TPS51610RHBT

This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION www.ti.com 3-Jun-2022 TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS K0 P1 B0 W Reel Diameter Cavity A0 B0 K0 W P1 A0 Dimension designed to accommodate the component width Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Sprocket Holes Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 User Direction of Feed Pocket Quadrants *All dimensions are nominal Device Package Package Pins Type Drawing TPS51610IRHBR VQFN RHB 32 TPS51610IRHBT VQFN RHB TPS51610RHBR VQFN RHB TPS51610RHBT VQFN RHB SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 3-Jun-2022 TAPE AND REEL BOX DIMENSIONS Width (mm) W L H *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS51610IRHBR VQFN RHB 32 3000 356.0 356.0 35.0 TPS51610IRHBT VQFN RHB 32 250 210.0 185.0 35.0 TPS51610RHBR VQFN RHB 32 3000 356.0 356.0 35.0 TPS51610RHBT VQFN RHB 32 250 210.0 185.0 35.0 Pack Materials-Page 2 GENERIC PACKAGE VIEW RHB 32 VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD 5 x 5, 0.5 mm pitch Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4224745/A www.ti.com PACKAGE OUTLINE RHB0032E VQFN - 1 mm max height SCALE 3.000 PLASTIC QUAD FLATPACK - NO LEAD 5.1 4.9 A B PIN 1 INDEX AREA (0.1) 5.1 4.9 SIDE WALL DETAIL OPTIONAL METAL THICKNESS 20.000 C 1 MAX SEATING PLANE 0.05 0.00 0.08 C 2X 3.5 (0.2) TYP 3.45 0.1 9 EXPOSED THERMAL PAD 16 28X 0.5 8 17 2X 3.5 SEE SIDE WALL DETAIL SYMM 33 32X 24 1 PIN 1 ID (OPTIONAL) 32 0.3 0.2 0.1 0.05 C A B C 25 SYMM 32X 0.5 0.3 4223442/B 08/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT RHB0032E VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD ( 3.45) SYMM 32 25 32X (0.6) 1 24 32X (0.25) (1.475) 28X (0.5) 33 SYMM (4.8) ( 0.2) TYP VIA 8 17 (R0.05) TYP 9 (1.475) 16 (4.8) LAND PATTERN EXAMPLE SCALE:18X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4223442/B 08/2019 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN RHB0032E VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD 4X ( 1.49) (0.845) (R0.05) TYP 32 25 32X (0.6) 1 24 32X (0.25) 28X (0.5) (0.845) SYMM 33 (4.8) 17 8 METAL TYP 16 9 SYMM (4.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 33: 75% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X 4223442/B 08/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. 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