TLV320DAC23IPWR

             ! " "# $#%& Data Manual February 2004 Digital Audio Products SLES001C IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright  2004, Texas Instruments Incorporated Contents Section Title Page 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−1 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−2 1.2 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−3 1.3 Terminal Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−4 1.4 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−5 1.5 Terminal Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−6 2 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−1 2.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−1 2.2 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 2−1 2.3 Electrical Characteristics Over Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−2 2.3.1 DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−2 2.3.2 Analog Line Input to Line Output . . . . . . . . . . . . . . . . . . . . . . 2−2 2.3.3 Stereo Headphone Output . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−3 2.3.4 Analog Reference Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−3 2.3.5 Digital I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−3 2.3.6 Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−3 2.4 Digital-Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−4 2.4.1 Audio Interface (Master Mode) . . . . . . . . . . . . . . . . . . . . . . . 2−4 2.4.2 Audio Interface (Slave-Mode) . . . . . . . . . . . . . . . . . . . . . . . . 2−5 2.4.3 Three-Wire Control Interface (SDI) . . . . . . . . . . . . . . . . . . . . 2−6 2.4.4 Two-Wire Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−6 3 How to Use the DAC23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1 3.1 Control Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1 3.1.1 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1 3.1.2 2-Wire . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−1 3.1.3 Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−2 3.2 Analog Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−4 3.2.1 Line Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−4 3.2.2 Line Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−5 3.2.3 Headphone Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−5 3.3 Digital Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−5 3.3.1 Digital Audio-Interface Modes . . . . . . . . . . . . . . . . . . . . . . . . 3−5 3.3.2 Audio Sampling Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−7 3.3.3 Digital Filter Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3−10 A Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A−1 iii List of Illustrations Figure 2−1 2−2 2−3 2−4 2−5 3−1 3−2 3−3 3−4 3−5 3−6 3−7 3−8 3−9 3−10 3−11 3−12 3−13 3−14 3−15 3−16 3−17 iv Title System-Clock Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Master-Mode Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Slave-Mode Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Three-Wire Control Interface Timing Requirements . . . . . . . . . . . . . . . . . . Two-Wire Control Interface Timing Requirements . . . . . . . . . . . . . . . . . . . SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-Wire Compatible Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Analog Line Input Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Right Justified Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Left Justified Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I2S Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digital De-Emphasis Filter Response − 44.1 kHz Sampling . . . . . . . . . . . Digital De-Emphasis Filter Response − 48 kHz Sampling . . . . . . . . . . . . DAC Digital Filter Response 0: USB Mode . . . . . . . . . . . . . . . . . . . . . . . . . DAC Digital Filter Ripple 0: USB Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . DAC Digital Filter Response 1: USB Mode Only . . . . . . . . . . . . . . . . . . . . DAC Digital Filter Ripple 1: USB Mode Only . . . . . . . . . . . . . . . . . . . . . . . . DAC Digital Filter Response 2: USB Mode and Normal Modes . . . . . . . . DAC Digital Filter Ripple 2: USB Mode and Normal Modes . . . . . . . . . . . DAC Digital Filter Response 3: USB Mode Only . . . . . . . . . . . . . . . . . . . . DAC Digital Filter Ripple 3: USB Mode Only . . . . . . . . . . . . . . . . . . . . . . . . Page 2−4 2−4 2−5 2−6 2−6 3−1 3−2 3−5 3−6 3−6 3−6 3−7 3−10 3−11 3−11 3−11 3−12 3−12 3−12 3−13 3−13 3−13 1 Introduction The TLV320DAC23 is a high performance stereo DAC with highly integrated analog functionality. The DACs within the TLV320DAC23 are comprised of multibit sigma-delta technology with integrated over-sampling digital interpolation filters. Supported data transfer word lengths are 16, 20, 24, and 32 bits with sample rates from 8 kHz to 96 kHz. The DAC sigma-delta modulator features a second order multibit architecture with up to 100 dBA SNR at audio sample rates up to 96 kHz. This enables high quality digital audio playback capability while consuming less than 19 mW during playback only. The TLV320DAC23 is the ideal choice for portable digital audio player applications such as MP3 digital audio players. Integrated analog features consist of stereo line inputs with an analog bypass path and a stereo headphone amplifier with analog volume control and mute. The headphone amplifier is capable of delivering 30 mW per channel into 32 Ω. The analog bypass path allows use of the stereo line inputs and the headphone amplifier with analog volume control while completely bypassing the DAC, thus enabling further design flexibility such as integrated FM tuners. While the TLV320DAC23 supports the industry standard over-sample rates of 256 fs and 384 fs, unique over-sample rates of 250 fs and 272 fs are provided which optimize interface considerations in designs using TI C54x DSPs and USB data interfaces. A single 12-MHz crystal can be used to supply clocking to the DSP, USB, and DAC. The TLV320DAC23 features an internal oscillator which, when connected to a 12-MHz external crystal, will provide a system clock to the DSP and other peripherals at either 12 MHz or 6 MHz using an internal clock buffer and selectable divider. Audio sample rates of 48 kHz and CD standard rates of 44.1 kHz are directly supported from a 12-MHz master clock with 250 fs and 272 fs over-sample rates. Low power consumption and flexible power management allow selective shutdown of DAC functions, thus extending battery life in portable applications. Couple this design solution with the industry’s smallest package, the TI proprietary MicroStar Junior using only 25 mm2 of board area, powerful portable stereo audio designs are easily realizable in a cost effective, space saving total analog solution. MicroStar Junior is a trademark of Texas Instruments. 1−1 1.1 Features • High-Performance Stereo DAC − − − − • Software control via TI McBSP-compatible multiprotocol serial port − − • 2-wire-compatible and SPI-compatible serial port protocols Glueless interface to TI McBSPs Audio data input/output via TI McBSP compatible programmable audio interface − − − − − − I2S-compatible interface Standard I2S, MSB, or LSB justified data transfers 16/20/24/32-bit word lengths Audio master/slave timing capability optimized for TI DSPs (250/272 fs) Industry-standard master/slave support also provided (256/384 fs) Glueless interface to TI McBSPs • Stereo line inputs • Stereo line outputs − Analog stereo mixer for DAC and analog bypass path • Analog volume control with mute • Highly efficient linear headphone amplifier − • • 18-mW power consumption during playback mode Standby power consumption 0.5465 fs −50 0 Filter Response − dB −2 −4 −6 −8 −10 0 0.1 0.2 0.3 0.4 0.5 Normalized Audio Sampling Frequency − Hz Figure 3−8. Digital De-Emphasis Filter Response − 44.1 kHz Sampling 3−10 Hz ±0.03 Passband ripple dB dB 0 Filter Response − dB −2 −4 −6 −8 −10 0 0.10 0.20 0.30 0.40 0.50 Normalized Audio Sampling Frequency − Hz Figure 3−9. Digital De-Emphasis Filter Response − 48 kHz Sampling Filter Response − dB 10 −10 −30 −50 −70 −90 0 0.5 1 1.5 2 Normalized Audio Sampling Frequency − Hz 2.5 3 Figure 3−10. DAC Digital Filter Response 0: USB Mode Filter Response − dB 0.10 0.08 0.06 0.04 0.02 0 −0.02 −0.04 −0.06 −0.08 −0.10 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 Normalized Audio Sampling Frequency − Hz Figure 3−11. DAC Digital Filter Ripple 0: USB Mode 3−11 Filter Response − dB 10 −10 −30 −50 −70 −90 0 0.5 1 1.5 2 2.5 3 Normalized Audio Sampling Frequency − Hz Figure 3−12. DAC Digital Filter Response 1: USB Mode Only Filter Response − dB 0.10 0.08 0.06 0.04 0.02 0 −0.02 −0.04 −0.06 −0.08 −0.10 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 Normalized Audio Sampling Frequency − Hz Figure 3−13. DAC Digital Filter Ripple 1: USB Mode Only Filter Response − dB 10 −10 −30 −50 −70 −90 0 0.5 1 1.5 2 2.5 Normalized Audio Sampling Frequency − Hz Figure 3−14. DAC Digital Filter Response 2: USB Mode and Normal Modes 3−12 3 Filter Response − dB 0.4 0.3 0.2 0.1 0 −0.1 −0.2 −0.3 −0.4 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 Normalized Audio Sampling Frequency − Hz Figure 3−15. DAC Digital Filter Ripple 2: USB Mode and Normal Modes Filter Response − dB 10 −10 −30 −50 −70 −90 0 0.5 1 2 1.5 2.5 3 Normalized Audio Sampling Frequency − Hz Figure 3−16. DAC Digital Filter Response 3: USB Mode Only Filter Response − dB 0.4 0.3 0.2 0.1 0 −0.1 −0.2 −0.3 −0.4 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 Normalized Audio Sampling Frequency − Hz Figure 3−17. DAC Digital Filter Ripple 3: USB Mode Only 3−13 3−14 Appendix A Mechanical Data GQE (S-PBGA-N80) PLASTIC BALL GRID ARRAY 5,10 SQ 4,90 4,00 TYP 0,50 J 0,50 H G F E D C B A 1 0,68 0,62 2 3 4 5 6 7 8 9 1,00 MAX Seating Plane 0,35 0,25 NOTES: A. B. C. D. ∅ 0,05 M 0,21 0,11 0,08 4200461/C 10/00 All linear dimensions are in millimeters. This drawing is subject to change without notice. MicroStar Junior BGA configuration Falls within JEDEC MO-225 MicroStar Junior is a trademark of Texas Instruments. A−1 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°−ā 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. A−2 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 RHD (S−PQFP−N28) PLASTIC QUAD FLATPACK 5,00 A B ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ 5,00 28 1 PIN 1 INDEX AREA 1,00 0,80 0,20 REF C SEATING PLANE 0,08 C 0,05 MAX 3,25 SQ 3,00 PIN 1 IDENTIFIER 1 0,65 28 0,45 0,435 28 0,18 0,435 4 3,00 0,18 0,50 EXPOSED THERMAL DIE PAD D 28 0,30 0,18 0,10 M C A B 4204400/A 05/02 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. QFN (Quad Flatpack No−Lead) Package configuration. A−3 D. The Package thermal performance may be enhanced by bonding the thermal die pad to an external thermal plane. This pad is electrically and thermally connected to the backside of the die and possibly selected ground leads. E. Package complies to JEDEC MO-220. A−4