TPS61040, TPS61041
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
TPS6104x Low-Power DC-DC Boost Converter in SOT-23 and WSON Packages
1 Features
3 Description
•
•
•
The TPS6104x is a high-frequency boost converter
dedicated for small to medium LCD bias supply and
white LED backlight supplies. The device is ideal to
generate output voltages up to 28 V from a dual-cell
NiMH/NiCd or a single-cell Li-Ion battery. The part can
also be used to generate standard 3.3-V or 5-V to
12-V power conversions.
2 Applications
•
•
•
•
•
•
•
LCD Bias Supply
White-LED Supply for LCD Backlights
Digital Still Camera
PDAs, Organizers, and Handheld PCs
Cellular Phones
Internet Audio Players
Standard 3.3-V or 5-V to 12-V Conversion
The TPS6104x operates with a switching frequency
up to 1 MHz. This frequency allows the use of
small external components using ceramic as well
as tantalum output capacitors. Together with the
thin WSON package, the TPS6104x gives a very
small overall solution size. The TPS61040 device
has an internal 400-mA switch current limit, while the
TPS61041 device has a 250-mA switch current limit,
offering lower output voltage ripple and allows the
use of a smaller form factor inductor for lower power
applications. The low quiescent current (typically 28
μA) together with an optimized control scheme, allows
device operation at very high efficiencies over the
entire load current range.
Device Information
PACKAGE(1)
PART NUMBER
TPS61040
TPS61041
(1)
BODY SIZE (NOM)
SOT-23 (5)
2.90 mm × 1.60 mm
SOT (5)
2.90 mm ×1.60 mm
WSON (6)
2.00 mm × 2.00 mm
SOT-23 (5)
2.90 mm ×1.60 mm
WSON (6)
2.00 mm × 2.00 mm
For all available packages, see the orderable addendum at
the end of the datasheet.
Efficiency vs Output Current
90
L1
10 mH
D1
5 V
IN
CIN
4.7 mF
SW
FB
R1
1
VI = 5 V
86
84
CFF
CO
1 mF
3
VO = 18 V
88
VOUT
VIN to 28 V
VIN
1.8 V to 6 V
Efficiency − %
•
•
•
•
•
1.8-V to 6-V Input Voltage Range
Adjustable Output Voltage Range up to 28 V
400-mA (TPS61040) and 250-mA (TPS61041)
Internal Switch Current
Up to 1-MHz Switching Frequency
28-μA Typical No-Load Quiescent Current
1-μA Typical Shutdown Current
Internal Soft Start
Available in SOT23-5, TSOT23-5,
and 2-mm × 2-mm × 0.8-mm WSON Packages
VI = 3.6 V
82
80
VI = 2.4 V
78
76
4
EN
GND
2
74
R2
72
70
0.1
1
10
IO − Output Current − mA
100
Copyright © 2016, Texas Instruments Incorporated
Typical Application Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................4
6.5 Electrical Characteristics.............................................5
6.6 Typical Characteristics................................................ 6
7 Detailed Description........................................................9
7.1 Overview..................................................................... 9
7.2 Functional Block Diagram........................................... 9
7.3 Feature Description.....................................................9
7.4 Device Functional Modes..........................................10
8 Application and Implementation.................................. 11
8.1 Application Information..............................................11
8.2 Typical Application.................................................... 11
8.3 System Examples..................................................... 16
9 Power Supply Recommendations................................19
10 Layout...........................................................................19
10.1 Layout Guidelines................................................... 19
10.2 Layout Example...................................................... 19
11 Device and Documentation Support..........................20
11.1 Third-Party Products Disclaimer............................. 20
11.2 Support Resources................................................. 20
11.3 Trademarks............................................................. 20
11.4 Electrostatic Discharge Caution.............................. 20
11.5 Glossary.................................................................. 20
12 Mechanical, Packaging, and Orderable
Information.................................................................... 20
4 Revision History
Changes from Revision J (December 2019) to Revision K (July 2022)
Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
Changes from Revision I (December 2016) to Revision J (December 2019)
Page
• Changed DRV package pinout image to show thermal pad outline and transparent top view .......................... 3
Changes from Revision H (October 2015) to Revision I (December 2016)
Page
• Changed CIN from: 4.7 mF To: 4.7 µF and CO From: 1 mF To: 1 µF in the Typical Application Schematic .......1
Changes from Revision G (December 2014) to Revision H (October 2015)
Page
• Added 500 µs/div label to X-axis of Figure 8-4. ............................................................................................... 15
Changes from Revision F (December 2010) to Revision G (December 2014)
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section................... 1
2
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
5 Pin Configuration and Functions
SW
1
GND
2
FB
3
5
VIN
4
EN
Figure 5-1. DDC Package, DBV Package SOT 5 Pins Top View
GND
1
VIN
2
EN
3
Thermal
PAD
6
SW
5
NC
4
FB
Figure 5-2. DRV Package WSON 6 Pins Transparent Top View
Table 5-1. Pin Functions
PIN
I/O
DESCRIPTION
DDC,
DBV NO.
DRV NO.
EN
4
3
I
This is the enable pin of the device. Pulling this pin to ground forces the device into
shutdown mode reducing the supply current to less than 1 μA. This pin should not be left
floating and needs to be terminated.
FB
3
4
I
This is the feedback pin of the device. Connect this pin to the external voltage divider to
program the desired output voltage.
GND
2
1
–
Ground
NC
–
5
–
No connection
SW
1
6
I
Connect the inductor and the Schottky diode to this pin. This is the switch pin and is
connected to the drain of the internal power MOSFET.
VIN
5
2
I
Supply voltage pin
-
ThermalPAD
-
Solder to ground plane for heat sink
NAME
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
3
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Supply voltages on pin VIN (2)
Voltages on pins EN, FB
(2)
MIN
MAX
UNIT
–0.3
7
V
–0.3
VIN + 0.3
V
Switch voltage on pin SW (2)
30
30
V
Operating junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
All voltage values are with respect to network ground terminal.
6.2 ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC
V(ESD)
(1)
(2)
Electrostatic discharge
JS-001(1)
UNIT
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101(2)
V
±750
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±XXX V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±YYY V may actually have higher performance.
6.3 Recommended Operating Conditions
MIN
NOM
MAX
VIN
Input voltage range
VOUT
Output voltage range
L
Inductor(1)
f
Switching frequency(1)
CIN
Input capacitor (1)
COUT
Output capacitor (1)
TA
Operating ambient temperature
–40
85
°C
TJ
Operating junction temperature
–40
125
°C
(1)
1.8
UNIT
2.2
6
V
28
V
1
MHz
10
μH
4.7
μF
1
μF
See application section for further information.
6.4 Thermal Information
TPS61040
THERMAL
TPS61041
DBV
DDC
DRV
DBV
DRV
5 PINS
5 PINS
6 PINS
5 PINS
6 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
205.2
214.7
83.0
205.2
83.0
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
118.3
38.5
57.1
118.3
57.1
°C/W
RθJB
Junction-to-board thermal resistance
34.8
35.4
52.9
34.8
52.9
°C/W
ψJT
Junction-to-top characterization parameter
12.2
0.4
2.4
12.2
2.4
°C/W
ψJB
Junction-to-board characterization parameter
33.9
34.8
53.4
33.9
53.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
—
26.9
—
26.9
°C/W
(1)
4
METRIC(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
6.5 Electrical Characteristics
VIN = 2.4 V, EN = VIN, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
VIN
Input voltage range
1.8
6
V
IQ
Operating quiescent current
IOUT = 0 mA, not switching, VFB = 1.3 V
ISD
Shutdown current
EN = GND
28
50
μA
0.1
1
μA
VUVLO
Undervoltage lockout threshold
1.5
1.7
V
ENABLE
VIH
EN high level input voltage
VIL
EN low level input voltage
II
EN input leakage current
1.3
EN = GND or VIN
V
0.1
0.4
V
1
μA
30
V
POWER SWITCH AND CURRENT LIMIT
Vsw
Maximum switch voltage
toff
Minimum off time
250
400
550
ns
ton
Maximum on time
4
6
7.5
μs
RDS(on)
MOSFET on-resistance
VIN = 2.4 V; ISW = 200 mA; TPS61040
600
1000
mΩ
RDS(on)
MOSFET on-resistance
VIN = 2.4 V; ISW = 200 mA; TPS61041
750
1250
mΩ
MOSFET leakage current
VSW = 28 V
1
10
μA
ILIM
MOSFET current limit
TPS61040
350
400
450
mA
ILIM
MOSFET current limit
TPS61041
215
250
285
mA
28
V
OUTPUT
VOUT
Adjustable output voltage range
Vref
Internal voltage reference
IFB
Feedback input bias current
VFB = 1.3 V
VFB
Feedback trip point voltage
1.8 V ≤ VIN ≤ 6 V
Line regulation (1)
1.8 V ≤ VIN ≤ 6 V; VOUT = 18 V; Iload = 10 mA;
CFF = not connected
0.05
%/V
Load regulation(1)
VIN = 2.4 V; VOUT = 18 V; 0 mA ≤ IOUT ≤ 30 mA
0.15
%/mA
(1)
VIN
1.233
1.208
1.233
V
1
μA
1.258
V
The line and load regulation depend on the external component selection. See the application section for further information.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
5
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
6.6 Typical Characteristics
Table 6-1. Table of Graphs
FIGURE
η
Efficiency
vs Load current
Figure 6-1,
Figure 6-2,
Figure 6-3
vs Input voltage
Figure 6-4
IQ
Quiescent current
vs Input voltage and temperature
Figure 6-5
VFB
Feedback voltage
vs Temperature
Figure 6-6
ISW
Switch current limit
vs Temperature
Figure 6-7
vs Supply voltage, TPS61041
Figure 6-8
ICL
Switch current limit
RDS(on)
RDS(on)
vs Supply voltage, TPS61040
Figure 6-9
vs Temperature
Figure 6-10
vs Supply voltage
Figure 6-11
Line transient response
Figure 8-2
Load transient response
Figure 8-3
Start-up behavior
Figure 8-4
90
90
VO = 18 V
86
86
84
84
VI = 3.6 V
82
80
VI = 2.4 V
78
74
72
72
70
0.1
100
Figure 6-1. Efficiency vs Output Current
86
L = 10 µH
VO = 18 V
88
IO = 10 mA
86
L = 10 µH
IO = 5 mA
84
L = 3.3 µH
82
Efficiency − %
Efficiency − %
100
90
VO = 18 V
84
80
78
82
80
78
76
76
74
74
72
72
70
0.1
1
10
IL − Load Current − mA
Figure 6-2. Efficiency vs Load Current
90
70
1
10
IL − Load Current − mA
100
1
2
3
4
5
6
VI − Input Voltage − V
Figure 6-3. Efficiency vs Load Current
6
78
76
88
TPS61041
80
74
1
10
IO − Output Current − mA
TPS61040
82
76
70
0.1
L = 10 µH
VO = 18 V
88
VI = 5 V
Efficiency − %
Efficiency − %
88
Figure 6-4. Efficiency vs Input Voltage
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
6.6 Typical Characteristics (continued)
40
1.24
TA = 85°C
35
VFB − Feedback Voltage − V
Quiescent Current − µA
1.238
30
TA = 27°C
25
TA = −40°C
20
15
10
1.236
VCC = 2.4 V
1.234
1.232
5
0
1.8
2.4
3
3.6
4.2
4.8
5.4
1.23
−40
6
−20
VI − Input Voltage − V
Figure 6-5. TPS61040 Quiescent Current vs Input Voltage
120
258
390
I(CL) − Current Limit − mA
256
370
350
330
310
290
270
254
250
248
246
244
TPS61041
242
230
−40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90
TA − Temperature − °C
240
Figure 6-7. TPS6104x Switch Current Limit vs Free-Air
Temperature
420
415
410
405
TA = 27°C
400
395
390
385
2.4
3
3.6
4.2
TA = 27°C
252
250
4.8
5.4
6
VCC − Supply Voltage − V
Figure 6-9. TPS61040 Current Limit vs Supply Voltage
1.8
2.4
3
3.6
4.2
4.8
5.4
6
VCC − Supply Voltage − V
Figure 6-8. TPS61041 Current Limit vs Supply Voltage
rDS(on) − Static Drain-Source On-State Resistance − mΩ
I(SW) − Switch Current Limit − mA
100
260
TPS61040
410
I(CL) − Current Limit − mA
20
40
60
80
TA − Temperature − °C
Figure 6-6. Feedback Voltage vs Free-Air Temperature
430
380
1.8
0
1200
1000
TPS61041
800
600
TPS61040
400
200
0
−40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90
TA − Temperature − °C
Figure 6-10. TPS6104x Static Drain-Source On-State Resistance
vs Free-Air Temperature
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
7
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
rDS(on) − Static Drain-Source On-State Resistance − mΩ
6.6 Typical Characteristics (continued)
1000
900
800
TPS61041
700
600
TPS61040
500
400
300
200
100
0
1.8
2.4
3
3.6
4.2
4.8
5.4
6
VCC − Supply Voltage − V
Figure 6-11. TPS6104x Static Drain-Source On-State Resistance vs Supply Voltage
8
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
7 Detailed Description
7.1 Overview
The TPS6104x is a high-frequency boost converter dedicated for small to medium LCD bias supply and white
LED backlight supplies. The device is ideal to generate output voltages up to 28 V from a dual-cell NiMH/NiCd or
a single cell device Li-Ion battery.
7.2 Functional Block Diagram
SW
Under Voltage
Lockout
Bias Supply
VIN
400 ns Min
Off T ime
Error Comparator
-
FB
S
+
RS Latch
Logic
Gate
Driver
Power MOSFET
N-Channel
VREF = 1.233 V
R
Current Limit
EN
RSENSE
+
_
6 ms Max
On Time
Soft
Start
GND
Copyright © 2016, Texas Instruments Incorporated
7.3 Feature Description
7.3.1 Peak Current Control
The internal switch turns on until the inductor current reaches the typical dc current limit (ILIM) of 400 mA
(TPS61040) or 250 mA (TPS61041). Due to the internal propagation delay of typical 100 ns, the actual current
exceeds the dc current limit threshold by a small amount. The typical peak current limit can be calculated:
V
IN
I
× 100 ns
+
peak(typ) = LIM
L
V
I
400 mA + IN × 100 ns for the TPS61040-Q1
=
peak(typ)
L
V
I
250 mA + IN × 100 ns for the TPS61041-Q1
peak(typ) =
L
I
(1)
The higher the input voltage and the lower the inductor value, the greater the peak.
By selecting the TPS6104x, it is possible to tailor the design to the specific application current limit requirements.
A lower current limit supports applications requiring lower output power and allows the use of an inductor with a
lower current rating and a smaller form factor. A lower current limit usually has a lower output voltage ripple as
well.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
9
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
7.3.2 Soft Start
All inductive step-up converters exhibit high inrush current during start-up if no special precaution is made. This
can cause voltage drops at the input rail during start up and may result in an unwanted or early system shut
down.
The TPS6104x limits this inrush current by increasing the current limit in two steps starting from
cycles to
I LIM
2
I LIM
4
for 256
for the next 256 cycles, and then full current limit (see Figure 8-4).
7.3.3 Enable
Pulling the enable (EN) to ground shuts down the device reducing the shutdown current to 1 μA (typical).
Because there is a conductive path from the input to the output through the inductor and Schottky diode, the
output voltage is equal to the input voltage during shutdown. The enable pin needs to be terminated and should
not be left floating. Using a small external transistor disconnects the input from the output during shutdown as
shown in Figure 8-6.
7.3.4 Undervoltage Lockout
An undervoltage lockout prevents misoperation of the device at input voltages below typical 1.5 V. When the
input voltage is below the undervoltage threshold, the main switch is turned off.
7.3.5 Thermal Shutdown
An internal thermal shutdown is implemented and turns off the internal MOSFETs when the typical junction
temperature of 168°C is exceeded. The thermal shutdown has a hysteresis of typically 25°C. This data is based
on statistical means and is not tested during the regular mass production of the IC.
7.4 Device Functional Modes
7.4.1 Operation
The TPS6104x operates with an input voltage range of 1.8 V to 6 V and can generate output voltages up to 28
V. The device operates in a pulse-frequency-modulation (PFM) scheme with constant peak current control. This
control scheme maintains high efficiency over the entire load current range, and with a switching frequency up to
1 MHz, the device enables the use of very small external components.
The converter monitors the output voltage, and as soon as the feedback voltage falls below the reference
voltage of typically 1.233 V, the internal switch turns on and the current ramps up. The switch turns off as
soon as the inductor current reaches the internally set peak current of typically 400 mA (TPS61040) or 250 mA
(TPS61041). See Peak Current Control for more information. The second criteria that turns off the switch is the
maximum on-time of 6 μs (typical). This is just to limit the maximum on-time of the converter to cover for extreme
conditions. As the switch is turned off the external Schottky diode is forward biased delivering the current to the
output. The switch remains off for a minimum of 400 ns (typical), or until the feedback voltage drops below the
reference voltage again. Using this PFM peak current control scheme the converter operates in discontinuous
conduction mode (DCM) where the switching frequency depends on the output current, which results in very
high efficiency over the entire load current range. This regulation scheme is inherently stable, allowing a wider
selection range for the inductor and output capacitor.
10
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
The TPS6104x is designed for output voltages up to 28 V with an input voltage range of 1.8 V to 6 V and
a switch peak current limit of 400 mA (250 mA for the TPS61041). The device operates in a pulse-frequencymodulation (PFM) scheme with constant peak current control. This control scheme maintains high efficiency over
the entire load current range, and with a switching frequency up to 1 MHz, the device enables the use of very
small external components. The following section provides a step-by-step design approach for configuring the
TPS61040 as a voltage regulating boost converter for LCD bias power supply, as shown in Figure 8-1.
8.2 Typical Application
The following section provides a step-by-step design approach for configuring the TPS611040 as a voltage
regulating boost converter for LCD bias supply, as shown in Figure 8-1.
L1
10 μH
VIN
1.8 V to 6 V
VOUT
18 V
TPS61040
VIN
C1
4.7 μF
D1
SW
R1
2.2 MΩ
FB
EN
GND
CFF
22 pF
C2
1 μF
L1:
D1:
C1:
C2:
R2
160 kΩ
Sumida CR32-100
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Tayo Yuden TMK316BJ105KL
Copyright © 2016, Texas Instruments Incorporated
Figure 8-1. LCD Bias Supply
8.2.1 Design Requirements
Table 8-1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input Voltage
1.8 V to 6 V
Output Voltage
18 V
Output Current
10 mA
8.2.2 Detailed Design Procedure
8.2.2.1 Inductor Selection, Maximum Load Current
Because the PFM peak current control scheme is inherently stable, the inductor value does not affect the
stability of the regulator. The selection of the inductor together with the nominal load current, input and output
voltage of the application determines the switching frequency of the converter. Depending on the application,
inductor values from 2.2 μH to 47 μH are recommended. The maximum inductor value is determined by the
maximum on time of the switch, typically 6 μs. The peak current limit of 400 mA/250 mA (typically) should be
reached within this 6-μs period for proper operation.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
11
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
The inductor value determines the maximum switching frequency of the converter. Therefore, select the inductor
value that ensures the maximum switching frequency at the converter maximum load current is not exceeded.
The maximum switching frequency is calculated by the following formula:
fS(max) =
VIN(min) ´ (VOUT - VIN )
IP ´ L ´ VOUT
(2)
where
•
•
•
IP = Peak current as described in Peak Current Control
L = Selected inductor value
VIN(min) = The highest switching frequency occurs at the minimum input voltage
If the selected inductor value does not exceed the maximum switching frequency of the converter, the next step
is to calculate the switching frequency at the nominal load current using the following formula:
fS (Iload ) =
2 ´ Iload ´ (VOUT - VIN + Vd )
IP2 ´ L
(3)
where
•
•
•
•
IP = Peak current as described in Peak Current Control
L = Selected inductor value
Iload = Nominal load current
Vd = Rectifier diode forward voltage (typically 0.3 V)
A smaller inductor value gives a higher converter switching frequency, but lowers the efficiency.
The inductor value has less effect on the maximum available load current and is only of secondary order. The
best way to calculate the maximum available load current under certain operating conditions is to estimate the
expected converter efficiency at the maximum load current. This number can be taken out of the efficiency
graphs shown in Figure 6-1 through Figure 6-4. The maximum load current can then be estimated as follows:
I lo a d(m a x) = h
I P 2 ´ L ´ fS (m a x)
2 ´ ( V O U T - VIN )
(4)
where
•
•
•
•
IP = Peak current as described in Peak Current Control
L = Selected inductor value
fSmax = Maximum switching frequency as calculated previously
η = Expected converter efficiency. Typically 70% to 85%
The maximum load current of the converter is the current at the operation point where the converter starts to
enter the continuous conduction mode. Usually the converter should always operate in discontinuous conduction
mode.
Last, the selected inductor should have a saturation current that meets the maximum peak current of the
converter (as calculated in Peak Current Control). Use the maximum value for ILIM for this calculation.
Another important inductor parameter is the dc resistance. The lower the dc resistance, the higher the efficiency
of the converter. See Table 8-2 and the typical applications for the inductor selection.
12
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
Table 8-2. Recommended Inductor for Typical LCD Bias Supply (see Figure
10-1)
DEVICE
INDUCTOR VALUE
COMPONENT SUPPLIER(1)
COMMENTS
10 μH
Sumida CR32-100
High efficiency
10 μH
Sumida CDRH3D16-100
High efficiency
10 μH
Murata LQH4C100K04
High efficiency
4.7 μH
Sumida CDRH3D16-4R7
Small solution size
4.7 μH
Murata LQH3C4R7M24
Small solution size
10 μH
Murata LQH3C100K24
High efficiency
Small solution size
TPS61040
TPS61041
(1)
See Third-Party Products disclaimer
8.2.2.2 Setting the Output Voltage
The output voltage is calculated as:
V
OUT
+ 1.233 V
Ǔ
ǒ1 ) R1
R2
(5)
For battery-powered applications, a high-impedance voltage divider should be used with a typical value for R2 of
≤200 kΩ and a maximum value for R1 of 2.2 MΩ. Smaller values might be used to reduce the noise sensitivity of
the feedback pin.
A feedforward capacitor across the upper feedback resistor R1 is required to provide sufficient overdrive for the
error comparator. Without a feedforward capacitor, or one whose value is too small, the TPS6104x shows double
pulses or a pulse burst instead of single pulses at the switch node (SW), causing higher output voltage ripple. If
this higher output voltage ripple is acceptable, the feedforward capacitor can be left out.
The lower the switching frequency of the converter, the larger the feedforward capacitor value required. A good
starting point is to use a 10-pF feedforward capacitor. As a first estimation, the required value for the feedforward
capacitor at the operation point can also be calculated using the following formula:
C
FF
+
2
p
1
fS
20
R1
(6)
where
•
•
•
R1 = Upper resistor of voltage divider
fS = Switching frequency of the converter at the nominal load current (See Inductor Selection, Maximum Load
Current for calculating the switching frequency)
CFF = Choose a value that comes closest to the result of the calculation
The larger the feedforward capacitor the worse the line regulation of the device. Therefore, when concern for line
regulation is paramount, the selected feedforward capacitor should be as small as possible. See the following
section for more information about line and load regulation.
8.2.2.3 Line and Load Regulation
The line regulation of the TPS6104x depends on the voltage ripple on the feedback pin. Usually a 50 mV
peak-to-peak voltage ripple on the feedback pin FB gives good results.
Some applications require a very tight line regulation and can only allow a small change in output voltage over
a certain input voltage range. If no feedforward capacitor CFF is used across the upper resistor of the voltage
feedback divider, the device has the best line regulation. Without the feedforward capacitor the output voltage
ripple is higher because the TPS6104x shows output voltage bursts instead of single pulses on the switch pin
(SW), increasing the output voltage ripple. Increasing the output capacitor value reduces the output voltage
ripple.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
13
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
If a larger output capacitor value is not an option, a feed-forward capacitor CFF can be used as described in
the previous section. The use of a feedforward capacitor increases the amount of voltage ripple present on the
feedback pin (FB). The greater the voltage ripple on the feedback pin (≥50 mV), the worse the line regulation.
There are two ways to improve the line regulation further:
1. Use a smaller inductor value to increase the switching frequency which will lower the output voltage ripple,
as well as the voltage ripple on the feedback pin.
2. Add a small capacitor from the feedback pin (FB) to ground to reduce the voltage ripple on the feedback pin
down to 50 mV again. As a starting point, the same capacitor value as selected for the feedforward capacitor
CFF can be used.
8.2.2.4 Output Capacitor Selection
For best output voltage filtering, a low ESR output capacitor is recommended. Ceramic capacitors have a low
ESR value but tantalum capacitors can be used as well, depending on the application.
Assuming the converter does not show double pulses or pulse bursts on the switch node (SW), the output
voltage ripple can be calculated as:
I
DV out + out
Cout
Ǔ
ǒ
I
L
1
P
–
fS(Iout) Vout ) Vd–Vin
)I
P
ESR
(7)
where
•
•
•
•
•
•
•
IP = Peak current as described in Peak Current Control
L = Selected inductor value
Iout = Nominal load current
fS (Iout) = Switching frequency at the nominal load current as calculated previously
Vd = Rectifier diode forward voltage (typically 0.3 V)
Cout = Selected output capacitor
ESR = Output capacitor ESR value
See Table 8-3 and the Typical Application for choosing the output capacitor.
Table 8-3. Recommended Input and Output Capacitors
DEVICE
TPS6104x
(1)
CAPACITOR
VOLTAGE RATING
COMPONENT SUPPLIER(1)
COMMENTS
4.7 μF/X5R/0805
6.3 V
Tayo Yuden JMK212BY475MG
CIN/COUT
10 μF/X5R/0805
6.3 V
Tayo Yuden JMK212BJ106MG
CIN/COUT
1 μF/X7R/1206
25 V
Tayo Yuden TMK316BJ105KL
COUT
1 μF/X5R/1206
35 V
Tayo Yuden GMK316BJ105KL
COUT
4.7 μF/X5R/1210
25 V
Tayo Yuden TMK325BJ475MG
COUT
See Third-Party Products disclaimer.
8.2.2.5 Input Capacitor Selection
For good input voltage filtering, low ESR ceramic capacitors are recommended. A 4.7-μF ceramic input capacitor
is sufficient for most of the applications. For better input voltage filtering this value can be increased. See Table
8-3 and typical applications for input capacitor recommendations.
8.2.2.6 Diode Selection
To achieve high efficiency a Schottky diode should be used. The current rating of the diode should meet the
peak current rating of the converter as it is calculated in Peak Current Control. Use the maximum value for ILIM
for this calculation. See Table 8-4 and the typical applications for the selection of the Schottky diode.
14
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
Table 8-4. Recommended Schottky Diode for Typical LCD Bias Supply (see Figure 10-1)
DEVICE
REVERSE VOLTAGE
COMPONENT SUPPLIER(1)
30 V
ON Semiconductor MBR0530
TPS6104x
(1)
20 V
ON Semiconductor MBR0520
20 V
ON Semiconductor MBRM120L
30 V
Toshiba CRS02
COMMENTS
High efficiency
See Third-Party Products disclaimer.
spacer
8.2.3 Application Curves
IO = 18 V
VO = 18 V
VI
2.4 V to 3.4 V
IO
100 mV/div
VO
100 mV/div
IO
1 mA to 10 mA
200 mS/div
200 µS/div
Figure 8-2. Line Transient Response
Figure 8-3. Load Transient Response
VO = 18 V
VO
5 V/div
EN
1 V/div
II
50 mA/div
500 us/div
Figure 8-4. Start-Up Behavior
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
15
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
8.3 System Examples
L1
10 μH
D1
VO
18 V
TPS61040
VIN
1.8 V to 6 V
VIN
CFF
22 pF
R1
2.2 MΩ
SW
C2
1 μF
FB
C1
4.7 μF
EN
GND
DAC or Analog Voltage
0 V = 25 V
1.233 V = 18 V
R2
160 kΩ
L1:
D1:
C1:
C2:
Sumida CR32-100
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Tayo Yuden GMK316BJ105KL
Copyright © 2016, Texas Instruments Incorporated
Figure 8-5. LCD Bias Supply With Adjustable Output Voltage
R3
200 k
L1
10 μH
VIN
1.8 V to 6 V
TPS61040
VIN
C1
4.7 μF
SW
FB
EN
GND
BC857C
D1
VOUT
18 V / 10 mA
R1
2.2 MΩ
CFF
22 pF
C2
1 μF
C3
0.1 μF
(Optional)
R2
160 kΩ
L1: Sumida CR32-100
D1: Motorola MBR0530
C1: Tayo Yuden JMK212BY475MG
C2: Tayo Yuden TMK316BJ105KL
Copyright © 2016, Texas Instruments Incorporated
Figure 8-6. LCD Bias Supply With Load Disconnect
16
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
D3
V2 = –10 V/15 μA
D2
L1
6.8 μH
C4
4.7 μF
C3
1 μF
D1
V1 = 10 V/15 mA
TPS61040
VIN
VIN = 2.7 V to 5 V
SW
R1
1.5 MΩ
CFF
22 pF
C2
1 μF
FB
C1
4.7 μF
EN
GND
L1:
D1, D2, D3:
C1:
C2, C3, C4:
R2
210 kΩ
Murata LQH4C6R8M04
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Tayo Yuden EMK316BJ105KF
Copyright © 2016, Texas Instruments Incorporated
Figure 8-7. Positive and Negative Output LCD Bias Supply
L1
6.8 μH
D1
VO = 12 V/35 mA
TPS61040
VIN 3.3 V
C1
10 μF
VIN
SW
R1
1.8 MΩ
CFF
4.7 pF
C2
4.7 μF
FB
EN
GND
L1:
D1:
C1:
C2:
R2
205 kΩ
Murata LQH4C6R8M04
Motorola MBR0530
Tayo Yuden JMK212BJ106MG
Tayo Yuden EMK316BJ475ML
Copyright © 2016, Texas Instruments Incorporated
Figure 8-8. Standard 3.3-V to 12-V Supply
D1
3.3 μH
5 V/45 mA
TPS61040
1.8 V to 4 V
VIN
SW
R1
620 kΩ
FB
C1
4.7 μF
EN
GND
CFF
3.3 pF
C2
4.7 μF
R2
200 kΩ
L1: Murata LQH4C3R3M04
D1: Motorola MBR0530
C1, C2: Tayo Yuden JMK212BY475MG
Copyright © 2016, Texas Instruments Incorporated
Figure 8-9. Dual Battery Cell to 5-V/50-mA Conversion Efficiency Approximately Equals 84% at VIN = 2.4
V to Vo = 5 V/45 mA
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
17
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
L1
10 μH
VCC = 2.7 V to 6 V
VIN
D1
D2
24 V
(Optional)
SW
C1
4.7 μF
FB
EN
PWM
100 Hz to 500 Hz
C2
1 μF
GND
L1: Murata LQH4C100K04
D1: Motorola MBR0530
C1: Tayo Yuden JMK212BY475MG
C2: Tayo Yuden TMK316BJ105KL
RS
82 Ω
Copyright © 2016, Texas Instruments Incorporated
Figure 8-10. White LED Supply With Adjustable Brightness Control Using a PWM Signal on the Enable
Pin, Efficiency Approximately Equals 86% at VIN = 3 V, ILED = 15 mA
L1
10 μH
VCC = 2.7 V to 6 V
C1
4.7 μF
VIN
SW
D1
MBRM120L
D2
24 V
(Optional)
FB
EN
R1
120 kΩ
GND
Analog Brightness Control
3.3 V @ Led Off
0 V @Iled = 20 mA
C2
100 nF
(See
Note A)
RS
110 Ω
R2
160 kΩ
L1:
D1:
C1:
C2:
Murata LQH4C3R3M04
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Standard Ceramic Capacitor
Copyright © 2016, Texas Instruments Incorporated
A.
A smaller output capacitor value for C2 causes a larger LED ripple.
Figure 8-11. White LED Supply With Adjustable Brightness Control Using an Analog Signal on the
Feedback Pin
18
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
9 Power Supply Recommendations
The device is designed to operate from an input voltage supply range between 1.8 V and 6 V. The output current
of the input power supply must be rated according to the supply voltage, output voltage and output current of
TPS6104x.
10 Layout
10.1 Layout Guidelines
Typical for all switching power supplies, the layout is an important step in the design; especially at high peak
currents and switching frequencies. If the layout is not carefully done, the regulator might show noise problems
and duty cycle jitter.
The input capacitor should be placed as close as possible to the input pin for good input voltage filtering. The
inductor and diode should be placed as close as possible to the switch pin to minimize the noise coupling into
other circuits. Because the feedback pin and network is a high-impedance circuit, the feedback network should
be routed away from the inductor. The feedback pin and feedback network should be shielded with a ground
plane or trace to minimize noise coupling into this circuit.
Wide traces should be used for connections in bold as shown in Figure 10-1. A star ground connection or ground
plane minimizes ground shifts and noise.
10.2 Layout Example
VIN
VOUT
1
GND
2
FB
3
TPS61040
SW
5
VIN
4
EN
GND
Figure 10-1. Layout Diagram
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
19
TPS61040, TPS61041
www.ti.com
SLVS413K – OCTOBER 2002 – REVISED JULY 2022
11 Device and Documentation Support
11.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
20
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TPS61040 TPS61041
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jul-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TPS61040DBVR
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 85
PHOI
Samples
TPS61040DBVRG4
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
PHOI
Samples
TPS61040DDCR
ACTIVE
SOT-23-THIN
DDC
5
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
QXK
Samples
TPS61040DDCT
ACTIVE
SOT-23-THIN
DDC
5
250
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
QXK
Samples
TPS61040DRVR
ACTIVE
WSON
DRV
6
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CCL
Samples
TPS61040DRVT
ACTIVE
WSON
DRV
6
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CCL
Samples
TPS61040DRVTG4
ACTIVE
WSON
DRV
6
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CCL
Samples
TPS61041DBVR
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 85
PHPI
Samples
TPS61041DRVR
ACTIVE
WSON
DRV
6
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CAW
Samples
TPS61041DRVT
ACTIVE
WSON
DRV
6
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CAW
Samples
TPS61041DRVTG4
ACTIVE
WSON
DRV
6
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CAW
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
工商网监
湘ICP备2023018690号
