0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
TPA2054D4YZKT

TPA2054D4YZKT

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    DSBGA25

  • 描述:

    IC AMP AUDIO HDPHN 1.4W 25DSBGA

  • 数据手册
  • 价格&库存
TPA2054D4YZKT 数据手册
TPA2054D4 www.ti.com ..................................................................................................................................................................................................... SLOS607 – APRIL 2009 1.4 W/CH STEREO CLASS-D AUDIO SUBSYSTEM WITH DirectPath™ HEADPHONE AMPLIFIER AND 3:1 INPUT MUX FEATURES 1 • Stereo Class-D Amp: – 1.4 W into 8 Ω from 5.0 V (10% THD + N) – 1.25 W into 8 Ω from 5.0 V (1% THD + N) • DirectPath™ Stereo Headphone Amplifier – No Output Capacitors Required • Independent Gain Select for Headphone Amplifier • Eight Programmable Maximum Headphone Voltage Limits • Two Single-Ended or One Differential Stereo Input • 3:1 Input MUX with Mode Control • 32-Step Volume Control for Both Input Channels • Independent Shutdown for Headphone and Class-D Amplifiers • Short-Circuit and Thermal-Overload Protection • ±8 kV HBM ESD Protection on Headphone Outputs • I2C™ Interface • 25-Ball 2,61 mm × 2,61 mm WCSP 23 APPLICATIONS • • • • Smart Phones / Cellular Phones Laptop Computers Portable Gaming Portable Media Players SIMPLIFIED SYSTEM BLOCK DIAGRAM Mono+ ABB 8 Speaker Mono- Left SE Codec MP3 Right SE TPA2054D4 8 Speaker Stereo Class D plus DirectPath™ DESCRIPTION The TPA2054D4 features a stereo Class-D power amplifier along with a stereo DirectPath™ headphone amplifier. The TPA2054D4 has a mono differential input and two stereo single-ended (SE) inputs that can be configured as one stereo differential input. Both input channels have a 32-step volume control and the DirectPath headphone amplifier has a 4-level gain control for coarse volume adjustment. All amplifiers have output short-circuit and thermaloverload protection. The Class-D amplifiers deliver 1.25 W into 8 Ω at 1% THD from a 5.0 V supply, and 700 mW from 3.6 V. The DirectPath headphone amplifier features an output voltage limiter to reduce the maximum output power to one of seven possible limits. The voltage limiter is programmed through the I2C interface. DirectPath eliminates the need for external DCblocking output capacitors to the headphones. The built-in charge pump creates a negative supply voltage for the headphone amplifier, allowing a 0-V DC bias at the output. The DirectPath headphone amplifier gains are +6 dB (default), 0 dB, –6 dB, and –14 dB, selected through the I2C interface. This allows the headphone volume to be different from the loudspeaker volume if both are used simultaneously. The TPA2054D4 has a 3:1 input MUX for audio source selection. The MUX has mode control which directs the input-to-output signal path. Mode and gain controls operate from a 1.8 V compatible I2C interface. The voltage supply range for both the Class-D amplifiers and the headphone charge pump is 2.5 V to 5.5 V. The Class-D amplifiers use a combined 7 mA and the headphone amplifier uses 10 mA of typical quiescent current. Total supply current reduces to less than 2µA. The TPA2054D4YZK is available in a 25-ball 2,61 mm × 2,61 mm WCSP package. Left SE Stereo Headphone Jack FM Tuner Right SE 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DirectPath is a trademark of Texas Instruments. I2C is a trademark of NXP Semiconductors. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated TPA2054D4 SLOS607 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA PACKAGED DEVICES (1) PART NUMBER (2) 25-ball, WCSP TPA2054D4YZKR 25-ball, WCSP TPA2054D4YZKT –40°C to 85°C (1) (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. The YZK packages are only available taped and reeled. The suffix R indicates a reel of 3000, the suffix T indicates a reel of 250. DEVICE PINOUT 2 A1 A2 A3 A4 A5 VREF INL_1 INR_1 DVDD OUTL+ B1 B2 B3 B4 B5 CPN INR_2 INL_2 RESET OUTL– C1 C2 C3 C4 C5 CPP SDA SCL AGND PGND D1 D2 D3 D4 D5 HPVSS MONO– MONO+ AVDD OUTR– E1 E2 E3 E4 E5 HPRIGHT VDDHP HPLEFT PVDD OUTR+ Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 TPA2054D4 www.ti.com ..................................................................................................................................................................................................... SLOS607 – APRIL 2009 FUNCTIONAL BLOCK DIAGRAM 1 mF VDD 1 mF Bias Control and Pop Suppression VREF +6 dB PWM 0.47 mF MONO + + MONO – – -66 dB to +24 dB Volume Control HBridge OUTL – OUTL + Oscillator 0.47 mF +6 dB PWM 0.47 mF LIN + HBridge OUTR – OUTR + Mode Control LIN – 0.47 mF -66 dB to +24 dB Volume Control 0.47 mF HPLEFT Gain Select : RIN + +6 0 -6 -14 RIN – 0.47 mF dB dB dB dB HPRIGHT DVDD SDA I2C Interface SCL RESET Headphone Power Limiter Charge Pump CPP CPN VSS PGND 1 mF VDDHP 1 mF Figure 1. Differential Input Mode 1 mF VDD 1 mF VREF Bias Control and Pop Suppression VDD +6 dB 0.47 mF MONO+ + MONO– – PGND VDD -66dB to +24dB Volume Control 0.47 mF 0.47 mF +6 dB LIN1 PWM Mode Control -66dB to +24dB Volume Control HBridge OUTL– OUTL+ Oscillator PWM HBridge OUTR– OUTR+ PGND VDDHP RIN1 0.47 mF 0.47 mF HPLEFT Gain Select: LIN2 -66dB to +24dB Volume Control +6 dB 0 dB -6 dB -14 dB RIN2 0.47 mF VSS VDDHP HPRIGHT DVDD VSS SDA I2C Interface SCL RESET Headphone Power Limiter Charge Pump CPP VDDHP CPN 1 mF VSS PGND 1 mF Figure 2. Single-Ended (SE) Input Mode Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 3 TPA2054D4 SLOS607 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com TERMINAL FUNCTIONS TERMINAL INPUT/ OUTPUT/ POWER (I/O/P) DESCRIPTION NAME BALL WCSP OUTL+ A5 O Left speaker positive output; connect to + terminal of loudspeaker DVDD A4 P I2C supply voltage; connect to 1.8V digital supply INR_1 A3 I Channel 1 right input (SE-In mode); Left– input (Diff-In mode); connect to ground through 0.47 µF capacitor if unused INL_1 A2 I Channel 1 left input (SE-In mode); Left+ input (Diff-In mode); connect to ground through 0.47 µF capacitor if unused VREF A1 I 1.65 V reference voltage; connect a 1 µF capacitor to ground OUTL– B5 O Left speaker negative output; connect to negative terminal of loudspeaker RESET B4 I Set to logic low to shut device down and return all I2C registers to default state; I2C can only be programmed once RESET returns to logic high INL_2 B3 I Channel 2 left input (SE-In mode); Right+ input (Diff-In mode); connect to ground through 0.47 µF capacitor if unused INR_2 B2 I Channel 2 right input (SE-In mode); Right– input (Diff-In mode); connect to ground through 0.47 µF capacitor if unused CPP B1 P Charge pump flying capacitor positive terminal; connect positive side of capacitor between CPP and CPN PGND C5 P Class-D ground; connect to ground AGND C4 P Analog ground; connect to ground SCL C3 I/O I2C clock input SDA C2 I/O I2C data input CPN C1 P Charge pump flying capacitor negative terminal; connect negative side of capacitor between CPP and CPN OUTR– D5 O Right speaker negative output; connect to negative terminal of loudspeaker AVDD D4 P Supply voltage MONO- D2 I Inverting mono input, typically connected to baseband OUT- MONO+ D3 I Non-inverting mono input, typically connected to baseband OUT+ HPVSS D1 P Negative supply generated by the charge pump; connect a 1µF capacitor to ground to reduce voltage ripple OUTR+ E5 O Right speaker positive output; connect to positive terminal of loudspeaker PVDD E4 P Supply voltage HPLEFT E3 O Headphone left channel output VDDHP E2 P Headphone charge pump supply voltage HPRIGHT E1 O Headphone right channel output ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range, TA = 25°C (unless otherwise noted) Supply voltage, VDDHP, PVDD, AVDD DVDD VI Input voltage INL_1, INL_2, INR_1, INR_2, MONO+, MONOSDA, SCL, RESET Output continuous total power dissipation VALUE UNIT –0.3 to 6.0 V –0.3 to 3.6 V –0.3 to VDD + 0.3 V –0.3 to DVDD + 0.3 V See Dissipation Rating Table TA Operating free-air temperature range –40 to 85 °C TJ Operating junction temperature range –40 to 150 °C Tstg Storage temperature range –65 to 150 °C ESD Electrostatic discharge, HBM OUTL+, OUTL–, OUTR+, OUTR– 2k V HPLEFT and HPRIGHT 8k V (1) 4 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 TPA2054D4 www.ti.com ..................................................................................................................................................................................................... SLOS607 – APRIL 2009 DISSIPATION RATINGS PACKAGE TA < 25°C DERATING FACTOR TA = 70°C TA = 85°C YZK (WCSP) 1.12 W 9 mW/°C 720 mW 585 mW RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) VIH MIN MAX Class-D supply voltage, PVDD 2.5 5.5 V Charge pump supply voltage, VDDHP 2.5 5.5 V I2C supply voltage, DVDD 1.7 3.3 V High-level input voltage VIL Low-level input voltage TA Operation free-air temperature SDA, SCL, RESET, DVDD = 1.8 V 1.3 SDA, SCL, RESET, DVDD = 3.3 V 3.0 UNIT V SDA, SCL, RESET, DVDD = 1.8 V 0.3 V 85 °C SDA, SCL, RESET, DVDD = 3.3 V –40 ELECTRICAL CHARACTERISTICS TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DC Power supply rejection ratio (Class-D amplifiers) VDD = 2.5 V to 5.5 V, Single-ended mode 48 75 dB DC Power supply rejection ratio (headphone amplifiers) VDD = 2.5 V to 5.5 V, Single-ended mode 60 80 dB High-level input current (SDA, SCL, RESET) 1 µA Low-level input current (SDA, SCL, RESET) 1 µA 15.8 20 mA VDD = 4.2 V, Class-D active, Headphone deactivated, no load 7.5 10.5 mA VDD = 4.2 V, Headphone active, Class-D deactivated, no load 10 13.5 mA 0.15 2 µA Supply current VDD = 5.5 V, Class-D and Headphone amplifiers active, no load VDD = 2.5 V to 5.5 V, SWS=1 or RESET ≤ 0.3 V (shutdown mode) TIMING CHARACTERISTICS For I2C Interface Signals Over Recommended Operating Conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN No wait states TYP MAX UNIT 400 kHz fSCLN Frequency, SCL tW(H) Pulse duration, SCL high 0.6 µs tW(L) Pulse duration, SCL low 1.3 µs tsu1 Setup time, SDA to SCL 100 ns th1 Hold time, SCL to SDA 10 ns t(buf) Bus free time between stop and start condition 1.3 µs tsu2 Setup time, SCL to start condition 0.6 µs th2 Hold time, start condition to SCL 0.6 µs tsu3 Setup time, SCL to stop condition 0.6 µs Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 5 TPA2054D4 SLOS607 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com Figure 3. SCL and SDA Timing Figure 4. Start and Stop Conditions Timing DEVICE RESET Apply logic low to the RESET pin to deactivate the TPA2054D4 and return all I2C registers to their default state. This clears the LIM_Lock bit to logic low, allowing changes to the headphone output limiter byte. Refer to the Register Map section for a complete list of default states. The I2C registers cannot be programmed until RESET returns to logic high. RESET requires a 1 ms minimum hold time at logic low for a valid reset command. On power-up, ensure that the DVDD and VDDHP voltages have settled and DVDD is at least 1.7V before setting RESET to logic high. The TPA2054D4 activates in soft shutdown mode, SWS bit at logic high. OPERATING CHARACTERISTICS VDD = 3.6 V, TA = 25°C, RSPEAKER = 8 Ω + 33 µH, RHEADPHONES = 16 Ω, Total HP Gain = 6 dB, Total Class-D Gain = 6 dB, MODE[2:0] = 001 (single-ended mode)(unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER AMPLIFIER PO Speaker output power VOS Offset Voltage THD = 1%, VDD = 3.6 V, f = 1 kHz 700 mW THD = 10%, VDD = 3.6 V, f = 1 kHz 860 mW THD = 1%, VDD = 4.2 V, f = 1 kHz VDD = 5.5 V Output impedance in shutdown SNR Signal-to-noise ratio PO = 250 mW; En Noise output voltage Total gain = 0 dB; A-weighted THD+N 6 Total harmonic distortion plus noise 940 –13 5 mW 13 mV 2 kΩ 90 dB 22 µVRMS VDD = 5.0 V, PO = 1 W, f = 1 kHz 0.18 % VDD = 3.6 V, PO = 0.6 W, f = 1 kHz 0.25 % Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 TPA2054D4 www.ti.com ..................................................................................................................................................................................................... SLOS607 – APRIL 2009 OPERATING CHARACTERISTICS (continued) VDD = 3.6 V, TA = 25°C, RSPEAKER = 8 Ω + 33 µH, RHEADPHONES = 16 Ω, Total HP Gain = 6 dB, Total Class-D Gain = 6 dB, MODE[2:0] = 001 (single-ended mode)(unless otherwise noted) PARAMETER kSVR TEST CONDITIONS AC-Power supply rejection ratio Thermal shutdown MIN Class-D switching frequency ΔAV Gain matching MAX UNIT -75 dB 200 mVpp ripple, f = 4 kHz, Total gain = 0 dB -70 dB Threshold 155 °C 35 °C Hysteresis Output short-circuit protection fCLK TYP 200 mVpp ripple, f = 217 Hz, Total gain = 0 dB 2.4 250 300 Between left and right channels 0.1 THD = 1%, VDD = 5.0 V, HP_Vout[2:0] = 000 150 THD = 1%, VDD = 3.0 V, HP_Vout[2:0] = 000 83 A 350 kHz dB HEADPHONE AMPLIFIER PO Headphone output power (1) (Outputs in Phase) VO Maximum headphone output voltage VOS Offset Voltage THD = 10 %, HP_VOUT[2:0] = 111 0.14 THD = 10 %, HP_VOUT[2:0] = 100 0.23 VDD = 5.5 V, Total gain = 0 dB –3.5 0.5 mW VRMS 3.5 mV 30 Ω SNR Signal-to-noise ratio PO = 50 mW; 90 dB En Noise output voltage Total gain = 0 dB; A-weighted, VDD = 5.0 V 12 µVRMS THD+N Total harmonic distortion plus noise(1) Output impedance in shutdown kSVR AC-Power supply rejection ratio PO = 30 mW into 16 Ω, VDD = 3.6 V, f = 1 kHz 0.02 PO = 50 mW into 32 Ω, VDD = 5.0 V, f = 1 kHz 0.01 % 200 mVpp ripple, f = 217 Hz, Total gain = 0 dB -89 dB 200 mVpp ripple, f = 4 kHz, Total gain = 0 dB Output short-circuit protection fOSC Charge pump switching frequency ΔAV Gain matching Between Left and Right channels % -83 dB 200 mA 300 kHz 0.1 dB 20.9 kΩ 1.65 V 8.25 ms INPUT SECTION RIN Input impedance (differential) Volume = 24 dB VREF Reference voltage VDD = 3.6 V, all active modes 16 Start-up time from shutdown (1) Per output channel TEST SET-UP FOR GRAPHS TPA2054D4 CI + Measurement Output – IN+ OUT+ Load CI IN– VDD + OUT– 30 kHz Low-Pass Filter + Measurement Input – GND 1 mF VDD – (1) All measurements were taken with a 1-µF CI (unless otherwise noted.) (2) A 33-µH inductor was placed in series with the load resistor to emulate a small speaker for efficiency measurements. (3) The 30-kHz low-pass filter is required, even if the analyzer has an internal low-pass filter. An RC low-pass filter (1 kΩ 4.7 nF) is used on each output for the data sheet graphs. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 7 TPA2054D4 SLOS607 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTIC GRAPHS CI = 1 µF, Cbypass = 1 µF Total Gain = 6 dB PO = 150 mW RL = 8 Ω + 33 µH VDD = 3 V DIFF Mode 0.1 0.01 SE Mode 0.001 20 100 1k 10 Total Gain = 6 dB PO = 300 mW RL = 8 Ω + 33 µH VDD = 3.6 V 1 0.1 SE Mode 0.01 DIFF Mode 0.001 10k 20k 20 100 f − Frequency − Hz 1k 1 0.1 SE Mode 0.01 DIFF Mode 0.001 20 10k 20k 100 1k 10k 20k f − Frequency − Hz G003 G002 Figure 8. TOTAL HARMONIC DISTORTION + NOISE (HP) vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE (HP) vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE (HP) vs FREQUENCY 10 Total Gain = 6 dB PO = 35 mW RL = 16 Ω VDD = 3 V 1 0.1 DIFF Mode 0.01 SE Mode 0.001 100 1k THD+N − Total Harmonic Distortion + Noise − % Figure 7. THD+N − Total Harmonic Distortion + Noise − % THD+N − Total Harmonic Distortion + Noise − % Total Gain = 6 dB PO = 600 mW RL = 8 Ω + 33 µH VDD = 5 V Figure 6. 20 10 Total Gain = 6 dB PO = 50 mW RL = 16 Ω VDD = 3.6 V 1 0.1 DIFF Mode 0.01 SE Mode 0.001 10k 20k 20 100 f − Frequency − Hz 1k 10 Total Gain = 6 dB PO = 100 mW RL = 16 Ω VDD = 5 V 1 0.1 DIFF Mode 0.01 SE Mode 0.001 20 10k 20k 100 1k 10k 20k f − Frequency − Hz f − Frequency − Hz G004 G006 G005 Figure 10. Figure 11. TOTAL HARMONIC DISTORTION + NOISE (HP) vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE (HP) vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE (HP) vs FREQUENCY 10 Total Gain = 6 dB PO = 20 mW RL = 32 Ω VDD = 3 V 1 0.1 DIFF Mode 0.01 SE Mode 0.001 20 100 1k 10k 20k f − Frequency − Hz THD+N − Total Harmonic Distortion + Noise − % Figure 9. THD+N − Total Harmonic Distortion + Noise − % THD+N − Total Harmonic Distortion + Noise − % 10 f − Frequency − Hz G001 10 Total Gain = 6 dB PO = 30 mW RL = 32 Ω VDD = 3.6 V 1 0.1 SE Mode 0.01 DIFF Mode 0.001 20 100 1k 10k 20k f − Frequency − Hz G007 Figure 12. 8 TOTAL HARMONIC DISTORTION + NOISE (SP) vs FREQUENCY THD+N − Total Harmonic Distortion + Noise − % 10 1 TOTAL HARMONIC DISTORTION + NOISE (SP) vs FREQUENCY THD+N − Total Harmonic Distortion + Noise − % THD+N − Total Harmonic Distortion + Noise − % TOTAL HARMONIC DISTORTION + NOISE (SP) vs FREQUENCY 10 Total Gain = 6 dB PO = 50 mW RL = 32 Ω VDD = 5 V 1 0.1 DIFF Mode 0.01 SE Mode 0.001 20 100 1k Figure 13. Submit Documentation Feedback 10k 20k f − Frequency − Hz G008 G009 Figure 14. Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 TPA2054D4 www.ti.com ..................................................................................................................................................................................................... SLOS607 – APRIL 2009 TYPICAL CHARACTERISTIC GRAPHS (continued) CI = 1 µF, Cbypass = 1 µF VDD = 3 V VDD = 2.5 V 1 0.1 VDD = 3.6 V 0.01 0.001 VDD = 5 V 0.01 0.1 1 Total Gain = 6 dB RL = 8 Ω + 33 µH Stereo Single-Ended VDD = 3 V VDD = 2.5 V 1 0.1 VDD = 3.6 V 0.01 0.001 VDD = 5 V 0.01 0.1 1 G010 100 10 Total Gain = 6 dB RL = 16 Ω Stereo Differential VDD = 5 V 1 VDD = 3.6 V VDD = 3 V 0.1 0.01 0.001 0.0001 10 VDD = 2.5 V 0.001 0.01 0.1 1 PO − Output Power − W PO − Output Power − W G012 G011 Figure 16. Figure 17. TOTAL HARMONIC DISTORTION + NOISE (HP) vs OUTPUT POWER TOTAL HARMONIC DISTORTION + NOISE (HP) vs OUTPUT POWER TOTAL HARMONIC DISTORTION + NOISE (HP) vs OUTPUT POWER 100 10 Total Gain = 6 dB RL = 16 Ω Stereo Single-Ended VDD = 5 V 1 VDD = 3.6 V VDD = 3 V 0.1 0.01 VDD = 2.5 V 0.001 0.0001 0.001 0.01 0.1 PO − Output Power − W 1 THD+N − Total Harmonic Distortion + Noise − % Figure 15. THD+N − Total Harmonic Distortion + Noise − % 100 10 Total Gain = 6 dB RL = 32 Ω Stereo Differential VDD = 5 V 1 VDD = 3 V VDD = 3.6 V 0.1 0.01 VDD = 2.5 V 0.001 0.0001 0.001 0.01 0.1 10 Total Gain = 6 dB RL = 32 Ω Stereo Single-Ended VDD = 3.6 V 1 VDD = 3 V VDD = 5 V 0.1 0.01 VDD = 2.5 V 0.001 0.0001 1 PO − Output Power − W G013 100 0.001 0.1 0.01 1 PO − Output Power − W G014 G015 Figure 18. Figure 19. Figure 20. SUPPLY RIPPLE REJECTION RATIO (SP) vs FREQUENCY SUPPLY RIPPLE REJECTION RATIO (SP) vs FREQUENCY SUPPLY RIPPLE REJECTION RATIO (HP) vs FREQUENCY 0 0 0 −20 Total Gain = 0 dB RL = 8 Ω + 33 µH Stereo Differential Input Level = 0.2 Vpp −40 VDD = 3 V VDD = 3.6 V −60 −80 VDD = 5 V VDD = 2.5 V −100 −120 20 100 1k 10k 20k −20 ksvr − Supply Ripple Rejection Ratio − dB THD+N − Total Harmonic Distortion + Noise − % 10 100 10 TOTAL HARMONIC DISTORTION + NOISE (HP) vs OUTPUT POWER THD+N − Total Harmonic Distortion + Noise − % Total Gain = 6 dB RL = 8 Ω + 33 µH Stereo Differential PO − Output Power − W ksvr − Supply Ripple Rejection Ratio − dB THD+N − Total Harmonic Distortion + Noise − % 100 10 TOTAL HARMONIC DISTORTION + NOISE (SP) vs OUTPUT POWER ksvr − Supply Ripple Rejection Ratio − dB THD+N − Total Harmonic Distortion + Noise − % TOTAL HARMONIC DISTORTION + NOISE (SP) vs OUTPUT POWER Total Gain = 0 dB RL = 8 Ω + 33 µH Stereo Single-Ended Input Level = 0.2 Vpp −40 VDD = 2.5 V VDD = 3.6 V −60 −80 VDD = 3 V VDD = 5 V −100 −120 20 100 1k 10k 20k f − Frequency − Hz f − Frequency − Hz Total Gain = 0 dB RL = 32 Ω Stereo Differential Input Level = 0.2 Vpp −40 VDD = 2.5 V −60 VDD = 3.6 V VDD = 3 V −80 −100 −120 20 VDD = 5 V 100 1k Figure 22. G018 Figure 23. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 10k 20k f − Frequency − Hz G017 G016 Figure 21. −20 9 TPA2054D4 SLOS607 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTIC GRAPHS (continued) CI = 1 µF, Cbypass = 1 µF SUPPLY RIPPLE REJECTION RATIO (HP) vs FREQUENCY EFFICIENCY (SP) vs OUTPUT POWER PER CHANNEL 100 Total Gain = 0 dB RL = 32 Ω Stereo Single-Ended Input Level = 0.2 Vpp 80 −40 VDD = 3 V VDD = 2.5 V −60 −80 VDD = 3.6 V 60 50 VDD = 3 V 40 30 100 1k Total Gain = 6 dB RL = 8 Ω + 33 µH Stereo Single-Ended 10 VDD = 5 V VDD = 3.6 V 0 0.00 10k 20k G019 0.25 VDD = 3.6 V 0.20 VDD = 2.5 V 0.15 0.10 VDD = 5 V 0.05 VDD =3 VDD =V 3V 0.50 0.75 1.00 1.25 1.50 0.0 0.5 1.0 1.5 2.0 2.5 PO − Total Output Power − W G020 3.0 G021 Figure 25. Figure 26. TOTAL POWER DISSIPATION (HP) vs TOTAL OUTPUT POWER TOTAL POWER DISSIPATION (HP) vs TOTAL OUTPUT POWER OUTPUT POWER PER CHANNEL (SP) vs SUPPLY VOLTAGE 0.6 VDD = 5 V 0.7 VDD = 3 V 0.6 VDD = 3.6 V 0.5 0.4 0.3 VDD = 2.5 V 0.2 Total Gain = 6 dB RL = 16 Ω Stereo Single-Ended Pdiss = PdissL + PdissR 0.1 0.0 0.0 0.1 0.2 0.3 0.4 PO − Total Output Power − W 1.6 Total Gain = 6 dB RL = 32 Ω Stereo Single-Ended Pdiss = PdissL + PdissR 0.5 PO − Output Power Per Channel − W 0.8 PD − Total Power Dissipation − W VDD = 5 V 0.4 VDD = 3.6 V 0.3 0.2 0.1 VDD = 3 V 0.0 0.00 0.5 VDD = 2.5 V 0.05 0.10 0.20 PO − Total Output Power − W G022 Total Gain = 6 dB RL = 8 Ω + 33 µH Stereo Single-Ended 1.4 1.2 THD+N = 10% 1.0 0.8 THD+N = 1% 0.6 0.4 0.2 0.0 0.15 0.25 2.5 3.0 3.5 4.0 4.5 VDD − Supply Voltage − V G023 5.0 5.5 G024 Figure 27. Figure 28. Figure 29. OUTPUT POWER PER CHANNEL (HP) vs SUPPLY VOLTAGE OUTPUT POWER PER CHANNEL (HP) vs SUPPLY VOLTAGE COMMON-MODE REJECTION RATIO (SP) vs FREQUENCY 0.14 PO − Output Power Per Channel − W 0.25 THD+N = 10% 0.20 0.15 0.10 THD+N = 1% 0.05 Total Gain = 6 dB RL = 16 Ω Stereo Single-Ended CMRR − Common-Mode Rejection Ratio − dB PD − Total Power Dissipation − W 0.30 Figure 24. 0.9 PO − Output Power Per Channel − W Total Gain = 6 dB RL = 8 Ω + 33 µH Stereo Single-Ended Pdiss = PdissL + PdissR 0.35 0.00 0.25 PO − Output Power Per Channel − W f − Frequency − Hz 0.12 THD+N = 10% 0.10 0.08 THD+N = 1% 0.06 0.04 Total Gain = 6 dB RL = 32 Ω Stereo Single-Ended 0.02 0.00 0.00 2.5 3.0 3.5 4.0 4.5 VDD − Supply Voltage − V 5.0 5.5 G025 Figure 30. 10 VDD = 5 V VDD = 2.5 V 70 20 −100 −120 20 PD − Total Power Dissipation − W −20 0.40 90 η − Efficiency − % ksvr − Supply Ripple Rejection Ratio − dB 0 TOTAL POWER DISSIPATION (SP) vs TOTAL OUTPUT POWER 2.5 3.0 3.5 4.0 4.5 5.0 VDD − Supply Voltage − V Figure 31. Submit Documentation Feedback 5.5 G026 0 −10 −20 Total Gain = 6 dB Input Level = 0.2 Vpp RL = 8 Ω + 33 µH VDD = 3.6 V −30 −40 −50 −60 −70 −80 20 100 1k 10k 20k f − Frequency − Hz G027 Figure 32. Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 TPA2054D4 www.ti.com ..................................................................................................................................................................................................... SLOS607 – APRIL 2009 TYPICAL CHARACTERISTIC GRAPHS (continued) CI = 1 µF, Cbypass = 1 µF CROSSTALK (SP) vs FREQUENCY 0 0 −20 −20 −40 −30 −40 −50 −60 −80 PO = 35 mW RL = 32 Ω VDD = 3.6 V Stereo Single-Ended −20 −40 Crosstalk − dB −10 PO = 250 mW RL = 8 Ω + 33 µH VDD = 3.6 V Stereo Single-Ended Left to Right Left to Right −60 −80 −100 −60 −80 20 100 1k −140 20 10k 20k Right to Left 100 1k −120 20 10k 20k G029 G030 Figure 35. SUPPLY CURRENT vs SUPPLY VOLTAGE SUPPLY CURRENT vs SUPPLY VOLTAGE SUPPLY CURRENT vs SUPPLY VOLTAGE 50 50 20 15 10 40 35 30 25 20 15 10 5 5 0 0 3.5 4.0 4.5 VDD − Supply Voltage − V 5.0 5.5 G031 Figure 36. Total Gain = 6 dB HP Load = 32 Ω RL = 8 Ω + 33 µH Speaker and Headphone Enabled 45 IDD − Supply Current − mA IDD − Supply Current − mA 25 3.0 Total Gain = 6 dB HP Load = 32 Ω RL = 8 Ω + 33 µH Headphone Enabled Only 45 30 2.5 10k 20k Figure 34. Total Gain = 6 dB HP Load = 32 Ω RL = 8 Ω + 33 µH Speaker Enabled Only 35 1k f − Frequency − Hz Figure 33. 50 40 100 f − Frequency − Hz G028 45 Right to Left −100 −120 −70 f − Frequency − Hz IDD − Supply Current − mA CROSSTALK (HP) vs FREQUENCY 0 Total Gain = 6 dB Input Level = 0.2 Vpp RL = 32 Ω VDD = 3.6 V Crosstalk − dB CMRR − Common-Mode Rejection Ratio − dB COMMON-MODE REJECTION RATIO (HP) vs FREQUENCY 40 35 30 25 20 15 10 5 0 2.5 3.0 3.5 4.0 4.5 5.0 VDD − Supply Voltage − V Figure 37. 5.5 2.5 3.0 3.5 4.0 4.5 5.0 VDD − Supply Voltage − V G032 Product Folder Link(s): TPA2054D4 G033 Figure 38. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated 5.5 11 TPA2054D4 SLOS607 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTIC GRAPHS (continued) CI = 1 µF, Cbypass = 1 µF SPEAKER OUTPUT - STARTUP SPEAKER OUTPUT - SHUTDOWN 2.0 2.0 SDA 1.5 1.5 1.0 V − Voltage − V V − Voltage − V 1.0 SDA 0.5 SPKR Output SPKR Output 0.5 0.0 0.0 −0.5 −0.5 −1.0 0 2 4 6 8 10 12 14 16 18 −1.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 20 t − Time − ms t − Time − ms G034 G035 Figure 39. Figure 40. HEADPHONE OUTPUT - STARTUP HEADPHONE OUTPUT - SHUTDOWN 2.0 2.0 SDA 1.5 1.5 1.0 V − Voltage − V 1.0 V − Voltage − V SDA 0.5 Headphone Output Headphone Output 0.5 0.0 0.0 −0.5 −0.5 −1.0 0 2 4 6 8 10 12 14 16 18 20 −1.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 t − Time − ms t − Time − ms G037 G036 Figure 41. 12 Figure 42. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 TPA2054D4 www.ti.com ..................................................................................................................................................................................................... SLOS607 – APRIL 2009 DETAILED DESCRIPTION GENERAL I2C OPERATION The I2C bus employs two signals, SDA (data) and SCL (clock), to communicate between integrated circuits in a system. The bus transfers data serially one bit at a time. The address and data 8-bit bytes are transferred most significant bit (MSB) first. In addition, each byte transferred on the bus is acknowledged by the receiving device with an acknowledge bit. Each transfer operation begins with the master device driving a start condition on the bus and ends with the master device driving a stop condition on the bus. The bus uses transitions on the data terminal (SDA) while the clock is at logic high to indicate start and stop conditions. A high-to-low transition on SDA indicates a start and a low-to-high transition indicates a stop. Normal data-bit transitions bust occur within the low time of the clock period. Figure 43 shows a typical sequence. The master generates the 7-bit slave address and the read/write (R/W) bit to open communication with another device and then waits for an acknowledge condition. The TPA2054D4 holds SDA low during the acknowledge clock period to indicate acknowledgment. When this occurs, the master transmits the next byte of the sequence. Each device is addressed by a unique 7-bit slave address plus R/W bit (1 byte). All compatible devices share the same signals via a bidirectional bus using a wired-AND connection. An external pull-up resistor must be used for the SDA and SCL signals to set the logic high level for the bus. Figure 43. Typical I2C Sequence There is no limit on the number of bytes that can be transmitted between start and stop conditions. When the last word transfers, the master generates a stop condition to release the bus. Figure 43 shows a generic data transfer sequence. SINGLE AND MULTI-BYTE TRANSFERS The serial control interface supports both single-byte and multi-byte read/write operations for all registers. During multi-byte reads, the TPA2054D4 responds with data, one byte at a time, starting at the register assigned provided the master devices continue to acknowledge. The TPA2054D4 supports sequential I2C addressing. For write transactions, if a register is issued followed by data for that register and all the remaining registers that follow, a sequential I2C write transaction has occurred. For I2C sequential write transactions, the register issued then serves as the starting point and the amount of data subsequently transmitted, before a stop or start is transmitted, determines how many registers are written to. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 13 TPA2054D4 SLOS607 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com SINGLE-BYTE WRITE As shown in Figure 44, a single-byte data write transfer begins with the master device transmitting a start condition followed by the I2C device address and the read/write bit. The read/write bit determines the direction of the data transfer. For a write data transfer, the read/write bit must be set to 0. After receiving the correct I2C device address and the read/write bit, the TPA2054D4 responds with an acknowledge bit. Next, the master transmits the register byte corresponding to the TPA2054D4 internal memory address being accessed. After receiving the register byte, the TPA2054D4 again responds with an acknowledge bit. Finally, the master device transmits a stop condition to complete the single-byte data write transfer. Figure 44. Single-Byte Write Transfer MULTI-BYTE WRITE AND INCREMENTAL MULTI-BYTE WRITER A multiple-byte data write transfer is identical to a single-byte data write transfer with the exception that multiple data bytes are transmitted by the master device to the TPA2054D4 as shown in Figure 45. After receiving each data byte, the TPA2054D4 responds with an acknowledge bit. Figure 45. Multiple-Byte Write Transfer SINGLE-BYTE READ As shown in Figure 46, a single-byte data read transfer begins with the master device transmitting a start condition followed by the I2C device address and the read/write bit. For the data read transfer, both a write followed by a read are actually done. Initially, a write is done to transfer the address byte of the internal memory address to be read. As a result, the read/write bit is set to a 0. After receiving the TPA2054D4 address and the read/write bit, the TPA2054D4 responds with an acknowledge bit. The master then sends the internal memory address byte, after which the TPA2054D4 issues an acknowledge bit. The master device transmits another start condition followed by the TPA2054D4 address and the read/write bit again. This time, the read/write bit is set to 1, indicating a read transfer. Next, the TPA2054D4 transmits the data byte from the memory address being read. After receiving the data byte, the master device transmits a not-acknowledge followed by a stop condition to complete the single-byte data read transfer. Figure 46. Single-Byte Read Transfer 14 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 TPA2054D4 www.ti.com ..................................................................................................................................................................................................... SLOS607 – APRIL 2009 MULTI-BYTE READY A multiple-byte data read transfer is identical to a single-byte read transfer except that multiple data bytes are transmitted by the TPA2054D4 to the master device as shown in Figure 47. With the exception of the last data byte, the master device responds with an acknowledge bit after receiving each data byte. Figure 47. Multi-Byte Read Transfer REGISTER MAPS REGISTER BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 1 Reserved Reserved Reserved PAL_Fault PAR_Fault HPL_Fault HPR_Fault Thermal 2 Reserved Reserved Reserved SWS HPL_Enable HPR_Enable PA_Enable Reserved 3 LIM_Lock Reserved Reserved Reserved Reserved Mode[2] Mode[1] Mode[0] 4 Reserved Reserved Reserved Mon_Vol[4] Mon_Vol[3] Mon_Vol[2] Mon_Vol[1] Mon_Vol[0] 5 Reserved Reserved Reserved ST1_Vol[4] ST1_Vol[3] ST1_Vol[2] ST1_Vol[1] ST1_Vol[0] 6 Reserved Reserved Reserved ST2_Vol[4] ST2_Vol[3] ST2_Vol[2] ST2_Vol[1] ST2_Vol[0] 7 Reserved Reserved Reserved HP_Vout[2] HP_Vout[1] HP_Vout[0] HP_Gain[1] HP_Gain[0] The TPA2054D4 I2C address is 0xE0 (binary 11100000) for writing and 0xE1 (binary 11100001) for reading. Refer to the General I2C Operation section for more details. Bits labeled Reserved are reserved for future enhancements. They may not be written to as it may change the function of the device. If read, these bits may assume any value. Any register above address 0x07 is reserved for testing and should not be written to because it may change the function of the device. If read, these bits may assume any value. Fault Register (Address: 1) BIT 7 6 5 4 3 2 1 0 Function Reserved Reserved Reserved PAL_Fault PAR_Fault HPL_Fault HPR_Fault Thermal Reset Value 0 0 0 0 0 0 0 0 Reserved These bits are reserved for future enhancements. They will not change state if programmed. If read these bits may assume any value. PAL_Fault Logic high indicates an over-current event has occurred on the Class-D left channel output. This bit is clear-on-write. Only logic low can be written to this bit. PAR_Fault Logic high indicates an over-current event has occurred on the Class-D right channel output. This bit is clear-on-write. Only logic low can be written to this bit. HPL_Fault Logic high indicates an over-current event has occurred on the headphone left channel output. This bit is clear-on-write. Only logic low can be written to this bit. HPR_Fault Logic high indicates an over-current event has occurred on the headphone right channel output. This bit is clear-on-write. Only logic low can be written to this bit. Thermal Logic high indicates thermal shutdown activated. Bit automatically clears when the thermal condition lowers past the hysteresis threshold. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 15 TPA2054D4 SLOS607 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com Power Management Register (Address: 2) BIT 7 6 5 4 3 2 1 0 Function Reserved Reserved Reserved SWS HPL_Enable HPR_Enable PA_Enable Reserved Reset Value 0 0 0 1 0 0 0 0 Reserved These bits are reserved for future enhancements. They will not change state if programmed. If read these bits may assume any value. SWS Software shutdown. Set to logic high to deactivate the TPA2054D4. Logic low reactivates the charge pump and input amplifiers; enable headphone and Class-D amplifiers using HPL_Enable, HPR_Enable, and PA_Enable. Default on turn-on is SWS logic high. HPL_Enable Headphone left channel enable. Set to logic low to deactivate left channel. HPR_Enable Headphone right channel enable. Set to logic low to deactivate right channel. PA_Enable Class-D power amplifier enable. Set to logic low to deactivate both left and right Class-D power amplifiers. Mux Output Control Register (Address: 3) BIT 7 6 5 4 3 2 1 0 Function LIM_Lock Reserved Reserved Reserved Reserved Mode[2] Mode1] Mode[0] Reset Value 0 0 0 0 0 0 0 1 Reserved These bits are reserved for future enhancements. They will not change state if programmed. If read these bits may assume any value. LIM_Lock Limiter change lockout. Set bit to logic high to prevent any changes to the HP_Vout[2:0] and LIM_Lock bits. The LIM_Lock bit can only be returned to 0 by applying logic low to the RESET pin or powering down VDD. Mode[2:0] Sets mux output mode. Refer to Modes of Operation section for details. Default mode is 001 (Stereo 1 Input mode) on power-up. Mono Input Volume Control Register (Address: 4) BIT 7 6 5 4 3 2 1 0 Function Reserved Reserved Reserved Mon_Vol[4] Mon_Vol[3] Mon_Vol[2] Mon_Vol[1] Mon_Vol[0] Reset Value 0 0 0 1 0 0 1 1 Reserved These bits are reserved for future enhancements. They will not change state if programmed. If read these bits may assume any value. Mon_Vol[4:0] Five-bit volume control for Mono Input. 11111 sets device to its highest gain (+24 dB); 00000 sets device to its lowest gain (–66 dB). Default setting on power-up is 10011 (+7 dB). Stereo Input 1 Volume Control Register (Address: 5) BIT 7 6 5 4 3 2 1 0 Function Reserved Reserved Reserved ST1_Vol[4] ST1_Vol[3] ST1_Vol[2] ST1_Vol[1] ST1_Vol[0] Reset Value 0 0 0 1 0 0 0 0 Reserved These bits are reserved for future enhancements. They will not change state if programmed. If read these bits may assume any value. ST1_Vol[4:0] Five-bit volume control for Stereo Input 1 in single-ended input mode and stereo input pair in differential input mode. 11111 sets device to its highest gain (+24 dB); 00000 sets device to its lowest gain (–66 dB). Default setting on power-up is 10000 (+0 dB). 16 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 TPA2054D4 www.ti.com ..................................................................................................................................................................................................... SLOS607 – APRIL 2009 Stereo Input 2 Volume Control Register (Address: 6) BIT 7 6 5 4 3 2 1 0 Function Reserved Reserved Reserved ST2_Vol[4] ST2_Vol[3] ST2_Vol[2] ST2_Vol[1] ST2_Vol[0] Reset Value 0 0 0 1 0 0 0 0 Reserved These bits are reserved for future enhancements. They will not change state if programmed. If read these bits may assume any value. ST2_Vol[4:0] Five-bit volume control for Stereo Input 2. 11111 sets device to its highest gain (+24 dB); 00000 sets device to its lowest gain (–66 dB). Default setting on power-up is 10000 (+0 dB). Headphone Output Control Register (Address: 7) BIT 7 6 5 4 3 2 1 0 Function Reserved Reserved Reserved HP_Vout[2] HP_Vout[1] HP_Vout[0] HP_Gain[1] HP_Gain[0] Reset Value 0 0 0 0 0 0 0 0 Reserved These bits are reserved for future enhancements. They will not change state if programmed. If read these bits may assume any value. HP_Vout[2:0] Headphone output voltage limiter. Sets the maximum output voltage / power to the headphones. HP_Gain[1:0] Headphone gain select. Sets the gain of the headphone output amplifiers. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 17 TPA2054D4 SLOS607 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com MODES OF OPERATION The TPA2054D4 has several operating modes for single-ended and differential inputs. Stereo 1 refers to the LIN_1 and RIN_1 input pair; Stereo 2 refers to the LIN_2 and RIN_2 input pair. Mux Output Mode The input mux selects which device input is directed to both the Class-D and headphone amplifiers. Mux summing and output are after the channel volume controls, as shown in the Simplified Functional Diagram. Program the mux mode using the Mode[2:0] bits in Mux Output Control (Register 3, Bits 0–2). Select the appropriate mode according to the table below. MODE BYTE: MODE[2:0] MUX OUTPUT MUX MODE LEFT MUX OUTPUT DESCRIPTION RIGHT 000 Mono Input Mono+ – Mono- Mono+ – Mono- Differential mono input 001 Stereo 1 Input LIN_1 RIN_1 LIN_1 and RIN_1 stereo single-ended input 010 Stereo 2 Input LIN_2 RIN_2 LIN_2 and RIN_2 stereo single-ended input 011 Stereo Differential LIN_1–RIN_1 LIN_2–RIN_2 LIN_1 and RIN_1 compose the left channel; LIN_2 and RIN_2 compose the right channel 100 Stereo Differential (mono-mode) (LIN_1–RIN_1) + (LIN_2–RIN_2) (LIN_1–RIN_1) + (LIN_2–RIN_2) Left and right differential inputs summed and directed to left and right mux output 101 Stereo 1 (mono-mode) LIN_1 + RIN_1 LIN_1 + RIN_1 LIN_1 + RIN_1 distributed to both left and right inputs of the headphone and Class-D amplifiers 110 Stereo 2 (mono-mode) LIN_2 + RIN_2 LIN_2 + RIN_2 LIN_2 + RIN_2 distributed to both left and right inputs of the headphone and Class-D amplifiers 111 Mute Mute Mute All inputs muted; no audio available at mux output Differential Input Mode The LIN_1 and RIN_1 input pair and the LIN_2 and RIN_2 input pair are configurable as either single-ended or differential inputs. Differential transmission between an audio source and the TPA2054D4 input improves system noise rejection when compared to single-ended transmission. In differential input modes, connect the Left+ and Left– source signal to LIN_1 and RIN_1, respectively; connect Right+ and Right– to LIN_2 and RIN_2, respectively. Single-ended input modes allow selection between two stereo sources. Differential input modes allow connection to only one stereo source. START-UP SEQUENCING AND SHUTDOWN CONTROL For correct start up with no turn-on pop, apply PVDD and VDDHP before applying DVDD while keeping RESET at logic low. Once DVDD has settled to a minimum of 1.7 V, set RESET to logic high to complete the start-up sequence. The TPA2054D4 starts up in soft shutdown mode with the SWS bit (Register 2, Bit 4) at logic high. The stereo Class-D power amplifiers, left headphone amplifier, and right headphone amplifier each have their own enable bits within the Power Management byte (Register 2, Bits 3–1). Set the corresponding bit to logic high to enable these amplifiers. Disabling an amplifier mutes its output and reduces supply current. Set SWS to logic high to deactivate all sections except the I2C interface, reducing total supply current to 2 µA, max. Set RESET to logic low to deactivate all sections including the I2C interface. The I2C registers cannot be programmed while RESET remains at logic low. Refer to the Headphone Output Limiter Lockout section for more details on using RESET. All register contents are maintained provided the supply voltage is not powered down and RESET remains at logic high. On deactivation of DVDD or PVDD, or on RESET set to logic low, all information programmed into the registers by the user is lost, returning to their default state once power is reapplied. 18 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 TPA2054D4 www.ti.com ..................................................................................................................................................................................................... SLOS607 – APRIL 2009 Class-D Output Amplifiers To enable both Class-D power amplifiers, set the PA_Enable bit (Register 2, Bit 1) to logic high. The left and right channel Class-D outputs cannot be separately activated. Total Class-D section typical current is 7 mA when active and less than 1 µA when deactivated. All Class-D outputs have short-circuit current protection and thermal overload protection. The PAL_Fault and PAR_Fault bits (Register 1, Bits 4 and 3) indicate an over-current event on the left and right Class-D channel outputs. These bits are clear-on-write; only logic low can be written. The Thermal bit (Register 1, Bit 1) goes to logic high if a thermal shutdown event occurs. It returns to logic low once the device temperature returns below 150°C. DirectPath Headphone Amplifier Set the HPL_Enable bit (Register 2, Bit 3) to logic high to enable the headphone left output and the HPR_Enable bit (Register 2, Bit 2) to logic high to enable the headphone right output. The headphone amplifier draws 10 mA of typical supply current with both left and right outputs active and less than 1 µA when deactivated. The HPL_Fault and HPR_Fault bits (Register 1, Bits 2 and 1) indicate an over-current event on the left and right headphone outputs. These bits are clear-on-write; only logic low can be written. HEADPHONE OUTPUT LIMITER LOCKOUT Setting the LIM_Lock bit (Register 3, Bit 7) to logic high prevents any register changes to the HP_Vout byte (Register 7, Bits 4-2) and the LIM_Lock bit itself. The LIM_Lock bit will remain locked at logic high until the power supply is deactivated or logic low is applied to the RESET pin. All volume control, mux modes and shutdown registers remain writable regardless of LIM_Lock status. MAXIMUM HEADPHONE POWER REGULATOR The HP_Vout byte (Register 7, Bits 4-2) sets the maximum output voltage from the headphone amplifiers. This is useful for limiting the maximum output power to the headphones. The HP_Vout byte sets the internally regulated supply voltage to the headphone amplifiers according to the table below. The table also shows the equivalent 10% THD output into 16Ω and 32Ω loads. (1) MAX HEADPHONE OUTPUT BYTE: HP_VOUT[2:0] VOUT,MAX POUT,MAX INTO 16Ω (10% THD) POUT,MAX INTO 32Ω (10% THD) 000 ±VDDHP (1) 130 mW (at VDDHP = 3.6 V) 65 mW (at VDDHP = 3.6 V) 001 ±1.13 V 40 mW 20 mW 010 ±0.54 V 9 mW 4.5 mW 011 ±0.38 V 4.5 mW 2.3 mW 100 ±0.315 V 3.1 mW 1.6 mW 101 ±0.253 V 2.0 mW 1.0 mW 110 ±0.227 V 1.6 mW 0.8 mW 111 ±0.196 V 1.2 mW 0.6 mW With no load. Maximum output voltage decreases as load resistance decreases. HEADPHONE GAIN VALUES For the DirectPath headphone amplifier, left and right output channels HEADPHONE GAIN REGISTER BYTE: HP_GAIN[1:0] NOMINAL GAIN 00 +6 dB 01 0 dB 10 –6 dB 11 –14 dB Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 19 TPA2054D4 SLOS607 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com INPUT VOLUME CONTROL The TPA2054D4 has three independent volume controls: one for the Mono differential input, one for the STEREO1 input pair (LIN_1 and RIN_1), and one for the STEREO2 input pair (LIN_2 and RIN_2). Each has 5-bit (32-step) resolution and are audio tapered; gain step changes are smaller at higher gain settings. The volume control range is –66 dB to +24 dB. Total input-to-output gain is input gain plus the headphone or Class-D amplifier gain. The Class-D amplifier gain is fixed at +6 dB. The headphone gain is programmable at +6 dB (default), 0 dB, –6 dB, and –14 dB. Headphone gain is set via the I2C interface. The Mono Input volume control byte is located at Register 4, Bits 4 – 0. The Stereo Input 1 volume control byte is located at Register 5, Bits 4–0. The Stereo Input 2 volume control byte is at Register 6, Bits 4–0. Gain matching between the left and right channels for STEREO1 and STEREO2 is within 0.1 dB. In differential input mode, the Stereo Input 1 byte (Register 5) controls left and right channel gain. The input impedance to the TPA2054D4 decreases as channel gain increases. See the Operating Characteristics section for specifications. Values listed in Audio Taper Gain Values table are nominal values. AUDIO TAPER GAIN VALUES For input channel volume controls 20 VOLUME CONTROL REGISTER BYTE: VOL[4:0] NOMINAL GAIN VOLUME CONTROL REGISTER BYTE: VOL[4:0] 00000 –66 dB 10000 0 dB 00001 –56 dB 10001 +3 dB 00010 –48 dB 10010 +5 dB 00011 –44 dB 10011 +7 dB 00100 –40 dB 10100 +9 dB 00101 –36 dB 10101 +11 dB 00110 –32 dB 10110 +13 dB 00111 –28 dB 10111 +15 dB 01000 –24 dB 11000 +17 dB 01001 –21 dB 11001 +18 dB 01010 –18 dB 11010 +19 dB 01011 –15 dB 11011 +20 dB 01100 –12 dB 11100 +21 dB 01101 –9 dB 11101 +22 dB 01110 –6 dB 11110 +23 dB 01111 –3 dB 11111 +24 dB Submit Documentation Feedback NOMINAL GAIN Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 TPA2054D4 www.ti.com ..................................................................................................................................................................................................... SLOS607 – APRIL 2009 DECOUPLING CAPACITOR, CS The TPA2054D4 is a high-performance Class-D audio amplifier that requires adequate power supply decoupling to ensure the efficiency is high and total harmonic distortion (THD) is low. For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) 1-µF ceramic capacitor (typically) placed as close as possible to the device PVDD (L, R) lead works best. Placing this decoupling capacitor close to the TPA2054D4 is important for the efficiency of the Class-D amplifier, because any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency. For filtering lower-frequency noise signals, a 4.7 µF or greater capacitor placed near the audio power amplifier would also help, but it is not required in most applications because of the high PSRR of this device. INPUT CAPACITORS, CI The input capacitors and input resistors form a high-pass filter with the corner frequency, fC, determined in Equation 1. 1 fC = (2p ´ RI ´ CI ) (1) The value of the input capacitor is important to consider as it directly affects the bass (low frequency) performance of the circuit. Speakers in wireless phones cannot usually respond well to low frequencies, so the corner frequency can be set to block low frequencies in this application. Not using input capacitors can increase output offset. Equation 2 is used to solve for the input coupling capacitance. If the corner frequency is within the audio band, the capacitors should have a tolerance of ±10% or better, because any mismatch in capacitance causes an impedance mismatch at the corner frequency and below. 1 CI = (2p ´ RI ´ fC ) (2) BOARD LAYOUT In making the pad size for the WCSP balls, it is recommended that the layout use non solder mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 48 and Table 1 shows the appropriate diameters for a WCSP layout. The TPA2054D4 evaluation module (EVM) layout is shown in the next section as a layout example. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 21 TPA2054D4 SLOS607 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com Figure 48. Land Pattern Dimensions Table 1. Land Pattern Dimensions (1) (1) (2) (3) (4) (5) (6) (7) SOLDER PAD DEFINITIONS COPPER PAD SOLDER MASK (5) OPENING COPPER THICKNESS Non solder mask defined (NSMD) 275 µm (+0.0, –25 µm) 375 µm (+0.0, –25 µm) 1 oz max (32 µm) (2) (3) (4) STENCIL (6) (7) OPENING 275 µm × 275 µm Sq. (rounded corners) STENCIL THICKNESS 125 µm thick Circuit traces from NSMD defined PWB lands should be 75 µm to 100 µm wide in the exposed area inside the solder mask opening. Wider trace widths reduce device stand off and impact reliability. Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the intended application. Recommend solder paste is Type 3 or Type 4. For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance. Solder mask thickness should be less than 20 µm on top of the copper circuit pattern Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in inferior solder paste volume control. Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to solder wetting forces. COMPONENT LOCATION Place all the external components very close to the TPA2054D4. Placing the decoupling capacitor, CS, close to the TPA2054D4 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency. TRACE WIDTH Recommended trace width at the solder balls is 75 µm to 100 µm to prevent solder wicking onto wider PCB traces. For high current pins (PVDD (L, R), PGND, and audio output pins) of the TPA2054D4, use 100-µm trace widths at the solder balls and at least 500-µm PCB traces to ensure proper performance and output power for the device. For the remaining signals of the TPA2054D4, use 75-µm to 100-µm trace widths at the solder balls. The audio input pins (INR± and INL±) must run side-by-side to maximize common-mode noise cancellation. 22 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 TPA2054D4 www.ti.com ..................................................................................................................................................................................................... SLOS607 – APRIL 2009 EFFICIENCY AND THERMAL INFORMATION The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factor for the packages are shown in the dissipation rating table. Converting this to θJA for the WCSP package: q JA = 1 1 = = 111°C/W Derating Factor 0.009 (3) Given θJA of 111°C/W, the maximum allowable junction temperature of 150°C, and the maximum internal dissipation of 0.12 W (0.06 W per channel) for 1.4 W per channel, 8-Ω load, 5-V supply, from Figure 25 , the maximum ambient temperature can be calculated with the following equation: TAMax = TJMax - θJAPDMAX = 150 - 111(0.12) = 137°C (4) Equation 4 shows that the calculated maximum ambient temperature is 137°C at maximum power dissipation with a 5-V supply and 8-Ω a load. The TPA2054D4 is designed with thermal protection that turns the device off when the junction temperature surpasses 150°C to prevent damage to the IC. Also, using speakers more resistive than 8-Ω dramatically increases the thermal performance by reducing the output current and increasing the efficiency of the amplifier. OPERATION WITH DACS AND CODECS In using Class-D amplifiers with CODECs and DACs, sometimes there is an increase in the output noise floor from the audio amplifier. This occurs when mixing of the output frequencies of the CODEC/DAC mix with the switching frequencies of the audio amplifier input stage. The noise increase can be solved by placing a low-pass filter between the CODEC/DAC and audio amplifier. This filters off the high frequencies that cause the problem and allow proper performance. See the functional block diagram. FILTER FREE OPERATION AND FERRITE BEAD FILTERS A ferrite bead filter can often be used if the design is failing radiated emissions without an LC filter and the frequency sensitive circuit is greater than 1 MHz. This filter functions well for circuits that just have to pass FCC and CE because FCC and CE only test radiated emissions greater than 30 MHz. When choosing a ferrite bead, choose one with high impedance at high frequencies, and low impedance at low frequencies. In addition, select a ferrite bead with adequate current rating to prevent distortion of the output signal. Use an LC output filter if there are low frequency (< 1 MHz) EMI sensitive circuits and/or there are long leads from amplifier to speaker. Figure 49 shows typical ferrite bead and LC output filters. Ferrite Chip Bead OUTP 1 nF Ferrite Chip Bead OUTN 1 nF Figure 49. Typical Ferrite Bead Filter (Chip bead example: TDK: MPZ1608S221A) Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2054D4 23 PACKAGE OPTION ADDENDUM www.ti.com 5-May-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPA2054D4YZKR ACTIVE DSBGA YZK 25 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM TPA2054D4YZKT ACTIVE DSBGA YZK 25 250 SNAGCU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-May-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPA2054D4YZKT Package Package Pins Type Drawing SPQ DSBGA 250 YZK 25 Reel Reel Diameter Width (mm) W1 (mm) 178.0 8.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 2.75 2.75 0.81 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 4-May-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA2054D4YZKT DSBGA YZK 25 250 217.0 193.0 35.0 Pack Materials-Page 2 MECHANICAL DATA TPA2054D4 Dimensions D: Max = 2602mm, Min = 2542mm E: Max = 2602mm, Min = 2542mm PACKAGE MATERIALS INFORMATION www.ti.com 17-Jun-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TPA2054D4YZKR DSBGA YZK 25 3000 180.0 8.4 TPA2054D4YZKT DSBGA YZK 25 250 180.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2.75 2.75 0.81 4.0 8.0 Q1 2.75 2.75 0.81 4.0 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Jun-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA2054D4YZKR DSBGA YZK 25 3000 182.0 182.0 20.0 TPA2054D4YZKT DSBGA YZK 25 250 182.0 182.0 20.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated
TPA2054D4YZKT 价格&库存

很抱歉,暂时无法提供与“TPA2054D4YZKT”相匹配的价格&库存,您可以联系我们找货

免费人工找货