TPS51633
SLUSEW4 – JUNE 2022
TPS51633 3-Phase, D-CAP+™ Step-Down Controller for VR12.6 VCPU
1 Features
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3 Description
Intel® VR12.6 PWM Specification serial VID (SVID)
compliant
1-, 2-, or 3-phase operation
Full VR12.6 mobile feature set including digital
current monitor, PS3 and PS4 operation
8-Bit DAC with 0.50-V to 2.30-V output range
Optimized efficiency at light and heavy loads
8 independent levels of overshoot reduction (OSR)
and undershoot reduction (USR)
Driverless configuration for efficient high-frequency
switching
Supports discrete, Power Block, Power Stage or
DrMOS MOSFET implementations
Accurate, adjustable voltage positioning
300-kHz to 800-kHz frequency selections
Patented AutoBalance Phase Balancing
Selectable 8-level current limit
4.5-V to 28-V conversion voltage range
Small, 4 × 4, 32-Pin, QFN PowerPAD™ integrated
circuit package
2 Applications
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Adapter
Battery
NVDC
5-V or 12-V Rails
The TPS51633 device is a driverless step-down
controller that is fully compliant with the SVID
communications protocol, meeting the Intel VR12.6
specification. Advanced control features such as DCAP+ architecture with overlapping pulse support
undershoot reduction (USR) and overshoot reduction
(OSR) provide fast transient response, lowest output
capacitance and high efficiency. The TPS51633
device also supports single-phase operation in CCM
or DCM for light-load efficiency. The TPS51633
device integrates the full complement of VR12.6
I/O features including VR_READY (PGOOD), ALERT
and VR_HOT. The SVID interface address allows
programming from 0 to 7.
In PS4, the quiescent power consumption of the
controller is typically 0.25 mW. Adjustable control of
VCPU slew rate and voltage positioning round out the
VR12.6 features. Paired with the new TPS51604 FET
gate driver, the solution delivers exceptionally high
speed and low switching loss. The TPS51633 device
works with selected TI Power Stage™ products for
optimum efficiency as well as DrMOS products.
The TPS51633 device is available in space saving,
thermally enhanced 32-pin QFN package that
operates from –40°C to 105°C.
PART NUMBER(1)
PACKAGE
BODY SIZE (NOM)
TPS51633
VQFN (32)
4.00 mm × 4.00 mm
(1)
For all available packages, see the orderable addendum at
the end of the document.
PWM1
TPS51604
Drive
Power
Block
TPS51604
Drive
Power
Block
TPS51604
Drive
Power
Block
TPS51633
PWM2
SVID BUS
PWM3
SKIP
Figure 3-1. Simplified Schematic
X
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS51633
www.ti.com
SLUSEW4 – JUNE 2022
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device and Documentation Support..............................3
5.1 Receiving Notification of Documentation Updates......3
5.2 Support Resources..................................................... 3
5.3 Trademarks................................................................. 3
5.4 Electrostatic Discharge Caution..................................3
5.5 Glossary......................................................................3
6 Mechanical, Packaging, and Orderable Information.... 3
4 Revision History
2
DATE
REVISION
NOTES
June 2022
*
Initial release.
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Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS51633
TPS51633
www.ti.com
SLUSEW4 – JUNE 2022
5 Device and Documentation Support
5.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
5.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
5.3 Trademarks
D-CAP+™, PowerPAD™, and TI E2E™ are trademarks of Texas Instruments.
Intel® is a registered trademark of Intel.
All trademarks are the property of their respective owners.
5.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS51633
3
PACKAGE OPTION ADDENDUM
www.ti.com
13-Apr-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPS51633RSMR
ACTIVE
VQFN
RSM
32
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 105
TPS
51633
TPS51633RSMT
ACTIVE
VQFN
RSM
32
250
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 105
TPS
51633
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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