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TLV70012QDCKRQ1

TLV70012QDCKRQ1

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SC-70-5

  • 描述:

    IC REG LINEAR 1.2V 300MA SC70-5

  • 数据手册
  • 价格&库存
TLV70012QDCKRQ1 数据手册
Order Now Product Folder Support & Community Tools & Software Technical Documents Reference Design TLV70018-Q1, TLV70012-Q1 SLVSB67C – NOVEMBER 2011 – REVISED JUNE 2017 TLV700xx-Q1 300-mA, Low-IQ, Low-Dropout Regulator 1 Features 3 Description • • The TLV70018-Q1 and TLV70012-Q1 low-dropout (LDO) linear regulators are low quiescent current devices with excellent line and load transient performance. A precision band-gap and error amplifier provides overall 2% accuracy. Low output noise, high power-supply rejection ratio (PSRR), and low-dropout voltage make this series of devices ideal for powering power-sensitive loads. All device versions have thermal shutdown and current limit for detecting fault conditions. 1 • • • • • • (1) Qualified for Automotive Applications AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range – Device HBM ESD Classification Level H2 – Device CDM ESD Classification Level C3B 2% Accuracy Low IQ: 35 μA Fixed-Output Voltages: 1.2 V and 1.8 V High PSRR: 68 dB at 1 kHz Stable With Effective Capacitance of 0.1 μF(1) Thermal Shutdown and Overcurrent Protection Furthermore, these devices are stable with an effective output capacitance of only 0.1 μF. This feature enables the use of cost-effective capacitors that have higher bias voltages and temperature derating. The devices regulate to specified accuracy with no output load. See the Input and Output Capacitor Requirements. Device Information(1) 2 Applications • • • • PART NUMBER Automotive Head Units Camera Sensors and Modules Heads-Up Displays (HUD) Telematics Control Units TLV70018-Q1 TLV70012-Q1 PACKAGE SOT (5) BODY SIZE (NOM) 2.90 mm × 1.60 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. SPACE SPACE SPACE SPACE SPACE SPACE Typical Application VIN IN OUT CIN COUT VOUT 1 mF Ceramic TLV700xx On Off EN GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TLV70018-Q1, TLV70012-Q1 SLVSB67C – NOVEMBER 2011 – REVISED JUNE 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 4 5 6.1 6.2 6.3 6.4 6.5 6.6 5 5 5 5 6 7 Detailed Description ............................................ 11 7.1 7.2 7.3 7.4 8 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Overview ................................................................. Functional Block Diagrams ..................................... Feature Description................................................. Device Functional Modes........................................ 11 11 11 12 Application and Implementation ........................ 13 8.1 Application Information............................................ 13 8.2 Typical Application .................................................. 13 9 Power Supply Recommendations...................... 14 10 Layout................................................................... 15 10.1 10.2 10.3 10.4 Layout Guidelines ................................................. Layout Example .................................................... Thermal Considerations ........................................ Power Dissipation ................................................. 15 15 15 15 11 Device and Documentation Support ................. 17 11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 Device Support...................................................... Documentation Support ........................................ Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 17 17 17 17 17 17 17 17 12 Mechanical, Packaging, and Orderable Information ........................................................... 18 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (January 2016) to Revision C Page • Changed Fixed-Output Voltage Features bullet from Fixed-Output Voltage Combinations Possible from 1.2 V to 4.8 V to Fixed-Output Voltages: 1.2 V and 1.8 V ......................................................................................................................... 1 • Changed Applications section ............................................................................................................................................... 1 • Changed first paragraph of Description section: changed TLV700xx-Q1 series to TLV70018-Q1 and TLV70012-Q1, deleted second sentence, changed a wide selection of battery-operated handheld equipment to powering powersensitive loads, and changed safety to detecting fault conditions.......................................................................................... 1 • Deleted Fixed-Voltage Version from Typical Application title ................................................................................................ 1 • Changed Input voltage parameter: changed symbol from VI to VIN, moved EN and OUT rows to standalone parameters ............................................................................................................................................................................. 5 • Changed maximum specification of Output voltage parameter from 5.5 V to 1.8 V ............................................................. 5 • Added IOUT symbol to Current output parameter ................................................................................................................... 5 • Deleted TLV70018-Q1 column from Thermal Information table ............................................................................................ 5 • Added TLV70018-Q1 to TLV70012-Q1 column in Thermal Information table; all thermal values for TLV70018-Q1 changed to the TLV70012-Q1 thermal values........................................................................................................................ 5 • Changed VOUT(TYP) to VOUT(NOM) in conditions statement of Electrical Characteristics table .................................................. 6 • Changed symbols for Line regulation, Load regulation, and Output noise voltage parameters from ΔVO/ΔVIN to ΔVOUT/ΔVIN, ΔVO/ΔIOUT to ΔVOUT/ΔIOUT, and VN to Vn (respectively) in Electrical Characteristics table.................................. 6 • Changed VOUT(TYP) to VOUT(NOM) in Typical Characteristics conditions statement .................................................................. 7 • Deleted Dropout Voltage vs Input Voltage and Dropout Voltage vs Output Current curves ................................................. 7 • Changed TLV700xx-Q1 to TLV70018-Q1 and TLV70012-Q1 in Overview section ............................................................. 11 • Added TLV70012-Q1 to sub-sections of Feature Description and Device Functional Modes sections .............................. 11 • Changed 160°C to 165°C, 140°C to 145°C, and 35°C to 40°C in Thermal Shutdown section .......................................... 12 • Changed Application Information section: changed first two sentences, deleted second paragraph ................................. 13 • Changed Example Value column values for 2nd and 3rd rows in Design Parameters table............................................... 13 • Added TLV70012-Q1 to Input and Output Capacitor Requirements section ....................................................................... 14 • Deleted first and last paragraphs from Thermal Considerations section ............................................................................ 15 2 Submit Documentation Feedback Copyright © 2011–2017, Texas Instruments Incorporated Product Folder Links: TLV70018-Q1 TLV70012-Q1 TLV70018-Q1, TLV70012-Q1 www.ti.com SLVSB67C – NOVEMBER 2011 – REVISED JUNE 2017 Revision History (continued) • Deleted second sentence from second paragraph of Power Dissipation section ............................................................... 15 • Added TLV70012-Q1 to Power Dissipation section ............................................................................................................ 15 Changes from Revision A (March 2012) to Revision B Page • Added ESD Ratings table, Recommended Operating Conditions table, Thermal Information table, Detailed Description section, Application and Implementation section, Application and Implementation section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ...... 1 • Deleted the Dissipation Ratings table..................................................................................................................................... 5 Copyright © 2011–2017, Texas Instruments Incorporated Product Folder Links: TLV70018-Q1 TLV70012-Q1 Submit Documentation Feedback 3 TLV70018-Q1, TLV70012-Q1 SLVSB67C – NOVEMBER 2011 – REVISED JUNE 2017 www.ti.com 5 Pin Configuration and Functions DDC Package 5-Pin SOT Top View IN 1 GND 2 EN 3 5 OUT 4 NC Pin Functions PIN NO. DESCRIPTION NAME Input pin. A small 1-μF ceramic capacitor is recommended from this pin to ground to assure stability and good transient performance. (1) 1 IN 2 GND 3 EN Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode and reduces operating current to 1 μA, nominal. 4 NC No connection. This pin can be tied to ground to improve thermal dissipation. 5 OUT (1) 4 Ground pin Regulated output voltage pin. A small 1-μF ceramic capacitor is needed from this pin to ground to assure stability. (1) See Input and Output Capacitor Requirements section for more details. Submit Documentation Feedback Copyright © 2011–2017, Texas Instruments Incorporated Product Folder Links: TLV70018-Q1 TLV70012-Q1 TLV70018-Q1, TLV70012-Q1 www.ti.com SLVSB67C – NOVEMBER 2011 – REVISED JUNE 2017 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range, unless otherwise noted. (1) Voltage (2) Current (source) MIN MAX UNIT IN –0.3 6.0 V EN –0.3 6.0 V OUT –0.3 6.0 V OUT Internally Limited Output short-circuit duration Indefinite Operating virtual junction, TJ –55 150 °C Storage temperature, Tstg –55 150 °C (1) (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network ground terminal. 6.2 ESD Ratings VALUE V(ESD) (1) Human-body model (HBM), per AEC Q100-002 Electrostatic discharge (1) UNIT 2000 Charged-device model (CDM), per AEC Q100-011 V 750 AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions over operating free-air temperature range, unless otherwise noted. MIN MAX VIN Input voltage IN 2 5.5 UNIT V VEN Enable voltage EN 0 5.5 V VOUT Output voltage OUT 0 1.8 V IOUT Current output 0 300 mA TJ Operating junction temperature –40 150 °C 6.4 Thermal Information THERMAL METRIC (1) TLV70018-Q1, TLV70012-Q1 DDC (SOT) UNIT 5 PINS RθJA Junction-to-ambient thermal resistance 262.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 68.2 °C/W RθJB Junction-to-board thermal resistance 81.6 °C/W ψJT Junction-to-top characterization parameter 1.1 °C/W ψJB Junction-to-board characterization parameter 80.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance NA °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Copyright © 2011–2017, Texas Instruments Incorporated Product Folder Links: TLV70018-Q1 TLV70012-Q1 Submit Documentation Feedback 5 TLV70018-Q1, TLV70012-Q1 SLVSB67C – NOVEMBER 2011 – REVISED JUNE 2017 www.ti.com 6.5 Electrical Characteristics At VIN = VOUT(NOM) + 0.5 V or 2 V (whichever is greater); IOUT = 10 mA, VEN = 0.9 V, COUT = 1.0 μF, and TA = –40°C to 125°C, unless otherwise noted. Typical values are at TA = 25°C, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP VOUT DC output accuracy –40°C ≤ TA ≤ 125°C ΔVOUT/ΔVIN Line regulation VOUT(NOM) + 0.5 V ≤ VIN ≤ 5.5 V, IOUT = 10 mA 1 5 0 mA ≤ IOUT ≤ 300 mA, TLV70018-Q1 1 15 0 mA ≤ IOUT ≤ 300 mA, TLV70012-Q1 1 20 500 860 mA 35 55 μA Load regulation ICL Output current limit VOUT = 0.9 × VOUT(NOM) 320 IOUT = 0 mA IGND Ground pin current ISHDN Ground pin current (shutdown) PSRR –2% 5.5 UNIT Input voltage range ΔVOUT/ΔIOUT 2 MAX VIN 0.5% IOUT = 300 mA, VIN = VOUT + 0.5 V 370 VEN ≤ 0.4 V, VIN = 2.0 V 400 V 2% mV mV μA nA VEN ≤ 0.4 V, 2.0 V ≤ VIN ≤ 4.5 V, TA = –40°C to 85°C 1 2 μA VEN ≤ 0.4 V, 2.0 V ≤ VIN ≤ 4.5 V, TA = 85°C to 125°C 1 2.5 μA Power-supply rejection ratio VIN = 2.3 V, VOUT = 1.8 V, IOUT = 10 mA, f = 1 kHz 68 dB Vn Output noise voltage BW = 100 Hz to 100 kHz, VIN = 2.3 V, VOUT = 1.8 V, IOUT = 10 mA 48 μVRMS tSTR Startup time (1) COUT = 1.0 μF, IOUT = 300 mA 100 μs VEN(HI) Enable pin high (enabled) 0.9 VIN VEN(LO) Enable pin low (disabled) 0 0.4 IEN Enable pin current VIN = VEN = 5.5 V UVLO Undervoltage lockout VIN rising 1.9 V Shutdown, temperature increasing 165 °C Reset, temperature decreasing 145 °C TSD Thermal shutdown temperature TA Operating temperature (1) 6 0.04 –40 V V μA 125 °C Startup time = time from EN assertion to 0.98 × VOUT(NOM). Submit Documentation Feedback Copyright © 2011–2017, Texas Instruments Incorporated Product Folder Links: TLV70018-Q1 TLV70012-Q1 TLV70018-Q1, TLV70012-Q1 www.ti.com SLVSB67C – NOVEMBER 2011 – REVISED JUNE 2017 6.6 Typical Characteristics Over operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(NOM) + 0.5 V or 2 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 μF, unless otherwise noted. Typical values are at TJ = 25°C. 1.90 1.90 VOUT = 1.8 V IOUT = 10 mA 1.88 1.86 1.84 1.84 1.82 1.82 VOUT (V) VOUT (V) 1.86 1.80 1.78 1.76 1.72 1.80 1.78 1.76 +125°C +85°C +25°C -40°C 1.74 VOUT = 1.8 V IOUT = 300 mA 1.88 +125°C +85°C +25°C -40°C 1.74 1.72 1.70 1.70 2.1 2.6 3.1 3.6 4.1 VIN (V) 4.6 5.1 2.3 5.6 Figure 1. Line Regulation 10 mA 3.1 3.9 VIN (V) 4.3 4.7 5.1 5.5 1.90 VOUT = 1.8 V 1.88 1.84 1.82 1.82 VOUT (V) 1.86 1.84 1.80 1.78 1.72 1.80 1.78 1.76 +125°C +85°C +25°C -40°C 1.74 VOUT = 1.8 V 1.88 1.86 1.76 10mA 150mA 200mA 1.74 1.72 1.70 1.70 0 50 100 150 200 300 250 -40 -25 -10 IOUT (mA) 5 20 35 50 65 Temperature (°C) 80 95 110 125 Figure 4. Output Voltage vs Temperature Figure 3. Load Regulation 450 50 VOUT = 1.8 V 45 VOUT = 1.8 V 400 40 350 35 300 30 IGND (mA) IGND (mA) 3.5 Figure 2. Line Regulation 300 mA 1.90 VOUT (V) 2.7 25 20 15 5 200 150 +125°C +85°C +25°C -40°C 10 250 +125°C +85°C +25°C -40°C 100 50 0 0 2.1 2.6 3.1 3.6 4.1 VIN (V) 4.6 5.1 5.6 Figure 5. Ground Pin Current vs Input Voltage 0 50 100 150 IOUT (mA) 200 250 300 Figure 6. Ground Pin Current vs Load Copyright © 2011–2017, Texas Instruments Incorporated Product Folder Links: TLV70018-Q1 TLV70012-Q1 Submit Documentation Feedback 7 TLV70018-Q1, TLV70012-Q1 SLVSB67C – NOVEMBER 2011 – REVISED JUNE 2017 www.ti.com Typical Characteristics (continued) Over operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(NOM) + 0.5 V or 2 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 μF, unless otherwise noted. Typical values are at TJ = 25°C. 50 2.5 VOUT = 1.8 V 45 VOUT = 1.8 V 2 40 ISHDN (mA) IGND (mA) 35 30 25 20 1.5 1 15 +125°C +85°C +25°C -40°C 0.5 10 5 0 0 -40 -25 -10 5 20 35 50 65 Temperature (°C) 80 95 2.1 110 125 Figure 7. Ground Pin Current vs Temperature 2.6 3.1 3.6 4.1 VIN (V) VOUT = 1.8 V IOUT = 10 mA 90 80 500 IOUT = 150 mA 70 PSRR (dB) ILIM (mA) 5.6 Figure 8. Shutdown Current vs Input Voltage 600 400 300 200 0 2.3 2.7 3.1 3.5 3.9 VIN (V) 4.3 4.7 5.1 10 Output Spectral Noise Density (mV/ÖHz) VOUT = 1.8 V 50 100 kHz 30 20 10 0 2.2 2.3 2.4 100 2.5 10 k 100 k 2.6 2.7 2.8 10 1M 10 M VOUT = 1.8 V IOUT = 10 mA CIN = COUT = 1 mF 1 0.1 0.01 0.001 10 100 Figure 11. Power-Supply Ripple Rejection vs Input Voltage 1k 10 k 100 k 1M 10 M Frequency (Hz) Input Voltage (V) Submit Documentation Feedback 1k Figure 10. Power-Supply Ripple Rejection vs Frequency 10 kHz 2.1 VIN - VOUT = 0.5 V 0 Frequency (Hz) 1 kHz 40 40 10 Figure 9. Current Limit vs Input Voltage 60 50 20 5.5 80 70 60 30 +125°C +85°C +25°C -40°C 100 PSRR (dB) 5.1 100 700 8 4.6 Figure 12. Output Spectral Noise Density vs Frequency Copyright © 2011–2017, Texas Instruments Incorporated Product Folder Links: TLV70018-Q1 TLV70012-Q1 TLV70018-Q1, TLV70012-Q1 www.ti.com SLVSB67C – NOVEMBER 2011 – REVISED JUNE 2017 Typical Characteristics (continued) Over operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(NOM) + 0.5 V or 2 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 μF, unless otherwise noted. Typical values are at TJ = 25°C. tR = tF = 1 ms IOUT 0 mA VOUT 20 mA/div 200 mA 5 mV/div 50 mV/div 100 mA/div tR = tF = 1 ms 10 mA 0 mA IOUT VOUT VOUT = 1.8 V VOUT = 1.8 V 10 ms/div 10 ms/div Figure 13. Load Transient Response Figure 14. Load Transient Response tR = tF = 1 ms 200 mA/div 300 mA IOUT 50 mA 0 mA 100 mV/div 20 mV/div 50 mA/div tR = tF = 1 ms VOUT IOUT 0 mA VOUT VOUT = 1.8 V VOUT = 1.8 V 10 ms/div 10 ms/div Figure 16. Load Transient Response Figure 15. Load Transient Response 1 V/div 2.9 V VIN Slew Rate = 1 V/ms 2.9 V 2.3 V VIN VOUT VOUT = 1.8 V IOUT = 300 mA 5 mV/div 2.3 V 5 mV/div 1 V/div Slew Rate = 1 V/ms VOUT VOUT = 1.8 V IOUT = 1 mA 1 ms/div 1 ms/div Figure 17. Line Transient Response Figure 18. Line Transient Response Copyright © 2011–2017, Texas Instruments Incorporated Product Folder Links: TLV70018-Q1 TLV70012-Q1 Submit Documentation Feedback 9 TLV70018-Q1, TLV70012-Q1 SLVSB67C – NOVEMBER 2011 – REVISED JUNE 2017 www.ti.com Typical Characteristics (continued) Slew Rate = 1 V/ms VOUT = 1.8 V IOUT = 300 mA 5.5 V VIN 10 mV/div 2.1 V VOUT = 1.8 V IOUT = 1 mA VIN 1 V/div 1 V/div Over operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(NOM) + 0.5 V or 2 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 μF, unless otherwise noted. Typical values are at TJ = 25°C. VOUT VOUT 1 ms/div 200 ms/div Figure 19. Line Transient Response 10 Submit Documentation Feedback Figure 20. VIN Ramp Up, Ramp Down Response Copyright © 2011–2017, Texas Instruments Incorporated Product Folder Links: TLV70018-Q1 TLV70012-Q1 TLV70018-Q1, TLV70012-Q1 www.ti.com SLVSB67C – NOVEMBER 2011 – REVISED JUNE 2017 7 Detailed Description 7.1 Overview The TLV70018-Q1 and TLV70012-Q1 low-dropout (LDO) linear regulators are low-quiescent-current devices with excellent line and load transient performance. These LDOs are designed for power-sensitive applications. A precision bandgap and error amplifier provides overall 2% accuracy together with low output noise, very high power-supply rejection ratio (PSRR), and low dropout voltage. 7.2 Functional Block Diagrams IN OUT Current Limit Thermal Shutdown UVLO EN Bandgap LOGIC TLV700xx Series GND 7.3 Feature Description 7.3.1 Internal Current Limit The TLV70018-Q1 and TLV70012-Q1 internal current limit helps to protect the regulator during fault conditions. During current limit, the output sources a fixed amount of current that is largely independent of the output voltage. In such a case, the output voltage is not regulated, and is VOUT = ILIMIT × RLOAD. The PMOS pass transistor dissipates (VIN – VOUT) × ILIMIT until thermal shutdown is triggered and the device turns off. As the device cools, it is turned on by the internal thermal shutdown circuit. If the fault condition continues, the device cycles between current limit and thermal shutdown. See the Thermal Considerations section for more details. The PMOS pass element in the TLV70018-Q1 and TLV70012-Q1 has a built-in body diode that conducts current when the voltage at OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is anticipated, external limiting to 5% of the rated output current is recommended. 7.3.2 Dropout Voltage The TLV70018-Q1 and TLV70012-Q1 use a PMOS pass transistor to achieve low dropout. When (VIN – VOUT) is less than the dropout voltage (VDO), the PMOS pass device is in the linear region of operation and the input-tooutput resistance is the RDS(ON) of the PMOS pass element. VDO scales approximately with output current because the PMOS device behaves as a resistor in dropout. As with any linear regulator, PSRR and transient response are degraded as (VIN – VOUT) approaches dropout. Figure 11 illustrates this effect. Copyright © 2011–2017, Texas Instruments Incorporated Product Folder Links: TLV70018-Q1 TLV70012-Q1 Submit Documentation Feedback 11 TLV70018-Q1, TLV70012-Q1 SLVSB67C – NOVEMBER 2011 – REVISED JUNE 2017 www.ti.com Feature Description (continued) 7.3.3 Undervoltage Lockout (UVLO) The TLV70018-Q1 and TLV70012-Q1 use an undervoltage lockout circuit to keep the output shut off until internal circuitry is operating properly. 7.3.4 Thermal Shutdown Thermal protection disables the output when the junction temperature rises to approximately 165°C, allowing the device to cool. When the junction temperature cools to approximately 145°C, the output circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a result of overheating. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. For reliable operation, junction temperature should be limited to 125°C maximum. To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should trigger at least 40°C above the maximum expected ambient condition of the particular application. This configuration produces a worst-case junction temperature of 125°C at the highest expected ambient temperature and worst-case load. The internal protection circuitry of the TLV70018-Q1 and TLV70012-Q1 has been designed to protect against overload conditions. It was not intended to replace proper heatsinking. Continuously running the TLV70018-Q1 or TLV70012-Q1 into thermal shutdown degrades device reliability. 7.4 Device Functional Modes 7.4.1 Shutdown The enable pin (EN) is active high. The device is enabled when voltage at EN pin goes above 0.9 V. This relatively lower value of voltage required to turn the LDO on can be exploited to power the LDO with a GPIO of recent processors whose GPIO Logic 1 voltage level is lower than traditional microcontrollers. The device is turned off when the EN pin is held at less than 0.4 V. When shutdown capability is not required, EN can be connected to the IN pin. 7.4.2 Operation with VIN Less than 2 V The TLV70018-Q1 and TLV70012-Q1 devices operate with input voltages above 2 V. The typical UVLO voltage is 1.9 V and the device operates at an input voltage above 2 V. When input voltage falls below UVLO voltage, the device will shutdown. 7.4.3 Operation with VIN Greater than 2 V When VIN is greater than 2 V, if input voltage is higher than desired output voltage plus dropout voltage, the output voltage is equal to the desired value. Otherwise, output voltage will be VIN minus dropout voltage. 12 Submit Documentation Feedback Copyright © 2011–2017, Texas Instruments Incorporated Product Folder Links: TLV70018-Q1 TLV70012-Q1 TLV70018-Q1, TLV70012-Q1 www.ti.com SLVSB67C – NOVEMBER 2011 – REVISED JUNE 2017 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The TLV70018-Q1 and TLV70012-Q1 consume low quiescent current and deliver excellent line and load transient performance. These characteristics, combined with low noise and very good PSRR with little (VIN – VOUT) headroom, make this family of devices ideal for portable RF applications. This family of regulators offers current limit and thermal protection, and is specified from –40°C to 125°C. 8.2 Typical Application VOUT VIN IN EN OUT TLV700xx-Q1 1 uF 1 uF GND Figure 21. Simplified Schematic 8.2.1 Design Requirements For this design example use, the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters PARAMETER EXAMPLE VALUE Input voltage range 2 V to 5.5 V Output voltage 1.2 V, 1.8 V Output current rating 300 mA Effective output capacitor range >0.1 µF Maximum output capacitor ESR range
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