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TPS22910A, TPS22912C, TPS22913B, TPS22913C
SLVSB49F – NOVEMBER 2011 – REVISED JANUARY 2015
TPS2291xx Ultra-small, Low On Resistance Load Switch With Controlled Turn-on
1 Features
3 Description
•
•
The TPS22910A, TPS22912C, and TPS22913B/C
are small, low rON load switches with controlled turn
on. The device contains a P-channel MOSFET that
can operate over an input voltage range of 1.4 V to
5.5 V. The switch is controlled by an on/off input
(ON), which is capable of interfacing directly with lowvoltage GPIO control signals.
1
•
•
•
•
•
•
•
•
Integrated Single Load Switch
Four Pin Wafer-Chip-Scale Package (Nom)
– 0.9 mm × 0.9 mm, 0.5-mm Pitch, 0.5-mm
Height (YZV)
Input Voltage Range: 1.4 V to 5.5 V
Low ON-Resistance
– rON = 60 mΩ at VIN = 5 V
– rON = 61 mΩ at VIN = 3.3 V
– rON = 74 mΩ at VIN = 1.8 V
– rON = 84 mΩ at VIN = 1.5 V
2-A Maximum Continuous Switch Current
Low Threshold Control Input
Controlled Slew-rate
Under-Voltage Lock Out
Full-Time Reverse Current Protection
Quick Output Discharge Transistor (TPS22913B/C
Devices)
The TPS22913B/C contains a 150-Ω on-chip load
resistor for quick output discharge when the switch is
turned off.
This family of devices have various slew rate options
to avoid inrush current (see Device Comparison
Table for details), are available in an ultra-small,
space-saving 4-pin WCSP packages, and are
characterized for operation over the free-air
temperature range of –40°C to 85°C.
2 Applications
•
•
•
•
•
•
•
•
•
The TPS22910A, TPS22912C, and TPS22913B/C
devices provide reverse current protection in ON and
OFF states. An internal reverse voltage comparator
disables the power-switch when the output voltage
(VOUT) is driven higher than the input voltage (VIN), by
VRCP, to quickly (10 µs typ) stop the flow of current
towards the input side of the switch. Reverse current
protection is always active, even when the powerswitch is disabled. Additionally, under-voltage lockout
(UVLO) protection turns the switch off if the input
voltage is too low.
Notebook Computer and Ultrabook™
Tablets and Set-Top-Boxes
Portable Industrial / Medical Equipment
Portable Media Players
Point Of Sale Pins
GPS Navigation Devices
Digital Cameras
Portable Instrumentation
Smartphones / Wireless Handsets
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS22910A
TPS22912C
DSBGA (4)
TPS22913B
0.90 mm × 0.90 mm
TPS22913C
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Simplified Schematic
VIN
Power
Supply
VOUT
CIN
On-State Resistance vs Input Voltage
RL
CL
HI
LO
ON
TPS22910A,
TPS22912C,
TPS22913B/C
120
−40C
25C
85C
GND
100
GND
Ron (mΩ)
80
60
40
20
0
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
4
4.5
5
5.5
6
G000
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS22910A, TPS22912C, TPS22913B, TPS22913C
SLVSB49F – NOVEMBER 2011 – REVISED JANUARY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
9
1
1
1
1
2
3
3
4
Absolute Maximum Ratings ...................................... 4
ESD Ratings.............................................................. 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 4
Electrical Characteristics........................................... 5
Switching Characteristics, Typical ............................ 6
Typical DC Characteristics........................................ 7
Typical AC Characteristics, TPS22910A .................. 9
Typical AC Characteristics, TPS22912C ................ 11
Typical AC Characteristics, TPS22913B .............. 13
Typical AC Characteristics, TPS22913C .............. 15
Parameter Measurement Information ................ 17
10 Detailed Description ........................................... 18
10.1
10.2
10.3
10.4
Overview ...............................................................
Functional Block Diagram .....................................
Feature Description...............................................
Device Functional Modes......................................
18
18
18
19
11 Application and Implementation........................ 20
11.1 Application Information.......................................... 20
11.2 Typical Application ............................................... 20
12 Power Supply Recommendations ..................... 30
13 Layout................................................................... 30
13.1 Layout Guidelines ................................................. 30
13.2 Layout Example .................................................... 30
13.3 Thermal Considerations ........................................ 30
14 Device and Documentation Support ................. 31
14.1
14.2
14.3
14.4
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
31
31
31
31
15 Mechanical, Packaging, and Orderable
Information ........................................................... 31
5 Revision History
Changes from Revision E (June 2014) to Revision F
•
Page
Updated 'ON' pin description in the Pin Functions table. ...................................................................................................... 3
Changes from Revision D (May 2014) to Revision E
Page
•
Updated Switching Characteristics table ............................................................................................................................... 6
•
Updated Typical DC Characteristics section. ......................................................................................................................... 7
•
Updated Timing Waveforms graphic. ................................................................................................................................... 17
•
Updated Application Curves section. ................................................................................................................................... 22
Changes from Revision C (May 2013) to Revision D
•
2
Page
Combined TPS22910A, TPS22912C, and TPS22913B/C datasheets. ................................................................................ 1
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Product Folder Links: TPS22910A TPS22912C TPS22913B TPS22913C
TPS22910A, TPS22912C, TPS22913B, TPS22913C
www.ti.com
SLVSB49F – NOVEMBER 2011 – REVISED JANUARY 2015
6 Device Comparison Table
DEVICE
rON (typ) at 3.3 V
RISE TIME at 3.3V
(typ)
QUICK OUTPUT
DISCHARGE
MAXIMUM OUTPUT
CURRENT
ENABLE
TPS22910A
61 mΩ
1 µs
No
2A
Active Low
TPS22912C
61 mΩ
1000 µs
No
2A
Active High
TPS22913B
61 mΩ
66 µs
Yes
2A
Active High
TPS22913C
61 mΩ
660 µs
Yes
2A
Active High
7 Pin Configuration and Functions
YZV PACKAGE
BUMP VIEW
LASER MARKING
VIEW
Table 1. Pin Assignments
B
ON
GND
A
VIN
VOUT
2
1
Pin Functions
PIN
I/O
DESCRIPTION
A1
O
Switch output
A2
I
Switch input, use a bypass capacitor (ceramic) to ground.
GND
B1
–
Ground
ON
B2
I
Switch control input. Do not leave floating
NAME
NO.
VOUT
VIN
Copyright © 2011–2015, Texas Instruments Incorporated
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3
TPS22910A, TPS22912C, TPS22913B, TPS22913C
SLVSB49F – NOVEMBER 2011 – REVISED JANUARY 2015
www.ti.com
8 Specifications
8.1 Absolute Maximum Ratings
MIN
MAX
VIN
Input voltage range
–0.3
6
V
VOUT
Output voltage range
–0.3
6
V
VON
Input voltage range
–0.3
6
V
IMAX
Maximum continuous switch current
2
A
IPLS
Maximum pulsed switch current, pulse < 300 µs, 2% duty cycle
TA
Operating free-air temperature range
TJ
Maximum junction temperature
Tstg
Storage temperature range
–40
–65
UNIT
2.5
A
85
°C
125
°C
150
°C
8.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±1000 V may actually have higher performance.
8.3 Recommended Operating Conditions
VIN
Input voltage range
VON
ON voltage range
VOUT
Output voltage range
VIH
High-level input voltage, ON
VIL
(1)
MAX
1.4
5.5
UNIT
V
0
5.5
V
VIN
Low-level input voltage, ON
CIN
MIN
VIN = 1.4 V to 5.5 V
1.1
5.5
V
VIN = 3.61 V to 5.5 V
0.6
V
VIN = 1.4 V to 3.6 V
0.4
V
Input capacitor
1
(1)
µF
Refer to the application section.
8.4 Thermal Information
THERMAL METRIC (1)
TPS22910
TPS22912
TPS22913
CSP
CSP
CSP
4 PINS
4 PINS
4 PINS
189.1
189.1
189.1
RθJA
Junction-to-ambient thermal resistance
RθJCtop
Junction-to-case (top) thermal resistance
1.9
1.9
1.9
RθJB
Junction-to-board thermal resistance
36.8
36.8
36.8
ψJT
Junction-to-top characterization parameter
11.3
11.3
11.3
ψJB
Junction-to-board characterization parameter
36.8
36.8
36.8
(1)
4
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Links: TPS22910A TPS22912C TPS22913B TPS22913C
TPS22910A, TPS22912C, TPS22913B, TPS22913C
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SLVSB49F – NOVEMBER 2011 – REVISED JANUARY 2015
8.5 Electrical Characteristics
The electrical characteristics in this section apply to all devices unless otherwise noted. For TPS22910A VON = 0 V where
enabled and VON = VIN where disabled. For TPS22912C and TPS22913B/C VON = VIN where enabled and VON = 0 V where
disabled. VIN = 1.4 V to 5.5 V, TA = –40ºC to 85ºC (unless otherwise noted)
PARAMETER
IIN
TEST CONDITIONS
Quiescent current
IIN(off)
IIN(Leakage)
TYP
MAX
IOUT = 0 mA, VIN = 5.25 V, VON = Enabled
2
10
IOUT = 0 mA, VIN = 4.2 V, VON = Enabled
2
7.0
IOUT = 0 mA, VIN = 3.6 V, VON = Enabled
Off supply current
2
7.0
0.9
5
IOUT = 0 mA, VIN = 1.5 V, VON = Enabled
0.7
5
RL = 1 MΩ, VIN = 5.25 V, VON = Disabled
1.2
10
RL = 1 MΩ, VIN = 4.2 V, VON = Disabled
0.2
7.0
0.1
7.0
0.1
5
RL = 1 MΩ, VIN = 1.5 V, VON = Disabled
0.1
5
VOUT = 0 V, VIN= 5.25 V, VON = Disabled
1.2
10
VOUT = 0 V, VIN = 4.2 V, VON = Disabled
0.2
7.0
VOUT = 0 V, VIN = 3.6 V, VON = Disabled
0.1
7.0
0.1
5
VOUT = 0 V, VIN = 1.5 V, VON = Disabled
0.1
5
VIN = 4.2 V, IOUT = –200 mA
VIN = 3.3 V, IOUT = –200 mA
VIN = 2.5 V, IOUT = –200 mA
VIN = 1.8 V, IOUT = –200 mA
VIN = 1.5 V, IOUT = –200 mA
RPD
(1)
UVLO
Full
VOUT = 0 V, VIN = 2.5 V, VON = Disabled
VIN = 5.0 V, IOUT = –200 mA
On-resistance
Full
RL = 1 MΩ, VIN = 2.5 V, VON = Disabled
VIN = 5.25 V, IOUT = –200 mA
rON
Full
25°C
60
Full
60
Full
60
Full
60.7
Full
63.4
Full
74.2
Full
83.9
Full
Full
80
80
mΩ
90
100
130
25°C
Under voltage lockout
80
120
25°C
25°C
µA
80
110
25°C
VIN increasing, VON = 0 V,
IOUT = –100 mA
µA
110
25°C
VIN = 3.3 V, IOUT = 30 mA, VON = 0
µA
110
25°C
Output pull down resistance
UNIT
110
25°C
VIN decreasing, VON = 0 V, RL = 10 Ω
ION
MIN
IOUT = 0 mA, VIN = 2.5 V, VON = Enabled
RL = 1 MΩ, VIN= 3.6 V, VON = Disabled
Leakage current
TA
120
150
153
200
1.2
Ω
V
0.50
ON input leakage current
VON = 1.4 V to 5.25 V or GND
VRCP
Reverse current voltage
threshold
TPS22910A, TPS22913B/C
44
TPS22912C
54
tDELAY
Reverse current response
delay
VIN = 5 V
10
µs
IRCP(leak)
Reverse current protection
leakage after reverse current
event.
VOUT – VIN > VRCP
0.3
µA
(1)
Full
1
25°C
µA
mV
Only applies to the TPS22913B/C devices
Copyright © 2011–2015, Texas Instruments Incorporated
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SLVSB49F – NOVEMBER 2011 – REVISED JANUARY 2015
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8.6 Switching Characteristics, Typical
PARAMETER
TEST CONDITION
TPS22910A
TPS22912C
TPS22913B
TPS22913C
UNIT
VIN = 5 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
2
840
76
770
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
5.5
6.6
6.6
6.6
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
1
912
82
838
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
3
3
3
3
1048
µs
VIN = 3.3 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
2.5
1147
102
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
7
8.6
8.5
8.6
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
1
1030
97
980
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
3.5
3
3
3
2344
µs
VIN = 1.5 V, TA = 25ºC (unless otherwise noted)
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF
4.5
2513
234
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF
16.5
17.4
17
18
tR
VOUT rise time
RL = 10 Ω, CL = 0.1 µF
2
1970
244
1823
tF
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
7
6.5
6.5
6.5
6
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µs
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SLVSB49F – NOVEMBER 2011 – REVISED JANUARY 2015
8.7 Typical DC Characteristics
The typical characteristics curves in this section apply to all devices unless otherwise noted.
120
6
−40C
25C
85C
100
5
4
VOUT (V)
Ron (mΩ)
80
60
3
40
2
20
1
0
VIN = 5.0V
VIN = 4.2V
VIN = 3.3V
VIN = 2.5V
VIN = 1.8V
VIN = 1.5V
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
4
4.5
5
5.5
0
6
0
0.2
0.4
0.6
0.8
VON (V)
1
1.2
1.4
G000
Figure 1. On-State Resistance vs Input Voltage
G000
Figure 2. TPS22910A On Input Threshold (Active Low)
6
3
VIN = 5.0V
VIN = 4.2V
VIN = 3.3V
VIN = 2.5V
VIN = 1.8V
VIN = 1.5V
5.5
5
4.5
2.5
2
4
3.5
IIN_Q (µA)
VOUT (V)
−40C
25C
85C
3
2.5
2
1.5
1
1.5
1
0.5
0.5
0
0
0.2
0.4
0.6
0.8
VON (V)
1
1.2
0
1.4
0
1
2
3
Voltage (V)
4
5
G000
Figure 3. TPS22912C and TPS22913B/C On Input Threshold
(Active High)
G000
Figure 4. Input Current, Quiescent vs Input Voltage
3000
180
−40C
25C
85C
2500
160
140
120
Ron (mΩ)
2000
IIN_Leak (nA)
6
1500
1000
VIN = 1.4V
VIN = 1.5V
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 4.2V
VIN= 5.0V
VIN = 5.5V
100
80
60
40
500
20
0
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
4
4.5
5
5.5
6
0
−40
−15
10
35
Temperature (°C)
G000
Figure 5. Input Current, Leak vs Input Voltage
Copyright © 2011–2015, Texas Instruments Incorporated
60
85
G000
Figure 6. On-state Resistance vs Temperature
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TPS22910A, TPS22912C, TPS22913B, TPS22913C
SLVSB49F – NOVEMBER 2011 – REVISED JANUARY 2015
www.ti.com
Typical DC Characteristics (continued)
The typical characteristics curves in this section apply to all devices unless otherwise noted.
1
800
700
Maximum Power Dissipation (W)
−40C
25C
85C
600
IIN_Off (nA)
500
400
300
200
0
0.5
1
1.5
2
2.5 3 3.5
Voltage (V)
4
4.5
5
5.5
6
G067
8
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
−40 −30 −20 −10 0 10 20 30 40 50
Ambient Temperature (°C)
100
0
0.9
60
70
80
Figure 7. Input Current, Off vs Input Voltage
Figure 8. Allowable Power Dissipation
Figure 9. Under Voltage Lockout Response
(IOUT = –100mA)
Figure 10. Full-Time Reverse Current Protection
(VIN = 3.0 V, VOUT Ramp up From 3.0 V to 3.3 V)
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G001
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WHITE SPACE
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SLVSB49F – NOVEMBER 2011 – REVISED JANUARY 2015
8.8 Typical AC Characteristics, TPS22910A
4
1
VIN =5.0V, CL = 0.1 µF, RL = 10 Ohms
0.8
3
tFall (µs)
tRise (µs)
0.6
2
0.4
1
0.2
VIN =5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
85
G000
G000
Figure 11. Rise Time vs Temperature
Figure 12. Fall Time vs Temperature
4
10
VIN =1.5V, CL = 0.1 µF, RL = 10 Ohms
9
8
3
7
tFall (µs)
tRise (µs)
6
2
5
4
3
1
2
1
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
85
G000
G000
Figure 13. Rise Time vs Temperature
Figure 14. Fall Time vs Temperature
4
8
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
6
tOff (µs)
tOn (µs)
3
2
1
4
2
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
60
85
G000
Figure 15. Turn-on Time vs Temperature
Copyright © 2011–2015, Texas Instruments Incorporated
G000
Figure 16. Turn-off Time vs Temperature
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SLVSB49F – NOVEMBER 2011 – REVISED JANUARY 2015
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Typical AC Characteristics, TPS22910A (continued)
7
25
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
6
20
15
4
tOff (µs)
tOn (µs)
5
3
10
2
5
1
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
60
85
G000
Figure 17. Turn-on Time vs Temperature
G000
Figure 18. Turn-off Time vs Temperature
2.5
25C
−40C
85C
2.0
tRise (µs)
1.5
1.0
0.5
CL = 0.1uF, RL = 10 Ohms, VON = 1.8V
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Vin (V)
G001
Figure 19. Rise Time vs Input Voltage
10
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SLVSB49F – NOVEMBER 2011 – REVISED JANUARY 2015
8.9 Typical AC Characteristics, TPS22912C
1200
4
VIN =5.0V, CL = 0.1 µF, RL = 10 Ohms
1000
3
tFall (µs)
tRise (µs)
800
600
2
400
1
200
VIN =5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
85
G000
G000
Figure 20. Rise Time vs Temperature
Figure 21. Fall Time vs Temperature
3000
10
VIN =1.5V, CL = 0.1 µF, RL = 10 Ohms
9
2500
8
7
2000
tFall (µs)
tRise (µs)
6
1500
5
4
1000
3
2
500
1
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
85
G000
G000
Figure 22. Rise Time vs Temperature
Figure 23. Fall Time vs Temperature
1200
10
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
1000
8
800
tOff (µs)
tOn (µs)
6
600
4
400
2
200
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
60
85
G000
Figure 24. Turn-on Time vs Temperature
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G000
Figure 25. Turn-off Time vs Temperature
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Typical AC Characteristics, TPS22912C (continued)
25
4000
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
3500
20
3000
15
tOff (µs)
tOn (µs)
2500
2000
10
1500
1000
5
500
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
85
G000
G000
Figure 26. Turn-on Time vs Temperature
Figure 27. Turn-off Time vs Temperature
3500
3000
tRise (µs)
2500
2000
1500
1000
500
−40C
25C
85C
CL = 1 µF, RL = 10 Ohms, VON = 1.8V
0
0
0.5
1
1.5
2
2.5 3 3.5
VIN (V)
4
4.5
5
5.5
6
G000
Figure 28. Rise Time vs Input Voltage
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8.10 Typical AC Characteristics, TPS22913B
180
10
160
9
VIN =5.0V, CL = 0.1 µF, RL = 10 Ohms
8
140
7
120
tFall (µs)
tRise (µs)
6
100
80
5
4
60
3
40
2
20
1
VIN =5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
85
G000
G000
Figure 29. Rise Time vs Temperature
Figure 30. Fall Time vs Temperature
500
400
tRise (µs)
300
200
100
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
G000
Figure 31. Rise Time vs Temperature
Figure 32. Fall Time vs Temperature
150
20
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
90
12
tOff (µs)
16
tOn (µs)
120
60
8
30
4
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
60
85
G000
Figure 33. Turn-on Time vs Temperature
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G000
Figure 34. Turn-off Time vs Temperature
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Typical AC Characteristics, TPS22913B (continued)
40
500
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
400
30
tOff (µs)
tOn (µs)
300
20
200
10
100
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
85
G000
G000
Figure 35. Turn-on Time vs Temperature
Figure 36. Turn-off Time vs Temperature
300
250
tRise (µs)
200
150
100
50
−40°C
25°C
85°C
CL = 0.1 µF, RL = 10 Ohms, VON = 1.8V
0
0
0.5
1
1.5
2
2.5 3 3.5
VIN (V)
4
4.5
5
5.5
6
G000
Figure 37. Rise Time vs Input Voltage
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8.11 Typical AC Characteristics, TPS22913C
1200
4
VIN =5.0V, CL = 0.1 µF, RL = 10 Ohms
1000
3
tFall (µs)
tRise (µs)
800
600
2
400
1
200
VIN =5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
G000
85
G000
Figure 38. Rise Time vs Temperature
Figure 39. Fall Time vs Temperature
3000
10
VIN =1.5V, CL = 0.1 µF, RL = 10 Ohms
9
2500
8
7
2000
tFall (µs)
tRise (µs)
6
1500
5
4
1000
3
2
500
1
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
60
G000
85
G000
Figure 40. Rise Time vs Temperature
Figure 41. Fall Time vs Temperature
1200
10
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
1000
8
800
tOff (µs)
tOn (µs)
6
600
4
400
2
200
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
G000
Figure 42. Turn-on Time vs Temperature
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60
85
G000
Figure 43. Turn-Off Time vs Temperature
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Typical AC Characteristics, TPS22913C (continued)
3500
25
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
3000
20
15
2000
tOff (µs)
tOn (µs)
2500
1500
10
1000
5
500
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
0
−40
85
−15
10
35
Temperature (°C)
G000
60
85
G000
Figure 44. Turn-On Time vs Temperature
Figure 45. Turn-Off Time vs Temperature
3000
2500
tRise (µs)
2000
1500
1000
500
−40°C
25°C
85°C
CL = 1 µF, RL = 10 Ohms, VON = 1.8V
0
0
0.5
1
1.5
2
2.5 3 3.5
VIN (V)
4
4.5
5
5.5
6
G000
Figure 46. Rise Time vs Input Voltage
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9 Parameter Measurement Information
VOUT
VIN
CIN = 1µF
CL
+
-
RL
HI
(A)
TPS22910A,
TPS22912C,
TPS22913B/C
ON
LO
GND
GND
GND
Figure 47. Timing Test Circuit
VON
50%
50%
tOFF
tON
VOUT
tF
tR
VOUT
50%
90%
10%
A.
90%
50%
10%
Rise and fall times of the control signal is 100 ns.
Figure 48. Timing Waveforms
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10 Detailed Description
10.1 Overview
This family of devices are single channel, 2-A load switches in ultra-small, space saving 4-pin WCSP package.
These devices implement a low resistance P-channel MOSFET with a controlled rise time for applications that
need to limit the inrush current.
These devices are designed to have very low leakage current during off state. This prevents downstream circuits
from pulling high standby current from the supply. Integrated control logic, driver, power supply, and output
discharge FET eliminates the need for additional external components, which reduces solution size and BOM
count.
10.2 Functional Block Diagram
VIN
Reverse
Current
Protection
ON
Control
Logic
Driver
VOUT
TPS22913 only
QOD
GND
10.3 Feature Description
10.3.1 On/Off Control
The ON pin controls the state of the switch. The ON pin is compatible with standard GPIO logic threshold. It can
be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V, 3.3-V, or 5.5-V GPIO.
10.3.2 Under-Voltage Lockout
Under-voltage lockout protection turns off the switch if the input voltage drops below the under-voltage lockout
threshold (UVLO). With the ON pin active, the input voltage rising above the under-voltage lockout threshold will
cause a controlled turn-on of the switch to limit current over-shoot.
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Feature Description (continued)
10.3.3 Full-Time Reverse Current Protection
In a scenario where VOUT is greater than VIN, there is potential for reverse current to flow through the pass FET
or the body diode. The devices monitor VIN and VOUT voltage levels. When the reverse current voltage threshold
(VRCP) is exceeded, the switch is disabled (within 10μs typ). Additionally, the body diode is disengaged so as to
prevent any reverse current flow to VIN. The peak instantaneous reverse current is the current it takes to activate
the reverse current protection. After the reverse current protection has activated due to the peak instantaneous
reverse current, the DC (off-state) leakage current from VOUT and VIN is referred to as IRCP(leak) (see Figure 49).
The pass FET, and the output voltage (VOUT), will resume normal operation when the reverse voltage scenario is
no longer present.
The following formula can be used to calculate the amount of peak instantaneous reverse current for a particular
application:
IRC =
VRCP
rON( VIN)
Where,
IRC is the amount of reverse current,
rON(VIN) is the on-resistance at the VIN of the reverse current condition.
VRCP is the reverse voltage threshold.
VOUT
VRCP
I RC
VIN
I REVERSE _CURRENT
IRCP (leak)
Figure 49. Reverse Current
10.4 Device Functional Modes
Table 2 describes what the VOUT pin will be connected to for a particular device as determined by the ON pin
Table 2. VOUT Function Table
ON
TPS22910A
TPS22912C
TPS22913B/C
L
VIN
Open
GND
H
Open
VIN
VIN
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11 Application and Implementation
11.1 Application Information
This section will highlight some of the design considerations when implementing this device in various
applications. A PSPICE model for this device is also available in the product page of this device on www.ti.com
for further aid.
11.1.1 VIN to VOUT Voltage Drop
The VIN to VOUT voltage drop in the device is determined by the RON of the device and the load current. The
RON of the device depends upon the VIN condition of the device. Refer to the RON specification of the device in
the Electrical Characteristics table of this datasheet. Once the RON of the device is determined based upon the
VIN conditions, use Equation 1 to calculate the VIN to VOUT voltage drop:
ΔV = ILOAD × RON
(1)
Where,
ΔV = Voltage drop from VIN to VOUT
ILOAD = Load current
RON = On-resistance of the device for a specific VIN
An appropriate ILOAD must be chosen such that the IMAX specification of the device is not violated.
11.1.2 On/Off Control
The ON pin controls the state of the switch. The ON pin has a low threshold, making it capable of interfacing with
low-voltage signals. The ON pin is compatible with standard GPIO logic thresholds. It can be used with any
microcontroller with 1.2 V or higher GPIO voltage. This pin cannot be left floating and must be driven either high
or low for proper functionality.
11.1.3 Input Capacitor (Optional)
To limit the voltage drop on the input supply caused by transient inrush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-µF ceramic
capacitor, CIN, placed close to the pins, is usually sufficient. Higher values of CIN can be used to further reduce
the voltage drop during high current applications. When switching heavy loads, it is recommended to have an
input capacitor about 10 times higher than the output capacitor to avoid excessive voltage drop.
11.1.4 Output Capacitor (Optional)
Due to the integrated body diode in the PMOS switch, a CIN greater than CL is highly recommended. A CL
greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current
flow through the body diode from VOUT to VIN. A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip
caused by inrush currents during startup, however a 10 to 1 ratio for capacitance is not required for proper
functionality of the device. A ratio smaller than 10 to 1 (such as 1 to 1) could cause slightly more VIN dip upon
turn-on due to inrush currents. This can be mitigated by using a device with a longer rise time.
11.2 Typical Application
VIN
Power
Supply
VOUT
CIN
RL
CL
HI
LO
ON
TPS22910A,
TPS22912C,
TPS22913B/C
GND
GND
Figure 50. Typical Application
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Typical Application (continued)
11.2.1 Design Requirements
Design Parameter
Example Value
VIN
1.5 V to 5 V
CL
0.1 µF to 1 µF
Maximum Acceptable Inrush Current
1A
11.2.2 Detailed Design Procedure
11.2.2.1 Inrush Current
When the switch is enabled, the output capacitors must be charged up from 0-V to VIN voltage. This charge
arrives in the form of inrush current. Inrush current can be calculated using the following equation:
dv
Inrush Current = C ´
dt
(2)
Where,
C = Output capacitance
dv
dt
= Output slew rate
The TPS22910A, TPS22912C, and TPS22913B/C offer several different rise time options to control the inrush
current during turn-on. The appropriate device can be selected based upon the maximum acceptable slew rate
which can be calculated using the design requirements and the inrush current equation. An output capacitance of
1.0 µF will be used since the inrush follows the following equations:
dv
1.0 A = 1.0 μF ´
dt
(3)
dv
= 1 V/μs
dt
(4)
To ensure an inrush current of less than 1 A, a device with a slew rate less than 1 V/µs must be used
The TPS22910A has a typical rise time of 1 µs at 3.3 V . This results in a slew rate of 3.3 V/µs which is above
the 1 V/µs requirement meaning the TPS22910 could not be used to meet the design requirements.
The TPS22913B has a typical rise time of 66 µs at 3.3 V. This results in a slew rate of 50 mV/µs which is below
the 1 V/µs requirement; therefor, the TPS22913B could be used to meet the design requirements. The
TPS22912C or TPS22913C have lower slew rates than the TPS22913B, so they could also be used, but the
output would rise more slowly.
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11.2.3 Application Curves
11.2.3.1 Typical Application Characteristics for TPS22910A
The dark blue curve (Channel 1) represents the VOUT pin of the device. The light blue curve (Channel 2)
represents the ON pin of the device.
VIN = 5 V
CL = 0.1 µF
TA = 25°C
RL = 10Ω
CIN = 10 µF
Figure 51. Turn-on Response
VIN = 5 V
CL = 1 µF
TA = 25°C
RL = 10 Ω
TA = 25°C
RL = 10Ω
CIN =10 µF
CIN = 10 µF
Figure 55. Turn-on Response Time
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TA = 25°C
RL = 10Ω
CIN = 10 µF
Figure 52. Turn-off Response
Figure 53. Turn-on Response Time
VIN = 1.5 V
CL = 0.1 µF
VIN = 5 V
CL = 0.1 µF
VIN = 5 V
CL = 1 µF
TA = 25°C
RL = 10Ω
CIN = 10 µF
Figure 54. Turn-off Response Time
VIN = 1.5 V
CL = 0.1 µF
TA = 25°C
RL = 10Ω
CIN = 10 µF
Figure 56. Turn-off Response Time
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VIN = 1.5 V
CL = 1 µF
TA = 25°C
RL = 10Ω
CIN = 10 µF
VIN = 1.5 V
CL = 1 µF
TA = 25°C
RL = 10Ω
CIN = 10 µF
Figure 58. Turn-off Response Time
Figure 57. Turn-on Response Time
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11.2.3.2 Typical Application Characteristics for TPS22912C
The dark blue curve (Channel 1) represents the VOUT pin of the device. The light blue curve (Channel 2)
represents the ON pin of the device.
VIN = 5 V
CL = 0.1 µF
TA = 25°C
RL = 10Ω
CIN = 1 µF
Figure 59. Turn-on Response
VIN = 5 V
CL = 1 µF
TA = 25°C
RL = 10 Ω
TA = 25°C
RL = 10 Ω
Figure 63. Turn-on Response Time
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TA = 25°C
RL = 10 Ω
CIN = 1 µF
Figure 60. Turn-off Response
CIN =10 µF
Figure 61. Turn-on Response Time
VIN = 1.5 V
CL = 0.1 µF
VIN = 5 V
CL = 0.1 µF
VIN = 5
CL = 1 µF
TA = 25°C
RL = 10 Ω
CIN = 10 µF
Figure 62. Turn-off Response Time
CIN = 1 µF
VIN = 1.5 V
CL = 0.1 µF
TA = 25°C
RL = 10 Ω
CIN = 1 µF
Figure 64. Turn-off Response Time
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VIN = 1.5 V
CL = 1 µF
TA = 25°C
RL = 10 Ω
CIN = 10 µF
Figure 65. Turn-on Response Time
Copyright © 2011–2015, Texas Instruments Incorporated
VIN = 1.5 V
CL = 1 µF
TA = 25°C
RL = 10 Ω
CIN = 10 µF
Figure 66. Turn-off Response Time
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11.2.3.3 Typical Application Characteristics For TPS22913B
The dark blue curve (Channel 1) represents the VOUT pin of the device. The light blue curve (Channel 2)
represents the ON pin of the device.
VIN = 5 V
CL = 1 µF
TA = 25°C
RL = 10 Ω
CIN = 10 µF
Figure 67. Turn-on Response
VIN = 5 V
CL = 0.1 µF
TA = 25°C
RL = 10 Ω
TA = 25°C
RL = 10 Ω
CIN = 1 µF
CIN = 10 µF
Figure 71. Turn-on Response Time
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TA = 25°C
RL = 10 Ω
CIN = 10 µF
Figure 68. Turn-off Response
Figure 69. Turn-on Response Time
VIN = 1.5 V
CL = 1 µF
VIN = 5 V
CL = 1 µF
VIN = 5 V
CL = 0.1 µF
TA = 25°C
RL = 10 Ω
CIN = 1 µF
Figure 70. Turn-off Response Time
VIN = 1.5 V
CL = 1 µF
TA = 25°C
RL = 10 Ω
CIN = 10 µF
Figure 72. Turn-off Response Time
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VIN = 1.5 V
CL = 0.1 µF
TA = 25°C
RL = 10 Ω
Figure 73. Turn-on Response Time
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CIN = 1 µF
VIN = 1.5 V
CL = 0.1 µF
TA = 25°C
RL = 10 Ω
CIN = 1 µF
Figure 74. Turn-off Response Time
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11.2.3.4 Typical Application Characteristics for TPS22913C
The dark blue curve (Channel 1) represents the VOUT pin of the device. The light blue curve (Channel 2)
represents the ON pin of the device.
VIN = 5 V
CL = 1 µF
TA = 25°C
RL = 10 Ω
CIN = 10 µF
Figure 75. Turn-On Response Time
VIN = 5 V
CL = 0.1 µF
TA = 25°C
RL = 10 Ω
TA = 25°C
RL = 10 Ω
CIN = 1 µF
CIN = 10 µF
Figure 79. Turn-Off Response Time
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TA = 25°C
RL = 10 Ω
CIN = 10 µF
Figure 76. Turn-Off Response Time
Figure 77. Turn-On Response Time
VIN = 1.5 V
CL = 1 µF
VIN = 5 V
CL = 1 µF
VIN = 5 V
CL = 0.1 µF
TA = 25°C
RL = 10 Ω
CIN = 1 µF
Figure 78. Turn-Off Response Time
VIN = 1.5 V
CL = 1 µF
TA = 25°C
RL = 10 Ω
CIN = 10 µF
Figure 80. Turn-Off Response Time
Copyright © 2011–2015, Texas Instruments Incorporated
Product Folder Links: TPS22910A TPS22912C TPS22913B TPS22913C
TPS22910A, TPS22912C, TPS22913B, TPS22913C
www.ti.com
SLVSB49F – NOVEMBER 2011 – REVISED JANUARY 2015
VIN = 1.5 V
CL = 0.1 µF
TA = 25°C
RL = 10 Ω
Figure 81. Turn-Off Response Time
Copyright © 2011–2015, Texas Instruments Incorporated
CIN = 1 µF
VIN = 1.5 V
CL = 0.1 µF
TA = 25°C
RL = 10 Ω
CIN = 1 µF
Figure 82. Turn-Off Response Time
Submit Documentation Feedback
Product Folder Links: TPS22910A TPS22912C TPS22913B TPS22913C
29
TPS22910A, TPS22912C, TPS22913B, TPS22913C
SLVSB49F – NOVEMBER 2011 – REVISED JANUARY 2015
www.ti.com
12 Power Supply Recommendations
The device is designed to operate with a VIN range of 1.4 V to 5.5 V.
13 Layout
13.1 Layout Guidelines
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects
along with minimizing the case to ambient thermal impedance.
13.2 Layout Example
The figure below shows an example for these devices. Notice the connection to system ground between the
VOUT Bypass Capacitor ground and the GND pin of the load switch, this creates a ground barrier which helps to
reduce the ground noise seen by the device.
To GPIO
control
Gnd
Via
ON
VIN Bypass
Capacitor
VIN
GND
B2
B1
A2
A1
Gnd
Via
VOUT Bypass
Capacitor
VOUT
VIA to Power Ground Plane
13.3 Thermal Considerations
The maximum IC junction temperature should be restricted to 125°C under normal operating conditions. To
calculate the maximum allowable dissipation, PD(max) for a given output current and ambient temperature, use the
following equation as a guideline:
PD(MAX) =
TJ(MAX) - TA
RθJA
(5)
where
• PD(max) = maximum allowable power dissipation
• TJ(max) = maximum allowable junction temperature
• TA = ambient temperature of the device
• θJA = junction to air thermal impedance. See the Thermal Information section. This parameter is highly
dependent upon board layout.
30
Submit Documentation Feedback
Copyright © 2011–2015, Texas Instruments Incorporated
Product Folder Links: TPS22910A TPS22912C TPS22913B TPS22913C
TPS22910A, TPS22912C, TPS22913B, TPS22913C
www.ti.com
SLVSB49F – NOVEMBER 2011 – REVISED JANUARY 2015
14 Device and Documentation Support
14.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 3. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS22910A
Click here
Click here
Click here
Click here
Click here
TPS22912C
Click here
Click here
Click here
Click here
Click here
TPS22913B
Click here
Click here
Click here
Click here
Click here
TPS22913C
Click here
Click here
Click here
Click here
Click here
14.2 Trademarks
Ultrabook is a trademark of Intel.
All other trademarks are the property of their respective owners.
14.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
14.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
15 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2011–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS22910A TPS22912C TPS22913B TPS22913C
31
PACKAGE OPTION ADDENDUM
www.ti.com
26-Mar-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPS22910AYZVR
ACTIVE
DSBGA
YZV
4
3000
RoHS & Green
SAC396
Level-1-260C-UNLIM
-40 to 85
75
TPS22910AYZVT
ACTIVE
DSBGA
YZV
4
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
75
TPS22912CYZVR
ACTIVE
DSBGA
YZV
4
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
78
TPS22912CYZVT
ACTIVE
DSBGA
YZV
4
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
78
TPS22913BYZVR
ACTIVE
DSBGA
YZV
4
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
64
TPS22913BYZVT
ACTIVE
DSBGA
YZV
4
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
64
TPS22913CYZVR
ACTIVE
DSBGA
YZV
4
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
76
TPS22913CYZVT
ACTIVE
DSBGA
YZV
4
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
76
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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