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TPS61177A
SNVSA76B – MARCH 2015 – REVISED MARCH 2017
TPS61177A WLED Driver for Notebooks With PWM Interface and Mixed Dimming Mode
1 Features
3 Description
•
•
•
•
The TPS61177A device provides a highly integrated
white LED (WLED) driver solution for notebook LCD
backlight. This device has a built-in high-efficiency
boost regulator with integrated 1.8-A, 40-V power
MOSFET. The six current sink regulators provide high
precision current regulation and matching. In total, the
device can support up to 72 WLEDs. In addition, the
boost output automatically adjusts its voltage to the
WLED forward voltage to optimize efficiency.
1
•
•
•
•
•
•
•
•
•
•
•
•
2.5-V to 24-V Input Voltage Range
39-V Maximum Output Voltage
Integrated 1.8-A, 40-V MOSFET
450-kHz to 1.2-MHz Programmable Switching
Frequency
Adaptive Boost Output to WLED Voltages
100-Hz to 25-kHz Wide Input PWM Dimming
Frequency Range
1% Minimum Dimming Duty Cycle
Small External Components
Integrated Loop Compensation
Six Current Sinks of 30 mA Maximum
1% (Typical) Current Matching
Input PWM Glitch Filter
PWM Brightness Interface Control
Three Optional Dimming Methods, including Direct
PWM Dimming, Analog Dimming, and Analog and
PWM Mixed Dimming
Built-in WLED Open Protection
Thermal Shutdown
The TPS61177A supports the analog dimming,
analog and PWM dimming, and direct PWM dimming
method. During analog dimming mode, each CS
current linearly varies depending on the duty cycle
information on the PWMB pin. During analog and
PWM mixed dimming mode, the input PWM duty
cycle information is translated to an analog signal to
control the WLED current linearly over 25% to 100%
brightness area. The device also allows adding PWM
dimming when the analog current is down to 25%.
Below 25%, the analog signal translates to PWM duty
cycle information to control the on or off of WLED
current and averages the WLED current down to 1%.
The frequency of adding PWM dimming is same to
input PWM frequency on the PWMB pin. While the
TPS61177A also supports a direct PWM dimming
method, in direct PWM dimming mode the WLED
current is turned on or off, synchronized with the input
PWM signal.
2 Applications
•
•
•
•
•
Notebook and Tablet LCD Display Backlights
Patient Monitors
Medical Displays
HMI
Test and Measurement Equipment
Device Information(1)
PART NUMBER
TPS61177A
PACKAGE
VQFN (20)
BODY SIZE (NOM)
3.50 mm x 3.50 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application – Analog and PWM Mixed Mode
L1
10 μH
VIN 2.5 V – 24 V
D1
VOUT
C2
4.7 μF
C1
4.7 μF
LXB
VINB
C4
1 μF
PGND
VLED
VCC
R1
10 kΩ
R2
10 kΩ
ENB
PWMB
100 Hz – 25 KHz
SDA
CS1
SCL
CS2
CS3
CS4
CS5
CS6
REF
C5
470 nF
AGND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61177A
SNVSA76B – MARCH 2015 – REVISED MARCH 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
4
5
7
8
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
I2C Timing Requirements..........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 16
7.5 Programming........................................................... 18
7.6 Register Maps ......................................................... 18
8
Application and Implementation ........................ 27
8.1 Application Information............................................ 27
8.2 Typical Application ................................................. 28
9 Power Supply Recommendations...................... 30
10 Layout................................................................... 31
10.1 Layout Guidelines ................................................. 31
10.2 Layout Example .................................................... 31
11 Device and Documentation Support ................. 32
11.1
11.2
11.3
11.4
11.5
Device Support......................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
32
32
32
32
32
12 Mechanical, Packaging, and Orderable
Information ........................................................... 32
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (March 2016) to Revision B
•
Changed layout example picture to show Vout connected to pin 14 of the device, not pin 13............................................ 31
Changes from Original (March 2015) to Revision A
•
2
Page
Page
Added several items to "Applications" on page 1 .................................................................................................................. 1
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SNVSA76B – MARCH 2015 – REVISED MARCH 2017
5 Pin Configuration and Functions
RGR Package
20-Pin VQFN
Top View
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
NUMBER
AGND
5, 9
—
6, 7, 8, 10, 11, 12
I
Current sink regulation inputs. They are connected to the cathode of
WLEDs. The PWM loop regulates the lowest VCS to 500 mV. Each
channel is limited to 30-mA current. Connect any unused CS pin to
AGND or leave it open.
ENB
19
I
Enable pin
LXB
16, 17
I
Drain connection of the internal PWM switch MOSFET and external
Schottky diode.
REF
4
O
The reference pin for internal error amplifier. Connect a 470-nF
ceramic capacitor to REF.
PGND
15
—
Power ground of the IC. Internally, it connects to the source of the
PWM switch. Tie the ground of power stage components to this
ground.
PWMB
20
I
Dimming control logic input. The dimming frequency range is from 100
Hz to 25 kHz.
SCL
2
I
Clock input for I2C interface
SDA
1
I/O
Data input for I2C interface
VCC
3
I
Internal pre-regulator and supply rail for the internal logic. Do not
connect any capacitor to VCC pin.
VINB
18
I
Power supply to the IC
VLED
14
I
The voltage detect pin for VOUT.
CS1, CS2, CS3, CS4,
CS5, CS6
Signal ground of the device.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Voltage (2)
(1)
MIN
MAX
VINB
–0.3
26.4
LXB, VLED, CS1, CS2, CS3, CS4, CS5, CS6
–0.3
40
ENB, PWMB
–0.3
30
SDA, SCL, VCC
–0.3
3.6
Continuous power dissipation
–40
150
Storage temperature, Tstg
–65
150
(2)
V
See Thermal Information
Operating junction temperature
(1)
UNIT
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
6.2 ESD Ratings
VALUE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
V(ESD)
(1)
(2)
Electrostatic discharge
(1)
UNIT
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
V
±1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
2.5
24
VIN + 2
39
PWM input signal frequency
0.1
25
kHz
PWM input signal minimum duty cycle
1%
FBOOST
Boost regulator switching frequency
450
1200
kHz
TA
Operating free-air temperature
–40
85
TJ
Operating junction temperature
–40
125
VIN
Input voltage
VOUT
Output voltage
FPWM_I
DMIN_I
UNIT
V
°C
6.4 Thermal Information
TPS61177A
THERMAL METRIC (1)
RGR (VQFN)
UNIT
20 PINS
RθJA
Junction-to-ambient thermal resistance
34.4
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
46.8
°C/W
RθJB
Junction-to-board thermal resistance
12.2
°C/W
ψJT
Junction-to-top characterization parameter
0.5
°C/W
ψJB
Junction-to-board characterization parameter
12.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.0
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics
VINB = 12 V, PWMB/ENB = logic high, CS current = 20 mA, CS voltage = 500 mV, TA = –40°C to +85°C, typical values are
at TA = 25°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
VINB
Input voltage range
Iq_VINB
Operating quiescent current into
VIN
ISD
Shutdown current
VINB_UVLO
VIN_Hys
VINB undervoltage lockout
threshold,
voltage ramp up
2.5
24
Device enable, no switching and no load,
VINB = 12 V
3.5
VINB = 12 V, EN = low
10
VINB = 24 V, EN = low
15
UVLO = 000
2.1
2.25
2.4
UVLO = 001
2.4
2.55
2.7
UVLO = 010
2.8
3
3.2
UVLO = 011
3.3
3.5
3.7
Other case
3.8
4
4.2
VIN undervoltage lockout
hysteresis
200
V
mA
µA
V
mV
BOOST OUTPUT REGULATION
VCS
CS voltage regulation
500
600
VIN = 12 V
0.20
0.35
VIN = 3.3 V
0.30
0.40
2.2
2.6
A
5
µA
RDS(ON)
Switch FET on-resistance
ILIM
Switching MOSFET current limit
D = Dmax
ILEAK_LX
Switch FET leakage current
VSW = 40 V
FLX
Switching frequency
DMAX
Maximum duty cycle
TF
Slew rate of switching FET ON
1.8
FREQ = 00
0.36
0.45
0.54
FREQ = 01
0.48
0.6
0.72
FREQ = 10
0.64
0.8
0.96
1.44
FREQ = 11
0.96
1.2
FLX = 0.8 MHz
90%
95%
SR = 00
4.6
SR = 01
3.5
SR = 10
2.5
SR = 11
1.3
ICS = 0000
15
ICS = 0001
16
…
…
mV
Ω
MHz
V/ns
CS CURRENT REGULATION
ICS
CSn current
(See Figure 23)
ICS = 1111
ICSA
CSn current accuracy
(ICSn – 20 mA × DPWM_I)/20 mA x
DPWM_I
mA
30
ICS = 20 mA, MODE = 00 and 01
DPWM_I = 100%, TA = 25°C
–3%
3%
ICS = 20 mA, MODE = 01
DPWM_I = 255/1023, TA = 25°C
–3%
3%
ICS = 20 mA, MODE = 10,
DPWM_I = 255/1023, TA = 25°C
–3%
3%
ICS = 20 mA, MODE = 10,
DPWM_I = 51/1023, TA = 25°C
–5%
5%
ICS = 20 mA, MODE = 10,
DPWM_I = 10/1023, TA = 25°C
–8%
8%
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Electrical Characteristics (continued)
VINB = 12 V, PWMB/ENB = logic high, CS current = 20 mA, CS voltage = 500 mV, TA = –40°C to +85°C, typical values are
at TA = 25°C (unless otherwise noted).
PARAMETER
Current matching (ICSn –
IAVG)/IAVG
ICSM
DC dimming resolution steps
Brightness response time
ICSLK
CSn leakage current
ICSIR
CSn current inrush
tMP
Minimum dimming pulse
tDEG
Deglitch pulse width
TEST CONDITIONS
MIN
TYP
MAX
ICS = 20 mA, MODE = 00 and 01,
DPWM_I = 100%, TA = 25°C
–2%
2%
ICS = 20 mA, MODE = 01,
DPWM_I = 255/1023, TA = 25°C
–2%
2%
ICS = 20 mA, MODE = 10,
DPWM_I = 255/1023, TA = 25°C
–2%
2%
ICS = 20 mA, MODE = 10,
DPWM_I = 51/1023, TA = 25°C
–5%
-5%
ICS = 20 mA, MODE = 10,
DPWM_I = 10/1023, TA = 25°C
–5%
5%
MODE = 01 and 10, FPWM_I = 0.1 to 5 kHz
1024
MODE = 01 and 10, FPWM_I = 5 to 10 kHz
512
MODE = 01 and 10, FPWM_I = 10 to 25 kHz
256
DPWM_I 10% to 90% MODE = mixed and DC,
FPWM_I = 25 kHz
400
DPWM_I 10% to 90% MODE = mixed and DC,
FPWM_I = 100 Hz
10.4
VCS = 40 V
UNIT
μs
ms
5
μA
10%
MODE = 00
400
ns
125
ns
CONTROL AND PROTECTION
VH
ENB logic high threshold
VINB = 2.7 V and 3.3 V
VL
ENB logic low threshold
VINB = 2.7 V and 3.3 V
VH
PWMB logic high threshold
VINB = 2.7 V and 3.3 V
VL
PWMB logic low threshold
VINB = 2.7 V and 3.3 V
Pulldown resistor on ENB
ENB = 3.3 V
300
600
1200
Pulldown resistor on PWMB
PWMB = 3.3 V
300
600
1200
39
39.5
40
RPD
1.8
0.5
1.8
0.5
VOVP
Output overvoltage threshold
Tshutdown
Thermal shutdown threshold
150
Thermal shutdown hysteresis
15
FSAMPLE
6
Input sampling oscillator
frequency
22
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V
25
kΩ
V
°C
29
MHz
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6.6 I2C Timing Requirements
MIN
ADDR
Configuration parameters slave address
NOM
Write
58h
Read
59h
MAX
UNIT
0.75
V
VIL
Low level input voltage
Supply = 2.5 V, VIN falling,
standard and fast modes
VIH
High level input voltage
Supply = 2.5 V, VIN rising,
standard and fast modes
1.75
V
VHYS
Hysteresis
Supply = 2.5 V,
applicable to fast mode only
125
mV
VOL
Low level output voltage
Sinking 3 mA
CI
Input capacitance
ƒSCL
Clock frequency
tLOW
Clock low period
tHIGH
Clock high period
tBUF
500
mV
10
pF
Standard mode
100
Fast mode
400
Standard mode
4.7
Fast mode
1.3
Standard mode
0.6
Bus free time between a STOP and a
START condition
Standard mode
4.7
Fast mode
1.3
thd:STA
Hold time for a repeated START
condition
Standard mode
tsu:STA
Set-up time for a repeated START
condition
Standard mode
tsu:DAT
Data set-up time
thd:DAT
Data hold time
tRCL1
tRCL
Rise time of SCL
tFCL
Fall time of SCL
tRDA
Rise time of SDA
tFDA
Fall time of SDA
tsu:STO
Set-up time for STOP condition
CB
Capacitive load on SDA and SCL
NWRITE
Number of write cycles
tWRITE
Write time
Fast mode
µs
4
Fast mode
µs
µs
4
µs
0.6
4
µs
Fast mode
0.6
Standard mode
250
Fast mode
100
Standard mode
0.05
3.45
Fast mode
0.05
0.9
Rise time of SCL after a repeated START Standard mode
condition and after an ACK bit
Fast mode
20+0.1CB
1000
20+0.1CB
1000
Standard mode
20+0.1CB
1000
Fast mode
20+0.1CB
300
Standard mode
20+0.1CB
300
Fast mode
20+0.1CB
300
Standard mode
20+0.1CB
1000
Fast mode
20+0.1CB
300
Standard mode
20+0.1CB
300
Fast mode
20+0.1CB
300
Data retention
Standard mode
Fast mode
kHz
ns
4
µs
ns
ns
ns
ns
ns
µs
0.6
Standard mode
400
Fast mode
400
pF
1000
100
Storage temperature = 150°C
100,000
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6.7 Typical Characteristics
Table 1. Table of Graphs
TITLE
DESCRIPTION
FIGURE
Figure 1
Efficiency vs PWM Duty in PWM Mode VIN = 3 V, 12 V, 21 V, VOUT = 6S6P, 8S6P, 10S6P, L = 10 µH
Figure 2
Efficiency vs PWM duty in Mixed Mode VIN = 12 V, VOUT = 6S6P, 8S6P, 10S6P, ICS = 20 mA, L = 10 µH
Figure 3
Efficiency vs PWM duty in Mixed Mode VIN = 3 V, 12 V, 21 V, VOUT = 6S6P, 8S6P, 10S6P, L = 10 µH
Figure 4
Efficiency vs PWM duty in Analog
Mode
VIN = 12 V, VOUT = 6S6P, 8S6P, 10S6P, ICS = 20 mA, L = 10 µH
Figure 5
Efficiency vs PWM duty in Analog
Mode
VIN = 3 V, 12 V, 21 V, VOUT = 6S6P, 8S6P, 10S6P, L = 10 µH
Figure 6
Dimming Linearity in PWM Mode
VIN = 12 V, VOUT = 10S6P , FDIM = 200 Hz and 20 kHz, L = 10 µH
Figure 7
Dimming Linearity in Mixed Mode
VIN = 12 V, VOUT = 10S6P , FDIM = 200 Hz and 20 kHz, L = 10 µH
Figure 8
Dimming linearity in Analog Mode
VIN = 12 V, VOUT = 10S6P , FDIM = 200 Hz and 20 kHz, L = 10 µH
Figure 9
Switch Waveform
VIN = 3 V, VOUT = 6S6P, Duty = 100%, L = 10 µH
Figure 10
Switch Waveform
VIN = 12 V, VOUT = 10S6P, Duty = 100%, L = 10 µH
Figure 11
Mixed-Mode Dimming Ripple
VIN = 12 V, VOUT = 10S6P, FDIM = 200 Hz, Duty = 50%, L = 10 µH
Figure 12
Mixed-Mode Dimming Ripple
VIN = 12 V, VOUT = 10S6P, FDIM = 200 Hz, Duty = 12.5%, L = 10 µH
Figure 13
Mixed-Mode Dimming Ripple
VIN = 12 V, VOUT = 10S6P, FDIM = 20 kHz, Duty = 12.5%, L = 10 µH
Figure 14
PWM-Mode Dimming Ripple
VIN = 12 V, VOUT = 10S6P, FDIM = 200 Hz, Duty = 50%, L = 10 µH
Figure 15
PWM-Mode Dimming Ripple
VIN = 12 V, VOUT = 10S6P, FDIM = 20 kHz, Duty = 50%, L = 10 µH
Figure 16
100
100
90
90
80
80
Efficiency (%)
Efficiency (%)
Efficiency vs PWM Duty in PWM Mode VIN = 12 V, VOUT = 6S6P, 8S6P, 10S6P, ICS = 20 mA, L = 10 µH
70
60
6S6P
8S6P
10S6P
50
40
0
20
40
60
80
60
Vin
V6S6P
6S6P
V
in ==33V
50
Vin
12VV8S6P
8S6P
V
in ==12
V
Vin
21VV10S6P
10S6P
in ==21
40
100
PWM Duty Cycle (%)
0
20
40
60
80
100
PWM Duty Cycle (%)
C001
Figure 1. Efficiency vs PWM Duty in PWM Mode
8
70
C002
Figure 2. Efficiency vs PWM Duty in PWM Mode
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100
100
90
90
80
80
Efficiency (%)
Efficiency (%)
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70
60
6S6P
8S6P
10S6P
50
40
0
20
40
60
80
100
80
Efficiency (%)
80
70
60
6S6P
8S6P
10S6P
50
40
80
80
100
C004
60
Vin
V6S6P
6S6P
V
in ==33V
50
Vin
12VV8S6P
8S6P
V
in ==12
V
Vin
21VV10S6P
10S6P
in ==21
40
0
20
Figure 5. Efficiency vs PWM Duty in Analog Mode
100
100
80
80
Current (mA)
120
40
200 Hz
60
80
100
C006
Figure 6. Efficiency vs PWM Duty in Analog Mode
120
60
40
PWM Duty Cycle (%)
C005
20
60
70
100
PWM Duty Cycle (%)
40
Figure 4. Efficiency vs PWM Duty in Mixed Mode
90
60
20
PWM Duty Cycle (%)
90
40
V
Vin
21VV10S6P
10S6P
in ==21
0
100
20
Vin
12VV8S6P
8S6P
V
in ==12
C003
100
0
Vin
V6S6P
6S6P
V
in ==33V
40
Figure 3. Efficiency vs PWM Duty in Mixed Mode
Efficiency (%)
60
50
PWM Duty Cycle (%)
Current (mA)
70
60
40
200 Hz
20
20 kHz
20 kHz
0
0
0
20
40
60
80
PWM Duty Cycle (%)
100
0
20
Figure 7. Dimming Linearity in PWM Mode
40
60
80
PWM Duty Cycle (%)
C007
100
C008
Figure 8. Dimming Linearity in Mixed Mode
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120
VLED Voltage 100mV/div
Current (mA)
100
80
LXB Voltage 10V/div
60
40
200 Hz
20
Inductor Current 300mA/div
20 kHz
0
0
20
40
60
80
PWM Duty Cycle (%)
100
C009
Time (1µs/div)
Figure 9. Dimming Linearity in Analog Mode
Figure 10. Switch Waveform
VLED Voltage 100mV/div
VLED Voltage 100mV/div
PWMB Voltage 3V/div
CS1 Voltage 1V/div
LXB Voltage 10V/div
CS Current 50mA/div
Inductor Current 300mA/div
Time (1µs/div)
Time (5 ms/div)
FDIM = 200 Hz
Figure 11. Switch Waveform
Figure 12. Mixed-Mode PWM Dimming
VLED Voltage 100mV/div
VLED Voltage 100mV/div
PWMB Voltage 3V/div
PWMB Voltage 3V/div
CS1 Voltage 4V/div
CS1 Voltage 4V/div
IOUT Current 50mA/div
IOUT Current 50mA/div
Time (5 ms/div)
FDIM = 200 Hz
Time (50 µs/div)
Duty = 12.5%
FDIM = 20 kHz
Figure 13. Mixed-Mode PWM Dimming
10
Duty = 50%
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Duty = 12.5%
Figure 14. Mixed-Mode PWM Dimming
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VLED Voltage 200mV/div
VLED Voltage 200mV/div
PWMB Voltage 3V/div
PWMB Voltage 3V/div
CS1 Voltage 5V/div
CS1 Voltage 5V/div
IOUT Current 100mA/div
IOUT Current 100mA/div
Time (5 ms/div)
FDIM = 200 Hz
Time (50 µs/div)
Duty = 50%
FDIM = 20 kHz
Figure 15. PWM Mode Dimming
Duty = 50%
Figure 16. PWM Mode Dimming
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7 Detailed Description
7.1 Overview
The TPS61177A is a high-efficiency, high output voltage white-LED (WLED) driver for notebook panel
backlighting applications. Due to the large number of white LEDs required to provide backlighting for medium-tolarge display panels, the LEDs must be arranged in parallel strings of several LEDs in series. Therefore, the
backlight driver for battery-powered systems is almost always a boost regulator with multiple current-sink
regulators. Having more WLEDs in series reduces the number of parallel strings, thus improving overall current
matching. However, the efficiency of the boost regulator declines due to the need for high output voltage. Also,
there must be enough white LEDs in series to ensure the output voltage stays above the input voltage range.
The TPS61177A device has integrated all of the key function blocks to power and control up to 72 WLEDs. The
device includes a 1.8-A, 40-V boost regulator, six 30-mA current sink regulators, and a protection circuit for
overcurrent, overvoltage, open LED, short LED, and overtemperature failures. The TPS61177A integrates mixed
mode dimming methods with the PWM interface to reduce the output ripple voltage and audible noise. Optional
direct PWM and pure analog dimming modes are user selectable through the I2C programming.
7.2 Functional Block Diagram
L
D
VIN
VOUT
C1
4.7μF
C2
4.7μF
LXB
VLED
VIN
VCC
Linear
Regulator
R
Q
S
Slope
Compensation
Oscillator
PGND
Σ
M
U
X
EA
GM
REF
PWM
C3
470nF
Vref
500mV
CS1
CS2
CS3
CS4
CS5
CS6
CS1
25MHz
ENB
PWMB
SDA
SCL
Decoder
A0h
A1h
A2h
A3h
A4h
A5h
MODE
CS
UVLO
FREQ
SR
Dimming
Mode
EA
Current
Reference
ILIM
I2C
Interface
AGND
Current Sink
Current Sink
Current Sink
Current Sink
Current Sink
CS2
CS3
CS4
CS5
CS6
7.3 Feature Description
7.3.1 Supply Voltage
The TPS61177A device has a built-in linear regulator to supply the device analog and logic circuit. The VCC pin
is recommended to be open without any capacitance load. VCC does not have high current sourcing capability
for external use and typically is regulated at 3.3 V.
12
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Feature Description (continued)
7.3.2 Boost Regulator
The fixed-frequency PWM boost converter uses current-mode control and has integrated loop compensation.
The internal compensation ensures stable output over the full input and output voltage ranges assuming the
recommended inductance and output capacitance values shown in Figure 36. The output voltage of the boost
regulator is automatically set by the device to minimize voltage drop across the CS pins. The device regulates
the lowest CS pin to 500 mV at 20-mA current and consistently adjusts the boost output voltage to account for
any changes in LED forward voltages. If the input voltage is higher than the sum of the WLED forward voltage
drops (at low duty cycles), the boost converter is not able to regulate the output due to its minimum duty cycle
limitation. In this case, increase the number of WLEDs in series or include series ballast resistors in order to
provide enough headroom for the converter to boost the output voltage. Since the TPS61177A integrates a 1.8A, 40-V power MOSFET, the boost converter can provide up to a 39-V output voltage.
7.3.3 Programmable Switch Frequency and Slew Rate
Both switching frequency and slew rate of TPS61177A can be programmable by a E2PROM register value which
is pre-set before device power up. The switching frequency has four options adjustable to 450 kHz, 600 kHz, 800
kHz, or 1200 kHz. The slew rate of switching FET from off to on also has four selections: 1.3 V/ns, 2.5 V/ns, 3.5
V/ns to 4.6 V/ns.
See FREQ (A3h) and SR (A4h) for E2PROM address and data table of boost switching frequency programming
and boost switching slew rate selection.
The adjustable switching frequency feature provides the user with the flexibility of choosing either a faster
switching frequency by using an inductor with smaller inductance and footprint or a slower switching frequency to
get potentially higher efficiency due to lower switching losses. In additional, the selectable slew rate for switching
gives flexibility to trade off between switching loss and electronic-magnetic interference (EMI) effects to the
application system.
7.3.4 LED Current Sinks
The six current sink regulators embedded in the TPS61177A can be collectively configured to provide up to a
maximum of 30 mA each. These six specialized current sinks are accurate to within ±3% max for currents at 20
mA, with a string-to-string difference of ±2%.
Each CS channel current must be programmed to the highest WLED current expected; each CS channel current
is programmable from 15 mA to 30 mA by an E2PROM register through the I2C interface. See CS (A1h) for the
E2PROM register table of CS current programming.
7.3.5 Enable and Start-Up Timing
The internal regulator which provides VCC wakes up as soon as ENB is applied. VCC does not come to full
regulation until VINB voltage is above UVLO. Before boost convert start-up, the TPS61177A checks the status of
all current feedback channels and shuts down any unused feedback channels. It is recommended to short the
unused channels to ground for faster start-up.
After the device is enabled, if the PWM pin is left floating or grounded, the output voltage of the TPS61177A
regulates to the minimum output voltage. Once the device detects a voltage on the PWM pin, the TPS61177A
begins to regulate the CS pin current, as a pre-set per the E2PROM register data, according to the duty cycle of
the signal on the PWMB pin. The boost converter output voltage rises to the appropriate level to accommodate
the sum of the white LED string with the highest forward voltage drops plus the headroom of the current sink at
that current.
Pulling the ENB pin low shuts down the device, resulting in consumption of less than 10 µA in shutdown mode.
The TPS61177A also integrates power-up sequence control for start-up. There is no specified power or control
signal sequence requirement for VINB, ENB, and PWMB. Figure 17 provides the detail timing diagram for
TPS61177A start-up and shutdown.
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Feature Description (continued)
VINB
ENB
PWMB
VLED
PWMB decoder delay
No use detection
4 ms
VCSn
ICSn
Figure 17. Start-up and Shutdown Timing Diagram
The PWMB decoder delay time period is determined by different dimming mode, input duty cycle, and frequency
on the PWMB pin. In PWM mode, the decoder delay time is zero. Once the rising edge is detected on the PWMB
pin, the output voltage starts ramping up immediately. While in mixed dimming mode or analogdimming mode,
the decoder delay time is equal to twice input PWM signal cycle time and 400 µs minimally. If PWM signal input
keeps at high level after first rising edge, the decoder delay is about 20 ms.
Figure 18 provides the detail timing diagram for TPS61177A start-up and shutdown when one of CS channel is
open. The VLED voltage always ramps up to the overvoltage protection threshold which is 39.5 V typically, if one
of CS pin is floating. The device then detects the zero current string, and removes it from the feedback loop.
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Feature Description (continued)
VINB
ENB
PWMB
39.5 V
VLED
PWMB decoder delay
4 ms
No use detection
VCSn
ICSn
Figure 18. Start-Up and Shutdown Timing Diagram (Mixed Mode and DC Mode)
7.3.6 Input Undervoltage Protection (UVLO)
The TPS61177A will not start up until the VINB voltage is higher than the UVLO threshold which is preset by
E2PROM register data. During normal operation, if the VINB drops below UVLO with 200-mV hysteresis, the
TPS61177A immediately shuts down. See UVLO (A2h) for E2PROM address and data table of UVLO threshold.
7.3.7 Overvoltage Protection (OVP)
The TPS61177A integrates output OVP which is fixed at 39.5 V typically. Once the VLED pin detects the voltage
higher than 39.5 V, the boost switching regulator stops switching until the voltage of VLED pin drop below 39.5 V
with 500-mV hysteresis.
7.3.8 Current-Sink Open Protection
If one of the device WLED strings is open, the device automatically detects and disables that string. The open
WLED string is detected by sensing no current in the corresponding CS pin. As a result, the TPS61177A
deactivates the open current sink and removes it from the voltage feedback loop. Subsequently, the output
voltage drops and is regulated to the minimum voltage required for the connected WLED strings. The CS
currents of the connected WLED strings remain in regulation.
The device turns off if it detects that all of the WLED strings are open. If an open string is reconnected again, a
power-on reset (POR) or ENB pin toggling is required to reactivate a previously deactivated string.
7.3.9 Overcurrent Protection
The TPS61177A has a pulse-by-pulse overcurrent limit of 1.8 A (minimum). The PWM switch turns off when the
inductor current reaches this current threshold. The PWM switch remains off until the beginning of the next
switching cycle. This protects the device and external components during an overload condition. When there is a
sustained overcurrent condition more than 2 ms, the device shuts down and requires a POR or EN pin toggling
to restart. The overcurrent shutdown protection can be disabled by E2PROM register through I2C interface. See
ILIM (A5h) for E2PROM register table of ILIM shutdown protection programming.
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Feature Description (continued)
7.3.10 Thermal Protection
When the junction temperature of the TPS61177A is over 150°C, the thermal protection circuit is triggered and
shuts down the device immediately. The device automatically restarts when the junction temperature is back to
less than 150°C with about 15°C hysteresis.
7.4 Device Functional Modes
7.4.1 Mode Selection
The mixed-mode dimming method, analog dimming method, or direct PWM dimming method can be selected
through the E2PROM register. See MODE (A0h) for E2PROM register table of dimming mode programming.
7.4.2 Analog and PWM Mixed Dimming Mode
In analog and PWM mixed mode, the TPS61177A features both analog dimming and PWM digital dimming.
Analog dimming can provide potentially a lower power requirement for the same WLED brightness output
because of a low voltage drop across each WLED when the current is low. Digital PWM dimming provides less
WLED color distortion since the WLED current is held at 25% of full scale when the WLED is on.
The brightness control signal on the PWM pin is translated to a 10-bit digital signal and sent to control the six
current regulators. Each current regulator outputs is DC, and PWM (25% < DPWM < 100%) modulates the
amplitude of the currents from 25% to 100% of preset full-scale current. For DPWM < 25%, each CS turns on/off
at translated duty cycle and same frequency to the input PWM, and in the WLED on duty current is regulated at
25% of full scale. Mixed-mode dimming provides the benefits of both the analog and PWM dimming. For 25% <
DPWM < 100%, analog dimming benefits the low power requirement and increases the power to brightness
transform efficiency. At light load conditions, DPWM < 25%, the PWM dimming provides both high accuracy
brightness and low color distortion. Figure 19 provides the detailed timing diagram of the analog and PWM mixed
dimming mode.
D=100%
D=80%
PWM
Input
D=60%
D=50%
D=25%
D=12.5%
D=6.25%
TON
TPWM
ILEDMAX
80%
60%
50%
CSn
D=50%
D=25%
25%
0A
Analog and PWM Mixed Dimming Mode
Figure 19. Analog and PWM Mixed-Mode Dimming Diagram
7.4.3 Analog Dimming Mode
In analog dimming mode, TPS61177A features pure analog dimming all over the brightness range of full-scale
LED current. Analog dimming can provide potentially low power requirement for same WLED brightness output
because of low voltage drop across each WLED when the current is low. In additional, the brightness control
signal on the PWMB pin is translated to an up to 10-bits digital signal and sent to control the six current
regulators. Each current regulator output DC modulates the amplitude of the currents from 1% to 100% of preset
full-scale current. Figure 20 provides the detailed timing diagram of the analog dimming mode.
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Device Functional Modes (continued)
D=100%
PWM
Input
D=80%
D=60%
D=50%
D=25%
D=12.5%
D=6.25%
TON
TPWM
ILEDMAX
80%
60%
50%
CSn
25%
12.5%
0A
Analog Dimming Mode
Figure 20. Analog-Mode Dimming Diagram
7.4.4 Direct PWM Dimming
In direct PWM mode, all current feedback channels are turned on and off and are synchronized with the input
PWM signal. Figure 21 provides the detailed timing diagram of the direct PWM dimming mode.
D=100%
PWM
Input
D=80%
D=60%
D=50%
D=25%
D=12.5%
D=6.25%
TON
TPWM
ILEDMAX
CSn
0A
Direct PWM Dimming Mode
Figure 21. Direct PWM-Mode Dimming Diagram
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7.5 Programming
7.5.1 Configuration Parameters
Table 2 shows the memory map of the configuration parameters.
Table 2. Configuration Memory Map
REGISTER
ADDRESS
REGISTER
NAME
FACTORY
DEFAULT
DESCRIPTION
A0h
MODE
01h
Sets brightness dimming mode
A1h
CS
05h
Sets the current sinks full scale current
A2h
UVLO
03h
Sets the input voltage UVLO threshold
A3h
FREQ
01h
Sets the boost switching frequency
A4h
SR
00h
Sets the boost switching slew rate
A5h
ILIM
00h
Enables/disables the shutdown protection for current limit
FFh
Control
00h
Controls whether read and write operations access RAM or E2PROM registers.
7.6 Register Maps
7.6.1 MODE (A0h)
The MODE register can be written to and read from.
Figure 22. MODE Register Bit Allocation
7
6
5
4
3
2
1
RESERVED
R/W-0
0
MODE
R/W-1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 3. MODE Register Bit Field Descriptions
Bit
Field
Type
Reset
Description
7:2
RESERVED
R/W
0
These bits are reserved for future use. During write operations, data intended for
these bits are ignored, and during read operations 0 is returned.
1:0
MODE
R/W
1
These bits configure the current sink dimming method for brightness control.
00 = Direct PWM dimming mode
01 = Analog and PWM mixed dimming mode
10 = Analog dimming mode
7.6.2 CS (A1h)
The CS register can be written to and read from.
Figure 23. CS Register Bit Allocation
7
6
5
4
3
2
RESERVED
R/W-0
1
0
CS
R/W-5
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 4. CS Register Bit Descriptions
18
Bit
Field
Type
Reset
7:4
RESERVED
R/W
0
Description
These bits are reserved for future use. During write operations, data intended for these
bits are ignored, and during read operations 0 is returned.
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Table 4. CS Register Bit Descriptions (continued)
Bit
Field
Type
Reset
Description
These bits select the full scale current for all six current sinks.
3:0
CS
R/W
0000:
0001:
0010:
0011:
0100:
0101:
0110:
0111:
5
ICS = 15
ICS = 16
ICS = 17
ICS = 18
ICS = 19
ICS = 20
ICS = 21
ICS = 22
mA
mA
mA
mA
mA
mA
mA
mA
1000:
1001:
1010:
1011:
1100:
1101:
1110:
1111:
ICS = 23
ICS = 24
ICS = 25
ICS = 26
ICS = 27
ICS = 28
ICS = 29
ICS = 30
mA
mA
mA
mA
mA
mA
mA
mA
7.6.3 UVLO (A2h)
The UVLO register can be written to and read from.
Figure 24. UVLO Register Bit Allocation
7
6
5
RESERVED
R/W-0
4
3
2
1
UVLO
R/W-3
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 5. UVLO Register Bit Field Descriptions
Bit
Field
Type
Reset
7:3
RESERVED
R/W
0
These bits are reserved for future use. During write operations data intended for these
bits is ignored, and during read operations 0 is returned.
3
These bits select the UVLO threshold.
000: VUVLO = 2.25 V
001: VUVLO = 2.55 V
010: VUVLO = 3 V
011: VUVLO = 3.5 V
100: VUVLO = 4 V
Others: VUVLO = 4 V
2:0
UVLO
R/W
Description
7.6.4 FREQ (A3h)
The FREQ register can be written to and read from.
Figure 25. FREQ Register Bit Allocation
7
6
5
4
3
2
1
RESERVED
R/W-0
0
FREQ
R/W-1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6. FREQ Register Bit Field Descriptions
Bit
Field
Type
Reset
7:2
RESERVED
R/W
0
These bits are reserved for future use. During write operations, data intended for
these bits are ignored, and during read operations 0 is returned.
1
These bits configure the switching frequency.
00: FLX = 450 kHz
01: FLX = 600 kHz
10: FLX = 800 kHz
11: FLX = 1200 kHz
1:0
FREQ
R/W
Description
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7.6.5 SR (A4h)
The SR register can be written to and read from.
Figure 26. SR Register Bit Allocation
7
6
5
4
3
2
1
RESERVED
R/W-0
0
SR
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 7. SR Register Bit Field Descriptions
Bit
Field
Type
Reset
7:2
RESERVED
R/W
0
These bits are reserved for future use. During write operations, data intended for
these bits are ignored, and during read operations 0 is returned.
0
These bits configure the falling slew rate of switching voltage from OFF to ON.
00: SR = 4.6 V/ns
01: SR = 3.5 V/ns
10: SR = 2.5 V/ns
11: SR = 1.3 V/ns
1:0
SR
R/W
Description
7.6.6 ILIM (A5h)
The ILIM register can be written to and read from.
Figure 27. ILIM Register Bit Allocation
7
6
5
4
RESERVED
R/W-0
3
2
1
0
ILIM
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 8. ILIM Register Bit Field Descriptions
Bit
Field
Type
Reset
7:1
RESERVED
R/W
0
These bits are reserved for future use. During write operations, data intended for these
bits are ignored, and during read operations 0 is returned.
ILIM
R/W
0
This bit configures the current limit shutdown protection.
0 = Disable current limit shutdown protection
1 = Enable current limit shutdown protection
0
20
Description
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7.6.7 Control (FFh)
Figure 28. Control Register Bit Allocation
7
WED
6
5
4
3
2
1
0
RED
R/W-0
RESERVED
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 9. Control Register Bit Field Descriptions
Bit
7
6:1
0
Field
Type
Reset
Description
Setting this bit forces the contents of all registers to be copied into E2PROM,
thereby making them the default values during power up.
When the contents of all the registers have been written to E2PROM, the
TPS61177A device automatically resets this bit.
WED
RESERVED
R/W
RED
R/W
0
These bits are reserved for future use. During write operations, data intended for
these bits are ignored, and during read operations 0 is returned.
0
The state of this bit determines whether read operations return the contents of the
registers or the contents of the E2PROM.
0 = Read operations return the contents of the registers.
1 = Read operations return the contents of the E2PROM.
7.6.8 Example – Writing to a Single RAM Register
1. Bus master sends START condition
2. Bus master sends 7-bit slave address plus low R/W bit (58h)
3. TPS61177A acknowledges
4. Bus master sends address of RAM register (A0h)
5. TPS61177A acknowledges
6. Bus master sends data to be written
7. TPS61177A acknowledges
8. Bus master sends STOP condition
58h
S
A0h
7-Bit Slave Address
0
A
RAM Register Address
DATA
A
RAM Register Data
A
P
Figure 29. Writing To A Single Ram Register
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7.6.9 Example – Writing to Multiple RAM Registers
1. Bus master sends START condition
2. Bus master sends 7-bit slave address plus low R/W bit (58h).
3. TPS61177A acknowledges
4. Bus master sends address of first RAM register to be written to (A0h)
5. TPS61177A acknowledges
6. Bus master sends data to be written to first RAM register
7. TPS61177A acknowledges
8. Bus master sends data to be written to RAM register at next higher address (auto-increment)
9. TPS61177A acknowledges
10. Steps (8) and (9) repeated until data for final RAM register has been sent
11. TPS61177A acknowledges
12. Bus master sends STOP condition
58h
S
A0h
7-Bit Slave Address
0
A
DATA
DATA
RAM Register Address (n)
A
RAM Register Data (n)
A
RAM Register Data (n+1)
A
DATA
RAM Register Data (Last)
A
P
Figure 30. Writing To Multiple Ram Registers
7.6.10 Example – Saving Contents of all RAM Registers to E2PROM
1. Pull high the Enable pin of TPS61177A
2. Pull the PWM pin of TPS61177A to low
3. Bus master sends START condition
4. Bus master sends 7-bit slave address plus low R/W bit (58h)
5. TPS61177A acknowledges
6. Bus master sends address of Control Register (FFh)
7. TPS61177A acknowledges
8. Bus master sends data to be written to the Control Register (80h)
9. TPS61177A acknowledges
10. Bus master sends STOP condition
58h
S
7-Bit Slave Address
80h
FFh
0
A
Control Register Address
A
Control Register Data
A
P
Figure 31. Saving Contents Of All Ram Registers To E2PROM
The TPS61177A needs a 50-ms time period after receiving STOP condition for saving all RAM registers data to
E2PROM. If bus master send 7-bit slave address to call TPS61177A again within 50-ms period, the TPS61177A
pulls down the SCL line to LOW until the all RAM registers data saving to E2PROM is completed.
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7.6.11 Example – Reading from a Single RAM Register
1. Bus master sends START condition
2. Bus master sends 7-bit slave address plus low R/W bit (58h)
3. TPS61177A acknowledges
4. Bus master sends address of Control Register (FFh)
5. TPS61177A acknowledges
6. Bus master sends data for Control Register (00h)
7. TPS61177A acknowledges
8. Bus master sends STOP condition
9. Bus master sends START condition
10. Bus master sends 7-bit slave address plus low R/W bit (58h)
11. TPS61177A acknowledges
12. Bus master sends address of RAM register (A0h)
13. TPS61177A acknowledges
14. Bus master sends REPEATED START condition
15. Bus master sends 7-bit slave address plus high R/W bit (59h)
16. TPS61177A acknowledges
17. TPS61177A sends RAM register data
18. Bus master not acknowledges
19. Bus master sends STOP condition
58h
S
7-Bit Slave Address
S
7-Bit Slave Address
00h
FFh
0
A
Control Register Address
0
A
RAM Register Address
58h
A
Control Register Data
A
P
1
A
59h
A0h
A Sr
7-Bit Slave Address
DATA
RAM Register Data
A
P
Figure 32. Reading From A Single Ram Register
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7.6.12 Example – Reading from a Single E2PROM Register
1. Bus master sends START condition
2. Bus master sends 7-bit slave address plus low R/W bit (58h)
3. TPS61177A acknowledges
4. Bus master sends address of Control Register (FFh)
5. TPS61177A acknowledges
6. Bus master sends data for Control Register (01h)
7. TPS61177A acknowledges
8. Bus master sends STOP condition
9. Bus master sends START condition
10. Bus master sends 7-bit slave address plus low R/W bit (58h)
11. TPS61177A acknowledges
12. Bus master sends address of RAM register (A0h)
13. TPS61177A acknowledges
14. Bus master sends REPEATED START condition
15. Bus master sends 7-bit slave address plus high R/W bit (59h)
16. TPS61177A acknowledges
17. TPS61177A sends E2PROM register data
18. Bus master not acknowledges
19. Bus master sends STOP condition
58h
S
7-Bit Slave Address
S
7-Bit Slave Address
01h
FFh
0
A
Control Register Address
0
A
E PROM Register Address
58h
A
A
P
1
A
59h
A0h
2
Control Register Data
A Sr
DATA
7-Bit Slave Address
2
E PROM Register Address
A
P
Figure 33. Reading From A Single E2PROM Register
24
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7.6.13 Example – Reading from Multiple RAM Registers
1. Bus master sends START condition
2. Bus master sends 7-bit slave address plus low R/W bit (58h)
3. TPS61177A acknowledges
4. Bus master sends address of Control Register (FFh)
5. TPS61177A acknowledges
6. Bus master sends data for Control Register (00h)
7. TPS61177A acknowledges
8. Bus master sends STOP condition
9. Bus master sends START condition
10. Bus master sends 7-bit slave address plus low R/W bit (58h)
11. TPS61177A acknowledges
12. Bus master sends address of RAM register (A0h)
13. TPS61177A acknowledges
14. Bus master sends REPEATED START condition
15. Bus master sends 7-bit slave address plus high R/W bit (59h)
16. TPS61177A acknowledges
17. TPS61177A sends contents of first RAM register to be read
18. Bus master acknowledges
19. TPS61177A sends contents of second RAM register to be read
20. Bus master acknowledges
21. TPS61177A sends contents of third (last) RAM register to be read
22. Bus master not acknowledges
23. Bus master sends STOP condition
58h
S
7-Bit Slave Address
S
7-Bit Slave Address
FFh
0
A
Control Register Address
0
A
RAM Register Address (n)
58h
00h
Control Register Data
A
A0h
A
P
1
A
DATA
59h
A Sr
7-Bit Slave Address
A
DATA
DATA
RAM Register Data (n+1)
RAM Register Data (n)
A
RAM Register Data (Last)
A
P
Figure 34. Reading From A Multiple Ram Register
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7.6.14 Example – Reading from Multiple E2PROM Registers
1. Bus master sends START condition
2. Bus master sends 7-bit slave address plus low R/W bit (58h)
3. TPS61177A acknowledges
4. Bus master sends address of Control Register (FFh)
5. TPS61177A acknowledges
6. Bus master sends data for Control Register (01h)
7. TPS61177A acknowledges
8. Bus master sends STOP condition
9. Bus master sends START condition
10. Bus master sends 7-bit slave address plus low R/W bit (58h)
11. TPS61177A acknowledges
12. Bus master sends address of E2PROM register (00h)
13. TPS61177A acknowledges
14. Bus master sends REPEATED START condition
15. Bus master sends 7-bit slave address plus high R/W bit (59h)
16. TPS61177A acknowledges
17. TPS61177A sends contents of first E2PROM register to be read
18. Bus master acknowledges
19. TPS61177A sends contents of second E2PROM register to be read
20. Bus master acknowledges
21. TPS61177A sends contents of third (last) E2PROM register to be read
22. Bus master not acknowledges
23. Bus master sends STOP condition
58h
S
7-Bit Slave Address
S
7-Bit Slave Address
FFh
Control Register Address
01h
0
A
0
A E PROM Register Address (n) A Sr
58h
A
Control Register Data
A0h
2
A
P
1
A
DATA
59h
7-Bit Slave Address
2
E PROM Register Data (n)
A
DATA
DATA
2
2
E PROM Register Data (n+1) A E PROM Register Data (Last) A
P
Figure 35. Reading From Multiple E2PROM Registers
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 CS Pin Unused
The TPS61177A has open/short string detection. For an unused CS string, simply short it to ground or leave it
open. If the CS pin is open, the boost output voltage ramps up to overvoltage threshold during start-up. The
device then detects the zero current string and removes it from the feedback loop. If the CS pin is shorted to
ground, the device detects the short and immediately removes it (or them) out of feedback loop within 4 ms after
device enable, and the boost output voltage does not go up to overvoltage threshold. Instead, it ramps to the
regulation voltage after soft start.
Shorting unused CS pins to ground for faster start-up is recommended.
8.1.2 Brightness Dimming Control
The TPS61177A has three dimming methods. See Mode Selection section for dimming mode selection. With
analog and PWM mixed dimming or pure analog dimming through the PWM control interface, the internal
decoder block detects duty information from the input PWM signal, saves it in an up to 10-bits register and
delivers to either a mixed mode dimming control circuit or pure analog dimming control circuit. In mixed dimming
mode, the output dimming control circuit sets the DC current of six current sinks linearly between 25% and 100%
at same scale to the value in up to a 10-bits register. When the brightness level is below 25% to full-scale value,
the dimming control circuit turns on/off six output current sinks at same frequency with PWMB and duty cycle out
of shift register. See Analog and PWM Mixed Dimming Mode section for more explanation. While in pure analog
dimming mode, the output dimming control circuit sets the DC current of six current sinks linearly between 1%
and 100% at same scale to the value in up to a 10-bits register. See Analog Dimming Mode section for more
detail explanation.
The TPS61177A also has direct PWM dimming control through the PWM control interface. In direct PWM mode,
each current sink turns on/off at the same frequency and duty cycle as the input PWM signal. See Direct PWM
Dimming section for more explanation.
When in analog and PWM mixed mode, insertion of a series 10-kΩ to 20-kΩ resistor close to PWMB pin is
recommended. This resistor, together with an internal capacitor, forms a low pass R-C filter with a 30-ns to 60-ns
time constant. This prevents possible high frequency noise being coupled into the input PWM signal and causing
interference to the internal duty cycle decoding circuit. However, it is not necessary for direct PWM mode since
the duty cycle decoding circuit is disabled during direct PWM mode.
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8.2 Typical Application
L1
10 μH
VIN 2.5 V – 24 V
D1
VOUT
C2
4.7 μF
C1
4.7 μF
LXB
VINB
C4
1 μF
PGND
VLED
VCC
R1
10 kΩ
R2
10 kΩ
ENB
PWMB
100 Hz – 25 KHz
SDA
CS1
SCL
CS2
CS3
CS4
CS5
CS6
REF
C5
470 nF
AGND
Figure 36. TPS61177A Typical Application
8.2.1 Design Requirements
28
DESIGN PARAMETER
EXAMPLE VALUE
Inductor
10 µH
Minimum input voltage
2.5 V
Number of series LED
12
LED maximum forward voltage (Vf)
3.3 V
Schottky diode forward voltage (Vf)
0.2 V
Efficiency (η)
85%
Switching frequency
600 kHz
PWM input frequency
1 kHz
Maximum LED string current
30 mA
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The TPS61177A is designed to support up to 2.2 A (typical) SW current. Thus, SW current must be carefully
calculated with factors such as inductor, target efficiency, output voltage, load current, and so forth. In most
cases, the voltage ratio between input and boost output must be < 10.
8.2.2 Detailed Design Procedure
8.2.2.1 Inductor Selection
Because selection of the inductor affects power supply steady-state operation, transient behavior, and loop
stability, the inductor is the most important component in switching power regulator design. There are three
specifications most important to the performance of the inductor: inductor value, DC resistance, and saturation
current. The TPS61177A is designed to work with inductor values between 4.7 µH and 22 µH. A 10-µH inductor
is typically available in a smaller or lower profile package, while a 22-µH inductor may produce higher efficiency
due to a slower switching frequency and/or lower inductor ripple. If the boost output current is limited by the
overcurrent protection of the device, using a 10-µH inductor and the highest switching frequency maximizes
controller output current capability.
Internal loop compensation for PWM control is optimized for the external component values, including typical
tolerances, recommended in Table 10. Inductor values can have ±20% tolerance with no current bias. When the
inductor current approaches saturation level, its inductance can decrease 20% to 35% from the 0-A value
depending on how the inductor vendor defines saturation. In a boost regulator, the inductor DC current can be
calculated with Equation 1.
V
´I
IL(DC) = OUT OUT
VIN ´ h
where
•
•
•
•
VOUT = boost output voltage
IOUT = boost output current
VIN = boost input voltage
η = power conversion efficiency, use 90% for TPS61177A applications
(1)
The inductor current peak-to-peak ripple can be calculated with Equation 2.
1
DIL(P-P) =
æ
1
1 ö
+
L´ç
÷ ´ FS
V
V
V
IN
IN ø
è OUT
where
•
•
•
•
•
ΔIL(P-P) = inductor peak-to-peak ripple
L = inductor value
FS = Switching frequency
VOUT = boost output voltage
VIN = boost input voltage
(2)
Therefore, the peak current seen by the inductor is calculated with Equation 3.
DIL(P - P)
IL(P) = IL(DC) +
2
(3)
Select an inductor with a saturation current over the calculated peak current. To calculate the worst-case inductor
peak current, use the minimum input voltage, maximum output voltage, and maximum load current.
Regulator efficiency is dependent on the resistance of its high current path and switching losses associated with
the power FET switch and power diode. Although the TPS61177A device has optimized the internal switch
resistances, the overall efficiency is affected by the inductor DC resistance (DCR). Lower DCR improves
efficiency. However, there is a trade off between DCR and inductor footprint; furthermore, shielded inductors
typically have higher DCR than unshielded ones. Table 10 lists the recommended inductors.
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Table 10. Recommended Inductor
L (µH)
DCR (mΩ)
ISAT (A)
Size (L × W × H mm)
10
140
3
5.4 × 5.2 × 1.6
10
335
1.45
6 × 6 × 1.2
Cyntec
PCMB051H-100MS
Taiyo
NRA6012T 100ME
8.2.2.2 Output Capacitor Selection
The output capacitor is mainly selected to meet the requirement for output ripple and loop stability. This ripple
voltage is related to the capacitance of the capacitor and its equivalent series resistance (ESR). Assuming a
capacitor with zero ESR, the minimum capacitance needed for a given ripple can be calculated with Equation 4:
(VOUT - VIN )´ IOUT
COUT =
VOUT ´ FS ´ Vripple
where
•
Vripple = peak-to-peak output ripple.
(4)
The additional part of the ripple caused by ESR is calculated using: Vripple_ESR = IOUT × RESR
Due to its low ESR, Vripple_ESR can be neglected for ceramic capacitors, but must be considered if tantalum or
electrolytic capacitors are used. The controller output voltage also ripples due to the load transient that occurs
during PWM dimming. The TPS61177A adopts a patented technology to limit this type of output ripple even with
the minimum recommended output capacitance. In a typical application, the output ripple is less than 250 mV
during PWM dimming with a 4.7-µF output capacitor. However, the output ripple decreases with higher output
capacitances.
8.2.3 Application Curves
VLED Voltage 10V/div
VLED Voltage 10V/div
PWMB Voltage 3V/div
PWMB Voltage 3V/div
CS1 Voltage 4V/div
CS1 Voltage 4V/div
Inductor Current 500mA/div
Inductor Current 500mA/div
Time (20 ms/div)
Time (5 ms/div)
Figure 37. Start-Up Waveform
Figure 38. Start-Up Waveform
9 Power Supply Recommendations
The power supply for applications using the TPS61177A device must be big enough considering output power
and efficiency at a given input voltage condition. Minimum current requirement condition is (VOUT × IOUT)/(VIN ×
efficiency), and TI recommends a minimum current that is approximately 20% to 30% higher than this value.
30
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10 Layout
10.1 Layout Guidelines
As for all switching power supplies, especially those providing high current and using high switching frequencies,
layout is an important design step. If layout is not carefully done, the regulator could show instability as well as
EMI problems. Therefore, use wide and short traces for high current paths. The input capacitor, C1 in the Typical
Application , must not only to be close to the VIN pin, but also to the GND pin in order to reduce the input ripple
seen by the device. The input capacitor, C4 in the Typical Application , must also be placed close to the inductor.
C5 is the reference capacitor for the internal integration circuit. It must be placed as close between the REF and
AGND pins as possible to prevent any noise insertion to the digital circuits. The LX pin carries high current with
fast rising and falling edges. Therefore, the connection between the pin to the inductor and Schottky diode must
be kept as short and wide as possible. It is also beneficial to have the ground of the output capacitor C2 close to
the PGND pin because there is a large ground return current flowing between them. When laying out signal
grounds, TI recommends using short traces separated from power ground traces, and connecting them together
at a single point, for example on the DAP. The DAP must be soldered on to the PCB and connected to the GND
pin of the device. An additional thermal via can significantly improve power dissipation of the device.
10.2 Layout Example
VIN
PGND
VOUT
ENB
PWMB
SDA
SCL
AGND
20 19 18 17 16
15
1
14
2
13
3 PGND
12
4
11
5
6 7 8 9 10
PGND
CS1
CS2
CS3
AGND
CS4
CS5
CS6
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPS61177ARGRR
ACTIVE
VQFN
RGR
20
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
77AS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of