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TMP815
SLDS153B – MAY 2009 – REVISED NOVEMBER 2015
TMP815 Variable-Speed Single-Phase Full-Wave Fan-Motor Predriver
1
1 Features
•
•
•
•
•
•
•
Single-Phase Full-Wave Driving Predriver
– Low Saturation Drive Using External P-channel
Devices at Top and N-channel Devices in
Bottom in H-bridge Configuration Enables
High-Efficiency Low-Power Consumption Drive
Variable Speed Control Possible With External
PWM Input
– Separately Excited Upper Direct PWM (f = 30
kHz) Control Method Ensures Quiet Speed
Control
Current Limiter Circuit Incorporated
– Chopper Type Current Limiting Made at Startup and During Lock
Reactive Current Cut Circuit Incorporated
– Reactive Current Before Phase Change Is Cut
to Enable Silent and Low-Consumption Drive
Minimum-Speed Setting Pin
– Minimum Speed Can be Set With External
Resistor
Soft-Start Setting Pin
Lock Protection and Automatic Reset Circuits
Incorporated
•
•
Rotation Speed Detection (FG) and Lock
Detection (RD) Output
Thermal Shutdown Circuit Incorporated
2 Applications
•
•
Server Fans
Appliance Fans
3 Description
The TMP815 device is a single-phase bipolar driving
motor predriver with a variable-speed function that is
compatible with an external PWM signal. A highly
efficient and quiet variable-drive fan motor with lowpower consumption can be achieved with few
external parts.
This device is best suited for driving of the servers
requiring large air flow and large current or the fan
motors of consumer appliances.
Device Information
PART NUMBER
TMP815
PACKAGE
TSSOP (PW)
(1)
BODY SIZE (NOM)
4.40 mm × 5.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
Vm
Speed Setting
H+
Soft Start
H-
Motor
Lock Detection
Frequency Set
TMP815
Current Limit
Speed Output
RF
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP815
SLDS153B – MAY 2009 – REVISED NOVEMBER 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
5
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 6
7.1 Overview ................................................................... 6
7.2 Functional Block Diagram ......................................... 6
7.3 Feature Description................................................... 7
7.4 Device Functional Modes.......................................... 9
8
Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Application .................................................. 11
9 Power Supply Recommendations...................... 14
10 Layout................................................................... 14
10.1 Layout Guidelines ................................................. 14
10.2 Layout Example .................................................... 14
11 Device and Documentation Support ................. 15
11.1
11.2
11.3
11.4
Community Resource............................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
15
15
15
15
12 Mechanical, Packaging, and Orderable
Information ........................................................... 15
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (May 2015) to Revision B
•
Changed the Operating free-air temperature from (-30 to 95 °C) to (-40 to 125 °C) in the Recommended Operating
Conditions table and added characterization data for the new temperature range in the Electrical Characteristics
table ....................................................................................................................................................................................... 4
Changes from Original (May 2009) to Revision A
•
2
Page
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
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SLDS153B – MAY 2009 – REVISED NOVEMBER 2015
5 Pin Configuration and Functions
PW Package
16-Pin TSSOP
Top View
OUT2P
OUT2N
VCC
SENSE
RMI
VTH
CPWM
FG
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
OUT1P
OUT1N
SGND
5VREG
S-S
CT
IN+
IN–
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
OUT2P
1
O
Upper-side driver output
OUT2N
2
O
Lower-side driver output
Power supply
For the power stabilization capacitor on the signal side (see *2 in Figure 5), use the capacitance
of 1 μF or more. Connect VCC and GND with a thick and short pattern.
For the power stabilization capacitor on the power side (see *3 in Figure 5), use the capacitance
of 1 μF or more. Connect the power supply on the power side and GND with a thick and short
pattern.
VCC
3
SENSE
4
I
Current limiting detection (see *8 in Figure 5)
When the pin voltage exceeds 0.2 V, the current is limited, and the operation enters the lower
regeneration mode. Connect to GND if not used.
RMI
5
I
Minimum speed setting (see *6 in Figure 5)
If the device power supply is likely to be turned off first when the pin is used with external power
supply, insert a current limiting resistor to prevent inflow of large current (also applies to VTH
terminal). Connect to 5VREG with a pullup resistor if not used.
VTH
6
I
Speed control (see *7 in Figure 5)
For control with pulse input, insert a current limiting resistor and use the pin with a frequency of
20 kHz to 100 kHz (TI recommends 20 kHz to 50 kHz). For the control method, see Figure 2.
Connect to GND if not used (at full speed).
CPWM
7
O
Connection to capacitor for generation of PWM basic frequency (see *5 in Figure 5)
CP = 220 pF causes oscillation at f = 30 kHz, which is the basic frequency of PWM. As this is
also used for the current limiting canceling signal, be sure to connect the capacitor even when
speed control is not used.
FG
8
O
Rotation speed detection pin (see *9 in Figure 5)
This is an open-collector output, which can detect the rotation speed from the FG output
according to the phase change over. Keep this pin open when not used.
IN–
9
I
Hall input (see *4 in Figure 5)
IN+
10
I
Hall input. Make connecting traces as short as possible to prevent carrying of noise. To further
limit noise, insert a capacitor between IN+ and IN–. The Hall input circuit is a comparator having
a hysteresis of 15 mV. Also includes a soft-switch section with ±30-mV input-signal differential
voltage. TI recommends that the Hall input level is a minimum of 100 mVp-p.
CT
11
O
Connection to the lock detection capacitor (see *10 in Figure 5)
The constant current charge and discharge circuits cause locking when the pin voltage rises to
3 V and unlocking when pin voltage falls to 1.1 V. Connect to GND when not used (when locking
is not necessary).
S-S
12
I
Connection to the soft-start setting capacitor (see *11 in Figure 5)
Connect the capacitor between S-S and 5VREG to set the soft-start time, according to the
capacitance that is chosen (see Figure 3 and Figure 4). Connect to GND when not used.
5VREG
13
O
5-V regulator output
SGND
14
OUT1N
15
O
Lower-side driver output
OUT1P
16
O
Upper-side driver output
System ground (see *1 in Figure 5)
Connection to the control-circuit power-supply system
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
VCC
Supply voltage
VOUT
Output voltage
MAX
UNIT
18
V
OUT1P, OUT1N, OUT2P, OUT2N
18
V
OUT1N, OUT2N
–20
OUT1P, OUT2P
20
IOUT
Continuous output current
VVTH
VRMI
Input voltage
VTH, RMI
7
V
VS-S
Input/output voltage
S-S
7
V
VFG
Output voltage
FG
19
V
IFG
Continuous output current
FG
10
mA
–20
mA
150
°C
I5VREG Continuous output current
Tstg
(1)
5VREG
Storage temperature
–65
mA
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
V(ESD)
(1)
(2)
Electrostatic discharge
(1)
UNIT
±2500
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins (2)
V
±1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
TA = 25°C
MIN
MAX
VCC
Supply voltage
6
16
UNIT
V
VVTH
VTH input voltage
0
5
V
VRMI
RMI input voltage
0
5
V
VICM
Hall input common phase input voltage
0.2
3
V
TA
Operating free-air temperature
–40
125
°C
6.4 Thermal Information
TMP815
THERMAL METRIC
(1)
PW (TSSOP)
UNIT
16 PINS
RθJA
Junction-to-ambient thermal resistance
108
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
94.2
°C/W
RθJB
Junction-to-board thermal resistance
31.5
°C/W
ψJT
Junction-to-top characterization parameter
38.9
°C/W
ψJB
Junction-to-board characterization parameter
1.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
38.3
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics
VCC = 12 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA = 25°C
I5VREG = –5 mA
MIN
TYP
MAX
4.8
4.95
5.1
UNIT
V5VREG
Output voltage
5VREG
VLIM
Current limiting voltage
SENSE
VCPWMH
High-level output voltage
2.8
3
3.2
V
VCPWML
Low-level output voltage
0.9
1.1
1.3
V
ICPWM1
Charge current
VCPWM = 0.5 V
24
30
36
μA
ICPWM2
Discharge current
VCPWM = 3.5 V
21
27
33
fPWM
Oscillation frequency
CP = 220 pF
VCTH
High-level output voltage
2.8
3
3.2
VCTL
Low-level output voltage
0.9
1.1
1.3
V
ICT1
Charge current
1.6
2
2.5
μA
ICT2
Discharge current
0.16
0.2
0.25
μA
RCT
Charge/discharge
current ratio
8
10
12
IS-S
Discharge current
0.4
0.5
0.6
VONH
High-level output voltage
VONL
Low-level output voltage
VOPL
Low-level output voltage
TA = –40°C to
+125°C
5.2
TA = 25°C
185
200
TA = –40°C to +125°C
CPWM
250
30
CT
S-S
215
VS-S = 1 V
OUT_N
TA = 25°C
IOL = 10 mA
0.9
TA = –40°C to
+125°C
mV
μA
kHz
VCC –
V – 0.85
1 CC
IOH = –10 mA
V
V
μA
V
1
1.05
V
OUT_P
IOL = 10 mA
0.5
0.65
V
IN+, IN-
IN+, IN– differential voltage
(including offset and hysteresis)
±10
±20
mV
0.15
0.3
VHN
Hall input sensitivity
VFG
Low-level output voltage
IFGL
Output leakage current
IVTH
IRMI
Bias current
VTH, RMI
ICC
Supply current
VCC
TA = 25°C
IFG = 5 mA
FG
TA = –40°C to
+125°C
0.41
V
VFG = 19 V
20
μA
VCPWM = VVTH = VRMI = 2 V, VCT = 0 V
0.1
μA
During drive
4
7.5
9.5
During lock protection
4
7.5
9.5
mA
6.6 Typical Characteristics
5.2
5VREGOUT Voltage (V)
5.0
4.8
4.6
4.4
5VREG Output-9V
4.2
5VREG Output-12V
5VREG Output-15V
4.0
0
5
10
15
20
Output Current (mA)
25
30
C001
Figure 1. 5VREG Output Voltage (V) vs Output Current (mA)
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7 Detailed Description
7.1 Overview
The TMP815 device is a single phase bipolar predriver which uses the hall sensor and speed control inputs for
driving the single phase motor connected through the H Bridge. The predriver outputs are designed for driving
top side P-channel and bottom side N-channel FETs in the bridge. Multiple protections like overcurrent, soft start,
speed control, lock detect, speed feedback and minimum speed are incorporated in the device.
7.2 Functional Block Diagram
CT
Discharge Circuit
Thermal Shutdown
0.47 µF
to 1 µF
FG
Discharge
Pulse
VCC
5VREG
5VREG
OUT1N
OUT1P
Controller
Hall
IN+
IN–
OUT2N
OUT2P
Oscillator
S-S RMI VTH
6
CPWM
SENSE
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SGND
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7.3 Feature Description
7.3.1 Speed Control
The speed control functionality is obtained by VTH pin of the device. For pulsed inputs, the user can supply a 20kHz to 100-kHz frequency input (20 kHz to 50 kHz recommended) on the pin with a current limiting resistor in
between.
If not used, this pin needs to be connected to ground for full speed.
f = 30 kHz (CP = 220 pF)
VTH voltage
3V
RMI voltage
CPWM
1.1 V
0V
Rotation set to
minimum speed
(stop mode)
PWM control
variable speed
Low speed
High speed
Full speed
FG
100%
ON Duty Cycle
0%
A.
Minimum speed setting (stop) mode. The low speed fan rotation occurs at the minimum speed set with the RMI pin.
When the minimum speed is not set (RMI pin pulled up to 5VREG), the motor stops.
B.
Low ↔ high-speed. PWM control is made by comparing the CPWM oscillation voltage (1.1 V ↔ 3 V) and VTH
voltage. Both upper and lower output TRs are turned ON when the VTH voltage is low. The upper output TR is turned
OFF when the VTH voltage is high, regenerating the coil current in the lower TR. Therefore, as the VTH voltage
decreases, the output on duty cycle increases, causing an increase in the coil current, raising the motor rotation
speed. The rotation speed can be monitored with the FG output.
C.
Full-speed mode. The full-speed mode becomes effective with the VTH voltage of 1.65 V or less. (VTH must be equal
to GND when the speed control is not used.)
D.
PWM-IN input disconnection mode. The full-speed mode becomes effective when the VTH voltage is 1.1 V or less.
Set VTH = GND when the speed control is not used.
Figure 2. Speed Control Timing
7.3.2 Soft-Start
The speed control functionality is obtained by S-S pin of the device. Connection to the soft-start setting capacitor
(see Figure 5) is through this pin. Connect the capacitor between S-S and 5VREG to set the soft-start time,
according to the capacitance that is chosen (see Figure 3 and Figure 4). If the soft-start feature is not intended to
be used, then the this pin needs to be connected to ground.
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Feature Description (continued)
S-S Voltage
3V
RMI Voltage
CPWM
VTH Voltage
1.1 V
0V
Lock Protection
VTH Set Speed
Soft-Start Section
100%
ON Duty Cycle
0%
Adjust the S-S pin voltage gradient by means of the capacitance of the oscillator between the S-S pin and 5VREG.
Recommended capacitance is 0.1 μF to 1 μF.
Figure 3. Soft-Start Timing (VVTH < VRMI)
S-S Voltage
VTH Voltage
3V
RMI Voltage
CPWM
1.1 V
0V
Lock Protection
SoftStart
Section
RMI Set Speed
100%
ON Duty Cycle
0%
Adjust the S-S pin voltage gradient by means of the capacitance of the oscillator between the S-S pin and 5VREG.
Recommended capacitance is 0.1 μF to 1 μF.
Figure 4. Soft-Start Timing (VVTH > VRMI)
8
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Feature Description (continued)
7.3.3 Lock Detection
When the rotor is locked by external means or load conditions, The lock detection feature helps to protect the
circuit by not allowing the current to rise beyond control. A hiccup mechanism is also provided. The lock
detection is enabled by a connection to the lock detection capacitor (see *10 in Figure 5) The constant current
charge and discharge circuits cause drive stop when the pin voltage rises to 3 V and unlocking the drive when
pin voltage falls to 1.1 V. If lock detection feature is not desired in the application, this pin needs to be connected
to ground.
7.3.4 Current Limit
Current limit resistor is connected in a return path of H Bridge connection. This input is connected to the SENSE
pin where the Current is limited when the voltage across this resistor crosses 200-mV threshold. The device
enters in lower regeneration mode (see *8 in Figure 5) If not used, this pin needs to be connected to ground.
7.3.5 Minimum Speed Setting
Minimum speed setting (see *6 in Figure 5) feature is use with the RMI pin in the device. Connect to 5VREG with
a pullup resistor if not used.
7.3.6 Speed Output
The speed of the motor while running can be observed at the FG pin which is an open collector output and
needs to be pulled high for using it.
7.3.7 Drive Frequency Selection
The P channel switches in the device are switched with higher frequency whose duty cycle is decided by the
speed control input. The frequency of the operation can be decided by the capacitor connected at the CPWM
pin. As this is used also for the current limiting canceling signal, be sure to connect the capacitor even when
speed control is not used.
7.4 Device Functional Modes
Table 1. Drive Lock Truth Table
IN–
(1)
(2)
IN+
CT
H
L
L
L
H
L
H
L
H
L
H
H
OUT1P
(1) (2)
OUT1N
OUT2P
OUT2N
FG
MODE
L
L
OFF
OFF
H
L
H
L
OUT1 → 2 drive
L
OFF
OFF
L
OUT2 → 1 drive
OFF
H
L
OFF
H
OFF
L
OFF
For VTH, RMI, and S-S pins, see Figure 2.
CPWM = H, VTH = RMI = S-S = L
Table 2. Speed Control Truth Table
VTH, RMI
CPWM
IN–
L
H
H
L
L
H
L
H
H
L
H
L
H
L
L
H
(1)
(2)
Lock protection
IN+
OUT1P
(1) (2)
OUT1N
OUT2P
OUT2N
MODE
L
L
OFF
H
OUT1 → 2 Drive
OFF
H
L
L
OUT2 → 1 Drive
OFF
L
OFF
H
OFF
H
OFF
L
Regeneration mode
For VTH, RMI, and S-S pins, see Figure 2.
CT = S-S = L
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TMP815 device needs few external components for the features described in Feature Description . The
device needs a 1-uF or greater capacitor connected at VCC. The device generates 5-V regulated output which
can be used for pullups in the circuit as well as the Hall sensor.
10
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8.2 Typical Application
Figure 5 shows the typical application diagram.
1 µF
25 V
*3
Rp = 1 kW
3
1
2
4
RF
1 µF
25 V
*2
RFG = 10 kW to 100 W
5VREG
VCC
FG
*4
H
IN–
SENSE
*9
*8
IN+
*11
*6
1
2
S-S
3
RMI
4
*7
VTH
SGND
*1
PWM-IN
CPWM
CP = 100 pF *5
30 kHz
CT
*10
CT = 0.47 µF
Figure 5. 12-V Sample Application Circuit
8.2.1 Design Requirements
For this design example, use the following parameters:
• Input Voltage: 6 to 16 V
• VCC capacitor: 1 µF or more
• H Bridge top side: P-channel FETs
• H Bridge bottom side: N-channel FETs
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Typical Application (continued)
8.2.2 Detailed Design Procedure
Pins:
• CPWM Capacitor: 220 pF for 30-kHz switching or appropriate.
• VTH Pin connected to Ground for Full speed or supplied with pulsed input
• RMI Pin Pulled high to 5VREG output or external connection if required
• 5VREG connected to Hall Sensor. Hall sensor differential inputs connected to IN+ and IN• Current sense resistor connected to SENSE pin or GND.
• CT connected to Lock Detection capacitor (0.47 uF or calculated values) or to GND
• Drive outputs connected to the Gates of the H bridge switches.
• Pull up on FG.
Power Supply:
• Make sure the power supply has set with sufficient current limit at the decided at the motor voltage.
Build the circuit with the recommended connections at the pins.
Test the motor circuit with hardware connected to it.
8.2.3 Application Curves
Figure 6. Start-up at 12 V (Soft Start)
12
Figure 7. Motor Outputs and Phase Current at 100% Duty
Cycle
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Typical Application (continued)
Figure 8. Motor Outputs and Phase Current at Duty Cycle
< 100%
Figure 9. Motor Outputs and Phase Currents at 100% Duty
Cycle and With Hall Sensor Data
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9 Power Supply Recommendations
For testing purposes, a current limited source can be connected with voltage from 6 to 16 V on printed-circuitboard. Use a 1-µF capacitor (minimum) to take care of load transient requirements.
10 Layout
10.1 Layout Guidelines
Connect 1-µF capacitor or greater between VCC and SGND with short traces.
Connect a capacitor between IN+ and IN- for noise reduction picked from Hall sensors.
Keep S-S, CT and CPWM capacitor near the device.
10.2 Layout Example
>1uF
OUT2P
OUT1P
OUT2N
OUT1N
VCC
SGND
SENSE
5VREG
TMP815
RMI
S-S
VTH
CT
CPWM
IN+
FG
IN±
GND
Figure 10. Recommended Layout Example
14
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11 Device and Documentation Support
11.1 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: TMP815
15
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
B0 W
Reel
Diameter
Cavity
A0
B0
K0
W
P1
A0
Dimension designed to accommodate the component width
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
TMP815PWR
Package Package Pins
Type Drawing
TSSOP
PW
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
12.4
Pack Materials-Page 1
6.9
B0
(mm)
K0
(mm)
P1
(mm)
5.6
1.6
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TMP815PWR
TSSOP
PW
16
2000
356.0
356.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
PW0016A
TSSOP - 1.2 mm max height
SCALE 2.500
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
TYP
6.2
A
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1
2X
5.1
4.9
NOTE 3
4.55
8
9
B
0.30
0.19
0.1
C A B
16X
4.5
4.3
NOTE 4
1.2 MAX
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0 -8
0.75
0.50
DETAIL A
A 20
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
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EXAMPLE BOARD LAYOUT
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
16X (1.5)
(R0.05) TYP
1
16
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
15.000
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
16X (1.5)
SYMM
(R0.05) TYP
1
16X (0.45)
16
SYMM
14X (0.65)
8
9
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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