TPA0243DGQR

TPA0243 2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE SLOS279C – JANUARY 2000 – REVISED NOVEMBER 2002 D Ideal for Notebook Computers, PDAs, and D D D D D D D D D D D Other Small Portable Audio Devices 2 W Into 4-Ω From 5-V Supply 0.6 W Into 4-Ω From 3-V Supply Stereo Head Phone Drive Mono (BTL) Signal Created by Summing Left and Right Signals Wide Power Supply Compatibility 3 V to 5 V Meets PC99 Desktop Specs (target) Low Supply Current – 10 mA Typical at 5 V – 9 mA Typical at 3 V Shutdown Control . . . 1 µA Typical Shutdown Pin Is TTL Compatible –40°C to 85°C Operating Temperature Range Space-Saving, Thermally-Enhanced MSOP Packaging DGQ PACKAGE (TOP VIEW) FILT_CAP SHUTDOWN VDD BYPASS RIN 1 2 3 4 5 10 9 8 7 6 LO/MO LIN GND ST/MN RO/MO description The TPA0243 is a 2-W mono bridge-tied-load (BTL) amplifier designed to drive speakers with as low as 4-Ω impedance. The mono signal is created by summing left and right inputs. The amplifier can be reconfigured on the fly to drive two stereo single-ended (SE) signals into headphones. This makes the device ideal for small notebook computers, PDAs, digital personal audio players, anyplace a mono speaker and stereo headphones are required. From a 5-V supply, the TPA0243 can deliver 2 W of power into a 4-Ω speaker. The gain of the input stage is set by the user-selected input resistor and a 50-kΩ internal feedback resistor (AV = – RF/ RI). The power stage is internally configured with a gain of –1.25 V/V in SE mode, and –2.5 V/V in BTL mode. Thus, the overall gain of the amplifier is 62.5 kΩ/ RI in SE mode and 125 kΩ/ RI in BTL mode. The input terminals are high-impedance CMOS inputs, and can be used as summing nodes. The TPA0243 is available in the 10-pin thermally-enhanced MSOP package (DGQ) and operates over an ambient temperature range of –40°C to 85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  2002, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 TPA0243 2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE SLOS279C – JANUARY 2000 – REVISED NOVEMBER 2002 CB 4 BYPASS VDD 3 VDD GND 8 1 FILT_CAP VDD BYPASS 1 µF 50 kΩ 1.25*R 100 kΩ 5 Right Audio Input CI RIN M U X R – – + CC RO/MO+ 6 + RI BYPASS BYPASS 100 kΩ 50 kΩ Stereo/Mono Control ST/MN 7 LO/MO– 10 50 kΩ 1.25*R Left Audio Input CI RI 9 LIN M U X R – – + CC + 1 kΩ BYPASS BYPASS From System Control 2 SHUTDOWN Shutdown and Depop Circuitry AVAILABLE OPTIONS TA PACKAGED DEVICES MSOP† (DGQ) MSOP SYMBOLIZATION – 40°C to 85°C TPA0243DGQ AEK † The DGQ package are available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TPA0243DGQR). 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TPA0243 2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE SLOS279C – JANUARY 2000 – REVISED NOVEMBER 2002 Terminal Functions TERMINAL NAME NO. I/O DESCRIPTION I BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to a 0.1-µF to 1-µF capacitor. BYPASS 4 GND 8 LIN 9 I Left-channel input terminal LO/MO 10 O Left-output in SE mode and mono negative output in BTL mode. MONO-IN 1 I Terminal used to filter supply RIN 5 I Right-channel input terminal RO/MO 6 O Right-output in SE mode and mono positive output in BTL mode SHUTDOWN 2 I SHUTDOWN places the entire device in shutdown mode when held low. TTL compatible input. ST/MN 7 I Selects between Stereo and Mono mode. When held high, the amplifier is in SE stereo mode; while held low, the amplifier is in BTL mono mode. VDD 3 I VDD is the supply voltage terminal. Ground terminal absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD +0.3 V Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . internally limited (see Dissipation Rating Table) Operating free-air temperature range, TA (see Table 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C Operating junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE PACKAGE DGQ TA ≤ 25°C 2.14 W‡ DERATING FACTOR 17.1 mW/°C TA = 70°C 1.37 W TA = 85°C 1.11 W ‡ See PowerPAD Thermally Enhanced Package Application Report (SLMA002) for more information on the PowerPAD package. The thermal data was measured on a PCB layout based on the information in the section entitled Texas Instruments Recommended Board for PowerPAD on page 33 of that document. recommended operating conditions ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Supply voltage, VDD High-level High level in input ut voltage, VIH ST/MN VDD = 3 V VDD = 5 V SHUTDOWN Low-level Low level in input ut voltage, VIL ST/MN MIN MAX 2.5 5.5 UNIT V 2.7 4.5 V 2 VDD = 3 V VDD = 5 V 1.65 2.75 V ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ SHUTDOWN 0.8 Operating free-air temperature, TA – 40 85 °C PowerPAD is a trademark of Texas Instruments. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 TPA0243 2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE SLOS279C – JANUARY 2000 – REVISED NOVEMBER 2002 electrical characteristics at specified free-air temperature, VDD = 3 V, TA = 25°C (unless otherwise noted) ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PARAMETER TEST CONDITIONS MIN |VOO| Output offset voltage (measured differentially) SHUTDOWN = 2 V, ST/MN = 0, RL = 4 Ω IDD IDD(SD) Supply current VDD = 2.5 V, SHUTDOWN = 2 V SHUTDOWN = 0 V |IIH| High level input current High-level |IIL| Low level input current Low-level RF Feedback resistor Supply current, shutdown mode SHUTDOWN, VDD = 3.3 V, ST/MN, VDD = 3.3 V, SHUTDOWN, VDD = 3.3 V, ST/MN, VDD = 3.3 V, TYP MAX mV 9 14 mA 1 10 µA VI = VDD VI = VDD 1 VI = 0 V VI = 0 V 1 VDD = 2.5 V, RL = 4 Ω, ST/MN = 1.375 V, SHUTDOWN = 2 V 1 1 47 UNIT 30 50 57 µA A µA A kΩ operating characteristics, VDD = 3 V, TA = 25°C, RL = 4 Ω ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PARAMETER PO power see Note 1 Output power, THD + N Total harmonic distortion plus noise BOM Maximum output power bandwidth TEST CONDITIONS THD = 1%, BTL mode THD = 0.1%, SE mode, PO = 500 mW, Gain = 2, f = 20 Hz to 20 kHz MIN TYP MAX UNIT 660 RL = 32 Ω mW 34 0.3% THD = 2% 20 kHz NOTE 1: Output power is measured at the output terminals of the device at f = 1 kHz. electrical characteristics at specified free-air temperature, VDD = 5 V, TA = 25°C (unless otherwise noted) ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ PARAMETER TEST CONDITIONS MIN TYP MAX |VOO| Output offset voltage (measured differentially) SHUTDOWN = 2 V, ST/MN = 0, RL = 4 Ω IDD IDD(SD) Supply current SHUTDOWN = 2 V Supply current, shutdown mode SHUTDOWN = 0 V High level input current High-level SHUTDOWN, VDD = 5.5 V, ST/MN, VDD = 5.5 V, VI = VDD VI = VDD 1 |IIH| Low level input current Low-level SHUTDOWN, VDD = 5.5 V, VI = 0 V VI = 0 V 1 |IIL| ST/MN, VDD = 5.5 V, UNIT 30 mV 10 15 mA 1 10 µA 1 1 µA A µA A operating characteristics, VDD = 5 V, TA = 25°C, RL = 4 Ω ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PARAMETER PO power see Note 1 Output power, THD + N Total harmonic distortion plus noise BOM Maximum output power bandwidth TEST CONDITIONS THD = 1%, BTL mode THD = 0.1%, SE mode, PO = 1 W, Gain = 2.5, f = 20 Hz to 20 kHz THD = 2% NOTE 1: Output power is measured at the output terminals of the device at f = 1 kHz. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MIN RL = 32 Ω TYP MAX UNIT 2 W 95 mW 0.2% 20 kHz TPA0243 2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE SLOS279C – JANUARY 2000 – REVISED NOVEMBER 2002 MECHANICAL DATA DGQ (S-PDSO-G10) PowerPAD PLASTIC SMALL-OUTLINE PACKAGE 0,27 0,17 0,50 10 0,25 M 6 Thermal Pad (See Note D) 0,15 NOM 3,05 2,95 4,98 4,78 Gage Plane 0,25 1 0°–ā6° 5 3,05 2,95 0,69 0,41 Seating Plane 1,07 MAX 0,15 0,05 0,10 4073273/A 04/98 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. PowerPAD is a trademark of Texas Instruments. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPA0243DGQ ACTIVE MSOPPower PAD DGQ 10 80 None CU SNPB Level-1-220C-UNLIM TPA0243DGQR ACTIVE MSOPPower PAD DGQ 10 2500 None CU SNPB Level-1-220C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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