0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
TLV5619QDW

TLV5619QDW

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SOIC20

  • 描述:

    IC DAC 12BIT V-OUT 20SOIC

  • 数据手册
  • 价格&库存
TLV5619QDW 数据手册
TLV5619 www.ti.com SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 2.7 V TO 5.5 V 12-BIT PARALLEL DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN FEATURES • • • • • • • • • • • Single Supply 2.7-V to 5.5-V Operation ± 0.4 LSB Differential Nonlinearity (DNL), ±1.5 LSB Integral Nonlinearity (INL) 12-Bit Parallel Interface Compatible With TMS320 DSP Internal Power On Reset Settling Time 1 µs Typ Low Power Consumption: – 8 mW for 5-V Supply – 4.3 mW for 3-V Supply Reference Input Buffers Voltage Output Monotonic Over Temperature Asynchronous Update APPLICATIONS • • • • • • • • Battery Powered Test Instruments Digital Offset and Gain Adjustment Battery Operated/Remote Industrial Controls Machine and Motion Control Devices Cordless and Wireless Telephones Speech Synthesis Communication Modulators Arbitrary Waveform Generation DESCRIPTION The TLV5619 is a 12-bit voltage output DAC with a microprocessor and TMS320 compatible parallel interface. The 12 data bits are double buffered so that the output can be updated asynchronously using the LDAC pin. During normal operation, the device dissipates 8 mW at a 5-V supply and 4.3 mW at a 3-V supply. The power consumption can be lowered to 50 nW by setting the DAC to power-down mode. The output voltage is buffered by a ×2 gain rail-to-rail amplifier, which features a Class A output stage to improve stability and reduce settling time. DW OR PW PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 8 9 10 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 20 19 18 17 16 15 14 13 12 11 D1 D0 CS WE LDAC PD GND OUT REFIN VDD AVAILABLE OPTIONS PACKAGE TA SMALL OUTLINE (DW) TSSOP (PW) 0°C to 70°C TLV5619CDW TLV5619CPW 40°C to 85°C TLV5619IDW TLV5619IPW 40°C to 125°C TLV5619QDW — Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1997–2004, Texas Instruments Incorporated TLV5619 www.ti.com SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. FUNCTIONAL BLOCK DIAGRAM REFIN D0 12 + _ 19 20 D1 1 D2 2 D3 3 D4 4 D5 5 D6 6 D7 7 D8 8 D9 9 D10 10 D11 Resistor String DAC 12 17 WE 12 x2 Power-On Reset Select and Control Logic 18 CS 12-Bit DAC Latch 12-Bit Input Register 15 PD 16 LDAC Terminal Functions TERMINAL NAME CS D0 (LSB)-D11 (MSB) NO. I/O DESCRIPTION 18 I Chip select 19, 20, 1-10 I Parallel data input GND 14 LDAC 16 I Load DAC OUT 13 O Analog output PD 15 I When low, disables all buffer amplifier voltages to reduce supply current REFIN 12 I Voltage reference input VDD 11 WE 17 2 Ground Positive power supply I Write enable 13 OUT TLV5619 www.ti.com SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) UNIT Supply voltage (VDD to GND) 7V Analog input voltage range - 0.3 V to VDD + 0.3 V Reference input voltage VDD + 0.3 V Digital input voltage range to GND Operating free-air temperature range, TA - 0.3 V to VDD + 0.3 V TLV5619C 0°C to 70°C TLV5619I -40°C to 85°C TLV5619Q -40°C to 125°C Storage temperature range, Tstg -65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds (1) 260°C Stresses beyond those listed under,, absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under,, recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX Supply voltage, VDD (5-V Supply) 4.5 5 5.5 V Supply voltage, VDD (3-V Supply) 2.7 3 3.3 V High-level digital input voltage, VIH DVDD = 2.7 V 2 DVDD = 5.5 V 2.4 V DVDD = 2.7 V Low-level digital input voltage, VIL DVDD = 5.5 V 0.6 TLV5619C and TLV5619I 1 TLV5619Q V 0.8 Reference voltage, Vref to REFIN terminal (5-V Supply) 0 2.048 VDD-1.5 Reference voltage, Vref to REFIN terminal (3-V Supply) 0 1.024 VDD-1.5 Load resistance, RL 2 10 Load capacitance, CL Operating free-air temperature, TA UNIT V V kΩ 100 TLV5619C 0 70 TLV5619I 40 85 TLV5619Q 40 125 pF °C 3 TLV5619 www.ti.com SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range, sdupply voltages, and reference voltages (unless otherwise noted) STATIC DAC SPECIFICATIONS PARAMETER EZS EG TEST CONDITIONS MIN Resolution Vref(REFIN) = 2.048 V at 5 V, 1.024 V at 3 V Integral nonlinearity (INL) Vref(REFIN) = 2.048 V at 5 V, 1.024 V at 3 V, Differential nonlinearity (DNL) TYP MAX 12 UNIT bits See (1) ±1.5 ±4 LSB Vref(REFIN) = 2.048 V at 5 V, 1.024 V at 3 V, See (2) ±0.4 ±1 LSB Zero-scale error (offset error at zero scale) Vref(REFIN) = 2.048 V at 5 V, 1.024 V at 3 V, See (3) ±3 ±20 mV Zero-scale-error temperature coefficient Vref(REFIN) = 2.048 V at 5 V, 1.024 V at 3 V, See (4) 3 Gain error Vref(REFIN) = 2.048 V at 5 V, 1.024 V at 3 V, See (5) ±0.25 Gain error temperature coefficient Vref(REFIN) = 2.048 V at 5 V, 1.024 V at 3 V, See (6) 1 PSRR Power-supply rejection ratio Zero scale Gain See (7) and ppm/°C ±0.5 ppm/°C 65 (8) % of FS voltage dB 65 (1) The relative accuracy or integral nonlinearity (INL), sometimes referred to as linearity error, is the maximum deviation of the output from the line between zero and full scale excluding the effects of zero code and full-scale errors. (2) The differential nonlinearity (DNL), sometimes referred to as differential error, is the difference between the measured and ideal 1 LSB amplitude change of any two adjacent codes. Monotonic means the output voltage changes in the same direction (or remains constant) as a change in the digital input code. (3) Zero-scale error is the deviation from zero voltage output when the digital input code is zero. (4) Zero-scale-error temperature coefficient is given by: EZS TC = [EZS (Tmax) - EZS (Tmin)]/Vref× 106/(Tmax - Tmin). (5) Gain error is the deviation from the ideal output (2 × Vref - 1 LSB) with an output load of 10 kΩ excluding the effects of the zero-error. (6) Gain temperature coefficient is given by: EG TC = [EG(Tmax) - EG (Tmin)]/Vref× 106/(Tmax - Tmin). (7) Zero-scale-error rejection ratio (EZS-RR) is measured by varying the VDD from 4.5 V to 5.5 V dc and measuring the proportion of this signal imposed on the zero-code output voltage. (8) Gain-error rejection ratio (EG-RR) is measured by varying the VDD from 4.5 V to 5.5 V dc and measuring the proportion of this signal imposed on the full-scale output voltage after subtracting the zero scale change. OUTPUT SPECIFICATIONS PARAMETER VO Voltage output range TEST CONDITIONS RL = 10 kΩ MIN TYP 0 VDD-0.4 Output load regulation accuracy VO(OUT)= 4.096 V, 2.048 V RL = 2 kΩ 0.1 IOSC(source) Output short circuit source current VO(OUT) = 0 V, Full scale code 5-V Supply 100 3-V Supply 25 IO(source) Output source current RL = 100Ω 5-V Supply 10 3-V Supply 10 4 MAX 0.29 UNIT V % of FS voltage mA mA TLV5619 www.ti.com SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 REFERENCE INPUT (REFIN) PARAMETER Vref Reference input voltage Ri Reference input resistance Ci Reference input capacitance TEST CONDITIONS See MIN (1) TYP MAX 0 UNIT VDD-1.5 V 10 Reference feed through REFIN = 1 Vpp at 1 kHz + 1.024 V dc (see Reference input bandwidth REFIN = 0.2 Vpp + 1.024 V dc at -3 dB (2)) MΩ 5 pF 60 dB 1.4 MHz DIGITAL INPUTS (D0-D11, CS, WE, LDAC, PD) IIH High-level digital input current VI = VDD 1 µA IIL Low-level digital input current VI = 0 V 1 µA Ci Input capacitance 8 pF (1) (2) Reference input voltages greater than VDD/2 will cause output saturation for large DAC codes. Reference feedthrough is measured at the DAC output with an input code = 0x000 and a Vref(REFIN) input = 1.024 V dc + 1 Vpp at 1 kHz. POWER SUPPLY PARAMETER IDD TEST CONDITIONS Power supply current No load, All inputs 0 V or VDD MIN TYP MAX 5-V Supply 1.6 3 3-V Supply 1.44 2.7 0.01 10 Power down supply current UNIT mA µA ANALOG OUTPUT DYNAMIC PERFORMANCE PARAMETER SR Slew rate TEST CONDITIONS CL = 100 pF, RL = 10 kΩ Vref(REFIN) = 2.048 V, Vref(REFIN) =1.024 V, VO from 10% to 90% VO from 90% to 10% Output settling time (full scale) To ±0.5 LSB, RL = 10 kΩ, CL = 100 pF, See Glitch energy DIN = all 0s to all 1s S/N Signal to noise fs = 480 kSPS, BW = 20 kHz, CL = 100 pF, fOUT = 1 kHz, RL = 10 kΩ , TA = 25°C, See (2) S/(N+D) f = 480 kSPS, BW = 20 kHz, CL = 100 pF, Signal to noise + distortion s fOUT = 1 kHz, RL = 10 kΩ, TA = 25°C, See (2) ts (1) (2) MIN TYP 5-V Supply 8 12 V/µs 3-V Supply 6 9 V/µs (1) Total harmonic distortion fs = 480 kSPS, BW = 20 kHz, CL = 100 pF, fOUT = 1 kHz, RL = 10 kΩ, TA = 25°C, See (2) Spurious free dynamic range fs = 480 kSPS, BW = 20 kHz, CL = 100 pF, fOUT = 1 kHz, RL = 10 kΩ, TA = 25°C, See (2) 1 MAX 3 5 5-V Supply 65 78 5-V Supply 58 67 3-V Supply 58 69 68 60 UNIT µs nV-s dB 60 72 Settling time is the time for the output signal to remain within ±0.5 LSB of the final measured value for a digital input code change of 32 to 4063 or 4063 to 32. Limits are ensured by design and characterization, but are not production tested. 1 kHz sinewave generated by DAC, reference voltage = 1.024 V at 3 V and 2.048 V at 5 V. TIMING REQUIREMENTS DIGITAL INPUTS MIN NOM MAX UNIT tsu(CS-WE) Setup time, CS low before positive WE edge 13 ns tsu(D) Setup time, data ready before positive WE edge 9 ns th(D) Hold time, data held after positive WE edge 0 ns tsu(WE-LD) Setup time, positive WE edge before LDAC low 0 ns twh(WE) Pulse width, WE high 25 ns tw(LD) Pulse width, LDAC low 25 ns 5 TLV5619 www.ti.com SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 PARAMETER MEASUREMENT INFORMATION D(0–11) X Data tsu(D) X th(D) CS tsu(CE-WE) twh(WE) WE tsu(WE-LD) LDAC Figure 1. Timing Diagram 6 tw(LD) TLV5619 www.ti.com SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS MAXIMUM OUTPUT VOLTAGE vs LOAD MAXIMUM OUTPUT VOLTAGE vs LOAD 5 3 VDD = 5 V, Vref = 2 V, Input Code = 4095 VDD = 3 V, Vref = 1.2 V, Input Code = 4095 2.5 VO – Output Voltage – V VO – Output Voltage – V 4 3 2 2 1.5 1 1 100 k 10 k 1k 100 RL – Output Load – Ω 0.5 100 k 10 10 k 1k 100 RL – Output Load – Ω Figure 2. Figure 3. TOTAL HARMONIC DISTORTION vs LOAD TOTAL HARMONIC DISTORTION vs FREQUENCY 0 0 VDD = 5 V, Vref = 2 V, Tone at 1 kHz VDD = 5 V THD – Total Harmonic Distortion – dB THD – Total Harmonic Distortion – dB 10 –20 –40 –60 –80 –10 –20 –30 –40 –50 –60 –70 –100 100 k –80 10 k 1k 100 RL – Output Load – Ω Figure 4. 10 0 5 10 15 20 25 30 35 f – Frequency – kHz Figure 5. 7 TLV5619 www.ti.com SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS (continued) SIGNAL-TO-NOISE + DISTORTION vs FREQUENCY SNRD – Signal-To-Noise Ratio + Distortion – dB 80 VDD = 5 V 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 f – Frequency – kHz DNL - Differential Nonlinearity - LSB Figure 6. 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0 500 1000 1500 2000 2500 3000 3500 4095 Code INL - Integral Nonlinearity - LSB Figure 7. Differential Nonlinearity 4 3 2 1.5 1 0.5 0 -0.5 -1 -1.5 -2 -3 -4 0 500 1000 1500 2000 2500 Code Figure 8. Integral Nonlinearity 8 3000 3500 4095 TLV5619 www.ti.com SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS (continued) POWER DOWN SUPPLY CURRENT vs TIME 1 I DD – Supply Current – mA 0.1 0.01 0.001 0.0001 0.00001 0.000001 0 100 200 300 400 500 600 t – Time – ms Figure 9. 9 TLV5619 SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 www.ti.com APPLICATION INFORMATION DEFINITIONS OF SPECIFICATIONS AND TERMINOLOGY Integral Nonlinearity (INL) The relative accuracy or integral nonlinearity (INL), sometimes referred to as linearity error, is the maximum deviation of the output from the line between zero and full scale excluding the effects of zero code and full-scale errors. Differential Nonlinearity (DNL) The differential nonlinearity (DNL), sometimes referred to as differential error, is the difference between the measured and ideal 1 LSB amplitude change of any two adjacent codes. Monotonic means the output voltage changes in the same direction (or remains constant) as a change in the digital input code. Zero-Scale Error (EZS) Zero-scale error is defined as the deviation of the output from 0 V at a digital input value of 0. Gain Error (EG) Gain error is the error in slope of the DAC transfer function. Signal-to-Noise Ratio + Distortion (S/N+D) S/N+D is the ratio of the rms value of the output signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for S/N+D is expressed in decibels. Spurious Free Dynamic Range (SFDR) SFDR is the difference between the rms value of the output signal and the rms value of the largest spurious signal within a specified bandwidth. The value for SFDR is expressed in decibels. Total Harmonic Distortion (THD) THD is the ratio of the rms sum of the first six harmonic components to the rms value of the fundamental signal and is expressed in decibels. 10 TLV5619 www.ti.com SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 APPLICATION INFORMATION (continued) LINEARITY, OFFSET, AND GAIN ERROR SUING SINGLE END SUPPLIES When an amplifier is operated from a single supply, the voltage offset can still be either positive or negative. With a positive offset, the output voltage changes on the first code change. With a negative offset the output voltage may not change with the first code depending on the magnitude of the offset voltage. The output amplifier attempts to drive the output to a negative voltage. However, because the most negative supply rail is ground, the output cannot drive below ground and clamps the output at 0 V. The output voltage remains at zero until the input code value produces a sufficient positive output voltage to overcome the negative offset voltage, resulting in the transfer function shown in Figure 10. Output Voltage 0V Negative Offset DAC Code Figure 10. Effect of Negative Offset (Single Supply) This offset error, not the linearity error, produces this breakpoint. The transfer function would have followed the dotted line if the output buffer could drive below the ground rail. For a DAC, linearity is measured between zero input code (all inputs 0) and full scale code (all inputs 1) after offset and full scale are adjusted out or accounted for in some way. However, single supply operation does not allow for adjustment when the offset is negative due to the breakpoint in the transfer function. So the linearity is measured between full scale code and the lowest code that produces a positive output voltage. GENERAL FUNCTION The TLV5619 is a 12-bit, single supply DAC, based on a resistor string architecture. It consists of a parallel interface, a power down control logic, a resistor string, and a rail-to-rail output buffer. The output voltage (full scale determined by reference) is given by: 2 REF CODE [V] 0x1000 Where REF is the reference voltage and CODE is the digital input value, range 0x000 to 0xFFF. A power on reset initially puts the internal latches to a defined state (all bits zero). 11 TLV5619 www.ti.com SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 APPLICATION INFORMATION (continued) PARALLEL INTERFACE The device latches data on the positive edge of WE. It must be enabled with CS low. LDAC low updates the DAC with the value in the holding latch. LDAC is an asynchronous input and can be held low, if a separate update is not necessary. However, to control the DAC using the load feature, LDAC can be driven low after the positive WE edge. TMS320C2XX, 5X A(0–15) TLV5619 IS Address Decoder CS LDAC WE WE D(0–11) D(0–15) Figure 11. Proposed Interface Between TLV5619 and TMS320C2XX, 5X DSPs TMS320C3X A(0–15) TLV5619 Address Decoder TCLK0 CS LDAC R/W WE IOSTROBE D(0–11) D(0–15) Figure 12. Proposed Interface Between TLV5619 and TMS320C3X DSPs 12 TLV5619 www.ti.com SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 APPLICATION INFORMATION (continued) TLV5619 INTERFACED TO TMS320C203 DSP Hardware Interface Figure 13 shows an example of the connection between the TLV5619 and the TMS320C203 DSP. The only other device that is needed in addition to the DSP and the DAC is the 74AC138 address decoding circuit . Using this configuration, the DAC address is 0x0084 within the I/O memory space of the TMS320C203. LDAC is held low so that the output voltage is updated with the rising WE edge. The power down mode is deactivated permanently by pulling PD to VDD. TMS320C203 74AC138 A2 A A3 A4 B C Y1 5V A6 IS G1 G2A G2B TLV5619 D(0–11) 12 D(0–11) VDD PD CS OUT WE WE REF191 Output RLOAD LDAC REFIN Figure 13. TLV5619 to TMS320C203 DSP Interface Connection Software No setup procedure is needed to access the TLV5619. The output voltage can be set using one command: out data_addr, DAC_addr Where data_addr points to the address location (in this example 0x0060) holding the new output voltage data and DAC_addr is the I/O space address of the TLV5619 (in this example 0x0084). The following code shows, how to use the timer of the TMS320C203 as a time base to generate a voltage ramp with the TLV5619. A timer interrupt is generated every 205 µs. The corresponding interrupt service routine increments the output code (stored at 0x0060) for the DAC and writes the new code to the TLV5619. Only the 12 LSBs of the data in 0x0060 are used by the DAC, so that the resulting period of the saw waveform is: • t = 4096 × 205 E-6 s = 0.84 s 13 TLV5619 SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 APPLICATION INFORMATION (continued) SOFTWARE LISTING ; File: ramp.asm ; Description: This program generates a ramp. ;------------- I/O and memory mapped regs ----------.include "regs.asm" TLV5619 .equ 0084h ;------------- vectors ------------------------------.ps 0h b start b INT1 b INT23 b TIM_ISR ********************************************************************* * Main Program ********************************************************************* .ps 1000h .entry start: ldp ; disable interrupts setc splk splk #0 ; set data page to 0 INTM ; disable maskable interrupts #0ffffh, IFR #0004h, IMR ; set up the timer splk splk out out splk out #0000h, #0042h, 61h. PRD 60h, TIM #0c2fh, 62h, TCR ; enable interrupts clrc INTM ; enable maskable interrupts 60h 61h 62h ; loop forever! next idle ; wait for interrupt b next ; all else fails stop here done b done ; hang there ********************************************************************* * Interrupt Service Routines ********************************************************************* INT1: ret ; do nothing and return INT23: ret ; do nothing and return TIM_ISR: ; useful code add #1h ; increment accumulator sacl 60h 14 www.ti.com TLV5619 www.ti.com SLAS172F – DECEMBER 1997 – REVISED FEBRUARY 2004 APPLICATION INFORMATION (continued) out clrc ret .end 60h, TLV5619 ; write to DAC intm; re-enable interrupts ; return from interrupt 15 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TLV5619CDW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 TLV5619C Samples TLV5619CDWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 TLV5619C Samples TLV5619CPW ACTIVE TSSOP PW 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 TV5619 Samples TLV5619CPWR ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 TV5619 Samples TLV5619IDW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 TLV5619I Samples TLV5619IDWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 TLV5619I Samples TLV5619IPW ACTIVE TSSOP PW 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 TY5619 Samples TLV5619IPWR ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 TY5619 Samples TLV5619QDWG4 ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM TLV5619Q Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
TLV5619QDW 价格&库存

很抱歉,暂时无法提供与“TLV5619QDW”相匹配的价格&库存,您可以联系我们找货

免费人工找货