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TPS54A20RNJR

TPS54A20RNJR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    VFQFN20

  • 描述:

    IC REG BUCK ADJ 10A 20VQFN

  • 数据手册
  • 价格&库存
TPS54A20RNJR 数据手册
Product Folder Sample & Buy Support & Community Tools & Software Technical Documents TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 TPS54A20 8-V to 14-V Input, 10-A, up to 10-MHz SWIFT™ Step Down Converter 1 Features 2 Applications • • 1 • • • • • • • • • • • • • • • • Two-phase, Synchronous Series Capacitor Buck Converter Automatic Current Balancing Between Phases 2-MHz to 5-MHz Per Phase Switching Frequency 14-ns Minimum On-Time 0.51-V to 2-V Output Voltage Range with ±0.5% Feedback Reference Voltage Input Overvoltage Lockout for 17-V Surge Protection Adjustable Current Limit with Auto Restart (Hiccup) Synchronizes to an External Clock Fixed Frequency in Steady State Adaptive On-Time Control Internal Feedback Loop Compensation Internal Gate Drive LDO with External Supply Option EN Pin Allowing for Adjustable Input UVLO Selectable Soft-Start Time Monotonic Startup with Pre-biased Output Output Power Good Indicator (Open Drain) Output Overvoltage/Undervoltage Protection Telecom, base station, and communications equipment Storage, SSD, DDR memory, switches, hubs, routers, and other networking equipment Low profile/Backside board mounting (< 2 mm height) • • 3 Description The TPS54A20 is a two-phase, synchronous series capacitor buck converter designed for small size, low voltage applications from a 12-V input rail. This topology uniquely merges a switched capacitor circuit with a two phase buck converter. Advantages include automatic current balancing between the inductors, lower switching losses which enable high frequency (HF) operation, and voltage step-down through the series capacitor. Small, low profile inductors used with the TPS54A20 significantly reduce total solution area and height. An adaptive on-time control architecture provides fast transient response and accurate voltage regulation at up to 10-MHz operating frequency. Fixed frequency operation during steady state is maintained through the use of a phase lock loop (PLL) to lock switching signals to a reference oscillator. Device Information(1) PART NUMBER TPS54A20 PACKAGE VQFN (20 pins) BODY SIZE (NOM) 3.5 mm x 4 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Simplified Schematic VIN Efficiency vs Load Current 95 VIN BOOTA 90 PGOOD 85 SCAP SS/FSEL EN LA VOUT SWA ILIM VGA Efficiency (%) SYNC 80 75 70 BOOTB 65 TON VG+ VGAGND LB SWB 60 FB 55 9 VIN 12 VIN 14 VIN 0 PGND 2 4 6 Output Current (A) 8 10 D019 1.8 VOUT, 2 MHz per phase, External VG+, 3.2 x 2.5 x 1.2 mm inductors Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 4 5 5 5 6 7 8 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Timing Requirements ................................................ Typical Characteristics .............................................. Detailed Description ............................................ 15 7.1 Overview ................................................................. 15 7.2 Functional Block Diagram ....................................... 16 7.3 Feature Description................................................. 16 8 Application and Implementation ........................ 22 8.1 Application Information............................................ 22 8.2 Typical Application ................................................. 23 9 Power Supply Recommendations...................... 31 10 Layout................................................................... 32 10.1 Layout Guidelines ................................................. 32 10.2 Layout Example .................................................... 33 11 Device and Documentation Support ................. 35 11.1 11.2 11.3 11.4 11.5 Documentation Support ........................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 35 35 35 35 35 12 Mechanical, Packaging, and Orderable Information ........................................................... 35 4 Revision History Changes from Original (December 2015) to Revision A • 2 Page Changed the device status to Production data. .................................................................................................................... 1 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 5 Pin Configuration and Functions RNJ Package VQFN (20 Pin) Top View Pin Functions PIN I/O (1) DESCRIPTION NAME NO. AGND 1 G Analog signal ground of the IC. AGND should be connected to PGND and VG- at a single point on PCB (e.g. underneath the IC). BOOTA 8 S Bootstrap capacitor node for phase A high-side MOSFET gate driver. Connect the bootstrap capacitor from this pin to the SCAP pin (pin 9). BOOTB 10 S Bootstrap capacitor node for phase B high-side MOSFET gate driver. Connect the bootstrap capacitor from this pin to the SWB pin. EN 4 I Enable pin. Floating this pin will enable the IC. Pull below 1.23V to enter shutdown mode. Can also be used to adjust the input undervoltage lockout above 8 V with two resistors. FB 18 I Feedback pin for voltage regulation. Connect this pin to the center tap of a resistor divider to set the output voltage. ILIM 5 I Current limit programming pin. A resistor between this pin and ground sets the current limit. If no resistor is included, the default load current limit is 15 A. NC 11 PGND 2 G Power ground of the IC. PGND should be connected to AGND and VG- at a single point on PCB (e.g. underneath the IC). Thermal vias to internal ground planes should be added beneath this pin. PGOOD 15 O Power good indicator. This pin is an open-drain output and will assert low if the output voltage is greater than ±5% away from the desired value or due to thermal shutdown, over-voltage/under-voltage, EN shutdown, or during soft start. A pull-up resistor can be connected between PGOOD and VG+ or an external logic supply pin. 9,20 O Series capacitor pin. Connect a ceramic capacitor from pin 20 to the SWA pin. SS/FSEL 6 I Soft start/frequency select pin. Connect a resistor from this pin to ground to set the soft-start time and the switching frequency. If no resistor is provided, the default setting of 4MHz oscillator frequency and 512µs soft start time is used. SWA 13 O Switching node for phase A. Connect an inductor from this pin to the output capacitors. SWB 12 O Switching node for phase B. Connect an inductor from this pin to the output capacitors. SYNC 14 I External clock synchronization pin. An external clock signal can be connected to this pin to synchronize the oscillator frequency (within ±10% of the nominal frequency set via SS/FSEL). SCAP (1) No connect. This pin is not electrically connected to the IC and is included for board level reliability (BLR) purposes. Connect this pin to the SCAP trace. I = Input, O = Output, S = Supply, G = Ground Return Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 3 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com Pin Functions (continued) PIN NAME I/O (1) NO. DESCRIPTION TON 19 I On-time selection. An external resistor from this pin to the AGND pin programs the nominal on-time of the high side switches. VG+ 16 S Gate driver positive supply pin. Connect a bypass capacitor from this pin to VG-. To improve converter efficiency, the internal regulator can be overridden by connecting an external 5V supply to this pin. This supply rail also provides power to the control circuitry. VG- 17 G Gate driver supply return pin. VG- should be connected to PGND and AGND at a single point on PCB (e.g. underneath the IC). VGA 7 S High side phase A gate driver supply pin. Connect a bypass capacitor from this pin to ground. VIN 3 I The power input pin to the IC. Connect VIN to a supply voltage between 8 V and 14 V. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) Power Conversion, VIN Bootstrap, V(BOOTA) (1) MIN MAX DC w.r.t. PGND, switching –0.3 15 DC w.r.t. PGND, non-switching –0.3 17 DC with respect to PGND –0.3 22 V 6 V 14 V DC with respect to SCAP DC with respect to PGND Bootstrap, V(BOOTB) DC with respect to SWB 6 V –0.3 6 V Series Capacitor Node Voltage, DC with respect to PGND V(SCAP) –0.3 16 –1 9 Bias Supply, VG Switch Node Voltage, V(SWA, DC with respect to PGND SWB) Pulse < 10 ns Feedback, V(FB) Voltage Input Current Output Current V DC with respect to PGND Input Voltage Output Voltage –0.3 UNIT Bias Supply, V(VGA) DC with respect to PGND V –4 14 –0.3 3 V V –0.3 15 Enable Voltage, V(EN) –0.3 7 Soft Start/Freq. Select, V(SS/FSEl) –0.3 3 Power Good Voltage, V(PGOOD) –0.3 6 External Sync Clock Voltage, V(SYNC) –0.3 6 Current Limit/Mode Select, V(ILIM) –0.3 3 On Time Pin Voltage, V(TON) –0.3 3 Power Conversion, I(VIN) V 6 A 100 mA Switch Node A, I(SWA) Current Limit A Switch Node B, I(SWB) Current Limit A Bias Supply, I(VG) Operating Junction Temperature, TJ –40 125 °C Storage temperature, Tstg –65 150 °C (1) 4 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input Voltage 8 14 V VOUT Output Voltage 0.5 VIN/5 V IOUT Output Current 0 10 A TJ Junction Temperature -40 125 °C 6.4 Thermal Information THERMAL METRIC (1) RNJ 20 PINS UNIT RθJA Junction-to-ambient thermal resistance 25 (2) °C/W RθJC(top) Junction-to-case (top) thermal resistance 13.4 °C/W RθJB Junction-to-board thermal resistance 4.9 °C/W ψJT Junction-to-top characterization parameter 0.2 °C/W ψJB Junction-to-board characterization parameter 4.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.0 °C/W (1) (2) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Tested on four layer evaluation board. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 5 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com 6.5 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY VOLTAGE (VIN PIN) VIN VIN Operating VIN Input UVLO Voltage VIN rising 8 12 14 7.4 7.65 7.95 VIN UVLO hysteresis VIN Input OVLO Voltage 250 VIN rising VIN falling 15.4 14.1 VIN OVLO hysteresis IQ V V mV 15.8 V 14.8 V 600 mV Shutdown EN < 0.4 V, VIN = 12 V, TA = 25°C 47 µA Operating into VIN FB = 0.53 V, VIN = 12 V, TA = 25°C 6 mA ENABLE (EN PIN) Enable threshold Input current 1.17 1.23 1.27 V Enable threshold + 50 mV –4 µA Enable threshold – 50 mV –1 µA VOLTAGE REFERENCE Voltage Reference TA = 25°C 0.5054 0.508 0.5106 V –40°C < TJ < 125°C 0.5029 0.508 0.5131 V R(SS/FSEL) = Open, 71.5 kΩ, or 48.7 kΩ 3.6 4 4.4 MHz R(SS/FSEL) = Short or 35.7 kΩ 6.3 7 7.7 MHz 9 10 11 MHz 20 ns 2 V FREQUENCY fOSC Oscillator Frequency R(SS/FSEL) = 21.5 kΩ, 15.4 kΩ, or 8.66 kΩ SYNC Minimum Input Clock Pulsewidth SYNC high threshold SYNC low threshold 0.8 Frequency sync range Last SYNC falling/rising edge to return to resistor timing mode if SYNC is not present V ±10 10 MHz: 400 ns 7 MHz: 571 ns 4 MHz : 1 µs % nominal 4 Cycles LOW-SIDE A MOSFET On resistance VG = 5 V, Measured at pins 6.8 10.5 mΩ VG = 5 V, Measured at pins 9.3 14.8 mΩ On resistance Vgs = 5 V, Measured at pins 27 50 mΩ SW rise time 10% to 90% VIN = 12 V 2 ns SW fall time 90% to 10% VIN = 12 V 2 ns LOW-SIDE B MOSFET On resistance HIGH-SIDE MOSFETS CURRENT LIMIT Peak Switch LSA Current Limit Peak Switch LSB Current Limit ~15A Load Trip, R(ILIM) = Open 12.7 16.3 19.9 ~11.25A Load Trip, R(ILIM) = 47 kΩ 9.9 12.7 15.5 ~15A Load Trip, R(ILIM) = Open 6.8 8.7 10.6 ~11.25A Load Trip, R(ILIM) = 47 kΩ 5.3 6.8 8.3 Overcurrent protection scheme 6 A Hiccup OCP cycle count to trip fault Fault hiccup wait time A 10 MHz: 13.1 ms 7 MHz: 18.7 ms 4 MHz: 32.8 ms Submit Documentation Feedback 3 Cycles 131,072 Cycles Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 Electrical Characteristics (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 4.4 4.8 5 100 140 mA 60 mA INTERNAL REGULATOR (VG LDO) 0 mA ≤ IVG ≤ 100 mA Output Voltage Current Limit Nominal Operating Current Fosc = 10 MHz, ILOAD = 10A V DYNAMIC REGULATOR (VGA LDO) 15 Output Voltage VIN = 12 V V 10.5 V SERIES CAP MONITOR Low Voltage Fault Trip 35 Nominal Voltage 50 High Voltage Fault Trip 62 65 Capacitor Precharge Current 5.5 10 38 %VIN 14.5 mA POWER GOOD VFB falling (Fault), UVP 90 VFB rising (Good) VFB threshold 95 VFB rising (Fault), OVP 110 VFB falling (Good) 105 PGOOD sink current V(PGOOD) = 0.4 V 2.7 PGOOD pin leakage current VFB = VREF, V(PGOOD)= 5 V Minimum VIN for valid PGOOD V(PGOOD) ≤ 0.5 V at 100 µA 1.2 %VREF mA 1 μA 2.75 V THERMAL SHUTDOWN Thermal shutdown set threshold Thermal shutdown hysteresis Thermal shutdown hiccup time 10 MHz: 13.1 ms 7 MHz: 18.7 ms 4 MHz: 32.8 ms 135 °C 20 °C 131,072 Cycles 6.6 Timing Requirements MIN NOM MAX UNIT ENABLE (EN PIN) Enable to Start Switching time 1 µF series cap, VIN = 12V 625 µs 30 µs SW minimum ON pulse width 14 ns SW minimum OFF pulse width 10 ns SYNC Lock in time HIGH-SIDE MOSFETS Non-Overlap Time between HS FET Off and LS FET On (deadtime) Non-Overlap Time between LS FET Off and HS FET On (deadtime) 3 Fsw = 5 MHz, VIN = 12 V 3 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 ns ns 7 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com 6.7 Typical Characteristics VIN = 12 V, VOUT = 1.2 V, TA = 25 ºC, unless otherwise noted. 50 10 High Side Phase A Low Side Phase A Rds(on) - On Resistance (m:) Rds(on) - On Resistance (m:) 45 40 35 30 25 20 15 10 -50 -25 0 25 50 75 100 Junction Temperature (qC) 125 9 8 7 6 5 4 -50 150 Figure 1. On Resistance vs Junction Temperature 0 25 50 75 100 Junction Temperature (qC) 125 150 D002 Figure 2. On Resistance vs Junction Temperature 15 510 Low Side Phase B VREF - Voltage Reference (V) 14 Rds(on) - On Resistance (m:) -25 D001 13 12 11 10 9 8 7 509.5 509 508.5 508 507.5 6 5 -50 -25 0 25 50 75 100 Junction Temperature (qC) 125 507 -50 150 -25 0 D003 Figure 3. On Resistance vs Junction Temperature 25 50 75 100 Junction Temperature (qC) 125 150 D004 Figure 4. Voltage Reference vs Junction Temperature 7.1 4.1 7 MHz 4 MHz 4.05 7 Frequency (MHz) Frequency (MHz) 4 3.95 3.9 3.85 6.9 6.8 6.7 3.8 6.6 3.75 3.7 -50 -25 0 25 50 75 100 Junction Temperature (qC) 125 150 -25 D005 Figure 5. Oscillator Frequency vs Junction Temperature 8 6.5 -50 0 25 50 75 100 Junction Temperature (qC) 125 150 D006 Figure 6. Oscillator Frequency vs Junction Temperature Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 Typical Characteristics (continued) VIN = 12 V, VOUT = 1.2 V, TA = 25 ºC, unless otherwise noted. 10.4 90 10 MHz 10.3 Shutdown Current (PA) 10.2 Frequency (MHz) 8V 12 V 14 V 80 10.1 10 9.9 9.8 70 60 50 40 30 9.7 9.6 -50 -25 0 25 50 75 100 Junction Temperature (qC) 125 20 -50 150 -25 0 D007 25 50 75 100 Junction Temperature (qC) 125 150 D008 EN = 0 V Figure 7. Oscillator Frequency vs Junction Temperature Figure 8. Shutdown Current vs Junction Temperature 4.2 1.2 4.1 1.15 1.1 1.05 Current (PA) Current (PA) 4 3.9 3.8 1 0.95 3.7 0.9 3.6 0.85 3.5 -50 -25 0 25 50 75 100 Junction Temperature (qC) 125 0.8 -50 150 EN = Threshold + 50 mV Figure 9. EN Pin Current vs Junction Temperature 25 50 75 100 Junction Temperature (qC) 125 150 D010 Figure 10. EN Pin Current vs Junction Temperature 6.8 1.235 6.6 1.233 6.4 Current (mA) Voltage (V) 0 EN = Threshold - 50 mV 1.237 1.231 1.229 1.227 1.225 -50 -25 D009 8V 12 V 14 V 6.2 6 5.8 -25 0 25 50 75 100 Junction Temperature (qC) 125 150 5.6 -50 -25 D011 0 25 50 75 100 Junction Temperature (qC) 125 150 D008 FB = 0.53 V (non-switching) Figure 11. EN Pin Threshold vs Junction Temperature Figure 12. Non-Switching Operating Current vs Junction Temperature Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 9 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com Typical Characteristics (continued) VIN = 12 V, VOUT = 1.2 V, TA = 25 ºC, unless otherwise noted. 115 16 15.5 110 100 UVP Falling OVP Rising Current (A) Voltage (%VREF) 15 105 PGOOD Rising PGOOD Falling 95 14.5 14 15 A Limit 11.25 A Limit 13.5 13 90 12.5 85 -50 -25 0 25 50 75 100 Junction Temperature (qC) 125 12 -50 150 -25 0 D013 Figure 13. PGOOD and Under/Overvoltage Protection Threshold vs Junction Temperature 25 50 75 100 Junction Temperature (qC) 125 150 D014 Figure 14. Phase A Low-Side MOSFET Current Limit vs Junction Temperature 9 4.82 4.815 8.5 4.81 7.5 Voltage (V) Current (A) 8 15 A Limit 11.25 A Limit 7 4.805 4.8 4.795 4.79 6.5 6 -50 4.785 -25 0 25 50 75 100 Junction Temperature (qC) 125 4.78 -50 150 Figure 15. Phase B Low-Side MOSFET Current Limit vs Junction Temperature 15.5 7.7 15.4 Voltage (V) Voltage (V) UVLO Rising UVLO Falling 7.5 150 D016 15.2 15.1 OVLO Rising OVLO Falling 15 14.8 -25 0 25 50 75 100 Junction Temperature (qC) 125 150 14.7 -50 D100 Figure 17. Undervoltage Lockout Threshold vs Junction Temperature 10 125 14.9 7.45 7.4 -50 25 50 75 100 Junction Temperature (qC) 15.3 7.65 7.55 0 Figure 16. Internal Gate Drive Voltage (VG) vs Junction Temperature 7.75 7.6 -25 D015 -25 0 25 50 75 100 Junction Temperature (qC) 125 150 D018 Figure 18. Overvoltage Lockout Threshold vs Junction Temperature Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 Typical Characteristics (continued) 95 95 90 90 85 85 Efficiency (%) Efficiency (%) VIN = 12 V, VOUT = 1.2 V, TA = 25 ºC, unless otherwise noted. 80 75 70 65 75 70 65 60 1.8 VOUT 1.2 VOUT 0.8 VOUT 60 External VG+ Internal VG+ 55 55 0 2 4 6 Output Current (A) 8 10 0 2 D022 fsw = 2 MHz per phase 3.2 x 2.5 x 1.2 mm inductors 35 0.3 30 0.2 Load Regulation (%V O) 0.4 20 15 10 8 10 D034 External VG+ 3.2 x 2.5 x 1.2 mm inductors Figure 20. Efficiency vs Output Current for Output Voltage 40 25 4 6 Output Current (A) fsw = 2 MHz per phase Figure 19. Efficiency vs Output Current for Gate Drive Supply Temperature Rise (qC) 80 5 8 VIN 12 VIN 14 VIN 0.1 0 -0.1 -0.2 -0.3 0 -0.4 0 2 4 6 Output Current (A) fsw = 2 MHz per phase 8 10 0 2 4 6 Output Current (A) D023 3.2 x 2.5 x 1.2 mm inductors 8 10 D024 No air flow Figure 22. Load Regulation Figure 21. Case Temperature Rise vs Output Current 0.4 4 0A 5A 10 A Recommended Theoretical 3.5 0.2 Max Output Voltage (V) Line Regulation (%V O) 0.3 0.1 0 -0.1 -0.2 3 2.5 2 1.5 1 -0.3 -0.4 0.5 8 10 12 Input Voltage (V) Figure 23. Line Regulation 14 8 10 12 Input Voltage (V) D025 14 D026 Figure 24. Max Output Voltage vs Input Voltage Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 11 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com Typical Characteristics (continued) VIN = 12 V, VOUT = 1.2 V, TA = 25 ºC, unless otherwise noted. 12 2.04 Recommended 2.03 Frequency (MHz) Min Input Voltage (V) 11 10 9 8 7 2.02 2.01 2.00 8 VIN 12 VIN 14 VIN 1.99 6 1.98 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 Output Voltage (V) 1.8 1.9 2 0 2 D033 Figure 25. Min Input Voltage vs Output Voltage 1 Ω Load 40 ms/div Series capacitance = 1 µF 200 µs/div fsw = 2 MHz per phase fsw = 2 MHz per phase 12 10 D027 fsw = 2 MHz per phase Figure 28. Startup Through EN 40 µs/div Figure 29. Shutdown Through EN 8 Figure 26. Frequency vs Output Current Figure 27. Input UVLO and OVLO 5 Ω Load 4 6 Output Current (A) Series capacitance = 1 µF 200 µs/div fsw = 2 MHz per phase Figure 30. Pre-biased Startup Through EN Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 Typical Characteristics (continued) VIN = 12 V, VOUT = 1.2 V, TA = 25 ºC, unless otherwise noted. Series capacitance = 1 µF 2 ms/div fsw = 2 MHz per phase 0 A Load fsw = 2 MHz per phase 400 µs/div Figure 32. Pre-biased Startup Through VIN Figure 31. Startup Through VIN 75 Ω Load 0.5 Ω Load 4 ms/div Figure 34. Shutdown Through VIN Figure 33. Shutdown Through VIN fsw = 2 MHz per phase 20 µs/div 2 µs/div Figure 35. Short Circuit Protection 4 ms/div Figure 36. Short Circuit Hiccup Restart Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 13 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com Typical Characteristics (continued) VIN = 12 V, VOUT = 1.2 V, TA = 25 ºC, unless otherwise noted. 3.2 MHz SYNC clock fsw = 2 MHz per phase 0 A load 200 ns/div Figure 38. External SYNC Add/Remove Figure 37. Steady-State Waveforms Figure 39. Thermal Shutdown Figure 40. Thermal Shutdown Recovery Room temperature fsw = 2 MHz per phase 10 A load 3.2 x 2.5 x 1.2 mm inductors No air flow Four layer board Figure 41. Thermal Image 14 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 7 Detailed Description 7.1 Overview The TPS54A20 is a 14-V, 10-A, synchronous series capacitor step-down (buck) converter with four integrated Nchannel MOSFETs. To improve performance during line and load transients the TPS54A20 implements an adaptive on-time control scheme which does not require external compensation components. The selectable switching frequencies are 2 MHz, 3.5 MHz, or 5 MHz per phase which allows for efficiency and size optimization when selecting the output filter components. A resistor to ground on the TON pin sets the nominal high side switch on-time based on the desired output voltage. The TPS54A20 contains an internal oscillator for steady-state, fixed frequency operation that is set through the SS/FSEL pin. The controller operates at twice the per phase switching frequency (that is, 4 MHz, 7 MHz, or 10 MHz) and the oscillator is set accordingly. An external synchronization clock can also be provided via the SYNC pin. The TPS54A20 starts up safely into loads with pre-biased outputs (non-zero volts at startup). The device implements an internal under voltage lockout (UVLO) feature on the VIN pin with a nominal starting voltage of 7.65 V. The total operating current for the TPS54A20 is approximately 6 mA when not switching and under no load. When the TPS54A20 is disabled by pulling the EN pin low, the supply current is typically less than 50 µA. The integrated MOSFETs allow for high-efficiency, high-density power supply designs with continuous output currents up to 10 A. The MOSFETs are sized to optimize efficiency for low duty cycle applications operating around 2 MHz per phase switching frequency. The TPS54A20 reduces the external component count by integrating the bootstrap recharge circuit. Capacitors connected between the BOOTA/BOOTB and SCAP/SWB pins (respectively) supply the gate drive voltage for the integrated high-side MOSFETs. The output voltage can be stepped down to as low as the 0.5-V voltage reference (VREF). The TPS54A20 has a power good comparator (PGOOD) which monitors the output voltage through the FB pin. The PGOOD pin is an open-drain MOSFET which is pulled low when the FB pin voltage is less than 95% or greater than 105% of the reference voltage (VREF). The PGOOD pin floats (de-asserted) when the FB pin voltage is between 95% to 105% of VREF. The PGOOD pin is held low during startup or when a fault occurs. The EN pin is used to provide power supply sequencing during power up. Soft start times for each frequency can be selected through the SS/FSEL pin. Soft start helps to minimize inrush currents. The device current limit can be set via the ILIM pin. Two selectable current limits are provided. The control scheme implemented is an adaptive on-time control. The on-time is adjusted based on input voltage and oscillator frequency. An internal phase lock loop (PLL) ensures fixed-frequency operation of the converter over the entire load range and adapts the on-time accordingly. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 15 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com 7.2 Functional Block Diagram SS/FSEL VG- VIN VG+ Regulator BOOTB BOOTA VGA 4.8V Regulator SYNC Oscillator VIN Pulse Freq. Detector VIN TON Input Voltage Feedforward SCAP On-time Generator Error Amplifier Switching Signal Logic and Deadtime Control Protection and Supervisory Circuits SWB PGND SWA AGND FB PGOOD EN ILIM Copyright © 2016, Texas Instruments Incorporated 7.3 Feature Description 7.3.1 Frequency Selection The oscillator frequency of this converter can be selected to be one of three options: 4, 7, or 10 MHz. The per phase switching frequency of the converter is half the oscillator frequency (that is, 2, 3.5, or 5 MHz per phase). The internal oscillator frequency is selected by programming the SS/FSEL pin. The resistor programming information is shown in Table 1. The frequency setting is latched in at power up and cannot be changed during operation. Cycling the input power or the EN pin will reset the frequency setting. 7.3.2 External Clock Syncronization An external clock can be connected to the SYNC pin. The external clock signal overrides the internal oscillator and is used as the system clock. This feature enables the user to synchronize the switching events to a master clock on their board and reduce/manage the ripple on the input capacitors. The internal phase locked loop (PLL) has been implemented to allow synchronization at frequencies between ±10% of the nominal oscillator frequency programmed on the SS/FSEL pin. This allows the user to easily switch from the internal oscillator mode to the external clock mode. Before the external clock is present or after it is removed, the device with default to the internal oscillator setting as programmed on the SS/FSEL pin. To implement the synchronization feature, connect a square wave clock signal to the SYNC pin with a duty cycle between 20% and 80%. The clock signal amplitude must transition lower than 0.8 V and higher than 2 V. The start of the switching cycle is synchronized to the rising edge of the SYNC pin. The device can be configured for operation in applications where both an internal oscillator mode and an external synchronization clock mode are needed. Before the external clock is present, the device functions with the internal oscillator and the switching 16 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 Feature Description (continued) frequency is set by the RSS/FSEL resistor. When the external clock is present, the SYNC mode overrides the internal oscillator. The first time the SYNC pin is pulled above the SYNC high threshold (2 V), the device switches from the internal oscillator mode to the SYNC mode and the PLL starts to lock onto the frequency of the external clock. When the external SYNC clock is removed, the converter will transition back to the internal oscillator after 4 internal clock cycles. 7.3.3 Adjusting the Output Voltage The output voltage is set by connecting a resistor divider network from the output voltage to the FB pin of the device and to AGND. It is recommended that the lower divider resistor maintain a range between 1 kΩ and 10 kΩ. To change the output voltage of a design, it is necessary to select the value of the upper resistor. Equation 2 can be used to select the upper resistor. Selecting the value of the upper resistor can change the output voltage between 0.508 V and 2 V. The minimum output setpoint voltage cannot be less than the reference voltage of 0.508 V. The maximum output voltage can be limited by minimum input voltage as shown in Figure 24. The recommended minimum input voltage should be at least five times the output voltage as shown in Figure 25. This is due to the nature of the series capacitor buck converter. 7.3.4 Soft Start Soft start is an important feature that limits current inrush into the converter and reduces the load on the bus converter that supplies this device. During soft start, the internal reference voltage is slowly ramped up to the nominal internal reference voltage (~0.5 V). This slowly increases the commanded output voltage of the converter and reduces the initial surge in current. PGOOD remains low during soft start, the PLL is not active, and output UVP/OVP faults are disabled. After the soft start interval is complete, the converter operates with normal operating conditions and PGOOD will no longer be held low when the output is within bounds. Soft-start time is programmed with an external resistor on SS/FSEL pin (or by shorting to ground or by leaving the pin open). There are multiple soft-start time options per operating frequency available to the user through the SS/FSEL pin. The soft-start setting is latched in at power up or when the EN pin voltage is set high. Resistors used for programing the SS/FSEL pin must have ±1% or lower tolerance. The following frequencies and soft start times can be programmed on the SS/FSEL pin. Table 1. Frequency and Soft Start Resistor Selection RSS/FSEL (kΩ) FOSC (MHz) FSW (MHz) Soft Start Time (µs) Hiccup Time (ms) 71.5 4 2 64 32.8 Open 4 2 512 32.8 48.7 4 2 4096 32.8 35.7 7 3.5 36.6 18.7 Short 7 3.5 293 18.7 21.5 10 5 25.6 13.1 15.4 10 5 205 13.1 8.66 10 5 1638 13.1 7.3.5 Startup into Pre-biased Outputs The device prevents the low-side MOSFETs from discharging a pre-biased output. During pre-biased startup, the low-side MOSFETs do not turn on until after the phase A high-side MOSFET has started switching. The highside MOSFETs do not start switching until the internal soft-start reference voltage exceeds the voltage at the FB pin. It is required to first apply the gate driver supply voltage (VG+) before starting up into pre-biased loads. Alternatively, 6.8 µF bypass capacitance or more can be used. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 17 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com 7.3.6 Power Good (PGOOD) The Power Good (PGOOD) pin is an open drain output. After startup when the FB pin is typically between 95% and 105% of the internal voltage reference, the PGOOD pin pull-down is de-asserted and the pin floats. It is recommended to use a pullup resistor between the values of 10 kΩ and 100 kΩ to a voltage source that is 5.5 V or less. The PGOOD is in a defined state once the VIN input voltage is greater than approximately 1.2 V but with reduced current sinking capability. The PGOOD achieves full current sinking capability once the VIN input voltage is above the input UVLO. The PGOOD pin is pulled low when the FB pin voltage is typically lower than 95% or greater than 105% of the nominal internal reference voltage. A resistor-capacitor (RC) filter can be connected to the PGOOD pin to filter out PGOOD being pulled low during large load transients if low output capacitance is used. The PGOOD pin is also pulled low if a fault is detected, the EN pin is pulled low, or the converter is performing its soft-start power up sequence. 7.3.7 Overcurrent Protection The device protects itself from an overcurrent condition by a current limit detector. The device senses inductor currents using the low side MOSFETs. After three sequential overcurrent measurements are made (in phase A or B), the over current flag is triggered, the converter switches are turned off, and PGOOD is pulled low. The converter attempts to restart after a hiccup interval counter has expired (that is, 32.8 ms, 18.7 ms, or 13.1 ms when in 4 MHz, 7 MHz, or 10 MHz mode, respectively). This provides a hiccup response to an overcurrent condition. The two overcurrent trip points are based on two full load applications of 7.5 A or 10 A. The overcurrent trip points correspond to the load demanding 1.5 times the full load current (11.25 A and 15 A, respectively). This provides enough margin for brief overshoots in inductor currents during a load transient while at the same time protecting against short circuits or other potentially catastrophic faults on the output. The table below lists the resistor values for programming the ILIM pin to select the desired overcurrent limit. Programming resistors with up to ±5% variation can be used. The current limit selection is latched in at power up and cannot be changed without cycling power input or the EN pin voltage. Table 2. Current Limit Selection RILIM (kΩ) Load Current Limit (A) Open 15 47 11.25 7.3.8 Light Load Operation The converter operates in forced continuous conduction mode (FCCM) under light load conditions. When operating in FCCM, the high side and low side MOSFETs are turned on and off in a complementary fashion and negative inductor current is allowed for part of the switching cycle. The switching frequency remains constant in FCCM. 7.3.9 Output Undervoltage/Overvoltage Protection The device incorporates an output undervoltage/overvoltage protection (UVP/OVP) circuit to prevent damage to the load. This fault can be triggered during large, fast load transients if insufficient output capacitance is used. The UVP/OVP feature compares the FB pin voltage to internal thresholds. If the FB pin voltage is lower than 90% or greater than 110% of the nominal internal reference voltage, the converter is turned off (i.e. power MOSFETs are turned OFF), a fault is triggered, and the PGOOD pin is pulled low. When the fault hiccup interval is complete, the converter will attempt to restart. 7.3.10 Input Undervoltage/Overvoltage Lockout The device incorporates an input undervoltage/overvoltage lockout (UVLO/OVLO) circuit. The converter will not operate if the input voltage is below the UVLO threshold. The OVLO circuit protects the converter if the input bus voltage flies higher than the input voltage rating of the device while it is switching. When the input voltage crosses the input rising OVLO trip threshold, the converter turns off all the switches (makes them high impedance) and PGOOD is pulled low. When the input voltage drops lower than the falling OVLO threshold, the converter restarts using the normal soft-start sequence. This feature increases the maximum input voltage the device can sustain without being damaged due to a fault in the system. 18 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 7.3.11 Enable and Adjusting Undervoltage Lockout The EN pin provides electrical on and off control of the device. Once the EN pin voltage exceeds the threshold voltage, the device starts operation. If the EN pin voltage is pulled below the threshold voltage, the regulator stops switching and enters a low power state. There is no voltage hysteresis in the EN threshold. The rising and falling voltage thresholds occur at the same level. The EN pin has an internal hysteretic current source. This allows the user to float the EN pin for self-enabling the device or to design the ON and OFF threshold input voltages with a resistor divider at the EN pin. If an application requires controlling the EN pin, use open drain or open collector output logic to interface with the pin. The EN pin can be configured as shown in Figure 42. The EN pin has a 1 µA pull-up current iP which sets the current source value before the start-up sequence. The device includes the second 3 µA current source iH which is activated when the EN threshold voltage has been exceeded. To achieve clean transitions between the OFF and ON states, it is recommended that the turn OFF threshold is no less than 7.75 V, and the turn ON threshold is no less than 8 V on the VIN pin. It is also recommended to set the UVLO hysteresis to be greater than 500mV in order to avoid repeated chatter during start up or shut down. The value of REN(TOP) and REN(BOT) can be calculated using Equation 18 and Equation 19 as described in the applications section. Figure 42. Adjustable VIN Undervoltage Lockout 7.3.12 Series Capacitor Monitoring The series capacitor voltage is preconditioned and monitored during operation. The series capacitor is located between the source of the high-side MOSFET and the drain of the low-side MOSFET in Phase A . After the input voltage is above UVLO and the EN pin is high, the series capacitor is precharged. A 10 mA current source charges the series capacitor up to half the input voltage. When the series capacitor precharge is complete, the soft start sequence begins. The delay due series capacitor precharge can be calculated using Equation 1. C x VIN t pc = t 2 x I pc (1) Here Ct is the series capacitance, Ipc is the precharge current, and VIN is the input voltage. The voltage monitor is continuously tracking the status of the series capacitor. Its function is to ensure the series capacitor voltage, measured differentially between the SCAP pin and the SWA pin, stays within predefined thresholds. These thresholds are relative to the VIN voltage with respect to PGND and set at 35% and 65% of VIN. If the voltage monitor indicates a voltage outside of these thresholds has occurred, a fault is triggered and following actions are taken based on which threshold has been crossed. 7.3.12.1 Dropping Below 35% Threshold The 35% of VIN threshold detects a series capacitor undervoltage fault. Once the 35% threshold is breached, a fault is triggered, the converter shuts down, and PGOOD is pulled low. After the fault hiccup time is complete, the converter will start up in the normal manner. The start up sequence begins with pre-charging the series capacitor to half the input voltage and is followed by the soft start. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 19 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com 7.3.12.2 Rising Above 65% Threshold The 65% of VIN threshold indicates a series capacitor overvoltage fault has occurred. Once the 65% threshold is breached, a fault is triggered, the converter shuts down, PGOOD is pulled low, and an internal bleed resistor is connected to the SCAP to reduce the series capacitor voltage. After the fault hiccup time is complete, the converter will start up in the normal manner. 7.3.13 Thermal Shutdown The die temperature is continuously monitored to ensure it is within limits. The thermal shutdown (TSD) fault is triggered when the die temperature exceeds the rising temperature threshold. This interrupts switching by making the switches high impedance. The fault state persists until the die temperature cools down to below the falling temperature threshold. The converter then automatically goes through the normal soft start sequence. 7.3.14 Phase A Power Stage Phase A implements a bootstrap driver for the high-side MOSFET, an LDO, a low-side driver and a low-side current monitor. Additional logic is included to implement deadtime control and overcurrent protection. An LDO is implemented to manage the high-side bootstrap driver. This LDO is unique to this topology given the high-side driver is referenced to the SCAP pin and not to the conventional switch node of a buck converter. A conventional bootstrap circuit will not work because the SCAP pin is never connected to PGND during operation. The LDO is designed to produce an output voltage at the VGA pin. This allows a nominal enhancement of around 5V about the VIN rail. The bootstrap capacitor charges when the phase A low side switch is on. An external decoupling capacitor is required on the VGA pin. The low-side MOSFET current is monitored using a sense FET configuration. This circuit enables the driver to monitor the current delivered in Phase A for overcurrent protection. In the case of overcurrent, a fault flag is set if the current detected exceeds the current limit threshold. Adjustment of this threshold is accomplished via programming the ILIM pin. 7.3.15 Phase B Power Stage Phase B implements a bootstrap driver for the high-side MOSFET, a low-side driver and a low-side current monitor. Additional logic is included to implement deadtime control and overcurrent protection. No additional LDO function is required for Phase B as the bootstrap capacitor is charged directly from the VG input rail. A conventional bootstrap circuit is used in phase B. The overcurrent protection operates in the same manner as Phase A. 7.3.16 Internal Gate Drive Regulator There is an internal linear regulator that generates a 4.8 V supply rail on the VG+ pin. The input comes from the VIN pin. The VG+ supply rail is used to power the gate drivers of phase A low side switch and phase B switches. It also is the input to another regulator that generates the internal supply rails used by the controller. To improve converter efficiency, an external 5V supply is recommended to be connected to the VG+ pin, thereby overriding the internal 4.8 V regulator. The VG+ supply requires external decoupling capacitance connected between the VG+ and VG- pins. The VG- pin must be connected to AGND and PGND. It is recommended to make this connection directly beneath the device. 7.3.17 Voltage Feed Forward The input voltage feed forward (VFF) circuit adapts the nominal on-time of the converter in response to changes in the input voltage. The VFF provides a control signal to the on-time generator based on the value of the resistor placed on the TON pin and the input voltage. 7.3.18 Internal Oscillator The internal oscillator provides a default system clock for the converter. The oscillator can be programmed to run at 4 MHz, 7 MHz, or 10 MHz depending on the resistor connected to the SS/FSEL pin. Synchronization to an external clock is allowed. If provided, an external synchronization clock signal is passed through to the oscillator block and bypasses internal oscillator. 20 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 7.3.19 Pulse Frequency Detector The pulse frequency detector is an important block used to create a phase lock loop (PLL). This portion of the PLL accepts two clock signals and delivers a control signal. The PLL control is held inactive during startup and is activated once soft start is complete. The control signal is delivered to the on-time generator to make small adjustments in the on-time such that the frequency and phase of the switching signals match the reference clock (internal or external SYNC). 7.3.20 On-Time Generator The on-time generator provides the on-time pulse for high side switches of the converter. The nominal on-time is programmed from the TON pin. The control signal generated by the VFF circuit is proportional to the on-time required by the converter and is adjusted for input voltage variation. Fine adjustment of the on-time comes from pulse frequency detector which enables fixed frequency operation in steady state. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 21 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The TPS54A20 is a two-phase, synchronous series capacitor buck converter optimized for small size, low voltage applications from a 12 V input rail. See (SLVA750) for a more detailed introduction to the series capacitor buck converter topology. 8.1.1 Two-Phase Series Capacitor Buck Converter Topology The series capacitor buck converter topology uniquely merges a switched capacitor converter and a buck converter. Only one extra capacitor (the series capacitor) is needed as compared to a conventional two-phase buck converter. Advantages include automatic current balancing between the inductors (inductor current sensing and a current sharing loop are not required), lower switching losses which enable high frequency (HF) operation, and voltage step-down through the series capacitor. The on-time of both high side switches is double that of a regular buck converter. This is particularly helpful in high frequency, high conversion ratio applications. The schematic of the converter topology and the converter switch states are shown below. + + La Ct Vswa - Q1a + Co Q2a Vo - - Q1b Lb Vswb Q2b Copyright © 2016, Texas Instruments Incorporated Figure 43. Two-Phase Series Capacitor Buck Converter Topology 8.1.2 Converter Switch Configurations Q1a + - Vswa + + + Co Q2a + Vswb + Co Q2a - Vo - Lb Q1b Q2b Vswb Lb Q2b Copyright © 2016, Texas Instruments Incorporated Figure 44. Phase A High Side MOSFET On 22 Vswa Q1a Vo Q1b - Copyright © 2016, Texas Instruments Incorporated Figure 45. Phase B High Side MOSFET On Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 Application Information (continued) Vswa Ct + Q1a + + Co Q2a Vo - Q1b Lb Vswb Q2b Copyright © 2016, Texas Instruments Incorporated Figure 46. Phase A/B Low Side MOSFET On 8.2 Typical Application Vin = 9.2 V - 14 V VIN C24 22µF C1 10µF C2 10µF U1 TPS54A20RNJR PGND R2 80.6k VG+ R6 VIN 3 PGOOD 15 SYNC 14 SSFSEL 6 R3 12.4k R5 22.1k SYNC 8 BTA C5 0.047µF SCAP SCAP 9 20 SWA 13 EN C6 2.2µF SWA L1 220nH ILIM 5 ILIM VGA 7 VGA TON 19 Vout = 1.2 V, 10 A BOOTB 10 BTB VG+ 17 VG- C4 1µF VOUT C7 0.047µF TON VG+ 16 C9 47µF L2 SWB PGND SCAP SS/FSEL 4 1 AGND PGOOD EN SCAP 11 PGND BOOTA PG 47.5k C3 1µF 16V VIN FB 12 18 C10 47µF SWB FB 220nH R9 R10 1.40k PGND 0 NC AGND PGND 2 R8 100 PGND AGND C8 330pF R7 1.00k AGND Copyright © 2016, Texas Instruments Incorporated Figure 47. Typical Application 8.2.1 Design Requirements Table 3. Design Parameters PARAMETER CONDITIONS MIN TYP MAX UNIT VOUT Output voltage 1.2 IOUT Output current 10 A ΔVOUT Transient response 60 mV VIN Input voltage VOUT(ripple) Output voltage ripple 9-A load step 9.2 12 V 14 V 20 mV(P-P) V Start input voltage Input voltage rising 9.4 Stop input voltage Input voltage falling 9.2 V fSW Switching frequency 2 MHz TA Ambient temperature 25 °C Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 23 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com 8.2.2 Detailed Design Procedure 8.2.2.1 Output Voltage Before beginning design, ensure that the series capacitor buck converter can be used in the application. It is recommended to use this converter when the minimum input voltage is at least five times greater than the target output voltage. If this recommendation is not followed, output voltage dropout can occur at heavy load conditions and poor transient response to load increases can result. The output voltage is set by connecting a resistor divider network from the output voltage to the FB pin of the device and to AGND. It is recommended that the lower divider resistor maintain a range between 1 kΩ and 10 kΩ. To change the output voltage of a design, it is necessary to select the value of the upper resistor. The value of RTOP for a specific output voltage can be calculated using Equation 2. R (BOT) x (VOUT - VREF ) R (TOP) = VREF (2) For the example design, 1 kΩ was selected for RBOT (R7). Using Equation 2, RTOP (R9) is calculated as 1.4 kΩ. It is recommended to use resistors with ±1% or less variation. A capacitor can be connected in parallel with the upper resistor to provide additional phase boost near the converter's crossover frequency. See (SLVA289) for more details and design guidelines. For this design, 330 pF in series with 100 Ω is used. The values were optimized based on measured loop performance. 8.2.2.2 Switching Frequency A key design step is to decide on a switching frequency for the regulator. There is a tradeoff between higher and lower switching frequencies. Higher switching frequencies may produce a smaller solution size using lower valued inductors and smaller output capacitors compared to a power supply that switches at a lower frequency. However, the higher switching frequency creates extra switching loss, which reduces the converter’s efficiency and thermal performance. In this design, a moderate switching frequency of 2 MHz per phase is selected to achieve both a small solution size and a high efficiency operation. Refer to Table 1 for the SS/FSEL programming resistor selection. 8.2.2.3 On-Time The TON pin requires a resistor to set the nominal on-time and to support the input voltage feedforward circuit. The resistance value used also influences the internal ramp in the controller. As a starting point, Equation 3 is recommended for selecting the TON resistor. R (TON) = 3 k + 15 k x VOUT (3) The RTON resistor (R5) is calculated to be 21 kΩ. The selected value for this design example is 22.1 kΩ. During startup, the converter uses the nominal on-time programmed through TON. The phase lock loop (PLL) is only activated after startup is complete. When the PLL is engaged, the on-time is adjusted. If the nominal on-time programmed through the TON pin is not close to the on-time when the PLL is engaged, the SYNC range of the device may be reduced. The TON resistor can also be adjusted to tune the controller. Lowering the RTON value will increase the internal ramp height. This will reduce the converter’s sensitivity to noise and jitter but it will also reduce the transient response capabilities of the converter. 8.2.2.4 Inductor Selection To calculate the value of the output inductors, use Equation 4. KIND is a coefficient that represents the amount of inductor ripple current relative to the maximum output current. The inductor ripple current is filtered by the output capacitor. In general, the inductor ripple value is at the discretion of the designer; however, KIND is normally from 0.1 to 0.4 for the majority of applications. L = ( 2 x VOUT x VIN(MAX) - 2 x VOUT ) K (IND) x IOUT x VIN(MAX) x FSW (4) For this design example, use KIND = 0.4 and the inductor value is calculated to be 249 nH. For this design, the nearby standard value of 220 nH was chosen. For the output filter inductor, it is generally recommended that the RMS current and saturation current ratings not be exceeded. The current ripple, RMS, and peak inductor current are calculated in Equation 5, Equation 6, and Equation 7. 24 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com DI L = SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 ( 2 x VOUT x VIN(MAX) - 2 x VOUT ) L x VIN(MAX) x FSW (5) 2 1 æ IOUT ö 2 ç 2 ÷ + 12 x (DI L ) è ø IOUT DI L = + 2 2 I L(RMS) = I L(PEAK) (6) (7) For this design, the RMS inductor current is calculated to be 5.04 A and the peak inductor current is 6.13 A. The chosen inductor is 220 nH with a saturation current rating of 8.2 A and a dc current rating of 7.6 A. The current flowing through each inductor is the inductor ripple current plus half the output current. During power up, faults, or transient load conditions, the inductor current can increase above the peak inductor current level calculated above. In transient conditions, the inductor current can increase up to the switch current limit of the device. For this reason, the most conservative approach is to specify an inductor with a saturation current rating equal to or greater than half the load current limit rather than the peak inductor current in steady state. Many inductors today have soft saturation characteristics that may be able to ride through a transient that pushes current beyond the saturation rating specified in the datasheet. An example list of inductors that have been tested to work with the TPS54A20 are shown in Table 4. Inductors not listed below can also be used with this device. Table 4. Example Inductor List Inductance (nH) Saturation Current Rating (A) Dimensions [L x W x H] (mm) 220 ±20% 9.3 330 ±20% 7.5 220 ±30% DCR Typ/Max (mΩ) Type Vendor 3.2 x 2.5 x 1.2 9 / 12 HMLW32251B-R22MS CYNTEC 3.2 x 2.5 x 1.2 13 / 16 HMLW32251B-R33MS CYNTEC 8.2 3.2 x 2.5 x 1.2 7.5 / 10.5 MLA-FY12NR22N-M3 MAGLAYERS 330 ±30% 7.5 3.2 x 2.5 x 1.2 13.5 / 16 MLA-FY12NR33N-M3 MAGLAYERS 220 ±20% 8.7 3.2 x 2.5 x 1.2 9.4 / 11.6 MCMK3225TR22MG TAIYO YUDEN 330 ±20% 10.4 3.2 x 2.5 x 1.2 11.2 / 13.8 MCMK3225TR33MG TAIYO YUDEN 250 ±30% 12 3.2 x 2.5 x 1.5 10 / 12.5 74479290125 WURTH ELECTRONIK 330 ±30% 12.4 4.1 x 4.1 x 2.1 6 / 7.2 744383560033 WURTH ELECTRONIK 220 ±20% 10.1 3.5 x 3.2 x 1.5 7.8 / 8.9 XEL3515-221 COILCRAFT 350 ±20% 8.2 3.5 x 3.2 x 1.5 11.6 / 13.4 XEL3515-351 COILCRAFT 330 ±20% 8.5 2.5 x 2.0 x 1.2 14 / 19 DFE252012F-R33M TOKO 8.2.2.5 Output Capacitor Selection For most applications, the primary consideration for selecting the value of the output capacitor is how the regulator responds to a large change in load current. The output capacitance may also be selected based on output voltage ripple or closed-loop bandwidth design objectives. The output capacitance required to maintain an output voltage ripple ΔVOUT during steady-state operation can be estimated using Equation 8. DI L CO > 16 x fSW x DVOUT (8) The desired response to a large change in the load current is typically the most stringent criteria. The output capacitor needs to supply the load with current when the regulator cannot. This situation would occur if there are desired hold-up times for the regulator where the output capacitor must hold the output voltage above a certain level for a specified amount of time after the input power is removed. The regulator is also temporarily not able to supply sufficient output current if there is a large, fast change in the load current such as a transition from no load to full load. The output capacitor must be sized to supply the extra current to the load until the control loop responds to the load change. The minimum output capacitance required for a load increase can be estimated using Equation 9. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 25 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com 2 CO > 2 x L x (DIOUT ) (VIN - 4 x VOUT ) x DVOUT (9) In low voltage applications, the inductor slew rate during a load step decrease is sometimes slower than its slew rate during a load step increase. The minimum output capacitance required for a load decrease can be estimated using Equation 10 for a given tolerable amount of overshoot in the output voltage. 2 CO > L x (DIOUT ) 4 x VOUT x DVOUT (10) Here ΔIOUT is the change in output current and ΔVOUT is the allowable change in the output voltage. For this design example, the transient load response is specified as a 3% change in VOUT for a load step of 5A. For this example, ΔIOUT = 5 A and ΔVOUT = 0.03 x 1.2 = 0.036 V. Based on these design parameters, a minimum capacitance of 93 µF is calculated using Equation 9. This value does not take the ESR of the output capacitor into account in the output voltage change. For ceramic capacitors, the ESR is usually small enough to ignore in this calculation. Additional capacitance de-ratings for aging, temperature and DC bias should be factored in which also increases this minimum value. For this design example, two 47 µF, 6.3 V rated, ceramic capacitors with 3 mΩ of ESR are selected. 8.2.2.6 Input Capacitor Selection The TPS54A20 requires a high quality ceramic, type X5R or X7R, input decoupling capacitor of at least 4.7 µF of effective capacitance on the VIN input voltage pin. Additional bulk capacitance may also be required for the VIN input. The value of a ceramic capacitor varies significantly over temperature and the amount of DC bias applied to the capacitor. The capacitance variations due to temperature can be minimized by selecting a dielectric material that is stable over temperature. X5R and X7R ceramic dielectrics are usually selected for power regulator capacitors because they have a high capacitance to volume ratio and are fairly stable over temperature. The capacitor must also be selected with the DC bias taken into account. The capacitance value of a capacitor decreases as the DC bias across a capacitor increases. For this example design, a ceramic capacitor with at least a 25-V voltage rating is selected to support the maximum input voltage. The input capacitance value impacts the input ripple voltage of the regulator. The minimum input capacitance can be estimated using Equation 11. CIN(MIN) = ( 2 x IOUT x VOUT VIN(MIN) - 2 x VOUT fSW x V 2 IN(MIN) ) x DVIN (11) Here ΔVIN is the input voltage ripple in steady state. Using the design example values, IOUT = 10 A, VOUT = 1.2 V, VIN(MIN) = 9 V, FSW = 2 MHz and ΔVIN = 25 mV, Equation 11 yields an input capacitance of 39 µF. For this example, two 10µF, 25-V and a single 22-µF, 25-V ceramic capacitors in parallel have been selected for the VIN voltage rail. Because ESR is typically fairly low in ceramic capacitors, it is not included in this calculation. The capacitor must also have a ripple current rating greater than the maximum input current ripple to the device during full load. The input ripple current can be calculated using Equation 12. ICIN(  RMS) = IOUT x 2 æ 2 x VOUT 2 x VOUT x ç1 ç VIN(MIN) VIN(MIN) è ö ÷ ÷ ø (12) For this example design, the RMS input ripple current is 2.21 A (RMS). The ripple current can be assumed to be shared equally between the input capacitors. 8.2.2.7 Series Capacitor Selection A major function of the series capacitor is energy transfer. This is a different role from input and output capacitors where decoupling is the primary function. In many ways, the series capacitor is similar to the capacitor used for energy transfer in SEPIC converters and can be designed accordingly. A design objective may be to ensure the series capacitor voltage ripple does not exceed 5% to 10% of the nominal voltage under the worst case conditions. The series capacitor voltage ripple is given by Equation 13. VOUT x IOUT DV(Ct) = C t x fsw x VIN(MIN) (13) 26 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 Here Ct is the series capacitance. Equation 13 can be rearranged to provide the design equation for series capacitor selection which is 2 x VOUT x IOUT Ct ³ k Ct x fsw x V 2 IN(MIN) (14) where kCt represents the voltage ripple percentage. For example, if the voltage ripple target is 5%, the value for kCt is 0.05. The largest voltage ripple occurs at full load current (highest IOUT), highest duty ratio (lowest input voltage/highest output voltage), and lowest frequency. For this design example, the value for kCt was selected to be 0.08. The resulting series capacitance calculated is 1.85 µF. A 10 V, X7R ceramic capacitor with 2.2 µF of capacitance is selected. Another aspect to consider is capacitor RMS current rating. This impacts the temperature rise of the capacitor. Check the capacitor datasheet for temperature rise information. If the temperature rise is too large for a single capacitor, multiple capacitors may be placed in parallel to share the RMS current. The series capacitor has the same current profile as the high side MOSFETs. The RMS current squared can be expressed as I 2Ct(RMS) = 2 x D x I 2 L(RMS) (15) where IL(RMS) is the RMS inductor current of either inductor. The series capacitor RMS current can be expressed as ICt(RMS) = æ VOUT 4x ç ç VIN(MIN) è ö éæ IOUT ö2 æ DI L ö2 ù + ç ÷ êç ÷ ú ÷ êè 2 ÷ø è 12 ø úû øë (16) where ΔIL is the inductor current ripple. The largest RMS current occurs at the highest load current and highest duty ratio. Multilayer ceramic capacitors (MLCC) are well suited for operating as the series capacitor. The equivalent series resistance (ESR) is relatively low (for example, 5 mΩ to 10 mΩ) which helps to reduce power loss and self heating. The equivalent series inductance (ESL) is fairly low which results in a high self resonant frequency (SRF). There are a few key items that should be considered when designing. First, the effective capacitance decreases with DC bias. This means that the capacitor should be selected based on its capacitance with the nominal voltage of VIN/2 applied. Temperature variation also reduces effective capacitance. For this reason, X7R capacitors with up to 125°C operating temperature range are recommended. If capacitors are not properly selected, cracking or other failure modes may result. 8.2.2.8 Soft-Start Time Selection The soft-start time is the amount of time it takes for the output voltage to reach its nominal programmed value during power up. This is useful if a load requires a controlled voltage slew rate. This is also used if the output capacitance is very large and would require large amounts of current to quickly charge the capacitor to the desired output voltage level. The large currents necessary to charge the capacitor may make the TPS54A20 reach the current limit and trigger a fault. Excessive current draw from the input power supply may cause the input voltage rail to sag. Limiting the output voltage slew rate solves both of these problems. The soft-start time can be selected using the resistor values listed in Table 1. For the example circuit, the soft-start time is not critical since the output capacitor value is 94 µF which does not require a large amount of current to charge to 1.2 V. For this example design, the average output current is approximately 220 mA during soft start. The example circuit has the soft start time set to 512 µs which requires no resistor (open connection) on the SS/FSEL pin. The average converter output current required to charge the output capacitors to the target output voltage during soft start can be estimated using Equation 17. C x VOUT IOUT,SS = O t SS (17) 8.2.2.9 Bootstrap Capacitor Selection A 0.047 μF ceramic capacitor should be connected between the BOOTA to SCAP pins and between the BOOTB and SWB pins for proper operation. It is recommended to use a ceramic capacitor with X5R or better grade dielectric. The capacitor should have 10 V or higher voltage rating. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 27 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com 8.2.2.10 Gate Drive Capacitor Selection A 1 μF ceramic capacitor should be connected between VGA and PGND and between the VG+ and VG- pins for proper operation. It is recommended to use a ceramic capacitor with X5R or better grade dielectric. The VGA capacitor should have 16 V or higher voltage rating and the VG+ capacitor should have 10 V or higher voltage rating. 8.2.2.11 Under Voltage Lockout Set Point The Under Voltage Lock Out (UVLO) set point can be adjusted using an external voltage divider network. The top resistor is connected between VIN and the EN pin and bottom resistor is connected between EN and GND as shown in Figure 42. For the example design, the supply should turn on and start switching once the input voltage increases above 9.4 V (UVLO start or enable). After the regulator starts switching, it should continue to do so until the input voltage falls below 9.2 V (UVLO stop or disable). The resistor values for obtaining the desired UVLO thresholds can be calculated using Equation 18 and Equation 19. REN,TOP, the top UVLO divider resistor, is calculated using Equation 18. REN,BOT, the bottom UVLO divider resistor, is calculated in Equation 19. VIN(RISE) - VIN(FALL) REN(TOP) = IEN(FALL) - IEN(RISE) (18) REN(BOT) = REN(TOP) x VEN VIN(FALL) - VEN + REN(TOP) x IEN(FALL) (19) For the start and stop voltages specified the resistor value selected for REN,TOP (R2) is 80.6 kΩ and for REN,BOT (R3) is 12.4 kΩ. 8.2.2.12 Current Limit Selection The current limit can be selected using the ILIM pin. Refer to Table 2 for resistor selection information. It is recommended to choose a current limit that is 1.5 times or more than the full load current expected in the application. This allows for margin in the inductor currents when responding to load transients and limits nuisance trips. 28 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 8.2.3 Application Curves 90 90 80 80 70 70 Efficiency (%) 100 Efficiency (%) 100 60 50 40 30 60 50 40 30 20 20 VIN = 9V VIN = 12V VIN = 14V 10 0 0 1 2 3 4 5 6 Output Current (A) 7 8 9 VIN = 9V VIN = 12V VIN = 14V 10 0 0.001 10 Figure 48. Efficiency 1 0.5 0.8 0.4 0.6 0.3 0.4 0.2 0 -0.2 -0.4 2 3 4 5 7 10 D029 0.2 0.1 0 -0.1 -0.2 -0.6 -0.3 -0.8 -0.4 -1 -0.5 0 1 2 3 4 5 6 Output Current (A) 7 8 9 10 9 10 D030 Figure 50. Load Regulation 60 180 50 150 40 120 30 90 20 60 10 30 0 0 -10 -30 -20 -60 -30 -90 -40 -50 -60 100 200 500 1000 10000 Frequency (Hz) 11 12 Input Voltage (V) 13 14 D031 Figure 51. Line Regulation -120 Gain (dB) Phase (Deg) -150 -180 100000 500000 VO = 50 mV / div (ac coupled) Phase (Degree) Gain (dB) 1 Figure 49. Light Load Efficiency Line Regulation (%) Load Regulation (%) 0.01 0.02 0.05 0.1 0.2 0.5 Output Current (A) D028 IO = 5 A / div Load step = 0 A - 9 A, slew rate = 9 A / µsec D032 Figure 52. Loop Response Time = 50 µsec / div Figure 53. Transient Response Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 29 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com VI = 50 mV / div (ac coupled) VI = 50 mV / div (ac coupled) SWA = 5 V / div SWA = 5 V / div SWB = 5 V / div SWB = 5 V / div Time = 200 nsec / div Figure 54. No Load Input Voltage Ripple Time = 200 nsec / div Figure 55. Full Load Input Voltage Ripple VO = 20 mV / div (ac coupled) VO = 20 mV / div (ac coupled) SWA = 5 V / div SWA = 5 V / div SWB = 5 V / div SWB = 5 V / div Time = 200 nsec / div Figure 56. No Load Output Voltage Ripple Time = 200 nsec / div Figure 57. Full Load Output Voltage Ripple VIN = 10=0 V / div VIN = 10=0 V / div EN = 1 V / div EN = 1 V / div VO = 500 mV / div VO = 500 mV / div Time = 2 msec / div Figure 58. Start Up with VIN 30 Time = 2 msec / div Figure 59. Start Up with EN Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 VIN = 10=0 V / div VIN = 10=0 V / div EN = 1 V / div EN = 1 V / div VO = 500 mV / div VO = 500 mV / div Time = 2 msec / div Figure 60. Shut Down with VIN Time = 2 msec / div Figure 61. Shut Down with EN 9 Power Supply Recommendations The TPS54A20 is designed to operate from an input voltage supply range between 8V and 14V. This supply voltage must be well regulated. Power supplies must be well bypassed for proper electrical performance. This includes a minimum of one 4.7μF (after de-rating) ceramic capacitor, type X5R or better, from VIN to PGND. Additional local ceramic bypass capacitance may be required in systems with small input ripple specifications, in addition to bulk capacitance, if the TPS54A20 device is located more than a few inches away from its input power supply. In systems with an auxiliary power rail available, the power stage input, VIN, and the gate driver power input, VG+, may operate from separate input supplies. See the recommendations in the Layout section for further explanation. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 31 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com 10 Layout 10.1 Layout Guidelines • • • • • • • • • • • • • • • • • • • • • • 32 Layout is a critical portion of good power supply design. See Figure 62 and Figure 63 for a PCB layout example. It may be possible to obtain acceptable performance with alternate PCB layouts, however this layout has been shown to produce good results and is meant as a guideline. The IC package design provides several quiet pads for heat removal and enables a tight layout of the board components. Place the power components (including input and output capacitors, inductors, the series capacitor, and the TPS54A20 device) on the solder side of the PCB. To shield and isolate the small signal traces from noisy power lines, insert and connect at least one inner plane to ground. All sensitive analog traces and components such as FB, EN, TON, PGOOD, ILIM, and SS/FSEL must be placed away from high-voltage switching nodes such as SWA, SWB, SCAP, BOOTA, and BOOTB to avoid coupling. Use internal layers as ground planes and shield the feedback trace from power traces and components. Care should be taken to minimize the loop area formed by the input bypass capacitor connections, the VIN pin, and the ground connections. Place the input capacitors right next to the IC. Use low ESR ceramic capacitors with X5R or X7R dielectric. Care should also be taken to minimize the loop area formed by the series capacitor. Place the series capacitor directly beside the IC. If this guideline is not followed, extra voltage ringing due to parasitic inductances could occur on the switch nodes and the device could be damaged. Use low ESR ceramic capacitors with X7R or better dielectric. Ensure the capacitor operating temperature is sufficient. It is recommended to have at least 125 °C rating. Place the bootstrap capacitors close to the device to reduce parasitic inductance caused by switching loop area. Place the BOOTA to SCAP capacitor right next to the device. Thermal vias should be inserted in the PGND strip and connected to internal ground planes. This aids with heat removal and ground return current. The top layer ground area should be connected to the internal ground layer(s) using vias at the input bypass capacitor, the output filter capacitor and directly under the TPS54A20 device to provide a thermal path from the exposed thermal pad land to ground. For operation at full rated load, the top side ground area together with the internal ground planes, must provide adequate heat dissipating area. Place the output inductors close to the SWA and SWB pins and keep the switch node area small. This helps to prevent excessive capacitive coupling, reduce electromagnetic interference, and reduce conduction loss. The output filter capacitor ground should be returned directly to the PGND strip using an inner layer. The FB pin is sensitive to noise. The feedback resistors should be located as close as possible to the IC and routed with minimal lengths of trace. Place the feedback resistor network near the device to minimize the FB trace distance. When operating at 7 MHz or 10 MHz, a resistor (e.g. 10 kΩ) is required in series with the FB pin to reduce noise coupling and filter out high frequency noise as shown in Figure 62. Adding a phase boost capacitor in parallel with the top resistor of the output voltage feedback divider is recommended. Place the TON resistor directly next to the device. Connect the ground return to the AGND pin. Place the gate drive capacitor as close as possible to the VG+ and VG- pins. Make the return connection directly to the VG- pin instead of an inner ground layer. This reduces gate drive loop area. Place the VGA capacitor next to the VGA pin. Provide a ground via for the capacitor and ensure the loop is as small as possible. The no connect (NC) pin should be connected to the trace connecting the SCAP pin to the series capacitor. This will improve board level reliability. A snubber can be placed between the switch nodes and ground for effective ringing reduction. Land pattern and stencil information is provided in the data sheet addendum. Try to minimize conductor lengths while maintaining adequate width. It is recommended to experimentally validate all designs before production. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 10.2 Layout Example Figure 62. Layout Recommendation Figure 63. Example Converter Layout Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 33 TPS54A20 SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com Layout Example (continued) Figure 64. Top Layer of Example Converter Layout Figure 65. Bottom Layer of Example Converter Layout 34 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 TPS54A20 www.ti.com SLVSCQ8A – DECEMBER 2015 – REVISED APRIL 2016 11 Device and Documentation Support 11.1 Documentation Support Optimizing Transient Response of Internally Compensated DC-DC Converters, SLVA289. Introduction to the Series Capacitor Buck Converter, SLVA750. 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks SWIFT, E2E are trademarks of Texas Instruments. 11.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS54A20 35 PACKAGE OPTION ADDENDUM www.ti.com 14-Nov-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TPS54A20RNJR ACTIVE VQFN-HR RNJ 20 3000 RoHS & Green Call TI | NIPDAU Level-2-260C-1 YEAR -40 to 125 54A20 Samples TPS54A20RNJT ACTIVE VQFN-HR RNJ 20 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 54A20 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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TPS54A20RNJR
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