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TLV522DGKT

TLV522DGKT

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    TSSOP8

  • 描述:

    IC CMOS 2 CIRCUIT 8VSSOP

  • 数据手册
  • 价格&库存
TLV522DGKT 数据手册
Product Folder Sample & Buy Support & Community Tools & Software Technical Documents TLV522 SNOSD27 – MAY 2016 TLV522 Dual Nanopower, 500nA, RRIO CMOS Operational Amplifier 1 Features 3 Description • • • • • • • • • • • • The TLV522 500 nA dual, nanopower op amp offers optimum price performance in TI's nanopower family of operational amplifiers. The TLV522 provides 8 kHz of gain bandwidth from 500 nA of quiescent current, making it well suited for battery powered applications found in building automation and remote sensing nodes. Its CMOS input stage enables very low IBIAS, reducing errors commonly introduced in Megaohm feedback resistance topologies such as highimpedance photodiode and charge sense applications. Additionally, built-in EMI protection reduces sensitivity to unwanted RF signals from sources like mobile phones, WiFi, radio transmitters and RFID readers. 1 Unmatched Price Performance Wide Supply Range 1.7 V to 5.5 V Low Supply Current 500 nA Good Offset Voltage 4 mV (max) Good TcVos 1.5 µV/°C Gain-Bandwidth 8 kHz Rail-to-Rail Input and Output (RRIO) Unity-Gain Stable Low Input Bias Current 1 pA EMI Hardened Temperature Range –40°C to 125°C 8-pin VSSOP Package The TLV522 is offered in the 8-pin VSSOP (MSOP) package, and operates from –40°C to 125°C. 2 Applications • • • • • • • • Personal Health Monitors Battery Packs Solar-Powered or Energy Harvested Systems PIR, Smoke, Gas, and Fire Detection Systems Battery Powered Internet of Things (IoT) Devices Remote Sensors/Wireless Sensing Nodes Wearables Glucose Monitoring Device Information(1) PART NUMBER TLV522 PACKAGE VSSOP (8) BODY SIZE (NOM) 3.00 mm x 3.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. space space Nanopower Oxygen Sensor Amplifier 100 M + V 1M + VOUT RL OXYGEN SENSOR 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TLV522 SNOSD27 – MAY 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 2 3 6.1 6.2 6.3 6.4 6.5 6.6 3 3 3 3 4 5 Absolute Maximum Ratings ...................................... ESD Ratings ............................................................ Recommended Operating Ratings............................ Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. 8 Application and Implementation ........................ 12 8.1 Application Information............................................ 12 8.2 Typical Application: 60 Hz Twin "T" Notch Filter..... 12 8.3 Do's and Don'ts ...................................................... 13 9 Power Supply Recommendations...................... 14 10 Layout................................................................... 14 10.1 Layout Guidelines ................................................. 14 10.2 Layout Example .................................................... 14 11 Device and Documentation Support ................. 15 11.1 11.2 11.3 11.4 11.5 11.6 Detailed Description .............................................. 9 7.1 7.2 7.3 7.4 Overview ................................................................... Functional Block Diagram ......................................... Feature Description................................................... Device Functional Modes.......................................... 9 9 9 9 Device Support .................................................... Documentation Support ....................................... Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 15 15 15 15 15 15 12 Mechanical, Packaging, and Orderable Information ........................................................... 15 4 Revision History DATE REVISION NOTES May 2016 * Initial release. 5 Pin Configuration and Functions 8-Pin VSSOP DGK Package Top View OUT A 1 8 V+ 7 OUT B A -IN A 2 B +IN A 3 6 -IN B V- 4 5 +IN B Pin Functions PIN 2 I/O DESCRIPTION PIN NAME 1 OUT A O Channel A Output 2 –IN A I Channel A Inverting Input 3 +IN A I Channel A Non-Inverting Input 4 V– P Negative (lowest) power supply 5 +IN B I Channel B Non-Inverting Input 6 –IN B I Channel B Inverting Input 7 OUT B O Channel B Output 8 V+ P Positive (highest) power supply Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TLV522 TLV522 www.ti.com SNOSD27 – MAY 2016 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) Supply voltage, V+ to V– Voltage Signal input pins (2) MIN MAX UNIT -0.3 6 V - Current (2) + V – 0.3 V + 0.3 V –10 10 mA Continuous (4) Output short current Junction temperature –40 150 °C Storage temperature, Tstg –65 150 °C (1) (2) (3) (4) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should be current-limited to 10 mA or less. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Short-circuit to V–. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) ±250 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Ratings over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply Voltage ( V+– V− ) 1.7 5.5 V Specified Temperature –40 125 °C 6.4 Thermal Information TLV522 THERMAL METRIC (1) DGK (VSSOP) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance RθJC(top) Junction-to-case (top) thermal resistance 73.6 RθJB Junction-to-board thermal resistance 104.1 ψJT Junction-to-top characterization parameter 13.7 ψJB Junction-to-board characterization parameter 102.5 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A (1) 182.5 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TLV522 3 TLV522 SNOSD27 – MAY 2016 www.ti.com 6.5 Electrical Characteristics TA = 25°C, V+ = 3.3 V, V− = 0 V, VCM = VO = V+/2, and RL > 1 MΩ , unless otherwise noted. MIN TYP (1) MAX VCM = 0.3 V –4 ±1 4 VCM = 3 V –4 ±1 4 PARAMETER TEST CONDITIONS UNIT OFFSET VOLTAGE Input offset voltage (VOS) Drift (dVOS/dT) Power-Supply Rejection Ratio (PSRR) V+ = 1.8 V to 3.3 V, VCM = 0.3 V 80 mV 1.5 µV/°C 109 dB INPUT VOLTAGE RANGE Common-Mode voltage range (VCM) CMRR ≥ 62 dB Common-Mode Rejection Ratio (CMRR) 0 V < VCM < 3.3 V 0 62 0 V < VCM < 2.2V 3.3 90 V dB 90 INPUT BIAS CURRENT Input bias current (IBIAS) ±1 Input offset current (IOS) ±0.1 pA INPUT IMPEDANCE Differential 1013 || 2.5 Common mode 1013 || 2.5 Ω || pF NOISE Input voltage noise density, f = 1 kHz (en) Current noise density, f = 1 kHz (in) 300 nV/√Hz 65 fA√Hz 101 dB OPEN-LOOP GAIN Open-loop voltage gain (AOL) V+ = 5 V RL = 100 kΩ to V+/2, 0.5 V < VO < 4.5 V 91 OUTPUT Voltage output swing from positive rail V+ = 1.8 V, RL = 100 kΩ to V+/2 + + 3 20 2 20 Voltage output swing from negative rail V = 1.8 V, RL = 100 kΩ to V /2 Output current sourcing Sourcing, V+ = 1.8 V VO to V–, VIN(diff) = 100 mV 1 3 Output current sinking Sinking, V+ = 1.8 V VO to V+, VIN(diff) = –100 mV 1 5 mV mA FREQUENCY RESPONSE Gain-bandwidth product (GBWP) CL = 20 pF 8 Slew rate (SR) G = +1, Rising edge, 1Vp-p, CL = 20 pF 3.6 G = +1, Falling edge, 1Vp-p, CL = 20 pF 3.7 VCM = 0.3 V, IO = 0 500 kHz V/ms POWER SUPPLY Quiescent current per channel (IQ) (1) 4 800 nA Refer to Typical Characteristics. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TLV522 TLV522 www.ti.com SNOSD27 – MAY 2016 6.6 Typical Characteristics TA = 25 °C, VOUT = VCM = VS/2, RLOAD = 1 MΩ connected to VS/2, and CL = 20 pF, unless otherwise noted. 1000 Supply Current per Channel (nA/Ch) Supply Current per Channel (nA/Ch) 1000 VCM = 0.3V 900 800 700 600 500 400 125°C 85°C 25°C 0°C -40°C 300 200 100 0 1.5 2 2.5 3 3.5 4 4.5 5 No Output Load 700 600 500 400 125°C 85°C 25°C 0°C -40°C 300 200 100 0 1.5 2.5 3 3.5 4 4.5 5 5.5 Supply Voltage (V) VCM = 0.3 V No Output Load C001 VCM = (V+) – 0.3 V Figure 2. Supply Voltage vs Supply Current per Channel, High Vcm 1000 100 900 800 Output Current (mA) 10 700 600 500 400 125°C 85°C 25°C 0°C -40°C 300 200 100 0 1 0.1 -40°C 0.01 25°C 125°C 0.001 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 Common Mode Voltage (V) 1 10 100 1000 10000 Output Referred to V- (mV) C001 No Output Load SNK VS = 3.3 V Figure 3. Supply Current vs Common Mode at 3.3 V Figure 4. Output Sinking Current vs Output Swing at 3.3 V 100 Short Circuit Current to V- (mA) 50 10 Output Current (mA) 2 C001 Figure 1. Supply Voltage vs Supply Current per Channel, Low Vcm Supply Current per Channel (nA/Ch) 800 5.5 Supply Voltage (V) VCM = VS - 0.3V 900 1 0.1 -40°C 0.01 25°C 125°C 0.001 45 40 35 30 25 20 15 -40°C 10 25°C 5 125°C 0 1 10 100 1000 10000 Output Referred to V+ (mV) 1.5 VS = 3.3 V 2 2.5 3 3.5 4 4.5 Supply Voltage (V) SRC 5 SHR Output set high (sourcing), shorted to V– Figure 5. Output Sourcing Current vs Output Swing at 3.3 V Figure 6. Output Short Circuit Current to V- vs Supply Voltage Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TLV522 5 TLV522 SNOSD27 – MAY 2016 www.ti.com Typical Characteristics (continued) 50 0.10 45 0.08 40 0.06 Input Bias Current (pA) Short Circuit Current to V+ (mA) TA = 25 °C, VOUT = VCM = VS/2, RLOAD = 1 MΩ connected to VS/2, and CL = 20 pF, unless otherwise noted. 35 30 25 20 0.04 0.02 0.00 -0.02 -0.04 15 -40°C 10 25°C -0.06 5 125°C -0.08 0 1.5 2 2.5 3 3.5 4 4.5 5 Supply Voltage (V) -0.10 -0.3 VS = 3.3 V Figure 7. Output Short Circuit Current to V+ vs Supply Voltage 1.5 2.1 2.7 3.3 C004 TA = 25°C Figure 8. Input Bias Current vs Common Mode Voltage at 3.3 V 2.0 50 1.5 40 Input Bias Current (pA) Input Bias Current (pA) 0.9 Common Mode Voltage (V) Ouput set low (sinking), shorted to V+ 1.0 0.5 0.0 -0.5 -1.0 -1.5 30 20 10 0 -10 -20 -30 -40 -2.0 -0.3 0.3 0.9 1.5 2.1 2.7 VS = 3.3 V -50 -0.3 3.3 Common Mode Voltage (V) 0.3 TA = 85°C 0.9 1.5 2.1 2.7 3.3 Common Mode Voltage (V) C005 VS = 3.3 V Figure 9. Input Bias Current vs Common Mode Voltage at 3.3 V C006 TA = 125°C Figure 10. Input Bias Current vs Common Mode Voltage at 3.3 V 10k IN VS = 5V RL=100k OUT 50 mV/div Input Referred Voltage Noise (nV/SqRtHz) 0.3 SHR 1k 100 100m 1 10 100 1k 10k VS = 5 V RL = 100 kΩ Time (100us/div) 100k Frequency (Hz) C001 C001 CL = 20 pF VS = ±0.9 V G = +1 Figure 11. Input Referred Voltage Noise RL = 10 MΩ VIN = ±100 mV CL = 20 pF Figure 12. Pulse Response, 200mVpp at 1.8 V 6 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TLV522 TLV522 www.ti.com SNOSD27 – MAY 2016 Typical Characteristics (continued) TA = 25 °C, VOUT = VCM = VS/2, RLOAD = 1 MΩ connected to VS/2, and CL = 20 pF, unless otherwise noted. IN OUT OUT 50 mV/div 200 mV/div IN Time (200us/div) Time (100us/div) C002 C003 CL = 20 pF VS = ±2.5 V G = +1 Figure 13. Pulse Response, 1Vpp at 1.8V RL = 10 MΩ VIN = ±100 mV Figure 14. Pulse Response, 200mVpp at 5V 40 IN Gain (dB) 500 mV/div 30 20 10 45 0 0 100 1000 20 180 135 30 90 20 10 45 0 0 100 1000 10000 Frequency (Hz) VS = 5 V RL = 100 kΩ C011 CL = 20 pF -40°C 25°C 125°C Gain Phase ±10 RL = 100 kΩ 40 ±45 100000 Gain (dB) Gain (dB) 30 ±45 100000 Figure 16. Gain and Phase vs Temperature at 1.8 V Phase (ƒ) -40°C 25°C 125°C 10000 Frequency (Hz) VS = 1.8 V CL = 20 pF Figure 15. Pulse Response, 2Vpp at 5V Gain 135 90 C002 40 180 Phase ±10 Time (200us/div) RL = 10 MΩ VIN = ±1V -40°C 25°C 125°C Gain OUT VS = ±2.5 V G = +1 CL = 20 pF Phase (ƒ) RL = 10 MΩ VIN = ±500mV 135 90 Phase 10 45 0 0 ±10 100 1000 10000 ±45 100000 Frequency (Hz) C008 CL = 20 pF 180 VS = 1.8 V Figure 17. Gain and Phase vs Temperature at 5 V RL = 1 MΩ Phase (ƒ) VS = ±0.9 V G = +1 C012 CL = 20 pF Figure 18. Gain and Phase vs Temperature at 1.8 V Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TLV522 7 TLV522 SNOSD27 – MAY 2016 www.ti.com Typical Characteristics (continued) TA = 25 °C, VOUT = VCM = VS/2, RLOAD = 1 MΩ connected to VS/2, and CL = 20 pF, unless otherwise noted. 135 30 90 20 Phase 10 45 0 0 ±10 100 1000 ±45 100000 10000 Frequency (Hz) VS = 5 V 10 45 0 0 ±10 100 1000 10000 Frequency (Hz) VS = 1.8 V Figure 19. Gain and Phase vs Temperature at 5 V RL = 10 MΩ ±45 100000 C013 CL = 20 pF Figure 20. Gain and Phase vs Temperature at 1.8 V 40 -40°C 25°C 125°C Gain 30 20 180 135 90 Phase 10 45 0 0 ±10 1000 10000 Frequency (Hz) VS = 5 V 135 90 CL = 20 pF 100 180 Phase C009 RL = 1 MΩ Gain (dB) -40°C 25°C 125°C Gain Phase (ƒ) 20 40 RL = 10 MΩ Phase (ƒ) Gain (dB) 30 180 Gain (dB) -40°C 25°C 125°C Gain Phase (ƒ) 40 ±45 100000 C010 CL = 20 pF Figure 21. Gain and Phase vs Temperature at 5 V 8 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TLV522 TLV522 www.ti.com SNOSD27 – MAY 2016 7 Detailed Description 7.1 Overview The TLV522 dual op amplifier is unity-gain stable and can operate on a single supply, making it highly versatile and easy to use. The TLV522 is fully specified and tested from 1.7 V to 5.5 V. Parameters that vary significantly with operating voltages or temperature are shown in the Typical Characteristics curves. 7.2 Functional Block Diagram 7.3 Feature Description The amplifier's differential inputs consist of a non-inverting input (IN+) and an inverting input (IN–). The device amplifies only the difference in voltage between the two inputs, which is called the differential input voltage. The output voltage of the op-amp VOUT is given by Equation 1: VOUT = AOL (IN+ – IN–) (1) where AOL is the open-loop gain of the amplifier, typically around 100 dB. 7.4 Device Functional Modes 7.4.1 Rail-To-Rail Input The input common-mode voltage range of the TLV522 extends to the supply rails. This is achieved with a complementary input stage — an N-channel input differential pair in parallel with a P-channel differential pair. The N-channel pair is active for input voltages close to the positive rail, typically (V+) – 800 mV to 200 mV above the positive supply, while the P-channel pair is on for inputs from 300 mV below the negative supply to approximately (V+) – 800 mV. There is a small transition region, typically (V+) – 1.2 V to (V+) – 0.8 V, in which both pairs are on. This 400 mV transition region can vary 200 mV with process variation. Within the 400 mV transition region PSRR, CMRR, offset voltage, offset drift, and THD may be degraded compared to operation outside this region. 7.4.2 Supply Current Changes Over Common Mode Because of the ultra-low supply current, changes in common mode voltages will cause a noticeable change in the supply current as the input stages transition through the transition region, as shown in Figure 22 below. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TLV522 9 TLV522 SNOSD27 – MAY 2016 www.ti.com Device Functional Modes (continued) Supply Current per Channel (nA/Ch) 1000 900 800 700 600 500 400 125°C 85°C 25°C 0°C -40°C 300 200 100 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Common Mode Voltage (V) 4.5 5.0 C001 Figure 22. Supply Current Change Over Common Mode at 5 V For the lowest supply current operation, keep the input common mode range between V- and 1 V below V+. 7.4.3 Design Optimization With Rail-To-Rail Input In most applications, operation is within the range of only one differential pair. However, some applications can subject the amplifier to a common-mode signal in the transition region. Under this condition, the inherent mismatch between the two differential pairs may lead to degradation of the CMRR and THD. The unity-gain buffer configuration is the most problematic as it will traverse through the transition region if a sufficiently wide input swing is required. 7.4.4 Design Optimization for Nanopower Operation When designing for ultra-low power, choose system components carefully. To minimize current consumption, select large-value resistors. Any resistors will react with stray capacitance in the circuit and the input capacitance of the operational amplifier. These parasitic RC combinations can affect the stability of the overall system. A feedback capacitor may be required to assure stability and limit overshoot or gain peaking. When possible, use AC coupling and AC feedback to reduce static current draw through the feedback elements. Use film or ceramic capacitors since large electolytics may have static leakage currents in the tens to hundreds of nanoamps. 7.4.5 Common-Mode Rejection The CMRR for the TLV522 is specified in two ways so the best match for a given application may be used. First, the CMRR of the device in the common-mode range below the transition region (VCM < (V+) – 1.1 V) is given. This specification is the best indicator of the capability of the device when the application requires use of one of the differential input pairs. Second, the CMRR at VS = 3.3 V over the entire common-mode range is specified. 7.4.6 Output Stage The TLV522 output voltage swings 3 mV from rails at 3.3 V supply, which provides the maximum possible dynamic range at the output. This is particularly important when operating on low supply voltages. The TLV522 Maximum Output Voltage Swing defines the maximum swing possible under a particular output load. 7.4.7 Driving Capacitive Load The TLV522 is internally compensated for stable unity gain operation, with a 8 kHz typical gain bandwidth. However, the unity gain follower is the most sensitive configuration to capacitive load. The combination of a capacitive load placed directly on the output of an amplifier along with the amplifier’s output impedance creates a phase lag, which reduces the phase margin of the amplifier. If the phase margin is significantly reduced, the response will be under damped which causes peaking in the transfer and, when there is too much peaking, the op amp might start oscillating. 10 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TLV522 TLV522 www.ti.com SNOSD27 – MAY 2016 Device Functional Modes (continued) In order to drive heavy (>50pF) capacitive loads, an isolation resistor, RISO, should be used, as shown in Figure 23. By using this isolation resistor, the capacitive load is isolated from the amplifier’s output. The larger the value of RISO, the more stable the amplifier will be. If the value of RISO is sufficiently large, the feedback loop will be stable, independent of the value of CL. However, larger values of RISO result in reduced output swing and reduced output current drive. - RISO VOUT VIN + CL Figure 23. Resistive Isolation of Capacitive Load Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TLV522 11 TLV522 SNOSD27 – MAY 2016 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The TLV522 is a ultra-low power operational amplifier that provides 8 kHz bandwidth with only 490 nA quiescent current, and near precision offset and drift specifications at a low cost. These rail-to-rail input and output amplifiers are specifically designed for battery-powered applications. The input common-mode voltage range extends to the power-supply rails and the output swings to within millivolts of the rails, maintaining a wide dynamic range. 8.2 Typical Application: 60 Hz Twin "T" Notch Filter VBATT = 3V o 2V @ end of life CR2032 Coin Cell 225 mAh = 5 circuits @ 9.5 yrs. 10 M: 10 M: VBATT - Remote Sensor 10 M: + VIN Signal + 60 Hz To ADC VOUT 10 M: 270 pF 270 pF 10 M: 10 M: Signal × 2 (No 60 Hz) 60 Hz Twin T Notch Filter 270 pF AV = 2 V/V 270 pF Figure 24. 60 Hz Notch Filter 8.2.1 Design Requirements Small signals from transducers in remote and distributed sensing applications commonly suffer strong 60 Hz interference from AC power lines. The circuit of Figure 24 notches out the 60 Hz and provides a gain AV = 2 for the sensor signal represented by a 1 kHz sine wave. Similar stages may be cascaded to remove 2nd and 3rd harmonics of 60 Hz. Thanks to the nA power consumption of the TLV522, even 5 such circuits can run for 9.5 years from a small CR2032 lithium cell. These batteries have a nominal voltage of 3 V and an end of life voltage of 2 V. With an operating voltage from 1.7 V to 5.5 V the TLV522 can function over this voltage range. 8.2.2 Detailed Design Procedure The notch frequency is set by: F0 = 1 / 2πRC. (2) To achieve a 60 Hz notch use R = 10 MΩ and C = 270 pF. If eliminating 50 Hz noise, which is common in European systems, use R = 11.8 MΩ and C = 270 pF. The Twin T Notch Filter works by having two separate paths from VIN to the amplifier’s input. A low frequency path through the series input resistors and another separate high frequency path through the series input capacitors. However, at frequencies around the notch frequency, the two paths have opposing phase angles and the two signals will tend to cancel at the amplifier’s input. 12 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TLV522 TLV522 www.ti.com SNOSD27 – MAY 2016 Typical Application: 60 Hz Twin "T" Notch Filter (continued) To ensure that the target center frequency is achieved and to maximize the notch depth (Q factor) the filter needs to be as balanced as possible. To obtain circuit balance, while overcoming limitations of available standard resistor and capacitor values, use passives in parallel to achieve the 2C and R/2 circuit requirements for the filter components that connect to ground. To make sure passive component values stay as expected clean board with alcohol, rinse with deionized water, and air dry. Make sure board remains in a relatively low humidity environment to minimize moisture which may increase the conductivity of board components. Also large resistors come with considerable parasitic stray capacitance which effects can be reduced by cutting out the ground plane below components of concern. Large resistors are used in the feedback network to minimize battery drain. When designing with large resistors, resistor thermal noise, op amp current noise, as well as op amp voltage noise, must be considered in the noise analysis of the circuit. The noise analysis for the circuit in Figure 24 can be done over a bandwidth of 2 kHz, which takes the conservative approach of overestimating the bandwidth (TLV522 typical GBW/AV is lower). The total noise at the output is approximately 800 µVpp, which is excellent considering the total consumption of the circuit is only 900 nA. The dominant noise terms are op amp voltage noise , current noise through the feedback network (430 µVpp), and current noise through the notch filter network (280 µVpp). Thus the total circuit's noise is below 1/2 LSB of a 10-bit system with a 2 V reference, which is 1 mV. 8.2.3 Application Curve Figure 25. 60 Hz Notch Filter Waveform 8.3 Do's and Don'ts Do properly bypass the power supplies. Do add series resistance to the output when driving capacitive loads, particularly cables, MUX and ADC inputs. Do add series current limiting resistors and external schottky clamp diodes if input voltage is expected to exceed the supplies. Limit the current to 1 mA or less (1 KΩ per volt). Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TLV522 13 TLV522 SNOSD27 – MAY 2016 www.ti.com 9 Power Supply Recommendations The TLV522 is specified for operation from 1.7 V to 5.5 V (±0.85 V to ±2.75 V) over a –40°C to 125°C temperature range. Parameters that can exhibit significant variance with regard to operating voltage or temperature are presented in the Typical Characteristics. CAUTION Supply voltages larger than 6 V can permanently damage the device. For proper operation, the power supplies must be properly decoupled. For decoupling the supply lines it is suggested that 10 nF capacitors be placed as close as possible to the operational amplifier power supply pins. For single supply, place a capacitor between V+ and V– supply leads. For dual supplies, place one capacitor between V+ and ground, and one capacitor between V– and ground. If your application expects signals above (> 1 kHz) we recommend you use extra supply filtering. Extra filtering on the power supply input is recommended when presence of signals with frequency above one kHz (> 1 kHz) on the line is expected. Example of such signal sources are high-frequency switching supplies. 10 Layout 10.1 Layout Guidelines The V+ pin should be bypassed to ground with a low ESR capacitor. The optimum placement is closest to the V+ and ground pins. Care should be taken to minimize the loop area formed by the bypass capacitor connection between V+ and ground. The ground pin should be connected to the PCB ground plane at the pin of the device. The feedback components should be placed as close to the device as possible to minimize strays. There is an internal electrical connection between the exposed Die Attach Pad (DAP) and the V– pin. For best performance the DAP should be connected to the exact same potential as the V– pin. Do not use the DAP as the primary V– supply. Floating the DAP pad is not recommended. The DAP and V– pin should be joined directly as shown in the Layout Example. 10.2 Layout Example Place components close to device and to each other to reduce parasitic error VOUTA Place low-ESR ceramic bypass capacitor close to device RF Run the input traces as far away from the supply lines as possible OUTA V+ GND -INA OUTB VIN +INA -INB V- +INB GND RG Place low-ESR ceramic bypass capacitor close to device GND VS- Figure 26. Layout Example (Top View) 14 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TLV522 TLV522 www.ti.com SNOSD27 – MAY 2016 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support TINA-TI SPICE-Based Analog Simulation Program, http://www.ti.com/tool/tina-ti DIP Adapter Evaluation Module, http://www.ti.com/tool/dip-adapter-evm TI Universal Operational Amplifier Evaluation Module, http://www.ti.com/tool/opampevm TI FilterPro Filter Design software, http://www.ti.com/tool/filterpro 11.2 Documentation Support 11.2.1 Related Documentation For related documentation, see the following: • AN-1798 Designing with Electro-Chemical Sensors, SNOA514 • AN-1803 Design Considerations for a Transimpedance Amplifier, SNOA515 • AN-1852 Designing With pH Electrodes, SNOA529 • Compensate Transimpedance Amplifiers Intuitively, SBOA055 • Transimpedance Considerations for High-Speed Operational Amplifiers, SBOA112 • Noise Analysis of FET Transimpedance Amplifiers, SBOA060 • Circuit Board Layout Techniques, SLOA089 • Handbook of Operational Amplifier Applications, SBOA092 11.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TLV522 15 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TLV522DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 SL V522 TLV522DGKT ACTIVE VSSOP DGK 8 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 SL V522 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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