TPS53659RSBT

Product Folder Order Now Tools & Software Technical Documents Support & Community TPS53659 SLUSD38 – NOVEMBER 2016 TPS53659 Dual-Channel (4-Phase + 1-Phase) or (3-Phase + 2-Phase) D-CAP+™ Step-Down Multiphase Controller with NVM and PMBus™ for VR13 Server Memory 1 Device Overview 1.1 Features 1 • Full VR13 Server Feature Set Including Digital Input Power Monitor • Programmable Loop Compensations • Configurable with Non-Volatile Memory (NVM) for Low External Component Counts • Individual Phase Current Calibrations and Reports • Dynamic Phase Shedding with Programmable Current Threshold for Optimizing Efficiency at Light and Heavy Loads • Fast Phase-Adding for Undershoot Reduction (USR) • Backward VR12.0 and VR12.5 Compatible • 8-Bit DAC with Selectable 5 mV or 10 mV Resolution and Output Ranges from 0.25 V to 1.52 V or 0.5 V to 2.8125 V for Dual Channels • Driverless Configuration for Efficient HighFrequency Switching 1.2 • Applications VR13 Memory Power of Server and Telecom Applications 1.3 • Fully Compatible with TI NextFET™ Power Stage for High-Density Solutions • Accurate, Adjustable Voltage Positioning • Frequency Selections with Closed-loop Frequency Control: 300 kHz to 1 MHz • Patented AutoBalance™ Phase Balancing • Selectable, 16-level Per-Phase Current Limit • PMBus™ System Interface for Telemetry of Voltage, Current, Power, Temperature, and Fault Conditions • Dynamic Output Voltage Transitions with Programmable Slew Rates via SVID or PMBus Interface • Conversion Voltage Range: 4.5 V to 17 V • Low Quiescent Current • 5 mm × 5 mm, 40-Pin, WQFN PowerPad™ Package • • ASIC Needs Dual Power Rails High-Performance Processor Power Description The TPS53659 is a fully VR13 SVID compliant step-down controller with dual channels, built-in nonvolatile memory (NVM), and PMBus™ interface, and is fully compatible with TI NexFET™ power stage. Advanced control features such as D-CAP+™ architecture with undershoot reduction (USR) provide fast transient response, low output capacitance, and good current sharing. The device also provides novel phase interleaving strategy and dynamic phase shedding for efficiency improvement at different loads. Adjustable control of VCORE slew rate and voltage positioning round out the Intel® features. In addition, the device supports the PMBus communication interface for reporting the telemetry of voltage, current, power, temperature, and fault conditions to the systems. All programmable parameters can be configured by the PMBus interface and can be stored in NVM as the new default values to minimize the external component count. The TPS53659 device if offered in a thermally enhanced 40-pin WQFN packaged and is rated to operate from –40°C to 125°C. Table 1-1. Device Information (1) PART NUMBER TPS53659 (1) PACKAGE BODY SIZE WQFN (40) 5 mm × 5 mm For more information, see, Mechanical, Packaging, and Orderable Information. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS53659 SLUSD38 – NOVEMBER 2016 www.ti.com Table of Contents 1 2 3 2 Device Overview ......................................... 1 3.1 Receiving Notification of Documentation Updates ... 4 1.1 Features .............................................. 1 3.2 Community Resources ............................... 4 1.2 Applications ........................................... 1 3.3 Trademarks ........................................... 4 1.3 Description ............................................ 1 3.4 Electrostatic Discharge Caution ...................... 4 Revision History ......................................... 3 Device and Documentation Support ................. 4 3.5 Glossary .............................................. 4 4 Mechanical, Packaging, and Orderable Information ................................................ 5 Table of Contents Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS53659 TPS53659 www.ti.com SLUSD38 – NOVEMBER 2016 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES November 2016 * Initial release. Revision History Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS53659 3 TPS53659 SLUSD38 – NOVEMBER 2016 www.ti.com 3 Device and Documentation Support 3.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 3.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 3.3 Trademarks NextFET, AutoBalance, PowerPad, PMBus, NexFET, D-CAP+, E2E are trademarks of Texas Instruments. Intel is a registered trademark of Intel. PMBus is a trademark of SMIF, Inc.. 3.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 3.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 4 Device and Documentation Support Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS53659 TPS53659 www.ti.com SLUSD38 – NOVEMBER 2016 4 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2016, Texas Instruments Incorporated Mechanical, Packaging, and Orderable Information Submit Documentation Feedback Product Folder Links: TPS53659 5 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS53659RSBR ACTIVE WQFN RSB 40 3000 RoHS & Green NIPDAUAG Level-2-260C-1 YEAR -40 to 125 TPS 53659 TPS53659RSBT ACTIVE WQFN RSB 40 250 RoHS & Green NIPDAUAG Level-2-260C-1 YEAR -40 to 125 TPS 53659 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of