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TPS22901, TPS22902, TPS22902B
SLVS803D – NOVEMBER 2008 – REVISED JANUARY 2015
TPS2290x 3.6-V, 500-mA, 78-mΩ ON-Resistance Load Switch With Controlled Turnon
1 Features
2 Applications
•
•
•
•
•
•
•
•
•
•
•
1
•
•
•
•
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•
•
Integrated P-Channel Load Switch
Low Input Voltage: 1 V to 3.6 V
ON-Resistance (Typical Values)
– rON = 78 mΩ at VIN = 3.6 V
– rON = 93 mΩ at VIN = 2.5 V
– rON = 109 mΩ at VIN = 1.8 V
– rON = 146 mΩ at VIN = 1.2 V
500 mA Maximum Continuous Switch Current
Quiescent Current: 82 nA at 1.8 V
Shutdown Current: 44 nA at 1.8 V
Low Control Input Thresholds Enable Use of
1.2-V, 1.8-V, 2.5-V, and 3.3-V Logic
Controlled Slew Rate to Avoid Inrush Currents
– tr = 40 μs at VIN = 1.8 V (TPS22901/2)
– tr = 220 μs at VIN = 1.8 V (TPS22902B)
Quick Output Discharge (TPS22902/2B)
ESD Performance Tested Per JESD 22
– 2000-V Human Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
Four-Pin Wafer-Chip-Scale DSBGA Package
– 0.8-mm × 0.8-mm, 0.4-mm Pitch,
0.5-mm Height (YFP)
Personal Digital Assistants (PDAs)
Cellular Phones
GPS Devices
MP3 Players
Digital Cameras
Peripheral Ports
Portable Instrumentation
RF Modules
3 Description
The TPS22901, TPS22902, and TPS22902B are
small, low ON-resistance (rON) load switches with a
controlled turnon. These devices contain a P-channel
MOSFET that operates over an input voltage range of
1.0 V to 3.6 V. The switch is controlled by an on/off
input (ON), which can interface directly with lowvoltage control signals. In the TPS22902 and
TPS22902B, an 88-Ω on-chip load resistor is added
for output quick discharge when the switch is turned
off.
The TPS22901, TPS22902, and TPS22902B are
available in a space-saving 4-pin DSBGA (YFP) with
0.4-mm pitch. These devices are characterized for
operation over the free-air temperature range of
–40°C to 85°C.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DSBGA (4)
0.80 mm × 0.80 mm
TPS22901
TPS22902
TPS22902B
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Typical Application Schematic
VBATT
VIN
SMPS
ON
(see Note A)
CIN = 1 µF
CL
VOUT
LOAD
TPS22901/02/02B
CL
RL
OFF
GND
GND
A.
GND
Switched-mode power supply
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS22901, TPS22902, TPS22902B
SLVS803D – NOVEMBER 2008 – REVISED JANUARY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Typical Application Schematic.............................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
3
4
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
8.12
4
4
4
4
5
6
6
7
7
8
8
9
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics (VIN = 1.1 V).....................
Switching Characteristics (VIN = 1.2 V).....................
Switching Characteristics (VIN = 1.8 V).....................
Switching Characteristics (VIN = 2.5 V).....................
Switching Characteristics (VIN = 3.0 V)...................
Switching Characteristics (VIN = 3.6 V)...................
Typical DC Characteristics......................................
9 Parameter Measurement Information ................ 19
10 Detailed Description ........................................... 20
10.1
10.2
10.3
10.4
Overview ...............................................................
Functional Block Diagram .....................................
Feature Description...............................................
Device Functional Modes......................................
20
20
20
20
11 Application and Implementation........................ 21
11.1 Application Information.......................................... 21
11.2 Typical Application ................................................ 21
12 Power Supply Recommendations ..................... 24
13 Layout................................................................... 24
13.1 Layout Guidelines ................................................. 24
13.2 Layout Example .................................................... 24
14 Device and Documentation Support ................. 25
14.1
14.2
14.3
14.4
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
25
25
25
25
15 Mechanical, Packaging, and Orderable
Information ........................................................... 25
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (December 2012) to Revision D
Page
•
Added ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
•
Deleted the ORDERING INFORMATION table...................................................................................................................... 3
Changes from Revision B (March 2009) to Revision C
•
2
Page
Changed the ORDERING INFORMATION table.................................................................................................................... 3
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Product Folder Links: TPS22901 TPS22902 TPS22902B
TPS22901, TPS22902, TPS22902B
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SLVS803D – NOVEMBER 2008 – REVISED JANUARY 2015
6 Device Comparison Table
RON at 1.8 V
(TYP)
RISE TIME
(TYP at 1.8 V)
TPS22901
TPS22902
109 mΩ
MAX OUTPUT
CURRENT
ENABLE
500 mA
Active high
No
40 μs
Yes
220 μs
TPS22902B
(1)
QUICK OUTPUT
DISCHARGE (1)
Yes
This feature discharges the output of the switch to ground through an 88 Ω resistor, preventing the
output from floating.
7 Pin Configuration and Functions
YFP Package
4-Pin DSBGA
B
B
A
A
2 1
Laser Marking View
1 2
Bump View
Pin Assignments
B
ON
GND
A
VIN
VOUT
2
1
Pin Functions
PIN
I/O
DESCRIPTION
NO.
NAME
A1
VOUT
O
Switch output
A2
VIN
I
Switch input, bypass this input with a ceramic capacitor to ground
B1
GND
-
Ground
B2
ON
I
Switch control input, active high
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SLVS803D – NOVEMBER 2008 – REVISED JANUARY 2015
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8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VIN
Input voltage
VOUT
Output voltage
VON
Input voltage
P
Power dissipation at TA = 25°C
IMAX
Maximum continuous switch current
TA
Operating free-air temperature
Tlead
Maximum lead temperature (10-s soldering time)
Tstg
Storage temperature
(1)
MIN
MAX
UNIT
–0.3
4
V
VIN + 0.3
V
–0.3
–40
–65
4
V
0.48
W
500
mA
85
°C
300
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
8.2 ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
V(ESD)
(1)
(2)
Electrostatic discharge
(1)
UNIT
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
V
±1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
VIN
Input voltage
VOUT
Output voltage
VIH
High-level input voltage, ON
VIL
Low-level input voltage, ON
CIN
Input capacitor
(1)
MIN
MAX
1
3.6
V
VIN
V
3.6
V
0.85
UNIT
0.4
See
(1)
V
μF
See Input Capacitor (Optional).
8.4 Thermal Information
TPS2290X
THERMAL METRIC
(1)
YFP (DSBGA)
UNIT
4 PINS
RθJA
Junction-to-ambient thermal resistance
RθJC(top)
Junction-to-case (top) thermal resistance
2.3
RθJB
Junction-to-board thermal resistance
35.8
ψJT
Junction-to-top characterization parameter
11.8
ψJB
Junction-to-board characterization parameter
35.6
(1)
4
192.1
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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SLVS803D – NOVEMBER 2008 – REVISED JANUARY 2015
8.5 Electrical Characteristics
VIN = 1.0 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted). Typical values are for TA = 25°C
PARAMETER
IQ
IIN(OFF)
IIN(LEAKAGE)
TEST CONDITIONS
Quiescent current
IOUT = 0, VIN = VON
OFF-state supply current
VON = GND, VOUT = Open
OFF-state switch current
VON = GND, VOUT = 0 V
IOUT = - 200 mA
TYP
MAX
Full
37
120
VIN = 1.8 V
Full
82
235
VIN = 3.6 V
Full
204
880
VIN = 1.1 V
Full
22
210
VIN = 1.8 V
Full
44
260
VIN = 3.6 V
Full
137
700
VIN = 1.1 V
Full
22
140
VIN = 1.8 V
Full
45
230
VIN = 3.6 V
Full
137
610
25°C
78
95
93
110
VIN = 2.5 V
ON-state resistance
MIN
VIN = 1.1 V
VIN = 3.6 V
rON
TA
VIN = 1.8 V
VIN = 1.2 V
VIN = 1.1 V
rPD
Output pulldown resistance
VIN = 3.3 V, VON = 0, IOUT = 30 mA
(TPS22902/TPS22902B only)
ION
ON input leakage current
VON = 1.1 V to 3.6 V or GND
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Full
25°C
146
Full
nA
mΩ
200
200
174
Full
25°C
130
130
Full
25°C
nA
110
109
Full
25°C
nA
95
Full
25°C
UNIT
330
330
88
120
Ω
25
nA
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8.6 Switching Characteristics (VIN = 1.1 V)
VIN = 1.1 V, TA = 25°C (unless otherwise noted)
PARAMETER
tON
Turn-ON time
TEST CONDITIONS
RL = 500 Ω
MIN
tr
tf
Turn-OFF time
VOUT rise time
VOUT fall time
RL = 500 Ω
RL = 500 Ω
RL = 500 Ω
MAX
MIN
TYP
MAX
MIN
TYP
108
108
531
CL = 1 μF
131
131
596
CL = 3.3 μF
153
153
659
11
39
11
317
69
67
CL = 3.3 μF
1105
238
225
CL = 0.1 μF
70
70
365
CL = 1 μF
78
78
367
CL = 3.3 μF
92
92
395
CL = 0.1 μF
107
18
21
CL = 1 μF
966
175
189
3532
632
565
CL = 1 μF
CL = 3.3 μF
(1)
TYP
TPS22902B (1)
CL = 0.1 μF
CL = 0.1 μF
tOFF
TPS22902 (1)
TPS22901
MAX
UNIT
μs
μs
μs
μs
Quick Output Discharge
8.7 Switching Characteristics (VIN = 1.2 V)
VIN = 1.2 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
CL = 0.1 μF
tON
tOFF
tr
tf
Turn-ON time
Turn-OFF time
VOUT rise time
VOUT fall time
RL = 500 Ω
RL = 500 Ω
RL = 500 Ω
RL = 500 Ω
6
MIN
TYP
MAX
MIN
TYP
TPS22902B (1)
MAX
MIN
TYP
96
96
471
CL = 1 μF
116
116
527
CL = 3.3 μF
135
135
587
CL = 0.1 μF
39
10
10
317
62
61
CL = 3.3 μF
1110
210
199
CL = 0.1 μF
62
62
324
CL = 1 μF
69
69
325
CL = 3.3 μF
81
81
350
CL = 0.1 μF
109
17
20
CL = 1 μF
995
163
175
3650
587
523
CL = 1 μF
CL = 3.3 μF
(1)
TPS22902 (1)
TPS22901
MAX
UNIT
μs
μs
μs
μs
Quick Output Discharge
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SLVS803D – NOVEMBER 2008 – REVISED JANUARY 2015
8.8 Switching Characteristics (VIN = 1.8 V)
VIN = 1.8 V, TA = 25°C (unless otherwise noted)
PARAMETER
tON
Turn-ON time
TEST CONDITIONS
RL = 500 Ω
MIN
tr
Turn-OFF time
VOUT rise time
RL = 500 Ω
RL = 500 Ω
(1)
VOUT fall time
RL = 500 Ω
MAX
MIN
TYP
MAX
MIN
TYP
61
61
302
CL = 1 μF
72
72
335
CL = 3.3 μF
83
83
367
38
8
8
317
49
49
CL = 3.3 μF
1135
169
167
CL = 0.1 μF
40
40
220
CL = 1 μF
45
45
220
CL = 3.3 μF
53
53
235
CL = 1 μF
CL = 0.1 μF
tf
TYP
TPS22902B (1)
CL = 0.1 μF
CL = 0.1 μF
tOFF
TPS22902 (1)
TPS22901
111
15
15
CL = 1 μF
1020
140
159
CL = 3.3 μF
3700
517
481
MAX
UNIT
μs
μs
μs
μs
Quick Output Discharge
8.9 Switching Characteristics (VIN = 2.5 V)
VIN = 2.5 V, TA = 25°C (unless otherwise noted)
PARAMETER
tON
tOFF
tr
Turn-ON time
Turn-OFF time
VOUT rise time
TEST CONDITIONS
RL = 500 Ω
RL = 500 Ω
RL = 500 Ω
(1)
VOUT fall time
RL = 500 Ω
MIN
TYP
MAX
MIN
TYP
TPS22902B (1)
MAX
MIN
TYP
CL = 0.1 μF
45
45
223
CL = 1 μF
53
53
246
CL = 3.3 μF
61
61
268
CL = 0.1 μF
38
7
7
314
46
47
CL = 3.3 μF
1140
161
158
CL = 0.1 μF
32
32
175
CL = 1 μF
35
35
175
CL = 3.3 μF
41
41
187
CL = 1 μF
CL = 0.1 μF
tf
TPS22902 (1)
TPS22901
113
14
18
CL = 1 μF
1040
139
185
CL = 3.3 μF
3795
516
471
MAX
UNIT
μs
μs
μs
μs
Quick Output Discharge
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8.10 Switching Characteristics (VIN = 3.0 V)
VIN = 3.0 V, TA = 25°C (unless otherwise noted)
PARAMETER
tON
Turn-ON time
TEST CONDITIONS
RL = 500 Ω
MIN
tr
Turn-OFF time
VOUT rise time
RL = 500 Ω
RL = 500 Ω
(1)
VOUT fall time
RL = 500 Ω
MAX
MIN
TYP
MAX
MIN
TYP
38
38
191
CL = 1 μF
45
45
211
CL = 3.3 μF
53
53
231
38
7
7
320
46
46
CL = 3.3 μF
1145
53
156
CL = 0.1 μF
28
28
159
CL = 1 μF
31
31
160
CL = 3.3 μF
37
37
170
CL = 1 μF
CL = 0.1 μF
tf
TYP
TPS22902B (1)
CL = 0.1 μF
CL = 0.1 μF
tOFF
TPS22902 (1)
TPS22901
114
14
17
CL = 1 μF
1045
139
160
CL = 3.3 μF
3815
509
473
MAX
UNIT
μs
μs
μs
μs
Quick Output Discharge
8.11 Switching Characteristics (VIN = 3.6 V)
VIN = 3.6 V, TA = 25°C (unless otherwise noted)
PARAMETER
tON
tOFF
tr
Turn-ON time
Turn-OFF time
VOUT rise time
TEST CONDITIONS
RL = 500 Ω
RL = 500 Ω
RL = 500 Ω
(1)
8
VOUT fall time
RL = 500 Ω
MIN
TYP
MAX
MIN
TYP
TPS22902B (1)
MAX
MIN
TYP
CL = 0.1 μF
33
33
166
CL = 1 μF
39
39
183
CL = 3.3 μF
46
46
201
CL = 0.1 μF
38
7
7
322
46
45
CL = 3.3 μF
1145
156
155
CL = 0.1 μF
25
25
146
CL = 1 μF
28
28
146
CL = 3.3 μF
34
34
156
CL = 1 μF
CL = 0.1 μF
tf
TPS22902 (1)
TPS22901
116
14
17
CL = 1 μF
1060
139
161
CL = 3.3 μF
3840
512
475
MAX
UNIT
μs
μs
μs
μs
Quick Output Discharge
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SLVS803D – NOVEMBER 2008 – REVISED JANUARY 2015
8.12 Typical DC Characteristics
75
1.0
0.9
0.8
ON-State Resistance, rON (mΩ)
70
ON-State Resistance, rON (Ω)
0.7
0.6
0.5
0.4
0.3
0.2
65
60
55
0.1
0.0
50
–40
0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3
25
Temperature(°C)
Input Voltage, VIN (V)
Figure 1. rON vs VIN
Figure 2. rON vs Temperature (VIN = 3.3 V)
200
90
180
80
160
Quiescent Current, IIN (nA)
100
Voltage Drop (mV)
70
Vdrop = 1.0 V
60
Vdrop = 1.2 V
50
Vdrop = 1.8 V
Vdrop = 2.5 V
40
Vdrop = 3.3 V
30
140
120
100
80
60
20
40
10
20
0
0.00
0.05
0.10
0.15
85
0.20
0.25
0.30
Load Current (A)
0.35
0.40
0.45
0
0.5
0.50
Figure 3. Voltage Drop vs. Load Current
1.0
1.5
2.0
2.5
3.0
Input Voltage, VIN(V)
3.5
4.0
Figure 4. Quiescent Current vs VIN (VON = VIN, IOUT = 0)
120
250
200
IIN(OFF) Current (nA)
Quiescent Current, IIN (nA)
100
150
100
80
60
40
50
20
0
–40
25
Temperature(°C)
85
Figure 5. Quiescent Current vs Temperature (VIN = 3.3 V,
IOUT = 0)
0
0.5
1.0
1.5
2.0
2.5
Input Voltage, VIN(V)
3.0
3.5
4.0
Figure 6. IIN(OFF) vs VIN (VON = 0 V)
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Typical DC Characteristics (continued)
250
120
225
100
IIN (Leakage) Current (nA)
200
IIN(OFF) Current (nA)
175
150
125
100
80
60
40
75
20
50
25
0
0.5
0
–40
25
Temperature(°C)
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Input Voltage, VIN (V)
85
Figure 7. IIN(OFF) vs Temperature (VIN = 3.3 V)
Figure 8. IIN(Leakage) vs VIN (IOUT = 0)
250
4.0
225
3.5
VIN = 3.6 V
VIN = 3.3 V
3.0
175
VIN = 3 V
VIN = 2.5 V
2.5
150
VOUT (V)
IIN (Leakage) Current (nA)
200
125
2.0
VIN = 1.8 V
VIN = 1.5 V
1.5
100
VIN = 1.2 V
1.0
75
VIN = 1.1 V
0.5
50
0.0
25
0
–0.5
–40
25
85
0.3
0.4
Temperature (°C)
Figure 9. IIN (Leakage) vs Temperature (VIN = 3.3 V)
10
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0.5
0.6
Input Voltage, VON (V)
0.7
0.8
Figure 10. ON-Input Threshold
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SLVS803D – NOVEMBER 2008 – REVISED JANUARY 2015
8.12.1 Typical AC Characteristics
8.12.1.1 TPS22901
42
130
VIN = 3.3 V
CL = 0.1 µF
RL = 500 Ω
120
40
110
tOFF
100
80
VIN = 3.3 V
CL = 0.1 µF
RL = 500 Ω
70
60
tON/tOFF (µs)
90
trise/tfall (µs)
38
tfall
36
34
tON
50
32
40
trise
30
30
20
28
–50 –40 –30 –20 –10
10
–50 –40 –30 –20 –10
0
10 20 30 40
Temperature (°C)
50
60
70
80
90 100
0
10 20 30 40
Temperature (°C)
50
60
70
80
90 100
Figure 12. tON/tOFF vs Temperature
Figure 11. trise/tfall vs Temperature
8.12.1.2 TPS22902
40
30
28
35
tON
26
VIN = 3.3 V
CL = 0.1 µF
RL = 500 Ω
22
20
18
tON/tOFF (µs)
24
trise/tfall (µs)
30
trise
25
VIN = 3.3 V
CL = 0.1 µF
RL = 500 Ω
20
15
tfall
16
tOFF
10
14
5
12
0
10
–50 –40 –30 –20 –10
0
10 20 30 40
Temperature (°C)
50
60
70
80
–50 –40 –30 –20 –10
90 100
0
10 20 30 40
Temperature (°C)
50
60
70
80
90 100
Figure 14. tON/tOFF vs Temperature
Figure 13. trise/tfall vs Temperature
8.12.1.3 TPS22902B
170
160
150
140
130
trise
120
trise/tfall (µs)
100
90
tON/tOFF (µs)
VIN = 3.3 V
CL = 0.1 µF
RL = 500 Ω
110
80
70
60
50
40
tfall
30
20
10
0
–50
–35
–20
–5
10
25
40
Temperature (°C)
55
70
85
Figure 15. trise/tfall vs Temperature
100
200
190
180
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
–50
tON
VIN = 3.3 V
CL = 0.1 µF
RL = 500 Ω
tOFF
–35
–20
–5
10
25
40
Temperature (°C)
55
70
85
100
Figure 16. tON/tOFF vs Temperature
Copyright © 2008–2015, Texas Instruments Incorporated
Product Folder Links: TPS22901 TPS22902 TPS22902B
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TPS22901, TPS22902, TPS22902B
SLVS803D – NOVEMBER 2008 – REVISED JANUARY 2015
www.ti.com
Typical AC Characteristics (continued)
6.00
5.00
3.00
VON
2.00
1.00
0.00
–1.00
–2.00
–3.00
CL = 0.1 µF
RL = 500 Ω
VIN = 3.3 V
Control Input Voltage (V)
4.00
–4.00
–5.00
–6.00
–7.00
–8.00
0
50
100
150
200
250
Time (µs)
300
350
400
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
–10
450
400
300
250
200
VON
50
0.0
–50
–100
–150
CL = 0.1 µF
RL = 11 Ω
VIN = 3.3 V
8.00
7.00
IOUT
6.00
5.00
3.00
VON
2.00
1.00
0.005
0.00
–1.00
–2.00
–3.00
CL = 3.3 µF
RL = 500 Ω
VIN = 3.3 V
Control Input Voltage (V)
4.00
–4.00
–5.00
–6.00
–7.00
–8.00
0
50
100
150
200
250
Time (µs)
300
350
400
10
3.50
3.00
IOUT
2.50
VON
1.50
1.00
0.50
0.00
–0.50
–1.00
–1.50
CL = 0.1 µF
RL = 500 Ω
VIN = 1.2 V
–2.50
–3.00
–3.50
–4.00
100
150
200
250
Time (µs)
300
350
Figure 21. tON Response
12
–2.00
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400
450
Control Input Voltage (V)
2.00
50
20
30
40
50
Time (µs)
60
70
80
90
400
350
IOUT
300
250
200
VON
150
100
50
0.0
–50
–100
–150
CL = 3.3 µF
RL = 11 Ω
VIN = 3.3 V
–200
–250
–300
–350
–400
0
50
100
150
200
250
Time (µs)
300
350
400
450
Figure 20. tON Response
4.00
0
–300
–400
0
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
–50
450
Output Current (mA)
Control Input Voltage (V)
–50
–250
–350
Figure 19. tON Response
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
–200
Figure 18. tON Response
Output Current (mA)
Control Input Voltage (V)
–50
150
100
Figure 17. tON Response
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
350
IOUT
Output Current (mA)
7.00
Output Current (mA)
–50
8.00
IOUT
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
–50
199
180
160
140
120
100
80
60
40
20
0.0
–20
–40
–60
–80
–100
–120
–140
–160
–180
–200
IOUT
VON
CL = 0.1 µF
RL = 11 Ω
VIN = 1.2 V
0
50
100
150
200
250
Time (µs)
300
350
400
Output Current (mA)
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
Output Current (mA)
Control Input Voltage (V)
8.12.1.4 TPS22901 and TPS22902
450
Figure 22. tON Response
Copyright © 2008–2015, Texas Instruments Incorporated
Product Folder Links: TPS22901 TPS22902 TPS22902B
TPS22901, TPS22902, TPS22902B
www.ti.com
SLVS803D – NOVEMBER 2008 – REVISED JANUARY 2015
–50
4.00
3.50
3.00
IOUT
2.50
1.50
VON
1.00
0.50
0.00
–0.50
–1.00
–1.50
CL = 3.3 µF
RL = 500 Ω
VIN = 1.2 V
Control Input Voltage (V)
2.00
–2.00
–2.50
–3.00
–3.50
–4.00
0
50
100
150
200
250
Time (µs)
300
350
400
450
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
–50
199
180
160
140
120
100
80
60
40
20
0.0
–20
–40
–60
–80
–100
–120
–140
–160
–180
–200
IOUT
VON
CL = 3.3 µF
RL = 11 Ω
VIN = 1.2 V
0
50
Figure 23. tON Response
100
150
200
250
Time (µs)
300
350
400
Output Current (mA)
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
Output Current (mA)
Control Input Voltage (V)
Typical AC Characteristics (continued)
450
Figure 24. tON Response
8.12.1.5 TPS22901
2.5
9.00
2.2
2.0
1.8
1.6
1.4
1.2
1.0
800
600
400
200
0.0
–200
–400
–600
–800
–1.0
–1.2
–1.5
8.00
7.00
5.00
4.00
3.00
2.00
1.00
VON
0.00
–1.00
Control Input Voltage (V)
6.00
IOUT
–2.00
–3.00
–4.00
–5.00
–6.00
0
50
100
150
200
250
Time (µs)
300
350
400
–50
450
499
CL = 0.1 µF
RL = 11 Ω
VIN = 3.3 V
CL = 3.3 µF
RL = 500 Ω
VIN = 3.3 V
2.5
9.00
2.2
2.0
1.8
1.6
1.4
1.2
1.0
800
600
400
200
0.0
–200
–400
–600
–800
–1.0
–1.2
–1.5
8.00
7.00
5.00
IOUT
4.00
3.00
2.00
1.00
VON
0.00
–1.00
–2.00
–3.00
–4.00
–5.00
–6.00
10
20
30
40
50
Time (µs)
60
70
Figure 27. tOFF Response
80
90
Control Input Voltage (V)
6.00
0
350
300
250
200
150
100
VON
50
0.00
–50
–150
–200
–250
–300
0
50
100
150
200
250
Time (µs)
300
350
400
450
Figure 26. tOFF Response
10.00
Output Current (mA)
Control Input Voltage (V)
–10
400
IOUT
Figure 25. tOFF Response
2.5
2.2
2.0
1.8
1.6
1.4
1.2
1.0
800
600
400
200
0.0
–200
–400
–600
–800
–1.0
–1.2
–1.5
450
–50
499
CL = 3.3 µF
RL = 11 Ω
VIN = 3.3 V
450
400
350
300
250
200
150
IOUT
100
VON
50
0.00
Output Current (mA)
–50
10.00
Output Current (mA)
CL = 0.1 µF
RL = 500 Ω
VIN = 3.3 V
2.2
2.0
1.8
1.6
1.4
1.2
1.0
800
600
400
200
0.0
–200
–400
–600
–800
–1.0
–1.2
–1.5
Output Current (mA)
Control Input Voltage (V)
2.5
–50
–150
–200
–250
–300
0
50
100
150
200
250
Time (µs)
300
350
400
450
Figure 28. tOFF Response
Copyright © 2008–2015, Texas Instruments Incorporated
Product Folder Links: TPS22901 TPS22902 TPS22902B
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TPS22901, TPS22902, TPS22902B
SLVS803D – NOVEMBER 2008 – REVISED JANUARY 2015
www.ti.com
CL = 0.1 µF
RL = 500 Ω
VIN = 1.2 V
5.00
2.5
4.50
2.2
2.0
1.8
1.6
1.4
1.2
1.0
800
600
400
200
0.0
–200
–400
–600
–800
–1.0
–1.2
–1.5
4.00
3.50
2.50
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
–1.0
–1.2
–1.5
2.00
IOUT
1.50
500
VON
0.00
–500
Control Input Voltage (V)
3.00
–1.00
–1.50
–2.00
–2.50
–3.00
–50
0
50
100
150
200
250
Time (µs)
300
350
400
CL = 0.1 µF
RL = 11 Ω
VIN = 1.2 V
IOUT
VON
–5.0
450
0
5.0
Figure 29. tOFF Response
5.00
2.5
4.50
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
–1.0
–1.2
–1.5
4.00
3.50
2.50
2.00
IOUT
1.50
1.00
0.50
VON
0.00
–0.50
Control Input Voltage (V)
3.00
Output Current (mA)
Control Input Voltage (V)
CL = 3.3 µF
RL = 500 Ω
VIN = 1.2 V
–1.00
–1.50
–2.00
–2.50
–3.00
–1.0
0
1.0
2.0
3.0
4.0
5.0
Time (ms)
6.0
7.0
15.0
20.0 25.0
Time (µs)
30.0
35.0
40.0
Figure 30. tOFF Response
2.5
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
–1.0
–1.2
–1.5
10.0
249
220
200
180
160
140
120
100
80
60
40
20
0.00
–20
–40
–60
–80
–100
–120
–150
45.0
8.0
IOUT
VON
–50
9.0
249
220
200
180
160
140
120
100
80
60
40
20
0.00
–20
–40
–60
–80
–100
–120
–150
CL = 3.3 µF
RL = 11 Ω
VIN = 1.2 V
0
50
Figure 31. tOFF Response
100
150
200
250
Time (µs)
300
350
400
Output Current (mA)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
Output Current (mA)
Control Input Voltage (V)
2.5
Output Current (mA)
Typical AC Characteristics (continued)
450
Figure 32. tOFF Response
–50
6.00
5.00
4.00
VON
3.00
2.00
1.00
0.00
–1.00
–2.00
–3.00
–4.00
–5.00
–6.00
–7.00
–8.00
0
50
100
150
200
250
Time (µs)
300
350
Figure 33. tOFF Response
14
7.00
CL = 0.1 µF
RL = 500 Ω
VIN = 3.3 V
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400
450
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
–10
400
350
CL = 0.1 µF
RL = 11 Ω
VIN = 3.3 V
IOUT
300
250
200
VON
150
100
50
0.0
–50
–100
Output Current (mA)
8.00
IOUT
Control Input Voltage (V)
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
Output Current (mA)
Control Input Voltage (V)
8.12.1.6 TPS22902
–150
–200
–250
–300
–350
–400
0
10
20
30
40
50
Time (µs)
60
70
80
90
Figure 34. tOFF Response
Copyright © 2008–2015, Texas Instruments Incorporated
Product Folder Links: TPS22901 TPS22902 TPS22902B
TPS22901, TPS22902, TPS22902B
www.ti.com
SLVS803D – NOVEMBER 2008 – REVISED JANUARY 2015
7.00
CL = 3.3 µF
RL = 500 Ω
VIN = 3.3 V
6.00
5.00
4.00
VON
3.00
2.00
1.00
0.00
–1.00
–2.00
–3.00
–4.00
–5.00
–6.00
–7.00
–8.00
200
400
600
800 1000
Time (µs)
1200
1400
1600
150
100
50
0.0
–50
–100
–150
–200
–250
–300
–350
–400
0
50
3.50
3.00
2.50
1.50
1.00
500
0.00
–500
–1.00
–1.50
Control Input Voltage (V)
2.00
VON
Output Current (mA)
Control Input Voltage (V)
4.00
–2.00
–2.50
–3.00
–3.50
–4.00
–50
0
50
100
150
200
250
Time (µs)
300
350
400
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
3.50
CL = 3.3 µF
RL = 500 Ω
VIN = 1.2 V
3.00
2.50
1.50
1.00
0.50
0.00
–0.50
–1.00
–1.50
–2.00
–2.50
–3.00
–3.50
–4.00
200
400
600
800 1000
Time (µs)
1200
1400
Figure 39. tOFF Response
1600
1800
Control Input Voltage (V)
2.00
VON
0
300
350
400
450
VON
0
10
20
30
40
50
Time (µs)
60
70
80
200
180
160
140
120
100
80
60
40
20
0.0
–20
–40
–60
–80
–100
–120
–140
–160
–180
–200
200
180
160
140
120
100
80
60
40
20
0.0
–20
–40
–60
–80
–100
–120
–140
–160
–180
–200
90
Figure 38. tOFF Response
Output Current (mA)
Control Input Voltage (V)
–200
200
250
Time (µs)
IOUT
–10
450
4.00
IOUT
150
CL = 0.1 µF
RL = 11 Ω
VIN = 1.2 V
Figure 37. tOFF Response
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
100
Figure 36. tOFF Response
CL = 0.1 µF
RL = 500 Ω
VIN = 1.2 V
IOUT
250
200
Figure 35. tOFF Response
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
300
VON
–50
1800
350
Output Current (mA)
0
400
CL = 3.3 µF
RL = 11 Ω
VIN = 3.3 V
IOUT
Output Current (mA)
–200
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
Output Current (mA)
8.00
IOUT
Control Input Voltage (V)
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
Output Current (mA)
Control Input Voltage (V)
Typical AC Characteristics (continued)
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
–0.20
–0.40
–0.60
–0.80
–1.00
–1.20
–1.40
–1.60
–1.80
–2.00
–50
CL = 3.3 µF
RL = 11 Ω
VIN = 1.2 V
IOUT
VON
0
50
100
150
200
250
Time (µs)
300
350
400
450
Figure 40. tOFF Response
Copyright © 2008–2015, Texas Instruments Incorporated
Product Folder Links: TPS22901 TPS22902 TPS22902B
Submit Documentation Feedback
15
TPS22901, TPS22902, TPS22902B
SLVS803D – NOVEMBER 2008 – REVISED JANUARY 2015
www.ti.com
Typical AC Characteristics (continued)
8.12.1.7 TPS22902B
0.6
IOUT
0.05
0.5
0.4
0.3
0.2
Output Current (A)
Control Input Voltage (V)
0.7
0.1
Control Input Voltage (V)
0.8
0.00
0.0
–0.1
–0.2
–0.3
–200
0.0
200
400
600
800
1000
1200
VON
–0.05
–0.5
0.00
1500
–1000
–500
0.0
500
Time (µs)
CL = 3 µF
RL = 500 Ω
VIN = 3.3 V
1.1
1.0
VON
0.9
0.01
IOUT
0.6
0.05
0.5
0.4
0.3
0.2
0.1
Control Input Voltage (V)
0.7
Output Current (A)
Control Input Voltage (V)
0.8
0.00
0.0
–0.1
–0.2
–0.3
2500
3000
0.35
0.0
500
1000
Time (µs)
1500
2000
2500
CL = 3 µF
RL = 11 Ω
VIN = 3.3 V
IOUT
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
–0.2
3000
–1000
–0.05
–500
0.0
500
1000
Time (µs)
1500
2000
2500
CL = 0.1 µF
RL = 500 Ω
VIN = 1.2 V
1.0
VON
0.9
0.01
0.6
0.05
0.4
0.3
IOUT
0.2
0.1
0.00
0.0
–0.1
–0.2
–0.3
–0.00
–200
0.0
200
400
600
Time (µs)
800
1000
1200
Figure 45. tON Response
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1500
Output Current (A)
0.7
Control Input Voltage (V)
0.8
0.5
3000
Figure 44. tON Response
0.35
3.5
1.1
0.32
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
–0.02
VON
Figure 43. tON Response
Control Input Voltage (V)
2000
–0.5
–0.00
–500
1.2
16
1500
3.5
1.2
–0.4
–5000
1000
Time (µs)
Figure 42. tON Response
Figure 41. tON Response
–0.4
–1000
0.32
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
–0.02
Output Current (A)
VON
0.9
0.01
CL = 0.1 µF
RL = 11 Ω
VIN = 1.2 V
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
–0.2
–0.5
–1000
IOUT
VON
0.32
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
–0.02
Output Current (A)
1.0
CL = 0.1 µF
RL = 11 Ω
VIN = 3.3 V
IOUT
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
–0.2
Output Current (A)
CL = 0.1 µF
RL = 500 Ω
VIN = 3.3 V
1.1
–0.4
–500
0.35
3.5
1.2
–0.05
–500
0.0
500
1000
Time (µs)
1500
2000
2500
3000
Figure 46. tON Response
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Typical AC Characteristics (continued)
0.9
0.01
0.6
0.05
0.5
0.4
0.3
IOUT
0.2
0.1
Control Input Voltage (V)
0.7
Output Current (A)
Control Input Voltage (V)
0.8
0.00
0.0
–0.1
–0.2
–0.3
–500
0.0
500
1000
Time (µs)
1500
2000
2500
IOUT
VON
–0.05
–0.5
–0.00
3000
–1000
–500
0.0
Figure 47. tON Response
1.0
VON
0.01
0.6
0.05
0.5
0.4
0.3
IOUT
0.2
0.1
Control Input Voltage (V)
0.7
Output Current (A)
Control Input Voltage (V)
0.8
0.00
0.0
–0.1
–0.2
–0.3
0.0
200
400
600
Time (µs)
800
1000
1200
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
–0.2
2500
3000
0.35
CL = 0.1 µF
RL = 11 Ω
VIN = 3.3 V
0.32
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
–0.02
VON
1500
–250
–0.05
–100
0.0
100
200
300
Time (µs)
400
500
600
750
Figure 50. tOFF Response
0.35
3.5
CL = 3 µF
RL = 500 Ω
VIN = 3.3 V
1.1
1.0
VON
0.01
0.6
0.05
0.5
0.4
0.3
IOUT
0.2
0.1
0.00
0.0
–0.1
–0.2
–0.3
–0.00
–200
0.0
200
400
600
Time (µs)
800
1000
1200
Figure 51. tOFF Response
1500
Output Current (A)
0.7
Control Input Voltage (V)
0.8
Control Input Voltage (V)
2000
IOUT
Figure 49. tOFF Response
–0.4
–5000
1500
–0.5
–0.00
–200
1.2
0.9
1000
Time (µs)
Figure 48. tON Response
CL = 0.1 µF
RL = 500 Ω
VIN = 3.3 V
1.1
–0.4
–5000
500
3.5
1.2
0.9
0.32
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
–0.02
Output Current (A)
VON
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
–0.2
CL = 3 µF
RL = 11 Ω
VIN = 3.3 V
IOUT
0.32
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
–0.02
VON
–0.05
–0.5
–250
Output Current (A)
1.0
CL = 3 µF
RL = 11 Ω
VIN = 1.2 V
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
–0.2
Output Current (A)
CL = 3 µF
RL = 500 Ω
VIN = 1.2 V
1.1
–0.4
–1000
0.35
3.5
1.2
–100
0.0
100
200
300
Time (µs)
400
500
600
750
Figure 52. tOFF Response
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Typical AC Characteristics (continued)
VON
0.01
0.6
0.05
0.5
0.4
0.3
IOUT
0.2
0.1
Control Input Voltage (V)
0.7
Output Current (A)
Control Input Voltage (V)
0.8
0.00
0.0
–0.1
–0.2
–0.3
–0.4
–50
0.0
20
40
60
Time (µs)
80
100
120
150
–250
IOUT
VON
–0.05
–100
0.0
Figure 53. tOFF Response
1.0
VON
0.01
0.6
0.05
0.5
0.4
0.3
0.2
IOUT
0.1
0.00
0.0
–0.1
–0.2
–0.3
–0.00
–500
0.0
500
1000
Time (µs)
1500
2000
2500
Figure 55. tOFF Response
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3000
Control Input Voltage (V)
0.7
Output Current (A)
Control Input Voltage (V)
0.8
18
200
300
Time (µs)
400
500
600
750
Figure 54. tOFF Response
CL = 3 µF
RL = 500 Ω
VIN = 1.2 V
1.1
–0.4
–1000
100
0.35
3.5
1.2
0.9
0.32
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
–0.02
–0.5
–0.00
–20
CL = 0.1 µF
RL = 11 Ω
VIN = 1.2 V
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
–0.2
CL = 3 µF
RL = 11 Ω
VIN = 1.2 V
0.32
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
–0.02
IOUT
VON
–0.05
–0.5
–250
Output Current (A)
1.0
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
–0.2
Output Current (A)
CL = 0.1 µF
RL = 500 Ω
VIN = 1.2 V
1.1
0.9
0.35
3.5
1.2
–100
0.0
100
200
300
Time (µs)
400
500
600
750
Figure 56. tOFF Response
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SLVS803D – NOVEMBER 2008 – REVISED JANUARY 2015
9 Parameter Measurement Information
VIN
ON
VOUT
(A)
RL
CL
+
–
TPS22901/02
OFF
CIN =1 µF
GND
GND
GND
TEST CIRCUIT
1.8 V
VON
VON
VON/2
VON/2
tr
0V
tON
tOFF
VOUT/2
VOUT/2
90%
VOUT
VOH
VOUT
tf
0V
10%
90%
10%
VOL
tON/tOFF WAVEFORMS
A.
trise and tfall of the control signal is 100 ns.
Figure 57. Test Circuit and tON/tOFF Waveforms
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10 Detailed Description
10.1 Overview
The TPS2290x and TPS22902B is a single channel, 500-mA load switch in a small, space-saving DSBGA-4
package. These devices implement a P-channel MOSFET to provide a low ON-resistance for a low voltage drop
across the device. A controlled rise time is used in applications to limit the inrush current.
10.2 Functional Block Diagram
VIN
A2
Turn-On Slew Rate
Controlled Driver
ON
Control
Logic
B2
ESD Protection
A1
VOUT
Output Discharge
(TPS22902, TPS22902B Only)
B1
GND
10.3 Feature Description
10.3.1 ON/OFF Control
The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state. ON is
active-high and has a low threshold, making it capable of interfacing with low-voltage signals. The ON pin is
compatible with standard GPIO logic threshold, and it can be used with any microcontroller with 1.2 V, 1.8 V, 2.5
V or 3.3 V GPIOs.
10.3.2 Quick Output Discharge
The TPS2290x and TPS22902B includes the Quick Output Discharge (QOD) feature. When the switch is
disabled, a discharge resistance with a typical value of 88 Ω is connected between the output and ground. This
resistance pulls down the output and prevents it from floating when the device is disabled.
10.4 Device Functional Modes
Table 1 lists the VOURT pin connections for a particular device as determined by the ON pin.
Table 1. VOUT Function Table
20
ON (Control Input)
TPS22901
TPS22902/2B
L
Open
GND
H
VIN
VIN
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11 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
11.1 Application Information
11.1.1 Input Capacitor (Optional)
To limit the voltage drop on the input supply caused by transient inrush currents when the switch turns on into a
discharged load capacitor, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic capacitor, CIN,
placed close to the pins is usually sufficient. Higher values of CIN can be use to further reduce the voltage drop
during high current application. When switching heavy loads, TI recommends using an input capacitor about 10
times higher than the output capacitor in order to avoid excessive voltage drop.
11.1.2 Output Capacitor (Optional)
Because of the integral body diode in the PMOS switch, a CIN greater than CL is highly recommended. A CL
greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current
flow through the body diode from VOUT to VIN.
11.2 Typical Application
VBATT
VIN
SMPS
ON
(see Note A)
CIN = 1 µF
VOUT
LOAD
TPS22901/02/02B
CL
CL
RL
OFF
GND
GND
GND
A.
Switched-mode power supply
Figure 58. Typical Application Schematic
11.2.1 Design Requirements
Table 2. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
VIN
1.8 V
CL
4.7 µF
Load current
500 mA
Ambient Temperature
25 °C
Maximum inrush current
200 mA
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11.2.2 Detailed Design Procedure
11.2.2.1 Managing Inrush Current
When the switch is enabled, the output capacitors must be charged up from 0 V to the set value (1.8 V in this
example). This charge arrives in the form of inrush current. Inrush current can be calculated using the following
equation:
dV
IINRUSH = CL ´ OUT
dt
where:
•
•
•
CL = Output capacitance
dVOUT = Output voltage
dt = Rise time
(1)
The TPS2290x and TPS22902B offers a controlled rise time for minimizing inrush current. This device can be
selected based upon the minimum acceptable rise time which can be calculated using the design requirements
and the inrush current equation. An output capacitance of 4.7 µF will be used since the amount of inrush current
increases with output capacitance:
200 mA = 4.7 µF × 1.8V / dt
dt = 42.3 µs
(2)
To ensure an inrush current of less than 200 mA, a device with a rise time greater than 42.3 µs must be used.
The TPS22902B has a typical rise time of 220 µs at 1.8 V which meets the above design requirements. The
TPS22901/2 has a faster rise time of 40 µs at 1.8 V, and this would result in an inrush current larger than
desired.
11.2.2.2 VIN to VOUT Voltage Drop
The voltage drop from VIN to VOUT is determined by the ON-resistance of the device and the load current. RON
can be found in Electrical Characteristics and is dependent on temperature. When the value of RON is found, the
following equation can be used to calculate the voltage drop across the device:
ΔV = ILOAD × RON
where:
•
•
•
ΔV = Voltage drop across the device
ILOAD = Load current
RON = ON-resistance of the device
(3)
At VIN = 1.8 V, the TPS22901/2/2B has an RON value of 109 mΩ. Using this value and the defined load current,
the above equation can be evaluated:
ΔV = 500 mA × 109 mΩ
ΔV = 54.5 mV
(4)
Therefore, the voltage drop across the device will be 54.5 mV.
22
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11.2.3 Application Curve
Figure 59 shows the expected voltage drop across the device for different load currents and input voltages.
100
90
80
Voltage Drop (mV)
70
Vdrop = 1.0 V
60
Vdrop = 1.2 V
50
Vdrop = 1.8 V
Vdrop = 2.5 V
40
Vdrop = 3.3 V
30
20
10
0
0.00
0.05
0.10
0.15
0.20
0.25
0.30
Load Current (A)
0.35
0.40
0.45
0.50
Figure 59. Voltage Drop vs Load Current
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12 Power Supply Recommendations
The device is designed to operate with a VIN range of 1 V to 3.6 V. This supply must be well regulated and
placed as close to the device terminals as possible. It must also be able to withstand all transient and load
currents, using a recommended input capacitance of 1 µF if necessary. If the supply is located more than a few
inches from the device terminals, additional bulk capacitance may be required in addition to the ceramic bypass
capacitors. If additional bulk capacitance is required, an electrolytic, tantalum, or ceramic capacitor of 10 µF may
be sufficient.
13 Layout
13.1 Layout Guidelines
For best performance, VIN, VOUT, and GND traces should be as short and wide as possible to help minimize the
parasitic electrical effects. To be most effective, the input and output capacitors should be placed close to the
device to minimize the effects that parasitic trace inductances may have on normal operation.
For higher reliability, the maximum IC junction temperature, TJ(max), should be restricted to 125˚C under normal
operating conditions. Junction temperature is directly proportional to power dissipation in the device and the two
are related by
TJ = TA + θJA × PD
where:
•
•
•
•
TJ = Junction temperature of the device
TA = Ambient temperature
PD = Power dissipation inside the device
θJA = Junction to ambient thermal resistance. See Thermal Information section of the datasheet. This
parameter is highly dependent on board layout.
(5)
13.2 Layout Example
Figure 60. Layout Example Schematic
24
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14 Device and Documentation Support
14.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 3. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS22901
Click here
Click here
Click here
Click here
Click here
TPS22902
Click here
Click here
Click here
Click here
Click here
TPS22902B
Click here
Click here
Click here
Click here
Click here
14.2 Trademarks
All trademarks are the property of their respective owners.
14.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
14.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
15 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
25-Oct-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPS22901YFPR
ACTIVE
DSBGA
YFP
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
3P
(3 ~ 5)
TPS22902BYFPR
ACTIVE
DSBGA
YFP
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
3S
3
TPS22902YFPR
ACTIVE
DSBGA
YFP
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
3R
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Oct-2016
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
TPS22901YFPR
DSBGA
YFP
4
3000
178.0
9.2
TPS22902BYFPR
DSBGA
YFP
4
3000
180.0
TPS22902YFPR
DSBGA
YFP
4
3000
178.0
TPS22902YFPR
DSBGA
YFP
4
3000
180.0
0.89
0.89
0.58
4.0
8.0
Q1
8.4
0.89
0.89
0.58
4.0
8.0
Q1
9.2
0.89
0.89
0.58
4.0
8.0
Q1
8.4
0.89
0.89
0.58
4.0
8.0
Q1
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS22901YFPR
DSBGA
YFP
4
3000
220.0
220.0
35.0
TPS22902BYFPR
DSBGA
YFP
4
3000
182.0
182.0
20.0
TPS22902YFPR
DSBGA
YFP
4
3000
270.0
225.0
227.0
TPS22902YFPR
DSBGA
YFP
4
3000
182.0
182.0
20.0
Pack Materials-Page 2
PACKAGE OUTLINE
YFP0004
DSBGA - 0.5 mm max height
SCALE 10.000
DIE SIZE BALL GRID ARRAY
B
E
A
BALL A1
CORNER
D
C
0.5 MAX
SEATING PLANE
0.19
0.13
BALL TYP
0.05 C
0.4
TYP
B
D: Max = 0.79 mm, Min = 0.73 mm
SYMM
0.4
TYP
E: Max = 0.79 mm, Min = 0.73 mm
A
4X
0.015
0.25
0.21
C A B
1
2
SYMM
4223507/A 01/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YFP0004
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
4X ( 0.23)
2
1
A
SYMM
(0.4) TYP
B
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:50X
( 0.23)
METAL
SOLDER MASK
OPENING
0.05 MAX
EXPOSED
METAL
0.05 MIN
METAL UNDER
SOLDER MASK
EXPOSED
METAL
( 0.23)
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4223507/A 01/2017
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YFP0004
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
(R0.05) TYP
4X ( 0.25)
1
2
A
SYMM
(0.4) TYP
B
METAL
TYP
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:50X
4223507/A 01/2017
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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