%
TXB0101DBVR
R42
+3.3VIO
0.1ufd/16V
GND
LED9
1
9
2.7K/5%
GND
C70
2.7K/5%
C67
R117
U33
C72
U24
C69
SPI_SELECT
6
1
5
7
C65
6
GND
GND
357
IOVD1
1
U45
0.1ufd/16V
3
TAS_MISO
5
TAS_SCLK
4
4
8
AIC_SCLK
9
U46
3
10
+3.3VIO
SN74AVC2T245RSWR
PCA9306DCTR
C80
2
806k
1
+3.3VIO
2
for SPI:
Install JP62
GND
GND
GND
0.1ufd/16V
0.1ufd/16V
GND
GND
GND
GND
GND
Figure B-7. Digital
STANDOFFS
3480 3480 3480 3480 3480 3480 3480 3480
SO3 SO2 SO5 SO4 SO7 SO1 SO6 SO8
ANALOG INTERFACE CONNECTOR
mfg: JST
p/n: 100P-JMDSS-G-1-TF(LF)(SN)
BREAK-OUT CONNECTIONS
DIGITAL INTERFACE CONNECTOR
BREAK-OUT CONNECTIONS
BREAK-OUT CONNECTIONS
mfg: JST
p/n: 100P-JMDSS-G-1-TF(LF)(SN)
J9
0.5in 0.5in 0.5in 0.5in 0.5in 0.5in 0.5in 0.5in
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
SPKP
37
38
SPKP
SPKM
39
40
SPKM
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
HPL
65
66
HPR
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
GND
IN2L
GND
IN3L
GND
IN4L
GND
GND
GND
GND
MICBIAS
GND
MICBIAS_EXT
GND
RECP
LLOUT
RLOUT
GND
GND
SPKGND
GND
SPKVDD
HPGND
HPVDD
AV_ENABLE
AGND
VARVA
AGND
+1.8V_CP
AGND
+3.3VA
AGND
+5VA
GND
AV_ENABLE
GND
GND
+1.8V_CP
GND
GND
BREAK-OUT CONNECTIONS
J10
1
IN1L
IN1+
AGND
IN2+
AGND
IN3+
AGND
IN4+
AGND
IN5+
AGND
IN6+
AGND
IN7+
AGND
IN8+
AGND
MICBIAS
AGND
SPK1+
CLASS-D
SPK1SPEAKER
SPK2+
OUTPUT
SPK2OUT1+
OUT1GND
OUT2+
LINE
OUT2GND
OUTPUTS
OUT3+
OUT3GND
OUT4+
OUT4GND
AGND
HPGND
HEADSET
HPGND
GROUND
HPGND
HPGND
IN1R
IN1AGND
IN2AGND
IN3AGND
IN4AGND
IN5AGND
IN6AGND
IN7AGND
IN8AGND
MICDET
AGND
SPK1+
SPK1SPK2+
SPK2OUT1OUT1GND
OUT2OUT2GND
OUT3OUT3GND
OUT4OUT4GND
AGND
HP1L
HP1R
HP2L
HP2R
GND
IN2R
GND
97
98
99
100
IN3R
GND
IN4R
GND
GND
GND
GND
GND
Headset_Mic
GND
RECM
GND
GND
+5VD
DGND
+3.3IO
DGND
+1.8VD
DGND
VARVD
DGND
DV_ENABLE
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
TAS_SCL
27
28
TAS_SDA
29
30
31
32
33
34
WCLK1
35
36
DIN1
37
38
DOUT1
39
40
TAS_MISO
41
42
43
44
TAS_SSz
45
46
TAS_SCLK
47
48
I2S_ENABLE
49
50
RESETz
51
52
53
54
55
56
57
58
59
60
61
62
DIN2
63
64
DOUT2
65
66
67
68
69
70
71
72
73
74
75
76
DIN2
77
78
DOUT2
79
80
81
82
83
84
85
86
87
88
GPIO1
GND
+3.3IO
GND
+1.8VD
GND
VARVD
GND
DV_ENABLE
RESERVED
DGND
GND
GND
MCLK
GND
GND
GND
CLASS-D
SPEAKER
OUTPUT
GND
GND
DGND
GND
GND
GND
GND
GND
LINE
OUTPUTS
GND
GND
HEADSET
OUTPUTS
SPKGND
GND
1
+5V
RESERVED
SPKVDD
GND
GND
GND
+1.8VA
GND
GND
HPGND
HPVDD
RESERVED
AGND
VARVA
AGND
+1.8VA
AGND
+3.3VA
AGND
+5VA
GPIO
100P-JMDSS-G-1-TF(LF)(SN)
J10
+5V
GND
+3.0IO
GND
+1.8IO
GND
VARVD
GND
+5VD
DGND
+3.0IO
DGND
+1.8IO
DGND
VARVD
DGND
RESERVED
MCLK
I2C
MCLK
BCLK1
I2S1
TAS_MOSI
GND
GND
SPI
I2S_ENABLE
RESET
DGND
BCLK2
WCLK2
I2S_2
RESERVED
BCLK2
WCLK2
I2S_3
RESERVED
TAS_BCLK
TAS_WCLK
89
90
TAS_DIN
GPIO2
91
92
TAS_DOUT
GPIO3
93
94
GPIO4
95
96
GPIO5
97
98
GPIO6
99
100
I2S_4
RESERVED
100P-JMDSS-G-1-TF(LF)(SN)
J9
100P-JMDSS-G-1-TF(LF)(SN)
100P-JMDSS-G-1-TF(LF)(SN)
GND
GND
Figure B-8. Analog and Digital Interface Connectors
18
TLV320AIC3263EVM-U EVM Schematics
Copyright © 2013, Texas Instruments Incorporated
SLAU528 – June 2013
Submit Documentation Feedback
Appendix C
SLAU528 – June 2013
TLV320AIC3263EVM-U EVM Layout Views
PATCH
S4
S3
AIC_RESET
JP51
C96
R14
GPIO4
LED3
JP29
AD/SCLK
DOUT2
SCL/SSZ
J19 JP43
JP41
JP45
WCLK2
LED4
JP19
JP40
TP71
GPIO2
GPIO6
MCLK
DIN1
GPIO1
WCLK1
DOUT1
BCLK1
HPL
C189
MIC2
GND2
W10 W5
W9 W7 W6
LED5
R117
LED9
R65
GND5
U19
SO7
R66
C79
JP35
C188
JP32
U45
GPIO3
JP34
SO5
TP110
U16
U27
JP50
C65
GND7
HPR
SO3
SO1
WCLK3
JP52
FOR MEASUREMENT
GPIO5
J22
JP37
BCLK3
HEADPHONE OUT
U15
U18
DIN2
JP28
JP31
J18
DIN3
JP46
SDA/MOSI
JP47
J17
JP27
U1
JP42
IN3L
RESET
R64
DOUT3
JP44
VREF_SAR
MIC1
LED8
BCLK2
RLOUT
JP30
JP7
C131
JP10
W13
IN2R
IN2L
JP39
R69
U25
SPI_SEL
JP36
JP8
TP27
GND3
GP01/MISO
W8
IN3R
TP28
C32
R118
OSC2
TP22
SB_DATA
1.8VA
SRC1_Tx
JP20
J1
TP72
IN4R
MBIAS_EXT
EXT_AUX2
J2
JP33
J14
R119
SRC1_Rx
MICDET
GND6
MIC INPUT
SB_CLK
IN1L IN1R IN4L
JP53
LINE OUT
VSS_SNS
R120
JP54
EXT_IN1R
J13
VNEG
MBIAS
J23
SRC2_Rx
EXT_AUX1
SO4
VR5
SRC2_Tx
JP24
VR1
C52
TP26
J6
SO2
JP9
J21
W4
JP58
JP57
JP15
W2 W12 W1
LED1
Y1
R101
SO8
J12
3.3VIO
1.8VD
C51
JP25
U40
LED2
LLOUT
TP35
C63
JP26
JP1 JP2
J20
RECP
C46
3.3VA
JP60
C55
JP62 JP55
JP49
RECM
J7
TP23
C99
1.8V_CP
SPKM
GND4
C133
1.8VIO
C24
R52
VREF
SPKP
C53
OSC1
C130
C129
J15
SPKP
SPKM
R51
MASTER_RESET
VR4 C132
R121
GND1
VR6
VR3 C33
R13
VR2
R11
R12
C95
J16
+
C34
JP38
C93
JP61
C134
APP S2
C98
R22
C37
S1
C97
R21
C36
SO6
C82
MIC3
MIC4
MIC5
TLV320AIC3263EVM-U REVB
Figure C-1. Silkscreen Top
SLAU528 – June 2013
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Copyright © 2013, Texas Instruments Incorporated
19
Appendix C
www.ti.com
93R
33R
65C
75C
63U
4 6 C 83U
83R 14R
53R
03R
62C
92 C 7R
58C
9R
68C
8R
81C
49C
13C
32R
71R
09C
11C
91C 0 0 1 C
98R
71C
0 7 C 09R
94R
22C
19C
81 R
33U
07R
41U
04C
06R
6U
12C
42R
52R
001R
76C
96C
65R
27C
24C
08C
37R
66C
86C
901R
42U
32U
511R 54C
581C 3 4 C
24R
321C
01C
61R
88C
681C
74U
44C
23U
61C
26R
611R
59R
9C
98C
51 R
21U
84U
781C
011R
97R
03C
14U 7 7 C
601R
201R
34R
75R
471C
481C
87C
6C
18R
47R
93C
83C 53C
061C
151C
831C
561C
531C
551C
261C 661C
121C
08R
871C
501C
28R
241C
5C
U35
22U
091C
171C
111R
801C
221C
17R
771C
041C 541C
011C
761C
601C
64U
01J
071C
971C
89R
311R
671C
1BF
701R
081C
901C
741C
461C
351C
161C
951C
361C
631C
451C
2BF
411R
811C
211R
571C
711C
861C
651C
341C
271C
371C 961C
141C
731C
9J
82R
72C
78R
92R
88R
82C
301R
27R
87R
821C
77R
721C
751C
19R
85R
48C
01 R
14C
95R
9U
29R
851C
421C
7C
4R
2U
44U
03U
92U
4BF
401R
32C
3R
2C
1C
2R
1R
13R
3BF
43R
06C
82U
73U
52C
36R
301C
201C
04R
23R
21C
68R
58R
13U
Figure C-2. Silkscreen Bottom
20
TLV320AIC3263EVM-U EVM Layout Views
Copyright © 2013, Texas Instruments Incorporated
SLAU528 – June 2013
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Appendix C
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U40
R101
2U
301R
401R
TOP COPPER
INNER LAYER#1
INNER LAYER #2
BOTTOM COPPER
371C
141C
271C
341C
731C
901C
541C
081C
971C
241C
041C
21U
011C
161C
951C
1 4 U
601C
471C
771C
871C
061C
531C
501C
831C
801C
631C
261C
84U
201R
41U
1 3 U
09R
Figure C-3. Routing
SLAU528 – June 2013
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TLV320AIC3263EVM-U EVM Layout Views
Copyright © 2013, Texas Instruments Incorporated
21
Appendix D
SLAU528 – June 2013
TLV320AIC3263EVM-U Bill of Materials
ITEM
QTY
VALUE
PART NUMBER
1
2
C1, C2
47 pF
GRM1885C1H470JA0
1D
CAP, SMD, 0603, CERM,
47 PFD, 50 V, 5%, COG,
ROHS
MURATA
0603 COG
2
3
C5, C6, C7
1 µF
C1608X7R1C105K
CAP, SMD, 0603, CERM,
1 UFD, 16 V, 10%, X7R,
ROHS
TDK
0603 X7R
3
62
C9, C10, C11, C12,
C16, C17, C18,
C19, C21, C22,
C23, C24,C25, C26,
C27, C28, C29,
C30, C31, C32,
C33, C34, C35,
C36, C37, C38,
C39, C40, C41,
C42, C43, C44,
C45, C46, C51,
C52, C53, C55,
C56, C57, C60,
C63, C64, C65,
C66, C67, C68,
C69, C70, C72,
C77, C78, C79,
C80, C82, C170,
C171, C186, C187,
C188, C189, C190
0.1 µF
GRM155R71C104KA8 CAP, SMD, 0402, CERM,
8D
0.1 UFD, 16 V, X7R, 10%,
ROHS
MURATA
0402 X7R
4
3
C84, C85, C86
0.1 µF
C1608X7R1H104K
CAP, SMD, 0603, CERM,
0.1 UFD, 50 V, 10%, X7R,
ROHS
TDK
0603 X7R
5
14
C88, C89, C90,
C91, C93, C94,
C95, C96, C97,
C98, C99, C100,
C184, C185
10 µF
GRM188R60J106ME4
7D
CAP, SMD, 0603, CERM,
10 UFD, 6.3 V, 20%, X5R,
ROHS
MURATA
0603 X5R
6
1
C102
0.001 µF
C1608C0G1H102J
CAP, SMD, 0603, CERM,
1000 PFD, 50 V, 5%,
COG, ROHS
TDK CORP.
0603 COG
7
1
C103
100 pF
GRM1885C1H101JA0
1D
CAP, SMD, 0603, CERM,
100 PFD, 50 V, 5%, COG,
ROHS
MURATA
0603 COG
8
9
C105, C106, C108,
C109, C110, C177,
C178, C179, C180
1 µF
GRM188R60J105KA0
1D
CAPACITOR, SMT, 0603,
CERAMIC, 1 µF, 10 V,
10%, X5R
C1206_DNP
C1206_DNP
22
REFERENCES
9
2
C117, C118
10
8
C121, C122, C123,
C124, C127, C128,
C157, C158
11
6
C129, C130, C131,
C132, C133, C134
DESCRIPTION
0.0022 µF GRM188R71H222KA0 CAP, SMD, 0603, CERM,
1D
2200 PFD, 50 V, 10%,
X7R, ROHS
47 µF
JMK212BJ476MG-T
CAP, SMD, 0805, CERM,
47 UFD, 6.3 V, 20%, X5R,
ROHS
TLV320AIC3263EVM-U Bill of Materials
COMPANY
BAUFORM
CAP, SMT,
0603
DNI
1206
MURATA
0603 X7R
TAIYO YUDEN
0805 X5R
SLAU528 – June 2013
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Copyright © 2013, Texas Instruments Incorporated
Appendix D
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ITEM
QTY
REFERENCES
VALUE
PART NUMBER
DESCRIPTION
COMPANY
12
17
C135, C136, C137,
C138, C140, C141,
C142, C159, C160,
C161, C162, C164,
C172, C173, C174,
C175, C176
0.1 µF
GRM188R71C104KA0 CAP, SMD, 0603, CERM,
1D
0.1 UFD, 16 V, 10%, X7R,
ROHS
13
2
C143, C145
2.2 µF
GRM188C81A225KE3
4D
14
5
C147, C156, C165,
C168, C169
10 µF
GRM21BR71A106KE5 CAP, SMD, 0805, CERM,
1L
10 UFD, 10 V, 10%, X7R,
ROHS
MURATA
0805 X7R
15
7
C151, C153, C154,
C155, C163, C166,
C167
1 µF
EMK107B7105KA-T
CAP, SMD, 0603, CERM,
1 UFD, 16 V, 10%, X7R,
ROHS
TAIYO YUDEN
0603 X7R
16
27
DIN1, DIN2, DIN3,
BCLK1, BCLK2,
BCLK3, DOUT1,
DOUT2, DOUT3,
GPIO1, GPIO2,
GPIO3, GPIO4,
GPIO5, GPIO6,
TP123, TP124,
WCLK1, WCLK2,
WCLK3, SB_CLK,
AD/SCLK,
SB_DATA,
SCL/SSZ, SPI_SEL,
SDA/MOSI,
GP01/MISO
5004
PC TESTPOINT,
YELLOW, ROHS
KEYSTONE
Yellow
ELECTRONICS
17
2
FB1, FB2
BLM15EG121SN1D
FERRITE BEAD, SMD,
0402, 120 Ω, 1.5 A, ROHS
MURATA
18
1
FB3
600 Ω
BLM18AG601SN1
FERRITE BEAD, SMT,
0603, 600 Ω @ 100 MHz,
25%, 200 mA
19
1
FB4
220 Ω
MPZ1608S221A
FERRITE CHIP, 220 Ω, 2
A ,100 MHZ, SMD. 0603,
ROHS
TDK
20
7
GND1, GND2,
GND3, GND4,
GND5, GND6,
GND7
5011
PC TESTPOINT, BLACK,
063, HOLE, ROHS
KEYSTONE
Black
ELECTRONICS
21
30
IN1L, IN1R, IN2L,
IN2R, IN3L, IN3R,
IN4L, IN4R, TP22,
TP23, TP26, TP27,
TP28, TP35, TP71,
TP72, TP110,
TP111, TP112,
TP113, TP114,
TP115, TP116,
TP117, TP118,
TP119, VSS_SNS,
EXT_AUX1,
EXT_AUX2,
EXT_IN1R
5002
PC TESTPOINT, WHITE,
ROHS
KEYSTONE
White
ELECTRONICS
22
32
J1, J2, W8, J17,
J18, J19, J20, JP28,
JP29, JP30, JP31,
JP32, JP33, JP34,
JP35, JP36, JP37,
JP38, JP41, JP42,
JP43, JP44, JP45,
JP46, JP47, JP49,
JP50, JP53, JP54,
JP55, JP57, JP58
PBC03SAAN
HEADER THRU MALE, 3
PIN, 100LS, 120 TAIL,
GOLD, ROHS
SULLINS
MURATA
CAPACITOR, SMT, 0603,
CERAMIC, 2.2 µF, 10 V,
10%, X6S
SLAU528 – June 2013
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BAUFORM
0603 X7R
CAP, SMT,
0603
402
FERRITE
BEAD, SMT,
0603
603
100LS
TLV320AIC3263EVM-U Bill of Materials
Copyright © 2013, Texas Instruments Incorporated
23
Appendix D
www.ti.com
ITEM
QTY
23
3
J6, J13, J14
SJ-43516-SMT
JACK AUDIO-STEREO
MINI (3.5 mm, 4-COND
SMT-RA ROHS)
24
1
J7
ED555/3DS
TERMINAL BLOCK, 3 PIN, ON SHORE
6 A / 125 V, GRAY, 3.5
TECHNOLOGY
mm PITCH, 16-28 AWG,
ROHS
GRAY
25
2
J9, J10
100P-JMDSS-G-1TF(LF)(SN)
PLUG, SMD, 2x50,
FEMALE, JMDSERIES,
0.5 mm LS, GOLD, ROHS
JST
SMD - 0.5
mm
26
1
J12
UX60-MB-5ST
JACK USB, MINIB SMTRA, 5 PIN, ROHS
HIROSE
27
2
J15, J16
ED555/2DS
TERMINAL BLOCK, 2 PIN, ON SHORE
6 A / 125 V, GRAY, 3.5
TECHNOLOGY
mm PITCH, 16-28 AWG,
ROHS
28
1
J21 Config build
forTLV320AIC3263
YZF
75869-131LF
HEADER SHROUDED,
100LS, MALE, GOLD, 2x3
PINS, ROHS
FCI
29
1
J22
SJ-435105
JACK AUDIO MINI (3.5
mm, 4-COND SMT-RA
ROHS)
CUI STACK
3.5 mm
30
1
J23, Config build for
TLV320AIC3263YZ
F
5607-4200-SH
CONNECTOR-SATA, 7
PIN, SMT-RA SERIES,
5607, ROHS
3M
SATA
31
2
LED1, LED2
SML-LXT0805YW-TR
LED, YELLOW, 2 V, SMD,
0805, ROHS
LUMEX OPTO
805
32
5
LED3, LED4, LED5,
LED8, LED9
SML-LXT0805GW-TR
LED, GREEN, 2 V, SMD,
0805, ROHS
LUMEX OPTO
805
33
1
MIC1
WM-63PRT
MICROPHONE
ELECTRET,
OMNIDIRECTIONAL
DUAL BAND, 2 PIN,
ROHS
PANASONIC
ELECTRET
34
4
MIC2, MIC3, MIC4,
MIC5
SPM0423HD4H-WB
MIC DIGITAL, MIMISISONIC, HALOGEN
FREE, 6 PIN, ROHS
KNOWLES
Mini SiSonic
35
1
OSC1
24.576M
SM7745HSV-24.576M
OSCILLATOR, SMT, 3.3
PLETRONICS
V, SM77H SERIES, 24.576
MHz, ROHS
SM77H
36
1
OSC2
22.5792M SM7745HSV22.5792M
OSCILLATOR, SMT, 3.3
V, SM77H SERIES,
22.5792 MHz, ROHS
PLETRONICS
SM77H
37
1
R1
1.5 kΩ
ERJ-3EKF1501V
RESISTOR, SMD, 0603,
1.50 kΩ, 1%, THICK FILM,
1/10 W, ROHS
PANASONIC
603
38
2
R2, R3
27.4 Ω
ERJ-3EKF27R4V
RESISTOR, SMD, 0603,
27.4 Ω, 1%, 1/10 W,
ROHS
PANASONIC
603
39
1
R4
100 kΩ
ERJ-3EKF1003V
RESISTOR, SMD, 0603,
100 kΩ, 1%, THICK FILM,
1/10 W, ROHS
PANASONIC
603
40
34
R7, R8, R9, R10,
R11, R12, R13,
R14, R21, R22,
R25, R28, R29,
R30, R31, R32,
R33, R34, R35,
R38, R39, R40,
R41, R42, R43,
R49, R51, R52,
R56, R57, R101,
R109, R115, R116
10 kΩ
ERJ-3GEYJ103V
RESISTOR, SMD, 0603,
10K, 5%, 1/10 W, ROHS
PANASONIC
603
24
REFERENCES
VALUE
DNI
DNI
PART NUMBER
DESCRIPTION
TLV320AIC3263EVM-U Bill of Materials
COMPANY
CUI STACK
BAUFORM
3.5 mm
GRAY
SLAU528 – June 2013
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Copyright © 2013, Texas Instruments Incorporated
Appendix D
www.ti.com
ITEM
QTY
REFERENCES
VALUE
41
4
R15, R16, R17, R18
0Ω
ERJ-3GEY0R00V
RESISTOR, 0 Ω, 1/10 W,
JUMP, 0603, SMD
42
13
R23, R24, R77,
R78, R79, R80,
R81, R82, R91,
R92, R100, R102,
R118
1 kΩ
ERJ-3GSYJ102
RESISTOR, SMT, 0603,
5%, 1/10 W, 1K
43
2
R58, R59
649 Ω
RC0603FR-07649RL
RESISTOR, SMD, 0603,
THICK FILM, 649 Ω, 1%,
1/10 W, ROHS
44
4
R60, R62, R103,
R121
4.7 kΩ
ERJ-3GEYJ472V
RESISTOR, SMD, 0603,
PANASONIC
4.7 kΩ, 5%, 1/10 W, ROHS
603
45
1
R63
3.09 kΩ
CRCW06033091F
RESISTOR, SMT, 0603,
1%, 1/10 W,3.09K
RES, SMT,
0603
46
5
R64, R65, R66,
R69, R117
357 Ω
ERJ-3EKF3570V
RESISTOR, SMD, 0603,
357 Ω, 1%, THICK FILM,
1/10 W, ROHS
PANASONIC
603
47
3
R70, R71, R72
32.4 Ω
RC1206FR-0732R4L
RESISTOR, SMD, 1206,
32.4 Ω, 1%, 1/4 W, ROHS
YAGEO
1206 1/4 W
48
2
R73, R74
VISHAY
1206
49
4
R85, R86, R87, R88
2.7 kΩ
ERJ-3GEYJ272V
RESISTOR, SMD, 0603,
PANASONIC
2.7 kΩ, 5%, 1/10 W, ROHS
603
50
1
R89
200 kΩ
ERJ-3GEYJ204V
RESISTOR, SMD, 0603,
200 kΩ, 5%, 1/10 W,
ROHS
603
51
1
R90
806 kΩ
ERJ-2RKF8063X
RESISTOR, SMT, 0402,
806K, 1%, 1/16 W
RES, SMT,
0402
52
3
R95, R110, R111
2.1 kΩ
CRCW06032101F
RESISTOR, SMT, 0603,
1%, 1/10 W, 2.10K
RES, SMT,
0603
53
2
R98, R107
100 Ω
ERJ-3EKF1000V
RESISTOR, SMD, 0603,
100, 1%, THICK FILM,
1/10 W, ROHS
54
1
R104
R0603_DNP
R0603_DNP
54A
2
R119, R120, Config
build for
TLV320AIC3263YZ
F
0Ω
ERJ-3GSYJ000
RESISTOR, SMT, 0603,
5%, 1/10 W, 0 Ω
55
1
R106
1.1 kΩ
ERJ-3GSYJ112
RESISTOR, SMT, 0603,
5%, 1/10 W, 1.1K
RES, SMT,
0603
56
3
R112, R113, R114
200 Ω
ERJ-3GSYJ201
RESISTOR, SMT, 0603,
5%, 1/10 W, 200
RES, SMT,
0603
57
8
SO1, SO2, SO3,
SO4, SO5, SO6,
SO7, SO8
3480 & PMS 440 0025 STANDOFF, 4-40, 0.5 in,
PH
0.25 dia, ALUM RND, F-F,
ROHS, & 4-40 PHILLIPS
MACHINE SCREW
KEYSTONE
ELECTRONICS
58
4
S1, S2, S3, S4
TL1015AF160QG
SWITCH, MOM, 160G,
SMT, 4X3 mm, ROHS
E-SWITCH
59
1
U1
TLV320AIC3263YZF
CODEC WCSP81-YZF
ROHS
TEXAS
WCSP81INSTRUMENTS YZF
60
1
U2
TAS1020BPFB
USB STREAMING
CONTROLLER, TQFP48PFB, ROHS
TEXAS
TQFP48INSTRUMENTS PFB
61
2
U6, U9
SN74LVC1G126DBVR SINGLE BUS BUFFER
GATE WITH 3-STATE
OUTPUT, SOT23-DBV5,
ROHS
TEXAS
SOT23INSTRUMENTS DBV5
62
2
U12, U14
SRC4392IPFBR
BURR-BROWN
16 Ω
PART NUMBER
DESCRIPTION
CRCW120616R0JNEA RESISTOR, SMT, 1206,
16 Ω, 5%, 1/4 W,ROHS
PANASONIC
BAUFORM
603
RES, SMT,
0603
YAGEO
PANASONIC
PANASONIC
603
603
603
2 CHAN, ASYNC,
SAMPLE RATE CONV
W/DIG AUDIO
REC/XMTR, ROHS
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COMPANY
PANASONIC
603
TQFP48PFB
TLV320AIC3263EVM-U Bill of Materials
Copyright © 2013, Texas Instruments Incorporated
25
Appendix D
www.ti.com
ITEM
QTY
63
2
U15, U16
TORX147PL(F,T)
TOSLINK RECEIVER, 3.3
V, 15MB SHUTTER,
ROHS
TOSHIBA
64
2
U18, U19
TOTX147PL
TOSLINK TRANSMITTER,
3.3 V, 15MB SHUTTER,
ROHS
TOSHIBA
65
4
U22, U23, U24, U47
TXS0104EPWR
4-BIT BIDIR LEVEL
TEXAS
TSSOP14TRANSLATOR, TSSOP14- INSTRUMENTS PW
PW, ROHS
66
2
U25, U27
SN74LVC2G17DBVR
DUAL SCHMITTTRIGGER BUFFER,
SOT23-DBV6, ROHS
TEXAS
SOT23INSTRUMENTS DBV6
67
2
U28, U29
ICS542
CLOCK DIVIDER, SOP8D, ROHS
IDT
68
1
U30
TCA9539PWR
REMOTE, 16B, I2C
SMBUS, LO PWR, IO
EXPNDR, INT, OUT,
TSSOP24-PW, ROHS
TEXAS
TSSOP24INSTRUMENTS PW
69
1
U31
PCA9306DCTR
DUAL BIDIR, I2C BUS
AND SMBUS VOLT
LEVEL TRANS, SSOP8DCT, ROHS
TEXAS
SSOP8-DCT
INSTRUMENTS
70
2
U32, U46
SN74AVC2T245RSW
R
2BIT, XCVR,
CONFIGURABLE
TRANSLATION, 3-STATE
OUTS, QFN10-RSW,
ROHS
TEXAS
QFN10-RSW
INSTRUMENTS
71
1
U33
TXB0101DBVR
1-BIT, BIDIR, LEVEL
TRANSLATOR, SOT23DBV6, ROHS
TEXAS
SOT23INSTRUMENTS DBV6
72
4
U35, U36, U37, U38
SN74CBTLV3253DBQ LO VOLT, DUAL 1OF4
R
FET, MUX/DEMUX,
SSOP16-DB, ROHS
73
2
U40, U48
SN74LVC2G157DCTR MUX/DATA SELECTOR, 2 TEXAS
SSOP8-DCT
TO 1, SSOP8-DCT, ROHS INSTRUMENTS
74
1
U41
TXB0102DCUR
2-BIT, BIDIR, LEVEL
TRANSLATOR, VSSOP8DCU, ROHS
TEXAS
VSSOP8INSTRUMENTS DCU
75
1
U44
24FC512-I/MF
512K, I2C SERIAL
EEPROM, DFN8-MF,
ROHS
MICROCHIP
76
1
U45
SN74LVC2G04DBVR
DUAL INVERTER GATE,
SOT23-DBV6, ROHS
TEXAS
SOT23INSTRUMENTS DBV6
77
4
VR1, VR2, VR3,
VR4
TPS73618DBVT
VOLT REG, 1.8 V, 400
mA, LDO CAP, FREE
NMOS, SOT23-DBV5,
ROHS
TEXAS
SOT230DBV
INSTRUMENTS 5
78
2
VR5, VR6
TPS73633DBVT
VOLT REG, 3.3 V, 400
mA, LDO CAP, FREE
NMOS, SOT23-DBV5,
ROHS
TEXAS
SOT230DBV
INSTRUMENTS 5
79
30
W1, W2, W4, W5,
W6, W7, W9, JP1,
JP2, JP7, JP8, JP9,
W10, W12, W13,
JP10, JP15,
JP19,JP20, JP24,
JP25, JP26, JP27,
JP39, JP40, JP51,
JP52, JP60, JP61,
JP62
PBC02SAAN
HEADER THRU MALE, 2
PIN, 100LS, 120 TAIL,
GOLD, ROHS
SULLINS
100LS
80
1
Y1
SIT8002AI-13-33E6.00000T
OSCILLATOR, SMT, 6
MHz, 3.3 V, OUTENABLE, ROHS
SITIME
SMT-8002
26
REFERENCES
VALUE
PART NUMBER
DESCRIPTION
TLV320AIC3263EVM-U Bill of Materials
COMPANY
BAUFORM
SOP8-D
TEXAS
SSOP16-DB
INSTRUMENTS
DFN8-MF
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Copyright © 2013, Texas Instruments Incorporated
Appendix D
www.ti.com
ITEM
QTY
REFERENCES
VALUE
PART NUMBER
DESCRIPTION
81
11
1.8VA, 1.8VD,
3.3VA, TP120,
TP121, TP122,
1.8VIO, 3.3VIO,
1.8V_CP,
VREF_SAR,
MBIAS_EXT
5000
PC TESTPOINT, RED,
ROHS
82
18
See the list for
locations
382811-9
RED No. 382811-9 Shunt
83
22
See the list for
locations
382811-6
BLACK No. 382811-6
Shunt
84
22
See the list for
locations
382811-2
BLUE No. 382811-2 Shunt
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BAUFORM
KEYSTONE
Red
ELECTRONICS
TLV320AIC3263EVM-U Bill of Materials
Copyright © 2013, Texas Instruments Incorporated
27
Appendix E
SLAU528 – June 2013
Writing Scripts
A script is simply a text file that contains data to send to the serial control buses.
Each line in a script file is one command. No provision is made for extending lines beyond one line, except
for the > command. A line is terminated by a carriage return.
The first character of a line is the command. Commands are:
I—
Set interface bus to use
r—
Read from the serial control bus
w—
Write to the serial control bus
>—
Extend repeated write commands to lines below a w
#—
Comment
b—
Break
d—
Delay
f—
Wait for Flag
The first command, I, sets the interface to use for the commands to follow. This command must be
followed by one of the following parameters:
i2cstd— Standard mode I2C bus
i2cfast— Fast mode I2C bus
spi8— SPI bus with 8-bit register addressing
spi16— SPI bus with 16-bit register addressing
For example, if a fast mode I2C bus is to be used, the script begins with:
I i2cfast— A double-quoted string of characters following the b command can be added to provide
information to the user about each breakpoint. When the script is executed, the software's
command handler halts as soon as a breakpoint is detected and displays the string of characters
within the double quotes.
The Wait for Flag command, f, reads a specified register and verifies if the bitmap provided with the
command matches the data being read. If the data does not match, the command handler retries for up to
200 times. This feature is useful when switching buffers in parts that support the adaptive filtering mode.
The command f syntax follows:
f [i2c address] [register] [D7][D6][D5][D4][D3][D2][D1][D0]
where 'i2c address' and 'register' are in hexadecimal format
and 'D7' through 'D0' are in binary format with values of 0,
1 or X for don't care.8
Anything following a comment command # is ignored by the parser, provided that it is on the same line.
The delay command d allows the user to specify a time, in milliseconds, that the script pauses before
proceeding. Note: The delay time is entered in decimal format.
28
Writing Scripts
SLAU528 – June 2013
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Appendix E
www.ti.com
A series of byte values follows either a read or write command. Each byte value is expressed in
hexadecimal, and each byte must be separated by a space. Commands are interpreted and sent to the
TAS1020B by the program.
The first byte following an r (read) or w (write) command is the I2C slave address of the device (if I2C is
used) or the first data byte to write. (If SPI is used, note that SPI interfaces are not standardized on
protocols, so the meaning of this byte varies with the device being addressed on the SPI bus.) The
second byte is the starting register address that data will be written to (again, with I2C; SPI varies).
Following these two bytes are data, if writing; if reading, the third byte value is the number of bytes to
read, (expressed in hexadecimal).
For example, to write the values 0xAA 0x55 to an I2C device with a slave address of 0x30, starting at a
register address of 0x03, the user writes:
#example script
I i2cfast
w 30 03 AA 55
r 30 03 02e
This script begins with a comment, specifies that a fast I2C bus is used, then writes 0xAA 0x55 to the I2C
slave device at address 0x30, writing the values into registers 0x03 and 0x04. The script then reads back
two bytes from the same device starting at register address 0x03. Note that the slave device value does
not change. It is unnecessary to set the R/W bit for I2C devices in the script; the read or write commands
does that.
If extensive repeated write commands are sent and commenting is desired for a group of bytes, the >
command can be used to extend the bytes to other lines that follow. A usage example for the > command
follows:
#example script for '>' command
I i2cfast
# Write AA and BB to registers 3 and 4, respectively
w 30 03 AA BB
# Write CC, DD, EE and FF to registers 5, 6, 7 and 8, respectively
> CC DD EE FF
# Place a commented breakpoint
b "AA BB CC DD EE FF was written, starting at register 3"
# Read back all six registers, starting at register 3
r 30 03 06b
The following example demonstrates usage of the Wait for Flag command, f:
#example script for 'wait for flag' command
I i2cfast
# Switch to Page 44
w 30 00 2C
# Switch buffer
w 30 01 05
# Wait for bit D0 to clear. 'x' denotes a don't care.
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Writing Scripts
Copyright © 2013, Texas Instruments Incorporated
29
Appendix E
www.ti.com
f 30 01 xxxxxxx0
Any text editor can be used to write these scripts; jEdit is an editor that is highly recommended for general
usage. For more information, go to: www.jedit.org.
Once the script is written, it can be used in the command window by running the program, and then
selecting Open Script File... from the File menu. Locate the script and open it. The script then is displayed
in the command buffer. The user also can edit the script once it is in the buffer and save it by selecting
Save Script File... from the File menu.
Once the script is in the command buffer, it can be executed by pressing the Execute Command Buffer
button. If breakpoints are in the script, the script executes to that point, and the user is presented with a
dialog box with a button to press to continue executing the script. When ready to proceed, the user
pushes that button and the script continues.
30
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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
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supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
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