TMP121AQDBVREP

          TMP121-EP TMP123-EP SGLS315 – SEPTEMBER 2005 1.5°C ACCURATE DIGITAL TEMPERATURE SENSOR WITH SPI™ INTERFACE FEATURES • • • • • • • (1) Controlled Baseline – One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of -40°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) Digital Output: SPI-Compatible Interface Resolution: 12-Bit + Sign, 0.0625°C • • • • • Accuracy: ±1.5°C from –25°C to 85°C (max) Low Quiescent Current: 50 µA (max) Wide Supply Range: 2.7 V to 5.5 V Tiny SOT23-6 Package Operation to 150°C APPLICATIONS • • • • • Power-Supply Temperature Monitoring Computer Peripheral Thermal Protection Notebook Computers Battery Management Environmental Monitoring Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. DESCRIPTION The TMP121 and TMP123 are SPI-compatible temperature sensors available in the tiny SOT23-6 package. Requiring no external components, the TMP121 and TMP123 are capable of measuring temperatures within 2°C of accuracy over a temperature range of –40°C to 125°C. Low supply current and a supply range from 2.7 V to 5.5 V make the TMP121 and TMP123 excellent candidates for low-power applications. The TMP121 and TMP123 are ideal for extended thermal measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SPI is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005, Texas Instruments Incorporated TMP121-EP TMP123-EP www.ti.com SGLS315 – SEPTEMBER 2005 Temperature (1) Temperature NC 1 Diode Temp. Sensor Control Logic 6 SO GND 1 Diode Temp. Sensor Control Logic 6 SO GND 2 ∆Σ A/D Converter Serial Interface 5 CS NC 2 ∆Σ A/D Converter Serial Interface 5 CS V+ 3 OSC Config. and Temp. Register 4 SCK V+ 3 OSC Config. and Temp. Register 4 SCK TMP121 TMP123 NC = No Connection(1) NC = No Connection(1) Pins Labeled NC should be left floating or connected to GND. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION TA –40°C to 125°C (1) PACKAGE-LEAD SOT23-6 (DBV) Reel of 3000 ORDERABLE PART NUMBER PACKAGE MARKING TMP121AQDBVREP 121E TMP123AQDBVREP (1) 123E Product Preview ABSOLUTE MAXIMUM RATINGS (1) UNIT V+ Power supply Input voltage (2) Input current TJ max (1) (2) 2 7V –0.3 V to 7 V 10 mA Operating temperature range –55°C to 150°C Storage temperature range –60°C to 150°C Junction temperature 150°C Lead temperature (soldering) 300°C Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. Input voltage rating applies to all TMP121 and TMP123 input voltages. TMP121-EP TMP123-EP www.ti.com SGLS315 – SEPTEMBER 2005 ELECTRICAL CHARACTERISTICS At TA = –40°C to 125°C and V+ = 2.7 V to 5.5 V, unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 125 °C TEMPERATURE INPUT Range –40 ±0.5 ±1.5 –40°C to 125°C ±1 ±2 –40°C to 150°C ±1.5 –25°C to 85°C Accuracy (temperature error) Accuracy vs Supply °C/V 0.1 ±0.0625 Resolution °C °C DIGITAL INPUT/OUTPUT VIH 0.7(V+) Input logic levels VIL IIN 0.3(V+) Input current, SO, SCK, CS VOL SO VOH SO Output logic levels 0 V ≤ VIN≤ V+ ±1 ISINK = 3 mA 0.4 ISOURCE = 2 mA (V+)–0.4 V µA V Resolution 12 Bits Input capacitance, SO, SCK, CS 2.5 pF Conversion time 12-Bit 240 320 ms Conversion period (1) 12-BIt 480 640 ms POWER SUPPLY 5.5 V IQ Operating range Quiescent current Serial bus inactive 2.7 35 50 µA ISD Shutdown current (TPM121) Serial bus inactive 0.1 1 µA ISD Shutdown current (TMP123) Serial bus inactive 0.1 3 µA TEMPERATURE RANGE Specified range –40 125 °C Operating range –55 150 °C Storage range θJA (1) –60 Thermal resistance 150 SOT23-6 surface-mount 200 °C °C/W Period indicates time between conversion starts. PIN CONFIGURATIONS Top View SOT23-6 TMP121(1) GND 2 V+ 3 6 SO GND 1 5 CS NC 2 4 SCK V+ 3 SOT23−6 NC = No Connection(2) 123E 1 121E NC TMP123(1) 6 SO 5 CS 4 SCK SOT23−6 NC = No Connection(2) Pin 1 orientation is determined by package marking. (1) Pin 1 of the SOT23-6 package is determined by orienting the package marking as shown. (2) Pins labeled NC should be left floating or connected to GND. 3 TMP121-EP TMP123-EP www.ti.com SGLS315 – SEPTEMBER 2005 TYPICAL CHARACTERISTICS At TA = 25°C and V+ = 5 V, unless otherwise noted. QUIESCENT CURRENT vs TEMPERATURE SHUTDOWN CURRENT vs TEMPERATURE 50 1.0 0.9 V+ = 5V 0.8 40 0.7 30 ISD (µA) IQ (µA) 0.6 V+ = 2.7V 0.5 0.4 0.3 0.2 20 0.1 0.0 Serial Bus Inactive 10 −60 −40 −20 0 20 40 60 80 100 −0.1 −60 −40 −20 120 140 0 20 40 60 80 100 Temperature (
C) Temperature (
C) Figure 1. Figure 2. CONVERSION TIME vs TEMPERATURE TEMPERATURE ACCURACY vs TEMPERATURE 120 140 2.0 400 300 Temperature Error (
C) Conversion Time (ms) 1.5 V+ = 5V 200 V+ = 2.7V 1.0 0.5 0.0 −0.5 −1.0 −1.5 12−Bit Resolution 100 −60 −40 −20 4 0 20 40 60 80 100 120 140 3 Typical Units 12−Bit Resolution −2.0 −60 −40 −20 0 20 40 60 80 100 120 140 160 Temperature (
C) Temperature (
C) Figure 3. Figure 4. TMP121-EP TMP123-EP www.ti.com SGLS315 – SEPTEMBER 2005 APPLICATION INFORMATION The TMP121 and TMP123 are 12-bit plus sign read-only digital temperature sensors optimal for thermal management and thermal protection applications. The TMP121 and the TMP123 communicate through a serial interface that is SPI-compatible. Temperature is converted to a 12-bit plus sign data word with 0.0625°C resolution. The TMP121 and TMP123 are specified for a temperature range of –40°C to 125°C, with operation extending from –55°C to 150°C. The TMP121 and TMP123 are optimal for low power applications, with a 0.5 s conversion period for reduced power consumption. The TMP121 and TMP123 are specified for a supply voltage range of 2.7 V to 5.5 V, and also feature a hardware shutdown to provide additional power savings. The TMP121 and TMP123 require no external components for operation, though a 0.1-µF supply bypass capacitor is recommended. Figure 5 shows typical connections for the TMP121 and TMP123. V+ V+ 0.1µF 0.1µF 3 SCK 4 SO 6 3 1 NC(1) SCK 4 SO 6 TMP121 5 2 TMP123 5 CS 2 NC(1) CS 1 NC = No Connection GND GND NOTE: Pins labeled NC should be left floating or connected to GND. Figure 5. Typical Connections of the TMP121 and TMP123 The sensing device of both the TMP121 and TMP123 is the chip itself; the die flag of the lead frame is thermally connected to pin 2 of the TMP121 and of the TMP123. Thermal paths run through the package leads as well as the plastic package, and the lower thermal resistance of metal causes the leads to provide the primary thermal path. The GND pin (pin 2) of the TMP121 and the NC pin (pin 2) of the TMP123 are thermally connected to the metal lead frame and are the best choice for thermal input. To maintain accuracy in applications requiring air or surface temperature measurement, care should be taken to isolate the package and leads from ambient air temperature. 5 TMP121-EP TMP123-EP www.ti.com SGLS315 – SEPTEMBER 2005 APPLICATION INFORMATION (continued) TEMPERATURE REGISTER The temperature register of the TMP121 and TMP123 is a 16 bit, signed read-only register that stores the output of the most recent conversion. Up to 16 bits can be read to obtain data and are described in Table 1. The first 13 bits are used to indicate temperature with bits D2 = 0 and D1, D0 in a high impedance state. Data format for temperature is summarized in Table 2. Following power-up or reset, the temperature register reads 0°C until the first conversion is complete. Table 1. Temperature Register D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 T12 T11 T10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 0 Z Z Table 2. Temperature Data Format (1) TEMPERATURE (°C) DIGITAL OUTPUT (1) (BINARY) HEX 150 0100 1011 0000 0000 4B00 125 0011 1110 1000 0000 3E80 25 0000 1100 1000 0000 0C80 0.0625 0000 0000 0000 1000 0008 0 0000 0000 0000 0000 0000 –0.0625 1111 1111 1111 1000 FFF8 –25 1111 0011 1000 0000 F380 –55 1110 0100 1000 0000 E480 The last two bits are high impedance and are shown as 00 in the table. COMMUNICATING WITH THE TMP121 The TMP121 and TMP123 continuously convert temperatures to digital data while CS is high. CS must be high for a minimum of one conversion time (320 ms max) to update the temperature data. Reading temperature data from the TMP121 and TMP123 is initiated by pulling CS low, which causes any conversion in progress to terminate, and places the device into analog shutdown. Quiescent current is reduced to 1 µA during analog shutdown. Once CS is pulled low, temperature data from the last completed conversion prior to dropping CS is latched into the shift register and clocked out at SO on the falling SCK edge. The 16-bit data word is clocked out sign bit first, followed by the MSB. Any portion of the 16-bit word can be read before raising CS. The TMP121 and TMP123 typically require 0.25 s to complete a conversion and consume 50 µA of current during this period. If CS is held high for longer than one conversion time period the TMP121 and TMP123 goes into idle mode for 0.25 s, requiring only 20 µA of current. A new conversion begins every 0.5 s. Figure 6 describes the conversion timing for the TMP121 and TMP123. 0.5s 0.25s 50µA (active) 20µA (idle) Figure 6. Conversion Time and Period The serial data of the TMP121 and TMP123 consists of 12-bit plus sign temperature data followed by a confirmation bit and two high impedance bits. Data is transmitted in binary two's complement format. Figure 7 describes the output data of the TMP121 and TMP123. 6 TMP121-EP TMP123-EP www.ti.com SGLS315 – SEPTEMBER 2005 CS SCK SO/I Z D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 1 Z Z Figure 7. Data READ Timing Diagrams The TMP121 and TMP123 are SPI-compatible. Figure 8 and Figure 9 describe the various timing requirements, with parameters defined in Table 3. Table 3. Timing Description MIN MAX 100 UNIT t1 SCK period t2 SCK falling edge to output data delay ns t3 CS to rising edge SCK set-up time t4 CS to output data delay 30 ns t5 CS rising edge to output high impedance 30 ns 30 40 ns ns SCK t3 t1 t2 CS t4 SO Figure 8. Output Data Timing Diagram SCK SCK CS CS t5 t5 SO SO Figure 9. High Impedance Output Timing Diagram 7 PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TMP121AQDBVREP ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 121E V62/06608-01XE ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 121E (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of