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TPS61040-Q1, TPS61041-Q1
SGLS276D – JANUARY 2005 – REVISED MARCH 2016
TPS6104x-Q1 Low-Power DC-DC Boost Converter in SOT-23 Package
1 Features
3 Description
•
•
•
•
The TPS6104x-Q1 devices are high-frequency boost
converters for automotive applications. The devices
are ideal for generating output voltages up to 28 V
from a pre-regulated low voltage rail, dual-cell
NiMH/NiCd or a single-cell Li-Ion battery, supporting
input voltages from 1.8 V to 6 V.
1
•
•
•
•
•
Qualified for Automotive Applications
1.8-V to 6-V Input Voltage Range
Adjustable Output Voltage Range Up to 28 V
400-mA (TPS61040-Q1) and 250-mA (TPS61041Q1) Internal Switch Current
Up to 1-MHz Switching Frequency
28-µA Typical No Load Quiescent Current
1-µA Typical Shutdown Current
Internal Soft Start
Space-Saving, 5-Pin SOT-23 Package
2 Applications
•
•
•
•
•
•
•
Automotive Telematics, eCall, and Tolling
Infotainment and Clusters
Advanced Driver Assistance System (ADAS)
LCD Bias Supplies
White-LED Supplies for LCD Backlights
Dual-CELL NiMH/NiCd or Single-CELL Li-Ion
Battery-Powered Systems
Standard 3.3-V or 5-V to 12-V Conversions
The TPS6104x-Q1 devices operate with a switching
frequency up to 1 MHz, allowing the use of small
external components such as ceramic as well as
tantalum output capacitors. Combined with the spacesaving, 5-pin SOT-23 package, the TPS6104x-Q1
devices accomplish a small overall solution size. The
TPS61040-Q1 device has an internal 400-mA switch
current limit, while the TPS61041-Q1 device has a
250-mA switch current limit, offering lower output
voltage ripple and allowing the use of a smaller form
factor inductor for lower-power applications.
The TPS6104x-Q1 devices operate in a pulse
frequency modulation (PFM) scheme with constant
peak current control. The combination of low
quiescent current (28 µA typical) and the optimized
control scheme enable operation of the devices at
high efficiencies over the entire load current range.
Device Information(1)
PART NUMBER
TPS6104x-Q1
PACKAGE
SOT-23 (5)
BODY SIZE (NOM)
2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Diagram
L1
10 mH
Efficiency vs Output Current
D1
90
VOUT
VIN to 28 V
VIN
1.8 V to 6 V
CFF
SW
FB
CIN
4.7 mF
4
EN
GND
VI = 5 V
86
R1
1
CO
1 mF
3
2
R2
84
Efficiency − %
5 V
IN
VO = 18 V
88
VI = 3.6 V
82
80
VI = 2.4 V
78
76
74
72
70
0.1
1
10
IO − Output Current − mA
100
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61040-Q1, TPS61041-Q1
SGLS276D – JANUARY 2005 – REVISED MARCH 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 9
7.1
7.2
7.3
7.4
Overview ................................................................... 9
Functional Block Diagram ......................................... 9
Feature Description................................................... 9
Device Functional Modes........................................ 10
8
Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application .................................................. 11
8.3 System Examples ................................................... 16
9 Power Supply Recommendations...................... 19
10 Layout................................................................... 19
10.1 Layout Guidelines ................................................. 19
10.2 Layout Example .................................................... 19
11 Device and Documentation Support ................. 20
11.1
11.2
11.3
11.4
11.5
11.6
Device Support ....................................................
Related Links ........................................................
Community Resource............................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
20
20
20
20
20
20
12 Mechanical, Packaging, and Orderable
Information ........................................................... 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (April 2012) to Revision D
Page
•
Changed bullets in Applications ............................................................................................................................................ 1
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
•
Changed TPS61040/TPS61041 to TPS6104x-Q1, add -Q1 to TPS61040 and TPS61041, VIN and Vin to VIN, Cff to
CFF, RDS(ON) and RDSon to RDS(on), and Isw to ISW throughout document ......................................................................... 1
•
Updated text in Description ................................................................................................................................................... 1
•
Added MAX value of 47 in the Inductor row of Recommended Operating Conditions for better clarity ............................... 4
•
Changed Operating junction temperature row to Operating ambient temperature row in Recommended Operating
Conditions .............................................................................................................................................................................. 4
•
Changed TJ to TA in the conditions statement of Electrical Characteristics .......................................................................... 5
•
Moved figures 12 through 14 to Application Curves section .................................................................................................. 6
•
Deleted 50 mA from Inductor Selection, Maximum Load Current ....................................................................................... 11
•
Deleted Sumida CR32-100 row from Table 3 ..................................................................................................................... 13
•
Changed Layout Diagram in Layout Example...................................................................................................................... 19
Changes from Revision B (July 2011) to Revision C
•
2
Page
Added THERMAL SHUTDOWN section between UNDERVOLTAGE LOCKOUT and ABS MAX Table. ........................... 10
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SGLS276D – JANUARY 2005 – REVISED MARCH 2016
5 Pin Configuration and Functions
DBV Package
5 Pin SOT-23
Top View
SW
1
GND
2
FB
3
5
V
4
EN
IN
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
EN
4
I
This is the enable pin of the device. Pulling this pin to ground forces the device into shutdown mode reducing the
supply current to less than 1 µA. This pin must not be left floating and must be terminated.
FB
3
I
This is the feedback pin of the device. Connect this pin to the external voltage divider to program the desired output
voltage.
GND
2
—
SW
1
I
Connect the inductor and the Schottky diode to this pin. This is the switch pin and is connected to the drain of the
internal power MOSFET.
VIN
5
I
Supply voltage pin
Ground
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Supply voltages on pin VIN
Voltages on pins EN, FB
(2)
(2)
Switch voltage on pin SW
MIN
MAX
UNIT
–0.3
7
V
–0.3
VIN + 0.3
V
30
V
(2)
Continuous power dissipation
See Thermal Information
TJ
Operating junction temperature
–40
150
°C
TStg
Storage temperature
–65
150
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002 (1)
±2000
Charged-device model (CDM), per AEC Q100-011
±750
UNIT
V
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
MIN
VIN
Input voltage
VOUT
Output voltage
(1)
L
Inductor
f
Switching frequency (1)
CIN
Input capacitor
COUT
Output capacitor
TA
Operating ambient temperature
(1)
TYP
1.8
2.2
(1)
10
MAX
V
28
V
47
μH
1
MHz
μF
4.7
(1)
μF
1
–40
UNIT
6
125
°C
See Application and Implementation section for further information.
6.4 Thermal Information
TPS6104x-Q1
THERMAL METRIC (1)
DBV (SOT-23)
UNIT
5 PINS
RθJA
Junction-to-ambient thermal resistance
153.5
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
105.7
°C/W
RθJB
Junction-to-board thermal resistance
33.5
°C/W
ψJT
Junction-to-top characterization parameter
9.8
°C/W
ψJB
Junction-to-board characterization parameter
33.1
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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SGLS276D – JANUARY 2005 – REVISED MARCH 2016
6.5 Electrical Characteristics
VIN = 2.4 V, EN = VIN, TA = –40°C to 125°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
VIN
Input voltage range
6
V
IQ
Operating quiescent current
IOUT = 0 mA, not switching, VFB = 1.3 V
1.8
28
50
μA
ISD
Shutdown current
EN = GND
0.1
1
μA
VUVLO
Undervoltage lockout threshold
1.5
1.7
V
ENABLE
VIH
EN high level input voltage
VIL
EN low level input voltage
II
EN input leakage current
1.3
EN = GND or VIN
V
0.4
V
0.1
1
μA
30
V
400
550
ns
POWER SWITCH AND CURRENT LIMIT
Vsw
Maximum switch voltage
toff
Minimum OFF time
ton
Maximum ON time
6
7.5
μs
RDS(on)
MOSFET ON-resistance
VIN = 2.4 V; ISW = 200 mA; TPS61040-Q1
600
1100
mΩ
RDS(on)
MOSFET ON-resistance
VIN = 2.4 V; ISW = 200 mA; TPS61041-Q1
750
1300
mΩ
MOSFET leakage current
VSW = 28 V
1
10
μA
ILIM
MOSFET current limit
TPS61040-Q1
325
400
500
mA
ILIM
MOSFET current limit
TPS61041-Q1
200
250
325
mA
28
V
1
μA
250
4
OUTPUT
VOUT
Adjustable output voltage range (1)
Vref
Internal voltage reference
IFB
Feedback input bias current
VFB = 1.3 V
VFB
Feedback trip point voltage
1.8 V ≤ VIN ≤ 6 V
(1)
(2)
VIN
1.233
TJ = –40°C to 85°C
TJ = –40°C to 125°C
V
1.208
1.233
1.258
1.2
1.233
1.27
V
Line regulation
(2)
1.8 V ≤ VIN ≤ 6 V; VOUT = 18 V; Iload = 10 mA;
CFF = not connected
0.05
%/V
Load regulation
(2)
VIN = 2.4 V; VOUT = 18 V; 0 mA ≤ IOUT ≤ 30 mA
0.15
%/mA
Cannot be production tested. Assured by design.
The line and load regulation depend on the external component selection. See Application and Implementation for further information.
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6.6 Typical Characteristics
Table 1. Table of Graphs
FIGURE
vs Load current
Figure 1,
Figure 2,
Figure 3
vs Input voltage
Figure 4
vs Input voltage and temperature
Figure 5
Feedback voltage
vs Temperature
Figure 6
Switch current limit
vs Temperature
Figure 7
vs Supply voltage, TPS61041-Q1
Figure 8
vs Supply voltage, TPS61040-Q1
Figure 9
vs Temperature
Figure 10
vs Supply voltage
Figure 11
η
Efficiency
IQ
Quiescent current
VFB
ISW
ICL
Switch current limit
RDS(on)
RDS(on)
Line transient response
Figure 13
Load transient response
Figure 14
Start-up behavior
Figure 15
90
90
L = 10 mH
VO = 18 V
VO = 18 V
88
88
VI = 5 V
86
86
82
80
VI = 2.4 V
78
74
72
72
70
0.10
100
Figure 1. Efficiency vs Output Current
88
1
10
IL - Load Current - mA
100
Figure 2. Efficiency vs Load Current
90
VO = 18 V
86
L = 10 mH
VO = 18 V
88
IO = 10 mA
86
L = 10 mH
IO = 5 mA
84
84
L = 3.3 mH
82
Efficiency - %
Efficiency - %
78
76
90
80
78
82
80
78
76
76
74
74
72
72
70
0.10
70
1
10
IL - Load Current - mA
100
Figure 3. Efficiency vs Load Current
6
80
74
1
10
IO - Output Current - mA
TPS61041-Q1
82
76
70
0.10
TPS61040-Q1
84
VI = 3.6 V
Efficiency - %
Efficiency - %
84
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1
2
3
4
5
6
VI - Input Voltage - V
Figure 4. Efficiency vs Input Voltage
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SGLS276D – JANUARY 2005 – REVISED MARCH 2016
1.24
40
TA = 85°C
35
VFB - Feedback Voltage - V
Quiescent Current - mA
1.238
30
TA = 27°C
25
TA = -40°C
20
15
10
1.236
VCC = 2.4 V
1.234
1.232
5
0
1.8
2.4
3
3.6
4.2
4.8
5.4
1.23
-40
6
-20
VI - Input Voltage - V
Figure 5. TPS61040-Q1 Quiescent Current vs Input Voltage
100
120
260
TPS61040-Q1
410
258
256
I CL - Current Limit - mA
390
370
350
330
310
290
254
TA = 27°C
252
250
248
246
244
270
TPS61041-Q1
250
242
230
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
TA - Temperature - °C
240
Figure 7. TPS6104x-Q1 Switch Current Limit vs Free-Air
Temperature
420
415
410
TA = 27°C
405
400
395
390
385
380
1.8
2.4
3
3.6
4.2
4.8
5.4
6
VCC - Supply Voltage - V
Figure 9. TPS61040-Q1 Current Limit vs Supply Voltage
1.8
2.4
3
3.6
4.2
4.8
5.4
6
VCC - Supply Voltage - V
Figure 8. TPS61041-Q1 Current Limit vs Supply Voltage
− Static Drain-Source On-State Resistance − mW
R
DS(on)
I SW - Switch Current Limit - mA
20
40
60
80
TA - Temperature - °C
Figure 6. Feedback Voltage vs Free-Air Temperature
430
ICL - Current Limit - mA
0
1200
1000
TPS61041-Q1
800
600
TPS61040-Q1
400
200
0
−40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90
TA − Temperature − °C
Figure 10. TPS6104x-Q1 Static Drain-Source ON-State
Resistance vs Free-Air Temperature
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RDS(on) − Static Drain-Source On-State Resistance − mW
SGLS276D – JANUARY 2005 – REVISED MARCH 2016
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1000
900
800
TPS61041-Q1
700
600
TPS61040-Q1
500
400
300
200
100
0
1.8
2.4
3
3.6
4.2
4.8
5.4
6
VCC − Supply Voltage − V
Figure 11. TPS6104x-Q1 Static Drain-Source ON-State Resistance vs Supply Voltage
8
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SGLS276D – JANUARY 2005 – REVISED MARCH 2016
7 Detailed Description
7.1 Overview
The TPS6104x-Q1 is a high-frequency boost converter dedicated for small-to-medium LCD bias supply and
white-LED backlight supplies. The device is ideal for generating output voltages up to 28 V from a dual-cell
NiMH/NiCd or a single-cell device Li-Ion battery.
7.2 Functional Block Diagram
SW
Under Voltage
Lockout
Bias Supply
VIN
400 ns Min
Off Time
Error Comparator
-
FB
S
+
RS Latch
Logic
Power MOSFET
N-Channel
Gate
Driver
VREF = 1.233 V
R
Current Limit
6 µs Max
On Time
EN
RSENSE
+
_
Soft
Start
GND
7.3 Feature Description
7.3.1 Peak Current Control
The internal switch turns on until the inductor current reaches the typical DC current limit (ILIM) of 400 mA
(TPS61040-Q1) or 250 mA (TPS61041-Q1). Due to the internal propagation delay of typical 100 ns, the actual
current exceeds the DC-current limit threshold by a small amount. The typical peak current limit can be
calculated:
V
IN
I
100 ns
peak(typ) = LIM + L ×
V
I
400 mA + IN × 100 ns for the TPS61040-Q1
peak(typ) =
L
V
I
250 mA + IN × 100 ns for the TPS61041-Q1
peak(typ) =
L
I
where
•
•
•
VIN= Input voltage
L= Selected inductor value
ILIM = Typical DC current limit
(1)
The higher the input voltage and the lower the inductor value, the greater the peak.
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Feature Description (continued)
By selecting the TPS6104x-Q1, it is possible to tailor the design to the specific application current limit
requirements. A lower current limit supports applications requiring lower output power and allows the use of an
inductor with a lower current rating and a smaller form factor. A lower current limit usually has a lower outputvoltage ripple as well.
7.3.2 Soft Start
All inductive step-up converters exhibit high inrush current during start-up if no special precaution is made. This
can cause voltage drops at the input rail during start-up and may result in an unwanted or early system
shutdown.
I LIM
The TPS6104x-Q1 limits this inrush current by increasing the current limit in two steps starting from 4
I LIM
256 cycles to
for
2 for the next 256 cycles, and then full current limit (see Figure 15).
7.3.3 Enable
Pulling the enable (EN) to ground shuts down the device reducing the shutdown current to 1 µA (typical).
Because there is a conductive path from the input to the output through the inductor and Schottky diode, the
output voltage is equal to the input voltage during shutdown. The enable pin must be terminated and must not be
left floating. Using a small external transistor disconnects the input from the output during shutdown as shown in
Figure 17.
7.3.4 Undervoltage Lockout
An undervoltage lockout prevents misoperation of the device at input voltages below typical 1.5 V. When the
input voltage is below the undervoltage threshold the main switch is turned off.
7.3.5 Thermal Shutdown
An internal thermal shutdown is implemented and turns off the internal MOSFETs when the typical junction
temperature of 168°C is exceeded. The thermal shutdown has a hysteresis of typically 25°C. This data is based
on statistical means and is not tested during the regular mass production of the IC.
7.4 Device Functional Modes
The TPS6104x-Q1 operates with an input voltage range of 1.8 V to 6 V and can generate output voltages up to
28 V. The device operates in a pulse frequency modulation (PFM) scheme with constant peak current control.
This control scheme maintains high efficiency over the entire load current range, and with a switching frequency
up to 1 MHz, the device enables the use of very small external components.
The converter monitors the output voltage, and as soon as the feedback voltage falls below the reference voltage
of typically 1.233 V, the internal switch turns on and the current ramps up. The switch turns off as soon as the
inductor current reaches the internally set peak current of typically 400 mA (TPS61040-Q1) or 250 mA
(TPS61041-Q1). See Peak Current Control for more information. The second criteria that turns off the switch is
the maximum ON-time of 6 µs (typical). This is just to limit the maximum ON-time of the converter to cover for
extreme conditions. As the switch is turned off, the external Schottky diode is forward biased delivering the
current to the output. The switch remains off for a minimum of 400 ns (typical), or until the feedback voltage
drops below the reference voltage again. Using this PFM peak-current control scheme, the converter operates in
discontinuous conduction mode (DCM) where the switching frequency depends on the output current, which
results in high efficiency over the entire load current range. This regulation scheme is inherently stable, allowing
a wider selection range for the inductor and output capacitor.
10
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SGLS276D – JANUARY 2005 – REVISED MARCH 2016
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TPS6104x-Q1 is designed for output voltages up to 28 V with an input voltage range of 1.8 V to 6 V.
TPS61040-Q1 can operate up to 400-mA typical peak load current and TPS61040-Q1 can operate up to 250-mA
typical peak load current. The device operates in a pulse-frequency-modulation (PFM) scheme with constant
peak-current control. This control scheme maintains high efficiency over the entire load current range, and with a
switching frequency up to 1 MHz, the device enables the use of very small external components.
8.2 Typical Application
The following section provides a step-by-step design approach for configuring the TPS61040-Q1 as a voltageregulating boost converter for LCD bias supply, as shown in Figure 12.
L1
10 mH
VIN
1.8 V to 6 V
VOUT
18 V
TPS61040-Q1
VIN
C1
4.7 mF
D1
R1
2.2 MW
SW
FB
EN
GND
CFF
22 pF
C2
1 mF
L1:
D1:
C1:
C2:
R2
160 kW
Sumida CR32-100
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Tayo Yuden TMK316BJ105KL
Figure 12. LCD Bias Supply
8.2.1 Design Requirements
Table 2 lists the design parameters for this example.
Table 2. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input Voltage
1.8 V to 6 V
Output Voltage
18 V
Output Current
10 mA
8.2.2 Detailed Design Procedure
8.2.2.1 Inductor Selection, Maximum Load Current
Because the PFM peak-current control scheme is inherently stable, the inductor value does not affect the stability
of the regulator. The selection of the inductor together with the nominal load current, input and output voltage of
the application determines the switching frequency of the converter. Depending on the application, TI
recommends inductor values from 2.2 µH to 47 µH. The maximum inductor value is determined by the maximum
ON-time of the switch, typically 6 µs. The peak current limit of 400 mA (typically) must be reached within this
6-µs period for proper operation.
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The inductor value determines the maximum switching frequency of the converter. Therefore, select the inductor
value that ensures the maximum switching frequency at the converter maximum load current is not exceeded.
The maximum switching frequency is calculated using Equation 2.
VIN(min) ´ (VOUT - VIN )
fS(max) =
IP ´ L ´ VOUT
Where:
•
•
•
IP = Peak current as described in Peak Current Control
L = Selected inductor value
VIN(min) = The highest switching frequency occurs at the minimum input voltage
(2)
If the selected inductor value does not exceed the maximum switching frequency of the converter, the next step
is to calculate the switching frequency at the nominal load current using Equation 3:
2 ´ Iload ´ (VOUT - VIN + Vd )
fS (Iload ) =
IP2 ´ L
Where:
•
•
•
•
IP = Peak current as described in Peak Current Control
L = Selected inductor value
Iload = Nominal load current
Vd = Rectifier diode forward voltage (typically 0.3 V)
(3)
A smaller inductor value gives a higher converter switching frequency, but lowers the efficiency.
The inductor value has less effect on the maximum available load current and is only of secondary order. The
best way to calculate the maximum available load current under certain operating conditions is to estimate the
expected converter efficiency at the maximum load current. This number can be taken out of the efficiency
graphs shown in Figure 1, Figure 2, Figure 3, and Figure 4. The maximum load current can then be estimated
using Equation 4.
I lo a d(m a x) = h
I P 2 ´ L ´ fS (m a x)
2 ´ ( V O U T - VIN )
Where:
•
•
•
•
IP = Peak current as described in Peak Current Control
L = Selected inductor value
fS(max) = Maximum switching frequency as calculated previously
η = Expected converter efficiency. Typically 70% to 85%.
(4)
The maximum load current of the converter is the current at the operation point where the converter starts to
enter the continuous conduction mode. Usually the converter should always operate in discontinuous conduction
mode.
Last, the selected inductor must have a saturation current that exceeds the maximum peak current of the
converter (as calculated in Peak Current Control). Use the maximum value for ILIM for this calculation.
Another important inductor parameter is the DC resistance. The lower the DC resistance, the higher the
efficiency of the converter. Table 3 lists few typical inductors for LCD Bias Supply design (see Figure 12), but
customers must verify and validate them to check whether they are suitable for their application.
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Table 3. Typical Inductors for LCD Bias Supply (see Figure 12)
DEVICE
TPS61040Q1
TPS61041Q1
INDUCTOR VALUE
COMPONENT SUPPLIER
COMMENTS
10 μH
Sumida CDRH3D16-100
High efficiency
10 μH
Murata LQH4C100K04
High efficiency
4.7 μH
Sumida CDRH3D16-4R7
Small solution size
4.7 μH
Murata LQH3C4R7M24
Small solution size
10 μH
Murata LQH3C100K24
High efficiency
Small solution size
8.2.2.2 Setting The Output Voltage and Feed-Forward Capacitor
The output voltage is calculated as:
V out + 1.233 V
ǒ1 ) R1
Ǔ
R2
(5)
For battery-powered applications, a high impedance voltage divider must be used with a typical value for R2 of
≤200 kΩ and a maximum value for R1 of 2.2 MΩ. Smaller values can be used to reduce the noise sensitivity of
the feedback pin.
A feed-forward capacitor across the upper feedback resistor R1 is required to provide sufficient overdrive for the
error comparator. Without a feed-forward capacitor, or one whose value is too small, the TPS6104x-Q1 shows
double pulses or a pulse burst instead of single pulses at the switch node (SW), causing higher output voltage
ripple. If this higher output voltage ripple is acceptable, the feed-forward capacitor can be left out.
The lower the switching frequency of the converter, the larger the feed-forward capacitor value required. A good
starting point is to use a 10-pF feed-forward capacitor. As a first estimation, the required value for the feedforward capacitor at the operation point can also be calculated using Equation 6.
1
C
+
FF
fS
R1
2 p
20
Where:
•
•
•
R1 = Upper resistor of voltage divider
fS = Switching frequency of the converter at the nominal load current (see Inductor Selection, Maximum Load
Current for calculating the switching frequency)
CFF = Choose a value that comes closest to the result of the calculation
(6)
The larger the feed-forward capacitor the worse the line regulation of the device. Therefore, when concern for
line regulation is paramount, the selected feed-forward capacitor must be as small as possible. See the next
section for more information about line and load regulation.
8.2.2.3 Line and Load Regulation
The line regulation of the TPS6104x-Q1 depends on the voltage ripple on the feedback pin. Usually a 50-mV
peak-to-peak voltage ripple on the feedback pin FB gives good results.
Some applications require a very tight line regulation and can only allow a small change in output voltage over a
certain input voltage range. If no feed-forward capacitor CFF is used across the upper resistor of the voltage
feedback divider, the device has the best line regulation. Without the feed-forward capacitor the output voltage
ripple is higher because the TPS6104x-Q1 shows output voltage bursts instead of single pulses on the switch pin
(SW), increasing the output voltage ripple. Increasing the output capacitor value reduces the output voltage
ripple.
If a larger output capacitor value is not an option, a feed-forward capacitor CFF can be used as described in the
previous section. The use of a feed-forward capacitor increases the amount of voltage ripple present on the
feedback pin (FB). The greater the voltage ripple on the feedback pin (≥50 mV), the worse the line regulation.
There are two ways to improve the line regulation further:
1. Use a smaller inductor value to increase the switching frequency which will lower the output voltage ripple,
as well as the voltage ripple on the feedback pin.
2. Add a small capacitor from the feedback pin (FB) to ground to reduce the voltage ripple on the feedback pin
down to 50 mV again. As a starting point, the same capacitor value as selected for the feed-forward
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capacitor CFF can be used.
8.2.2.4 Output Capacitor Selection
For best output voltage filtering, TI recommends a low ESR output capacitor. Ceramic capacitors have a low
ESR value but tantalum capacitors can be used as well, depending on the application.
Assuming the converter does not show double pulses or pulse bursts on the switch node (SW), the output
voltage ripple can be calculated using Equation 7.
I
DV out + out
Cout
Ǔ
ǒ
I
L
1
P
–
fS(Iout) Vout ) Vd–Vin
)I
P
ESR
Where:
•
•
•
•
•
•
•
IP = Peak current as described in the Peak Current Control section
L = Selected inductor value
Iout = Nominal load current
fS (Iout) = Switching frequency at the nominal load current as calculated previously
Vd = Rectifier diode forward voltage (typically 0.3 V)
Cout = Selected output capacitor
ESR = Output capacitor ESR value
(7)
Table 4 lists few typical capacitors for LCD Bias Supply design (see Figure 12), but customers must verify and
validate them to check whether they are suitable for their application.
Table 4. Typical Input and Output Capacitors for LCD Bias Supply Design (See Figure 12)
DEVICE
TPS6104x-Q1
CAPACITOR
VOLTAGE RATING
COMPONENT SUPPLIER
COMMENTS
4.7 μF/X5R/0805
6.3 V
Taiyo Yuden JMK212BY475MG
CIN
10 μF/X5R/0805
6.3 V
Taiyo Yuden JMK212BJ106MG
CIN
1 μF/X7R/1206
25 V
Taiyo Yuden TMK316BJ105KL
COUT
1 μF/X5R/1206
35 V
Taiyo Yuden GMK316BJ105KL
COUT
4.7 μF/X5R/1210
25 V
Taiyo Yuden TMK325BJ475MG
COUT
8.2.2.5 Input Capacitor Selection
For good input voltage filtering, TI recommends low-ESR ceramic capacitors. A 4.7-μF ceramic input capacitor is
sufficient for most of the applications. For better input voltage filtering this value can be increased. See Table 4
and the Typical Application section for input capacitor recommendations.
8.2.2.6 Diode Selection
To achieve high efficiency, a Schottky diode must be used. The current rating of the diode must meet the peak
current rating of the converter as it is calculated in the section peak current control. Use the maximum value for
ILIM for this calculation. Table 5 lists the few typical Schottky Diodes for LCD Bias Supply design shown in
Figure 12. Customers must verify and validate them, however, to check whether they are suitable for their
application.
Table 5. Typical Schottky Diodes for LCD Bias Supply Design (See Figure 12)
DEVICE
TPS6104x-Q1
14
REVERSE VOLTAGE
COMPONENT SUPPLIER
30 V
ON Semiconductor MBR0530
20 V
ON Semiconductor MBR0520
20 V
ON Semiconductor MBRM120L
30 V
Toshiba CRS02
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COMMENTS
High efficiency
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8.2.3 Application Curves
VO = 18 V
VO = 18 V
VI
2.4 V to 3.4 V
VO
100 mA/div
VO
100 mV/div
VO
1 mA to 10 mA
200 µS/div
200 µS/div
Figure 14. Load Transient Response
Figure 13. Line Transient Response
VO = 18 V
VO
5 V/div
EN
1 V/div
II
50 mA/div
Figure 15. Start-Up Behavior
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8.3 System Examples
Figure 16 to Figure 22 shows the different possible power supply designs with the TPS6104x-Q1 devices.
However, these circuits must be fully validated and tested by customers before they actually use them in their
designs. TI does not warrant the accuracy or completeness of these circuits, nor does TI accept any
responsibility for them.
L1
10 mH
D1
VO
18 V
TPS61040
VIN
1.8 V to 6 V
VIN
CFF
22 pF
R1
2.2 MW
SW
C2
1 mF
FB
C1
4.7 mF
EN
GND
DAC or Analog Voltage
0 V = 25 V
1.233 V = 18 V
R2
160 kW
L1:
D1:
C1:
C2:
Sumida CR32-100
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Tayo Yuden GMK316BJ105KL
Figure 16. LCD Bias Supply With Adjustable Output Voltage
R3
200 kW
L1
10 mH
VIN
1.8 V to 6 V
TPS61040
VIN
C1
4.7 mF
SW
FB
EN
GND
BC857C
D1
VOUT
18 V / 10 mA
R1
2.2 MW
C2
1 mF
R2
160 kW
CFF
22 pF
C3
0.1 mF
(Optional)
L1:
D1:
C1:
C2:
Sumida CR32-100
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Tayo Yuden TMK316BJ105KL
Figure 17. LCD Bias Supply With Load Disconnect
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System Examples (continued)
D3
V2 = -10 V/15 mA
D2
L1
6.8 mH
C4
4.7 mF
C3
1 mF
D1
V1 = 10 V/15 mA
TPS61040
VIN
VIN = 2.7 V to 5 V
SW
R1
1.5 MW
CFF
22 pF
C2
1 mF
FB
C1
4.7 mF
EN
GND
L1:
D1, D2, D3:
C1:
C2, C3, C4:
R2
210 kW
Murata LQH4C6R8M04
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Tayo Yuden EMK316BJ105KF
Figure 18. Positive and Negative Output LCD Bias Supply
L1
6.8 mH
D1
VO = 12 V/35 mA
TPS61040
VIN 3.3 V
C1
10 mF
VIN
R1
1.8 MW
SW
CFF
4.7 pF
C2
4.7 mF
FB
EN
GND
L1:
D1:
C1:
C2:
R2
205 kW
Murata LQH4C6R8M04
Motorola MBR0530
Tayo Yuden JMK212BJ106MG
Tayo Yuden EMK316BJ475ML
Figure 19. Standard 3.3-V to 12-V Supply
D1
3.3 mH
5 V/45 mA
TPS61040
1.8 V to 4 V
VIN
SW
R1
620 kW
FB
C1
4.7 mF
EN
GND
R2
200 kW
CFF
3.3 pF
C2
4.7 mF
L1:
D1:
C1, C2:
Murata LQH4C3R3M04
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Figure 20. Dual Battery Cell to 5-V/50-mA Conversion
Efficiency Approximately Equals 84% at VIN = 2.4 V to VO = 5 V/45 mA
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System Examples (continued)
L1
10 µH
VCC = 2.7 V to 6 V
VIN
D1
SW
C1
4.7 µF
D2
24 V
(Optional)
FB
EN
PWM
100 Hz to 500 Hz
C2
1 µF
GND
L1:
D1:
C1:
C2:
RS
82 Ω
Murata LQH4C100K04
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Tayo Yuden TMK316BJ105KL
Figure 21. White-LED Supply With Adjustable Brightness Control
Using a PWM Signal on the Enable Pin Efficiency Approx. Equals 86% at VIN = 3 V, ILED = 15 mA
L1
10 mH
VCC = 2.7 V to 6 V
C1
4.7 mF
VIN
SW
D2
24 V
(Optional)
C2†
100 nF
FB
EN
R1
120 kW
GND
Analog Brightness Control
3.3 V@ Led Off
0 V@ Iled = 20 mA
A.
D1
MBRM120L
RS
110 W
R2 160 kW
L1:
D1:
C1:
C2:
Murata LQH4C3R3M04
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Standard Ceramic Capacitor
A smaller output capacitor value for C2 causes a larger LED ripple.
Figure 22. White-LED Supply With Adjustable Brightness Control
Using an Analog Signal on the Feedback Pin
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SGLS276D – JANUARY 2005 – REVISED MARCH 2016
9 Power Supply Recommendations
The device is designed to operate from an input voltage supply range from 1.8 V to 6 V. The output current of the
input power supply must be rated according to the supply voltage, output voltage, and output current of
TPS6104x-Q1.
10 Layout
10.1 Layout Guidelines
Typical for all switching power supplies, the layout is an important step in the design; especially at high peak
currents and switching frequencies. If the layout is not carefully done, the regulator can show noise problems and
duty cycle jitter.
Figure 23 provides an example of layout design with TPS6104x-Q1 device.
• The input capacitor must be placed as close as possible to the input pin for good input voltage filtering.
• The inductor and diode must be placed as close as possible to the switch pin to minimize the noise coupling
into other circuits.
• Keeping the switching pin and plane area short helps in minimizing the radiated emissions. It is also important
to have very low impedance switch plane to reduce the switching losses and hence a trade-off must be made
between these two and the switching pin and plane must be optimized.
• Because the feedback pin and network is noise-sensitive, the feedback network must be routed away from
the inductor.
• The feedback pin and feedback network must be shielded with a ground plane or trace to minimize noise
coupling into this circuit.
• A star ground connection or ground plane minimizes ground shifts and noise.
10.2 Layout Example
VIN
VOUT
1
GND
2
FB
3
TPS61040
SW
5
VIN
4
EN
GND
Figure 23. Layout Diagram
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 6. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS61040-Q1
Click here
Click here
Click here
Click here
Click here
TPS61041-Q1
Click here
Click here
Click here
Click here
Click here
11.3 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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28-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TPS61040AQDBVRQ1
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
2O6D
Samples
TPS61040QDBVRQ1
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
PHOQ
Samples
TPS61041AQDBVRQ1
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
2O7D
Samples
TPS61041QDBVRQ1
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
PHPQ
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of