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TPS61054, TPS61055
SLUS760B – SEPTEMBER 2007 – REVISED SEPTEMBER 2015
TPS6105x High-Power White LED Driver
2-mHz Synchronous Boost Converter With Standard Logic Interface
1 Features
3 Description
•
The TPS6105x device uses a high-frequency
synchronous-boost topology with constant current
sink to drive single white LEDs. The device uses an
inductive fixed-frequency PWM control scheme using
small external components, minimizing input ripple
current.
1
•
•
•
•
•
•
•
•
•
Four Operational Modes
– Torch and Flash up to ILED = 700 mA
– Voltage-Regulated Boost Converter: 5.0 V
– Shutdown: 0.3 μA (Typical)
Total Solution Circuit Area < 25 mm2
Up to 96% Efficiency
Integrated LED Turnon Safety Timer
Zero Latency TX-Masking Input
Integrated Low Light Dimming Mode
LED Disconnect During Shutdown
Open/Shorted LED Protection
Over-Temperature Protection
Available in a 12-Pin NanoFree™ (CSP) and 10Pin VSON Packaging
•
•
The TPS6105x device not only operates as a
regulated current source, but also as a standard
voltage-boost regulator. This additional operating
mode can be useful to supply other high-power
devices in the system, such as a hands-free audio
power amplifier, or any other component requiring a
supply voltage higher than the battery voltage.
The LED current or the desired output voltage can be
programmed through two logic signals (MODE0/1).
To simplify flash synchronization with the camera
module, the device offers a trigger pin
(FLASH_SYNC) for fast LED turnon time.
2 Applications
•
The 2-MHz switching frequency allows the use of
small and low-profile 2.2-μH inductors. To optimize
overall efficiency, the device operates with only a
250-mV LED feedback voltage.
Camera White LED Torch or Flash for Cell
Phones, Smartphones and PDAs
General Lighting Applications
Audio Amplifier Power Supply
When the TPS6105x is not in use, it can be put into
shutdown mode, reducing the input current to 0.3 μA
(typical). During shutdown, the LED pin is high
impedance to avoid leakage current through the LED.
Device Information(1)
PART NUMBER
TPS61054,
TPS61055
PACKAGE
BODY SIZE (NOM)
VSON (10)
3.00 mm × 3.00 mm
DSBGA (12)
1.96 mm × 1.46 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Diagram
TPS61054
L
2.2 mH
SW
SW
VOUT
COUT
10 mF
P
AVIN
CIN
P
P
LED
MODE1
MODE0
Tx-TOFF
FLASH_SYNC
AGND
PGND
PGND
P
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61054, TPS61055
SLUS760B – SEPTEMBER 2007 – REVISED SEPTEMBER 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Options.......................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
5
7.1
7.2
7.3
7.4
7.5
7.6
5
5
5
5
6
7
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 9
Detailed Description ............................................ 10
9.1 Overview ................................................................. 10
9.2 Functional Block Diagrams ..................................... 10
9.3 Feature Description................................................. 11
9.4 Device Functional Modes........................................ 13
10 Application and Implementation........................ 14
10.1 Application Information.......................................... 14
10.2 Typical Applications .............................................. 14
11 Power Supply Recommendations ..................... 19
12 Layout................................................................... 19
12.1 Layout Guidelines ................................................. 19
12.2 Layout Example .................................................... 19
12.3 Thermal Considerations ........................................ 20
13 Device and Documentation Support ................. 21
13.1
13.2
13.3
13.4
13.5
13.6
Device Support......................................................
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
21
21
21
21
21
21
14 Mechanical, Packaging, and Orderable
Information ........................................................... 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (May 2008) to Revision B
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
•
Deleted Package Summary section .................................................................................................................................... 21
2
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SLUS760B – SEPTEMBER 2007 – REVISED SEPTEMBER 2015
5 Device Options
PART NUMBER (1) (2)
TORCH CURRENT (3)
FLASH CURRENT (3)
SAFETY TIMER MAXIMUM
DURATION
CURRENT LIMIT
TPS61054DRC
75 mA
700 mA
820 ms
1500 mA (ILIM = 01)
TPS61055DRC
75 mA
500 mA
820 ms
1000 mA (ILIM = 00)
(1)
(2)
(3)
All devices are specified for operation in the commercial temperature range, –40°C to 85°C
The YZG package is available in tape and reel. Add R suffix (TPS6105xYZGR, TPS6105xDRCR) to order quantities of 3000 parts. Add
T suffix (TPS6105xDRCT) to order quantities of 250 parts.
For customized current settings, please contact the factory.
Copyright © 2007–2015, Texas Instruments Incorporated
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6 Pin Configuration and Functions
DRC Package
10-Pin VSON
Top View
Thermal
Pad
YZG Package
12-Pin DSBGA
Top View
YZG Package
12-Pin DSBGA
Bottom View
Pin Functions
PIN
NAME
I/O
DESCRIPTION
VSON
DSBGA
AVIN
5
D3
I
This is the input voltage pin of the device. Connect directly to the input bypass
capacitor.
VOUT
9
A2
O
Boost converter output.
LED
6
D2
I
LED return input. This feedback pin regulates the LED current through the internal
sense resistor by regulating the voltage across it. The regulation operates with typically
250-mV dropout voltage. Connect to the cathode of the LED.
Flash strobe pulse synchronization input.
FLASH_SYNC
10
A1
I
FLASH_SYNC = LOW (GND): The device is operating and regulating the LED current
to the torch current level (TC).
FLASH_SYNC = HIGH (VIN): The device is operating and regulating the LED current to
the flash current level (FC).
MODE0
2
Mode selection inputs. These pins must not be left floating and must be terminated.
B3
MODE0 = 0, MODE1 = 0: Device in shutdown mode
I
MODE1
1
A3
MODE0 = 1, MODE1 = 0: Device in torch only mode
MODE0 = 0, MODE1 = 1: Device in torch and flash mode
MODE0 = 1, MODE1 = 1: Device in constant voltage regulation mode
RF PA synchronization input.
Tx-TOFF
3
C3
I
Tx-TOFF = LOW : The device is operating normally.
Tx-TOFF = HIGH : The device is forced into torch mode.
SW
8
B1, B2
I/O
Inductor connection. Drain of the internal power MOSFET. Connect to the switched side
of the inductor. SW is high impedance during shutdown.
PGND
7
C1, C2
—
Power ground. Connect to AGND underneath IC.
AGND
4
D1
—
Analog ground.
Thermal Pad
—
N/A
—
Internally connected to PGND.
4
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SLUS760B – SEPTEMBER 2007 – REVISED SEPTEMBER 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Voltage on AVIN, VOUT, SW, LED (2)
Voltage on MODE0, MODE1, FLASH_SYNC, Tx-TOFF
Operating ambient temperature (3)
TA
TJ
(2)
(MAX)
Tstg
(1)
(2)
(3)
MIN
MAX
UNIT
–0.3
7
V
–0.3
7
V
–40
85
°C
150
°C
150
°C
Maximum operating junction temperature
Storage temperature
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (RθJA), as given by the following equation: TA(max)= TJ(max) – (RθJA X PD(max)).
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
(3)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (3)
±1000
Machine Model
±200
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
Input voltage range
2.5
3.6
6
V
Output voltage range in current regulator mode
VIN
5.5
V
Output voltage range in voltage regulator mode
4.5
5
5.25
V
L
Inductance effective value range
1.3
2.2
2.9
µH
CIN
Input capacitance range
COUT
Input capacitance effective value range
TJ
Operating junction temperature
VIN
VOUT
UNIT
10
3
µF
10
–40
50
µF
125
°C
7.4 Thermal Information
TPS61054, TPS61055
THERMAL METRIC (1)
DRC (VSON)
YZG (DSBGA)
UNIT
10 PINS
12 PINS
RθJA
Junction-to-ambient thermal resistance
48.5
82.0
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
67.4
0.6
°C/W
RθJB
Junction-to-board thermal resistance
23.0
35.0
°C/W
ψJT
Junction-to-top characterization parameter
1.8
2.6
°C/W
ψJB
Junction-to-board characterization parameter
23.1
19.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
5.3
—
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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7.5 Electrical Characteristics
Unless otherwise noted the specification applies for VIN = 3.6 V over an operating junction temperature of –40°C ≤ TJ ≤
125°C. Typical values are for TA = 25°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
Input voltage range
VIN
2.5
6
V
Minimum input voltage for start-up
MODE0 = 1, MODE1 = 1, RL = 10 Ω
IQ
Operating quiescent current into AVIN
MODE0 = 1, MODE1 = 1
8.5
ISD
Shutdown current into AVIN
MODE0 = 0, MODE1 = 0, –40°C ≤ TJ ≤ 85°C
0.3
3
μA
VUVLO
Undervoltage lockout threshold
VIN falling
2.3
2.4
V
2.5
V
mA
OUTPUT
VOUT
Current regulator mode
Output voltage range
OVP Output overvoltage protection
OVP
VIN
Voltage regulator mode
VOUT rising
5.7
Output overvoltage protection hysterisis
D
6
6.25
0.15
Minimum duty cycle
V
V
V
7.5%
LED current accuracy (1)
0.25 V ≤ VLED ≤ 2.0 V, ILED = ITORCH, TJ = 50°C
–15%
0.25 V ≤ VLED ≤ 2.0 V, ILED = IFLASH, TJ = 50°C
–12%
LED current temperature coefficient
VLED
5.5
5
15%
12%
0.08
DC output voltage accuracy
2.5 V ≤ VIN ≤ 0.9 VOUT, PWM operation
LED sense voltage
Boost Mode
250
LED input leakage current
VLED = VOUT = 5 V, –40°C ≤ TJ ≤ 85°C
0.1
–3%
%/°C
3%
mV
1
μA
POWER SWITCH
rDS(on)
Ilkg(SW)
Ilim
Switch MOSFET on-resistance
80
VOUT = VGS = 3.6 V
Rectifier MOSFET on-resistance
Switch MOSFET leakage
VDS = 6.0 V, –40°C ≤ TJ ≤ 85°C
Rectifier MOSFET leakage
2.5 V ≤ VIN ≤ 6.0 V, ILIM = 00
Switch current limit
mΩ
80
2.5 V ≤ VIN ≤ 6.0 V, ILIM = 01 (1)
Thermal shutdown (1)
0.1
1
0.1
1
μA
850
1000
1150
1275
1500
1725
140
160
°C
20
°C
Thermal shutdown hysteresis (1)
mA
OSCILLATOR
fSW
Oscillator frequency
1.8
2.0
2.2
MHz
MODE0, MODE1, Tx-TOFF, FLASH_SYNC
V(IH)
High-level input voltage
V(IL)
Low-level input voltage
1.2
V
I(LKG)
Logic input leakage current
Input connected to VIN or GND, –40°C ≤ TJ ≤ 85°C
0.01
Tx-TOFF pulldown resistance
Tx-TOFF ≤ 0.4 V
400
kΩ
FLASH_SYNC pulldown resistance
FLASH_SYNC ≤ 0.4 V
400
kΩ
From shutdown into flash mode ILED = 700 mA
1.2
ms
From shutdown into voltage mode
MODE0 = 1, MODE1 = 1, IOUT = 0 mA
650
μs
MODE0 = 0, MODE1 = 1,
ILED = from 75mA to 700 mA
160
μs
20
μs
0.4
V
0.1
μA
TIMING
Start-up time
(2)
LED current settling time triggered by
rising edge on FLASH_SYNC
LED current settling time
rising edge on Tx-TOFF
(1)
(2)
6
(2)
triggered by
MODE0 = 0, MODE1 = 1,
ILED = 700 mA to 75 mA
Assured by design. Not tested in production.
Settling time to ±15% of the target value
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7.6 Typical Characteristics
Table 1. Table of Graphs
FIGURE
vs. Input Voltage
Figure 1, Figure 2
DC Input Current
vs. Input Voltage
Figure 3
LED Current
vs. LED Pin Headroom Voltage
Figure 4
Voltage Mode Efficiency
vs. Output Current
Figure 5
DC Output Voltage
vs. Load Current
Figure 6
DC Output Voltage
vs. Input Voltage
Figure 7
Quiescent Current
vs. Input Voltage
Figure 8
Shutdown Current
vs. Input Voltage
Figure 9
Junction Temperature
vs. GPIO Voltage
Figure 10
100
100
90
90
80
ILED = 75mA
70
60
50
40
30
20
LED Power Efficiency (PLED/PIN) - %
LED Power Efficiency (PLED/PIN) - %
LED Power Efficiency
ILIM = 1500 mA
10
0
2.5
2.9
3.3
3.7
4.1
4.5
VI - Input Voltage - V
4.9
70
ILED = 500 mA
60
ILED = 700 mA
50
40
30
20
ILIM =1500 mA
10
0
2.5
5.3 5.5
Figure 1. LED Power Efficiency vs Input Voltage
2500
80
2.9
3.3
3.7
4.1
4.5
VI - Input Voltage - V
4.9
5.3 5.5
Figure 2. LED Power Efficiency vs Input Voltage
1400
ILIM = 1500 mA
ILIM = 1500 mA
2250
1200
1000
1750
ILED = 700 mA
LED Current - mA
DC Input Current - mA
2000
1500
1250
1000
750
800
ILED = 700 mA
600
ILED = 500 mA
400
500
250
0
2.5
200
ILED = 500 mA
2.9
3.3
3.7
4.1
4.5
VI - Input Voltage - V
4.9
5.3 5.5
0
250
ILED = 75 mA
350
450
550
650
750
850
950
1050
LED Pin Headroom Voltage - mV
Figure 3. DC Input Current vs Input Voltage
Figure 4. LED Current vs LED Pin Headroom Voltage
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5.15
VIN = 4.2 V
90
5.10
80
VIN = 3.6 V
Efficiency - %
DC Output Voltage - V
VIN = 3 V
70
VIN = 2.5 V
60
50
40
30
5.05
VIN = 4.2 V
5
VIN = 3.6 V
4.95
VIN = 3 V
VIN = 2.5 V
20
4.90
VOUT = 5 V,
ILIM = 1500 mA
10
0
0
1
10
100
1000
IO - Output Current - mA
4.85
0.1
10000
Figure 5. Voltage Mode Efficiency vs Load Current
5.60
10
100
1000
IO - Output Current - mA
10000
15
Voltage Mode Regulation,
VO = 5 V
14
13
12
Quiescent Current - mA
IOUT = 100 mA
5.40
1
Figure 6. DC Output Voltage vs Output Current
IOUT = 0 mA
VOUT = 5.0 V,
ILIM = 1500 mA
5.50
DC Output Voltage - V
VOUT = 5 V,
ILIM = 1500 mA
5.30
5.20
5.10
11
10
9
8
7
6
5
4
5
3
4.90
2
1
0
2.5
IOUT = 1000 mA
4.80
2.9
3.3
3.7
4.1
4.9
4.5
VI - Input Voltage - V
5.3 5.5
3.3
3.7
4.1
4.5
VI - Input Voltage - V
175
TJ - Junction Temperature - °C
TA = 85°C
1.20
1
0.80
0.60
TA = 25°C
0.40
TA = -40°C
0.20
GPIO = Input,
IGPIO = -100 mA
150
125
100
75
50
25
GPIO
Input Buffer
0
-25
2.9
3.3
3.7
4.1
4.5
4.9
VI - Input Voltage - V
5.3 5.5
Figure 9. Shutdown Current vs Input Voltage
8
5.3 5.5
200
1.40
0
2.5
4.9
Figure 8. Quiescent Current Vs Input Voltage
Figure 7. DC Output Voltage vs Input Voltage
Shutdown Current - mA
2.9
VGPIO
2.5
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-50
-0.50
-0.45
-0.40
-0.35
-0.30
100 mA
-0.25
-0.20
GPIO Voltage - V
Figure 10. Junction Temperature vs GPIO Voltage
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8 Parameter Measurement Information
TPS6105x
L
2.2µH
VIN
SW
SW
VOUT
C OUT
10 µF
P
AVIN
CIN
P
P
LED
MODE1
MODE0
Tx-TOFF
FLASH_SYNC
AGND
PGND
PGND
P
List Of Components:
- L = Wuerth Elektronik WE-PD S Series
- CIN = COUT = TDK C1605X5R0J106MT
Figure 11. Parameter Measurement Circuit
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9 Detailed Description
9.1 Overview
The TPS6105x family employs a 2-MHz constant-frequency, current-mode PWM converter to generate the
output voltage required to drive high-power LEDs. The device integrates a power stage based on an NMOS
switch and a synchronous NMOS rectifier. The device also implements a linear low-side current regulator to
control the LED current when the battery voltage is higher than the diode forward voltage.
9.2 Functional Block Diagrams
SW
AVIN
Undervoltage
Lockout
Bias Supply
VREF = 1.22 V
Ramp
Compensation
Bandgap
REF
OVP
COMPARATOR
VOUT
S
ERROR
AMPLIFIER
Control
Logic
VREF
P
COMPARATOR
CURRENT
REGULATION
VOLTAGE
REGULATION
2 MHz
Oscillator
SENSE FB
Max tON Timer
MODE0
Control
Logic
MODE1
LED
ON/OFF
DAC
CURRENT
CONTROL
P
LED Current Regulator
FLASH_SYNC
Tx-TOFF
P
AGND
PGND
Figure 12. Functional Block Diagram of TPS6105x
10
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Functional Block Diagrams (continued)
LED CURRENT CONTROL
Tx-TOFF
ILED
0
0
Torch Current
0
1
Torch Current
1
0
Flash Current
1
1
Torch Current
Tx-TOFF
MODE0
400 kW
MODE1
FLASH_SYNC
400 kW
Edge Detect
LED CURRENT CONTROL
0: TORCH CURRENT LEVEL
1: FLASH CURRENT LEVEL
Start
tSTIM
30.5 Hz
2 MHz CLOCK
16-bit Prescaler
122 Hz
Safety Timer
LED ON/OFF CONTROL
Duty-Cycle Generator (6.3%)
0: LED OFF
1: TORCH CURRENT LEVEL
Figure 13. Timer Block Diagram of TPS6105x
9.3 Feature Description
9.3.1 Operation
In boost mode, the duty cycle of the converter is set by the error amplifier and the saw-tooth ramp applied to the
comparator. Because the control architecture is based on a current-mode control, a compensation ramp is added
to allow stable operation at duty cycles larger than 50%. The converter is a fully-integrated synchronous-boost
converter, always operating in continuous-conduction mode. This allows low-noise operation, and avoids ringing
on the switch pin, which would be seen on a converter when entering discontinuous-conduction mode.
The TPS6105x device not only operates as a regulated current source but also as a standard voltage-boost
regulator. This additional operating mode can be useful to properly synchronize the converter when supplying
other high-power devices in the system, such as a hands-free audio power amplifier, or any other component
requiring a supply voltage higher than the battery voltage.
The mode of operation (shutdown, torch and flash modes, constant voltage regulation) selection is done through
the MODE0/1 control inputs.
Table 2. TPS6105x Operating Modes
MODE1 MODE0
OPERATING MODES
0
0
Power stage is in shutdown. The output is either connected directly to the battery through the body diode of the rectifier.
0
1
LED is turned on for torch light operation. The converter is operating in the current regulation mode (CM).
The output voltage is controlled by the forward voltage characteristic of the LED.
1
0
LED is turned on for flashlight operation. The converter is operating in the current regulation mode (CM).
The output voltage is controlled by the forward voltage characteristic of the LED.
1
1
LED is turned off and the converter is operating in voltage regulation mode (VM).
The output voltage is regulated to 5.0 V.
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9.3.2 Flash Synchronization
To simplify flash synchronization with the camera module, the device offers a FLASH_SYNC strobe input pin to
switch (with zero latency) the LED current from flash to torch light. The LED is driven at the flashlight current
level when a logic high signal is applied to the FLASH_SYNC pin.
The maximum duration of the flash pulse can be limited by means of an internal safety timer (820 ms). The
safety timer starts on the rising edge of the FLASH_SYNC signal and stops either on its falling edge or after a
time-out whatever occurs first.
FLASH_SYNC
FLASH_SYNC
STIM
STIM
TIMER
FLASH
LED CONTROL
TIMER
TIME-OUT
FLASH
TORCH
LED CONTROL
Figure 14. Level Sensitive Safety Timer (Time-Out)
TIME-OUT
TORCH
Figure 15. Level Sensitive Safety Timer
(Normal Operation + Time-Out)
9.3.3 Efficiency
The sense voltage has a direct effect on the converter’s efficiency. Because the voltage across the low-side
current regulator does not contribute to the output power (LED brightness), the lower the sense voltage, the
higher the efficiency will be.
When running in boost mode (VF(LED) > VIN), the voltage present at the LED pin of the low-side current regulator
is typically 250 mV, which contributes to high power-conversion efficiency.
When running in the linear down-converter mode (VF(LED) < VIN), the low-side current regulator drops the voltage
difference between the input voltage and the LED forward voltage. Depending on the input voltage and the LED
forward voltage characteristic, the converter displays efficiency of approximately 80% to 90%.
9.3.4 Flash Blanking
The TPS6105x device also integrates a Tx-TOFF input that can be used as flash masking input. This blanking
function turns the LED from flash to torch light, thereby reducing almost instantaneously the peak current loading
from the battery. This function has no influence on the safety timer duration.
IFLASH
LED Current
ITORCH
FLASH_SYNC
Tx-TOFF
Figure 16. Synchronized Flash With Blanking Periods (MODE0 = 0, MODE1 = 1)
9.3.5 Soft-Start
Because the output capacitor always remains biased to the input voltage, the TPS6105x can immediately start
switching once it has been enabled. The TPS6105x starts up by smoothly ramping up the internal reference
voltage of the device, thus limiting the inrush current.
9.3.6 Shutdown
In shutdown mode, the regulator stops switching and the LED pin is high-impedance, thus eliminating any DC
conduction path. The internal switch and rectifier MOSFET are turned off. VOUT is one body-diode drop below
the input voltage and the device consumes only a shutdown current of 0.3 μA (typical). The output capacitor
remains biased to the input voltage.
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9.3.7 Undervoltage Lockout
The undervoltage lockout circuit prevents the device from malfunctioning at low input voltages. It prevents the
converter from turning on the switch or rectifier MOSFET under undefined conditions.
9.3.8 Thermal Shutdown
As soon as the junction temperature, TJ, exceeds 160°C typical, the device goes into thermal shutdown. In this
mode, the boost power stage and the low-side current regulator are turned off. To resume operation, the device
needs to be cycled through a shutdown phase (MODE0 = 0, MODE1 = 0).
9.4 Device Functional Modes
9.4.1 Low-Light Dimming Mode
The TPS6105x device features white LED drive capability at very low-light intensity. To generate a reduced LED
average current, the device employs a 122-Hz, fixed-frequency PWM modulation scheme. Operation is
understood best by referring to the Figure 13.
The torch current is modulated with a 6.3% duty cycle. The low-light dimming mode can only be activated in the
torch only mode (MODE1 = 0, MODE0 = 1) together with a logic level high applied to the FLASH_SYNC input.
I TORCH
I LED(DC) = 0.063 x I TORCH
0
Figure 17. PWM Dimming Principle
White LED blinking can be achieved by turning on or off periodically the LED dimmer through the (DIM) bit, see
Figure 18.
LED OFF
LED ON with Reduced Current
ITORCH
ITORCH
6.3% PWM Dimming Steps
MODE0
Figure 18. White LED Blinking Control (MODE1 = 0, FLASH_SYNC = 1)
9.4.2 LED Failure Modes
If the LED fails as a short circuit, the low-side current regulator limits the maximum output current.
If the LED fails as an open circuit, the control loop initially attempts to regulate off of its low-side current regulator
feedback signal. This drives VOUT higher. Because the open-circuited LED will never accept its programmed
current, VOUT must be voltage-limited by means of a secondary control loop. In this failure mode, the TPS6105x
limits VOUT to 6.0 V (typical).
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The TPS6105x device uses a high-frequency synchronous-boost topology with constant current sink to drive
single white LEDs. The TPS6105x device not only operates as a regulated current source, but also as a standard
voltage-boost regulator. This additional operating mode can be useful to supply other high-power devices in the
system, such as a hands-free audio power amplifier, or any other component requiring a supply voltage higher
than the battery voltage.
10.2 Typical Applications
10.2.1 High Power White LED Solution Featuring No-Latency Turn-Down through PA TX Signal
TPS61054
L
SW
SW
VBAT
2.2 mH
VOUT
COUT
10 mF
P
AVIN
Li-Ion
CIN
P
WHITE LED
FLASH-LIGHT
P
LED
MODE1
MODE0
CAMERA ENGINE
Tx-TOFF
FLASH_SYNC
AGND
PGND
PGND
P
RF PA TX ACTIVE
Figure 19. High Power White LED Solution Featuring No-Latency Turn-Down through PA TX Signal
10.2.1.1 Design Requirements
Table 3 shows how to use the TPS6105x to drive high power white LED.
Table 3. Design Parameters
DESIGN PARAMETERS
EXAMPLE VALUE
Input voltage range
3.3 V to 4.2 V
Output voltage
5V
Flash current
500 mA
10.2.1.2 Detailed Design Procedure
10.2.1.2.1 Inductor Selection
A boost converter requires two main passive components for storing energy during the conversion. A boost
inductor and a storage capacitor at the output are required. The TPS6105x device integrates a current limit
protection circuitry. The peak current of the NMOS switch is sensed to limit the maximum current flowing through
the switch and the inductor (for example, 1000 mA or 1500 mA).
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To optimize solution size the TPS6105x device has been designed to operate with inductance values between a
minimum of 1.3 μH and maximum of 2.9 μH. In typical high-current white LED applications a 2.2-μH inductance
is recommended.
To select the boost inductor, TI recommends to keep the possible peak inductor current below the current limit
threshold of the power switch in the chosen configuration. The highest peak current through the inductor and the
power switch depends on the output load, the input and output voltages. Estimation of the maximum average
inductor current and the maximum inductor peak current can be done using Equation 1 and Equation 2:
V OUT
I L [ I OUT +
h VIN
(1)
I L(PEAK) +
I OUT
VIN D
)
2 f L (1 * D)
h
with D +
V OUT * V IN
VOUT
where
•
•
•
f = switching frequency (2 MHz)
L = inductance value (2.2 μH)
η = estimated efficiency (85%)
(2)
For example, for an output current of 500 mA at 5 V, the TPS6105x device needs to be set for a 1000 mA
current limit operation together with an inductor supporting this peak current.
The losses in the inductor caused by magnetic hysteresis losses and copper losses are a major parameter for
total circuit efficiency.
Table 4. List of Inductors
MANUFACTURER
SERIES
DIMENSIONS
TDK
VLF3010AT
2.6 mm × 2.8 mm × 1.0 mm maximum height
ILIM SETTINGS
TAIYO YUDEN
NR3010
3.0 mm × 3.0 mm × 1.0 mm maximum height
FDK
MIPSA2520
2.5 mm × 2.0 mm × 1.2 mm maximum height
TDK
VLF3014AT
2.6 mm × 2.8 mm × 1.4 mm maximum height
COILCRAFT
LPS3015
3.0 mm × 3.0 mm × 1.5 mm maximum height
MURATA
LQH3NP
3.0 mm × 3.0 mm × 1.5 mm maximum height
TOKO
FDSE0312
3.0 mm × 3.0 mm × 1.2 mm maximum height
1000 mA (typical)
1500 mA (typical)
10.2.1.2.2 Capacitor Selection
10.2.1.2.2.1 Input Capacitor
For good input voltage filtering low ESR ceramic capacitors are recommended. A 10-μF input capacitor is
recommended to improve transient behavior of the regulator and EMI behavior of the total power supply circuit.
The input capacitor must be placed as close as possible to the input pin of the converter.
10.2.1.2.2.2 Output Capacitor
The primary parameter necessary to define the output capacitor is the maximum allowed output voltage ripple of
the converter. This ripple is determined by two parameters of the capacitor, the capacitance and the ESR. It is
possible to calculate the minimum capacitance needed for the defined ripple, supposing that the ESR is zero, by
using Equation 3:
C min [
I OUT
f
ǒVOUT * VINǓ
DV
V OUT
where
•
•
f is the switching frequency
ΔV is the maximum allowed ripple.
(3)
With a chosen ripple voltage of 10 mV, a minimum capacitance of 10 μF is needed. The total ripple is larger due
to the ESR of the output capacitor. This additional component of the ripple can be calculated using Equation 4:
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ΔVESR = IOUT × RESR
(4)
The total ripple is the sum of the ripple caused by the capacitance and the ripple caused by the ESR of the
capacitor. Additional ripple is caused by load transients. This means that the output capacitor has to completely
supply the load during the charging phase of the inductor. A reasonable value of the output capacitance depends
on the speed of the load transients and the load current during the load change.
For the high current white LED application, a minimum of 3-μF effective output capacitance is usually required
when operating with 2.2-μH (typical) inductors. For solution size reasons, this is usually one or more X5R/X7R
ceramic capacitors. For stable operation of the internally compensated control loop, a maximum of 50-μF
effective output capacitance is tolerable.
Depending on the material, size and margin to the rated voltage of the used output capacitor, degradation on the
effective capacitance can be observed. This loss of capacitance is related to the DC bias voltage applied.
Therefore, TI always recommends to check that the selected capacitors are showing enough effective
capacitance under real operating conditions.
10.2.1.2.3 Checking Loop Stability
The first step of circuit and stability evaluation is to look from a steady-state perspective at the following signals:
• Switching node, SW
• Inductor current, IL
• Output ripple voltage, VOUT(AC)
These are the basic signals that need to be measured when evaluating a switching converter. When the
switching waveform shows large duty cycle jitter or the output voltage or inductor current shows oscillations the
regulation loop may be unstable. This is often a result of board layout and/or L-C combination.
The next step in regulation loop evaluation is to perform a load transient test. Output voltage settling time after
the load transient event is a good estimate of the control loop bandwidth. The amount of overshoot and
subsequent oscillations (ringing) indicates the stability of the control loop. Without any ringing, the loop has
usually more than 45° of phase margin.
Because the damping factor of the circuitry is directly related to several resistive parameters (for example,
MOSFET rDS(on)) that are temperature dependant, the loop stability analysis has to be done over the input voltage
range, output current range, and temperature range.
10.2.1.3 Application Curves
ILED
SW
(2V/div)
(50mA/div)
VOUT
(500 mV/div - 3.5 V Offset)
LED Headroom Voltage
(1V/div)
IL
(200mA/div - 0.6 A Offset)
IL
(50mA/div)
VOUT
(50mV/div - 5 V Offset)
VI = 4.2 V,
ILED = 75 mA
VI = 3.6 V, VO = 5 V,
IO = 500 mA, ILIM = 1500 mA
t - Time = 250 ns/div
t - Time = 125 ns/div
Figure 20. PWM Operation
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Figure 21. Down-Mode Operation
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VOUT
(200 mV/div - 4 V Offset)
VI = 3.6 V, VO = 5 V,
ILIM = 1500 mA
VOUT
(500 mV/div - 5 V Offset)
Battery Voltage
(200 mV/div - 4 V Offset)
ILED
(100 mA/div - 0.3 A Offset)
IL
(200 mA/div - 0.3 A Offset)
IL
(500 mA/div)
VI = 3.6 V to 3.9 V,
ILED = 500 mA, ILIM = 1500 mA
IOUT
(500 mA/div)
t - Time = 20 ms/div
t - Time = 50 ms/div
Figure 22. Voltage Mode Load Transient Response
Figure 23. Down-Mode Line Transient Response
Battery Voltage
(10 mV/div - 3.3 V Offset)
TRIGGERED ON RISING EDGE
SW
(1 V/div)
VOUT (20 mV/div - 4.2 V Offset)
IL
(200 mA/div - 0.5 A Offset)
VI = 3.6 V,
VO = 5 V,
IO = 500 mA,
ILIM = 1500 mA
ILED
(200 mA/div - 0.3 A Offset)
Li-Polymer Battery at 3.3V, ILED = 700 mA, ILIM = 1500 mA
t - Time = 50 ns/div
t - Time = 500 ns/div
Figure 24. Duty Cycle Jitter
Figure 25. Input Ripple Voltage
FLASH_SYNC
(2 V/div)
SAFETY TIMER LIMITATION
Frequency = 121 Hz
Duty Cycle = 6.25%
ILED
(500 mA/div)
ILED
(20 mA/div)
VOUT
(200 mV/div - 3.5 V Offset)
VIN = 3.6 V, ITORCH = 75 mA
VOUT
(500 mV/div - 3.40 V Offset)
LED Pin Headroom Voltage
(200 mV/div)
VI = 3.2 V, ILIM = 1500 mA
ILED = 75 mA (Torch) to 700 mA (Flash)
t - Time = 2 ms/div
t - Time = 100 ms/div
Figure 26. Low-Light Dimming Mode Operation
Figure 27. Torch and Flash Sequence
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VI = 3.6 V, ILIM = 1500 mA
ITORCH = 75 mA, IFLASH = 700 mA
FLASH_SYNC
(2 V/div)
Tx-TOFF
(2 V/div)
Tx-TOFF
(2 V/div)
ILED
(200 mA/div)
ILED
(200 mA/div)
IL
(500 mA/div)
IL
(500 mA/div)
VI = 3.6 V, ILIM = 1500 mA
ITORCH = 75 mA, IFLASH = 700 mA
t - Time = 10 ms/div
t - Time = 200 ms/div
Figure 28. TX-Masking Operation
Figure 29. TX-Masking Operation
Tx-TOFF
(2 V/div)
VI = 3.6 V, ILIM = 1500 mA ,IFLASH = 700 mA
MODE0 = GND, FLASH_SYNC = HIGH
MODE1
(2 V/div)
VOUT
(2 V/div)
ILED
ILED
(200 mA/div)
(500 mA/div)
IL
(500 mA/div)
IL
(200 mA/div)
VI = 3.6 V, ILIM = 1500 mA
ITORCH = 75 mA, IFLASH = 700 mA
t - Time = 200 ms/div
t - Time = 50 ms/div
Figure 31. Start-Up in Flash Operation
Figure 30. TX-Masking Operation
10.2.2 2 × 350-mA Dual LED Camera Flash
Figure 32 shows the typical application where TPS61054 is used to drive dual LED camera flash (2 × 350-mA).
TPS61054
L
VBAT
2.2 mH
SW
SW
VOUT
COUT
10 mF
AVIN
Li-Ion
C IN
LED 1
P
1 .5 R
P
LED 2
1 .5 R
P
LED
MODE1
LED 1, LED 2 VF variation
should be with 100 mV from each other
MODE0
Tx-TOFF
FLASH _SYNC
PGND
AGND
P
PGND
Figure 32. 2 × 350-mA Dual LED Camera Flash
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11 Power Supply Recommendations
The device is designed to operate from an input voltage supply range between 2.5 V to 6.0 V. This input supply
must be well regulated. If the input supply is located more than a few inches from the converter, additional bulk
capacitance may be required in addition to the ceramic bypass capacitors. A typical choice is an electrolytic or
tantalum capacitor with a value of 47 μF.
12 Layout
12.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks.
The input capacitor, output capacitor, and the inductor must be placed as close as possible to the IC. Use a
common ground node for power ground and a different one for control ground to minimize the effects of ground
noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
To lay out the control ground, TI recommends to use short traces, as well, separated from the power ground
traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and
control ground current.
12.2 Layout Example
4.7 mm
+ BATTERY
INDUCTOR
INPUT
CAP
AGND
C1
L1
PGND
DIGITAL I/O
PGND
OUTPUT
CAP
4.7 mm
LED
SENSE
C2
LED ANODE
Figure 33. Typical PCB Layout
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12.3 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component.
Three basic approaches for enhancing thermal performance are:
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB
• Introducing airflow in the system
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where
high maximum power dissipation exists, take special care to thermal dissipation issues in board design. The
maximum junction temperature (TJ) of the TPS6105x is 150°C.
The maximum power dissipation gets especially critical when the device operates in the linear down mode at
high LED current. For single-pulse power thermal analysis (for example, flash strobe), the allowable power
dissipation for the device is given by Figure 34.
4
No Airflow
Single Pulse Power Disipation - W
3.5
3
2.5
2
1.5
tPCB = 85°C
1
0.5
0
0
Theta JB: 35°CW
100 200 300 400 500 600 700 800 900 1000
Pulse Width - ms
Figure 34. Single Pulse Power Capability (CSP Package)
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13 Device and Documentation Support
13.1 Device Support
13.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
13.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 5. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS61054
Click here
Click here
Click here
Click here
Click here
TPS61055
Click here
Click here
Click here
Click here
Click here
13.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.4 Trademarks
NanoFree, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
13.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPS61054DRCT
ACTIVE
VSON
DRC
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
BRX
TPS61054YZGR
ACTIVE
DSBGA
YZG
12
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TPS61054
TPS61055DRCR
ACTIVE
VSON
DRC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
BRY
TPS61055DRCT
ACTIVE
VSON
DRC
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
BRY
TPS61055YZGR
ACTIVE
DSBGA
YZG
12
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TPS61055
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Sep-2015
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TPS61054DRCT
VSON
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
DRC
10
250
180.0
B0
(mm)
K0
(mm)
P1
(mm)
12.4
3.3
3.3
1.1
8.0
W
Pin1
(mm) Quadrant
12.0
Q2
TPS61054YZGR
DSBGA
YZG
12
3000
180.0
8.4
1.75
2.25
0.81
4.0
8.0
Q1
TPS61055DRCR
VSON
DRC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
TPS61055DRCT
VSON
DRC
10
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
TPS61055YZGR
DSBGA
YZG
12
3000
180.0
8.4
1.75
2.25
0.81
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS61054DRCT
VSON
DRC
10
250
210.0
185.0
35.0
TPS61054YZGR
DSBGA
YZG
12
3000
182.0
182.0
20.0
TPS61055DRCR
VSON
DRC
10
3000
367.0
367.0
35.0
TPS61055DRCT
VSON
DRC
10
250
210.0
185.0
35.0
TPS61055YZGR
DSBGA
YZG
12
3000
182.0
182.0
20.0
Pack Materials-Page 2
www.ti.com
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