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TPS62290, TPS62291, TPS62293
SLVS764G – JUNE 2007 – REVISED APRIL 2018
TPS6229x 1-A Step Down Converter in 2 x 2 DRV Package
1 Features
3 Description
•
•
•
The TPS6229x devices are highly efficient
synchronous step down DC/DC converters optimized
for battery powered portable applications. They
provide up to 1000-mA output current from a single
Li-ion cell.
1
•
•
•
•
•
•
•
•
High Efficiency - up to 96%
Output Current up to 1000 mA
VIN Range From 2.3 V to 6.0V for Li-ion Batteries
with Extended Voltage Range
2.25-MHz Fixed Frequency Operation
Power Save Mode at Light Load Currents
Output Voltage Accuracy in PWM Mode ±1.5%
Fixed Output Voltage Options
Typical 15-μA Quiescent Current
100% Duty Cycle for Lowest Dropout
Voltage Positioning at Light Loads
Available in a 2-mm × 2-mm × 0.8-mm WSON (6)
Package (DRV)
2 Applications
•
•
•
•
•
•
Mobile Phones, Smart-Phones
Wireless LAN
Pocket PCs
Low Power DSP Supply
Portable Media Players
Point-of-Load (POL) Applications
With an input voltage range of 2.3 V to 6.0 V, the
devices support batteries with extended voltage
range and are ideal to power portable applications
like mobile phones and other portable equipment.
The TPS6229x devices operate at 2.25-MHz fixed
switching frequency and enter power save mode
operation at light load currents to maintain high
efficiency over the entire load current range.
The power save mode is optimized for low output
voltage ripple. For low noise applications, the devices
can be forced into fixed frequency pulse width
modulation (PWM) mode by pulling the MODE pin
high. In the shutdown mode, the current consumption
is reduced to less than 1 μA. The TPS6229x devices
allow the use of small inductors and capacitors to
achieve a small solution size.
The TPS6229x devices operate over a free air
temperature range of –40°C to 85°C. The devices are
available in a 2-mm × 2-mm 6-pin WSON package
(DRV).
Device Information(1)
PART NUMBER
TPS6229x
PACKAGE
BODY SIZE (NOM)
SON (6)
2.00 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Typical Application Schematic
TPS62290DRV
VIN
CIN
SW
R1
EN
360 kW
10 mF
GND
MODE
L1
2.2 mH
C1
22 pF
100
VIN = 4.2 V
90
VIN = 3.8 V
COUT
80
FB
R2
180 kW
Efficiency - %
VIN 2.7 V to 6.0 V
Efficiency vs Output Current
VOUT 1.8 V,
1000 mA
70
VIN = 5 V
VIN = 4.5 V
60
50
40
VOUT = 3.3 V,
MODE = GND,
L = 2.2 mH
30
0.00001 0.0001 0.001
0.01
0.1
IO - Output Current - A
1
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS62290, TPS62291, TPS62293
SLVS764G – JUNE 2007 – REVISED APRIL 2018
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1
7.2
7.3
7.4
7.5
7.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics ..........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 7
8.1 Overview ................................................................... 7
8.2 Functional Block Diagram ......................................... 7
8.3 Feature Description................................................... 7
8.4 Device Functional Modes.......................................... 9
9
Application and Implementation ........................ 11
9.1 Application Information............................................ 11
9.2 Typical Application .................................................. 11
9.3 System Examples ................................................... 17
10 Power Supply Recommendations ..................... 18
11 Layout................................................................... 18
11.1 Layout Guidelines ................................................. 18
11.2 Layout Example .................................................... 18
12 Device and Documentation Support ................. 19
12.1
12.2
12.3
12.4
12.5
12.6
Device Support......................................................
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
19
19
19
19
19
19
13 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (January 2016) to Revision G
Page
•
Changed Equation 3 operator from × to + in correcting the ILmax formula. ....................................................................... 12
•
Added cross references to the Third-party Products disclaimer. ........................................................................................ 12
Changes from Revision E (September 2015) to Revision F
•
Page
Added Device Comparison Table .......................................................................................................................................... 3
Changes from Revision D (November 2009) to Revision E
•
2
Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
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SLVS764G – JUNE 2007 – REVISED APRIL 2018
5 Device Comparison Table
OUTPUT VOLTAGE (1)
DEVICE MARKING (2)
TPS62290
Adjustable
BYN
TPS62291
3.3 V fixed
CFY
TPS62293
1.8 V fixed
CFD
PART NUMBER
(1)
(2)
Contact TI for other fixed output voltage options
For the most current package and ordering information, see Mechanical, Packaging, and Orderable Information, or see the TI website at
www.ti.com
6 Pin Configuration and Functions
DRV Package
6-PIN SON
Top View
SW
MODE
FB
1
2
3
ed
os al
p
m
Ex her ad
T P
6
5
4
GND
VIN
EN
Pin Functions
PIN
NAME
NO.
TYPE
DESCRIPTION
EN
4
IN
This is the enable pin of the device. Pulling this pin to low forces the device into shutdown mode. Pulling
this pin to high enables the device. This pin must be terminated.
FB
3
IN
Feedback pin for the internal regulation loop. Connect the external resistor divider to this pin. In case of
fixed output voltage option, connect this pin directly to the output capacitor
GND
6
PWR
MODE
2
IN
MODE pin = High forces the device to operate in fixed-frequency PWM mode. Mode pin = Low enables
the power save mode with automatic transition from PFM mode to fixed-frequency PWM mode.
SW
1
OUT
This is the switch pin and is connected to the internal MOSFET switches. Connect the external inductor
between this terminal and the output capacitor.
VIN
5
PWR
VIN power supply pin.
Exposed
Thermal
Pad
GND supply pin
Connect the exposed thermal pad to GND.
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7 Specifications
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1)
VIN
MIN
MAX
–0.3
7
Voltage range at EN, MODE
–0.3
VIN +0.3, ≤ 7
Voltage at SW
–0.3
7
Input voltage range
(2)
Peak output current
A
Maximum operating junction temperature
–40
125
Tstg
Storage temperature
–65
150
(2)
V
Internally limited
TJ
(1)
UNIT
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
VIN
Supply voltage
NOM
MAX
2.3
6
UNIT
V
Output voltage range for adjustable voltage
0.6
VIN
V
TA
Operating ambient temperature
–40
85
°C
TJ
Operating junction temperature
–40
125
°C
7.4 Thermal Information
TPS6229x
THERMAL METRIC
(1)
DRV (SON)
UNIT
6 PINS
RθJA
Junction-to-ambient thermal resistance
67.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
88.6
°C/W
RθJB
Junction-to-board thermal resistance
37.2
°C/W
ψJT
Junction-to-top characterization parameter
2
°C/W
ψJB
Junction-to-board characterization parameter
37.6
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
7.9
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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SLVS764G – JUNE 2007 – REVISED APRIL 2018
7.5 Electrical Characteristics
Over full operating ambient temperature range, typical values are at TA = 25°C. Unless otherwise noted, specifications apply
for condition VIN = EN = 3.6 V. External components CIN = 4.7 μF 0603, COUT = 10 μF 0603, L = 2.2 μH, refer to parameter
measurement information.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
VIN
Input voltage
IOUT
Output current
2.3
6
VIN 2.7 V to 6 V
IQ
Operating quiescent current
ISD
Shutdown current
UVLO
1000
VIN 2.5 V to 2.7 V
600
VIN 2.3 V to 2.5 V
300
mA
IOUT = 0 mA, PFM mode enabled
(MODE = GND) device not switching,
See (1)
15
μA
IOUT = 0 mA, switching with no load
(MODE = VIN) PWM operation,
VOUT = 1.8 V, VIN = 3 V
3.8
mA
EN = GND
Undervoltage lockout threshold
V
0.1
Falling
1.85
Rising
1.95
1
μA
V
ENABLE, MODE
VIH
High level input voltage, EN,
MODE
2.3 V ≤ VIN ≤ 6 V
1
VIN
VIL
Low level input voltage, EN,
MODE
2.3 V ≤ VIN ≤ 6 V
0
0.4
IIN
Input bias current, EN, MODE
EN, MODE = GND or VIN
0.01
1
240
480
185
380
1.4
1.68
V
V
μA
POWER SWITCH
RDS(on)
ILIMF
TSD
High side MOSFET on-resistance
Low side MOSFET on-resistance
VIN = VGS = 3.6 V, TA = 25°C
Forward current limit MOSFET
high-side and low side
VIN = VGS = 3.6 V
Thermal shutdown
Increasing junction temperature
140
Thermal shutdown hysteresis
Decreasing junction temperature
20
1.19
mΩ
A
°C
OSCILLATOR
fSW
2.3 V ≤ VIN ≤ 6 V
Oscillator frequency
2.0
2.25
2.5
MHz
OUTPUT
VOUT
Adjustable output voltage range
Vref
Reference voltage
0.6
VFB(PWM)
Feedback voltage PWM mode
MODE = VIN, PWM operation,
2.3 V ≤ VIN ≤ 6 V, See (2)
VFB(PFM)
Feedback voltage PFM mode
MODE = GND, device in PFM mode,
+1% voltage positioning active, See (1)
VI
600
–1.5%
Load regulation
0%
1.5%
1%
–0.5
tStart Up
Start-up time
Time from active EN to reach 95% of
VOUT
500
tRamp
VOUT ramp-up time
Time to ramp from 5% to 95% of VOUT
250
Ilkg
Leakage current into SW pin
VIN = 3.6 V, VIN = VOUT = VSW, EN =
GND,
See (3)
0.1
(1)
(2)
(3)
V
mV
%/A
μs
μs
1
μA
In PFM mode, the internal reference voltage is set to typical 1.01 × Vref . See the parameter measurement information.
For VIN = VOUT + 1.0 V
In fixed output voltage versions, the internal resistor divider network is disconnected from FB pin.
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7.6 Typical Characteristics
0.8
20
MODE == GND,
GND
MODE
EN == VIN,
VIN
EN
Device Not
Not Switching
Switching
Device
0.7
IQ – Quiescent Current – mA
18
0.6
o
TA = 85 C
0.5
0.4
0.3
0.2
o
16
o
C
TTAA = 25°C
14
12
C
TTAA == –40
-40o°C
o
TA = 25 C
TA = -40 C
10
0.1
0
2
2.5
3
3.5
4
4.5
5
5.5
8
8 222
6
2.5
3
VIN − Input Voltage − V
High Side Switching
0.7
0.6
o
TA = 85 C
0.5
o
TA = 25 C
0.4
0.3
0.2
o
TA = -40 C
0.1
0
2.5
3
3.5
4
4.5
5
VIN − Input Voltage − V
Figure 3. Static Drain-Source On-State Resistance vs Input
Voltage
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55
4.5
4.5
44
5.5
5.5
66
Figure 2. Quiescent Current vs Input Voltage
RDS(on) - Static Drain-Source On-State Resistance − W
RDS(on) - Static Drain-Source On-State Resistance − W
0.8
2
3.5
V
VIN
InputVoltage
Voltage–−VV
IN–−Input
Figure 1. Shutdown Current Into VIN vs Input Voltage
6
o
TTAA == 85
85°C
IQ - Quiescent Current − mA
ISD - Shutdown Current Into VIN − mA
EN = GND
0.4
Low Side Switching
0.35
0.3
o
TA = 85 C
0.25
o
TA = 25 C
0.2
0.15
0.1
o
TA = -40 C
0.05
0
2
2.5
3
3.5
4
4.5
5
VIN − Input Voltage − V
Figure 4. Static Drain-Source On-State Resistance vs Input
Voltage
Copyright © 2007–2018, Texas Instruments Incorporated
Product Folder Links: TPS62290 TPS62291 TPS62293
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SLVS764G – JUNE 2007 – REVISED APRIL 2018
8 Detailed Description
8.1 Overview
The TPS6229x step down converters operate with typically 2.25-MHz fixed frequency pulse width modulation
(PWM) mode at moderate to heavy load currents. At light load currents, the converters can automatically enter
power save mode and operate then in pulse frequency modulation (PFM) mode.
During PWM operation, the converters use a unique fast response voltage mode controller scheme with input
voltage feed-forward to achieve good line and load regulation allowing the use of small ceramic input and output
capacitors. At the beginning of each clock cycle initiated by the clock signal, the high side MOSFET switch is
turned on. The current flows now from the input capacitor via the high side MOSFET switch through the inductor
to the output capacitor and load. During this phase, the current ramps up until the PWM comparator trips and the
control logic will turn off the switch. The current limit comparator also turns off the switch in case the current limit
of the high side MOSFET switch is exceeded. After a dead time preventing shoot through current, the low side
MOSFET rectifier is turned on and the inductor current ramps down. The current flows now from the inductor to
the output capacitor and to the load. It returns to the inductor through the low side MOSFET rectifier.
The next cycle is initiated by the clock signal again turning off the low side MOSFET rectifier and turning on the
high side MOSFET switch.
8.2 Functional Block Diagram
VIN
Current
Limit Comparator
VIN
Undervoltage
Lockout 1.8 V
Thermal
Shutdown
Limit
High Side
EN
Reference
0.6 V VREF
FB
PFM Comp .
+1% Voltage positioning
VREF + 1%
Mode
MODE
Softstart
VOUT RAMP
CONTROL
Error Amp
Control
Stage
Gate Driver
Anti
Shoot-Through
SW1
VREF
Integrator
FB
FB
Zero-Pole
AMP.
PWM
Comp .
Limit
RI1
GND
Low Side
RI3
RI..N
Int. Resistor
Network
Sawtooth
Generator
Current
Limit Comparator
2.25 MHz
Oscillator
GND
8.3 Feature Description
8.3.1 Dynamic Voltage Positioning
This feature reduces the voltage undershoots/overshoots at load steps from light to heavy load and vice versa. It
is active in power save mode and regulates the output voltage 1% higher than the nominal value. This provides
more headroom for both the voltage drop at a load step, and the voltage increase at a load throw-off.
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Feature Description (continued)
Output voltage
Voltage Positioning
Vout +1%
PFM Comparator
threshold
Light load
PFM Mode
Vout (PWM)
moderate to heavy load
PWM Mode
Figure 5. Power Save Mode Operation
8.3.2 Enable
The device is enabled by setting EN pin to high. During the start up time tStart Up the internal circuits are settled
and the soft start circuit is activated. The EN input can be used to control power sequencing in a system with
various DC/DC converters. The EN pin can be connected to the output of another converter, to drive the EN pin
high and getting a sequencing of supply rails. With EN = GND, the device enters shutdown mode, in which all
internal circuits are disabled. In fixed output voltage versions, the internal resistor divider network is disconnected
from FB pin.
8.3.3 Mode Selection
The MODE pin allows mode selection between forced PWM mode and power save mode.
Connecting this pin to GND enables the power save mode with automatic transition between PWM and PFM
mode. Pulling the MODE pin high forces the converter to operate in fixed frequency PWM mode even at light
load currents. This allows simple filtering of the switching frequency for noise sensitive applications. In this mode,
the efficiency is lower compared to the power save mode during light loads.
The condition of the MODE pin can be changed during operation and allows efficient power management by
adjusting the operation mode of the converter to the specific system requirements.
8.3.4 Undervoltage Lockout
The undervoltage lockout circuit prevents the device from malfunctioning at low input voltages and from
excessive discharge of the battery and disables the output stage of the converter. The undervoltage lockout
threshold is typically 1.85 V with falling VIN.
8.3.5 Thermal Shutdown
As soon as the junction temperature, TJ, exceeds 140°C (typical) the device goes into thermal shutdown. In this
mode, the high side and low side MOSFETs are turned-off. The device continues its operation when the junction
temperature falls below the thermal shutdown hysteresis.
8
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8.4 Device Functional Modes
8.4.1 Soft-Start
The TPS6229x has an internal soft start circuit that controls the ramp up of the output voltage. The output
voltage ramps up from 5% to 95% of its nominal value within typical 250 μs. This limits the inrush current in the
converter during ramp up and prevents possible input voltage drops when a battery or high impedance power
source is used. The soft start circuit is enabled within the start up time tStart Up.
8.4.2 Power Save Mode
The power save mode is enabled with MODE pin set to low level. If the load current decreases, the converter will
enter power save mode operation automatically. During power save mode the converter skips switching and
operates with reduced frequency in PFM mode with a minimum quiescent current to maintain high efficiency. The
converter will position the output voltage typically +1% above the nominal output voltage. This voltage positioning
feature minimizes voltage drops caused by a sudden load step.
The transition from PWM mode to PFM mode occurs once the inductor current in the low side MOSFET switch
becomes zero, which indicates discontinuous conduction mode.
During the power save mode the output voltage is monitored with a PFM comparator. As the output voltage falls
below the PFM comparator threshold of VOUT nominal +1%, the device starts a PFM current pulse. The high side
MOSFET switch will turn on and the inductor current ramps up. After the on-time expires, the switch is turned off
and the low side MOSFET switch is turned on until the inductor current becomes zero.
The converter effectively delivers a current to the output capacitor and the load. If the load is below the delivered
current, the output voltage will rise. If the output voltage is equal or higher than the PFM comparator threshold,
the device stops switching and enters a sleep mode with typical 15 μA current consumption.
If the output voltage is still below the PFM comparator threshold, a sequence of further PFM current pulses are
generated until the PFM comparator threshold is reached. The converter starts switching again once the output
voltage drops below the PFM comparator threshold.
With a fast single threshold comparator, the output voltage ripple during PFM mode operation can be kept small.
The PFM pulse is time controlled, which allows to modify the charge transferred to the output capacitor by the
value of the inductor. The resulting PFM output voltage ripple and PFM frequency depend in first order on the
size of the output capacitor and the inductor value. Increasing output capacitor values and inductor values will
minimize the output ripple. The PFM frequency decreases with smaller inductor values and increases with larger
values.
The PFM mode is left and PWM mode entered in case the output current can not longer be supported in PFM
mode. The power save mode can be disabled through the MODE pin set to high. The converter will then operate
in fixed frequency PWM mode.
8.4.3 100% Duty Cycle Low Dropout Operation
The device starts to enter 100% duty cycle mode once the input voltage comes close to the nominal output
voltage. In order to maintain the output voltage, the high side MOSFET switch is turned on 100% for one or more
cycles.
With further decreasing VIN the high side MOSFET switch is turned on completely. In this case, the converter
offers a low input-to-output voltage difference. This is particularly useful in battery-powered applications to
achieve longest operation time by taking full advantage of the whole battery voltage range.
The minimum input voltage to maintain regulation depends on the load current and output voltage, and can be
calculated as:
VINmin = VOUTmax + (IOUTmax × (RDS(on)max + RL))
where
•
•
•
•
IOUTmax = Maximum output current plus inductor ripple current
RDS(on)max = Maximum P-channel switch RDS(on)
RL = DC resistance of the inductor
VOUTmax = Nominal output voltage plus maximum output voltage tolerance
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Device Functional Modes (continued)
8.4.4 Short-Circuit Protection
The high side and low side MOSFET switches are short-circuit protected with maximum switch current equal to
ILIMF. The current in the switches is monitored by current limit comparators. Once the current in the high side
MOSFET switch exceeds the threshold of its current limit comparator, it turns off and the low side MOSFET
switch is activated to ramp down the current in the inductor and high side MOSFET switch. The high side
MOSFET switch can only turn on again, once the current in the low side MOSFET switch has decreased below
the threshold of its current limit comparator.
10
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TPS6229x devices are high-efficiency synchronous step-down DC/DC converters featuring power save
mode or 2.25-MHz fixed frequency operation.
9.2 Typical Application
VIN 2.3 V to 6.0 V
TPS62290DRV
VIN
CIN
2.2 mH
SW
R1
EN
10 mF
GND
L1
360 kW
VOUT 1.8 V,
Up to 1A
C1
22 pF
COUT
FB
10 mF
R2
MODE
180 kW
Figure 6. TPS62290DRV Adjustable 1.8 V
9.2.1 Design Requirements
The design guideline provides a component selection to operate the device within the recommended operating
condition.
Table 1 shows the list of components for the Application Characterstic Curves.
Table 1. List of Components
COMPONENT REFERENCE
PART NUMBER
MANUFACTURER (1)
VALUE
CIN
GRM188R60J106M
Murata
10 μF, 6.3 V. X5R Ceramic
COUT
GRM188R60J106M
Murata
10 μF, 6.3 V. X5R Ceramic
Murata
22 pF, COG Ceramic
Coilcraft
2.2 μH, 110 mΩ
C1
L1
LPS3015
R1, R2
Values depending on the programmed output voltage
(1)
See Third-party Products disclaimer
9.2.2 Detailed Design Procedure
9.2.2.1 Output Voltage Setting
The output voltage can be calculated to:
æ
R ö
VOUT = VREF ´ ç 1 + 1 ÷
è R2 ø with an internal reference voltage VREF typical 0.6 V.
To minimize the current through the feedback divider network, R2 should be 180 kΩ or 360 kΩ. The sum of R1
and R2 should not exceed ~1MΩ, to keep the network robust against noise.
An external feed forward capacitor C1 is required for optimum load transient response. The value of C1 should be
in the range between 22 pF and 33 pF.
Route the FB line away from noise sources, such as the inductor or the SW line.
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9.2.2.2 Output Filter Design (Inductor and Output Capacitor)
The TPS6229x is designed to operate with inductors in the range of 1.5 μH to 4.7 μH and with output capacitors
in the range of 4.7 μF to 22 μF. The part is optimized for operation with a 2.2-μH inductor and 10-μF output
capacitor.
Larger or smaller inductor values can be used to optimize the performance of the device for specific operation
conditions. For stable operation, the L and C values of the output filter may not fall below 1-μH effective
inductance and 3.5-μF effective capacitance.
9.2.2.2.1 Inductor Selection
The inductor value has a direct effect on the ripple current. The selected inductor has to be rated for its DC
resistance and saturation current. The inductor ripple current (ΔIL) decreases with higher inductance and
increases with higher VIN or VOUT.
The inductor selection has also impact on the output voltage ripple in PFM mode. Higher inductor values will lead
to lower output voltage ripple and higher PFM frequency, lower inductor values will lead to a higher output
voltage ripple but lower PFM frequency.
Equation 2 calculates the maximum inductor current under static load conditions. The saturation current of the
inductor should be rated higher than the maximum inductor current as calculated with Equation 3. This is
recommended because during heavy load transient the inductor current will rise above the calculated value.
VOUT
VIN
DIL = VOUT ´
L´f
DI
ILmax = IOUTmax + L
2
1-
(2)
where
•
•
•
•
f = Switching frequency (2.25 MHz typical)
L = Inductor value
ΔIL = Peak-to-peak inductor ripple current
ILmax = Maximum inductor current
(3)
A more conservative approach is to select the inductor current rating just for the maximum switch current of the
corresponding converter.
Accepting larger values of ripple current allows the use of low inductance values, but results in higher output
voltage ripple, greater core losses, and lower output current capability.
The total losses of the coil have a strong impact on the efficiency of the DC/DC conversion and consist of both
the losses in the DC resistance R(DC)) and the following frequency-dependent components:
• The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies)
• Additional losses in the conductor from the skin effect (current displacement at high frequencies)
• Magnetic field losses of the neighboring windings (proximity effect)
• Radiation losses
Table 2. List of Inductors
3
DIMENSIONS [mm ]
(1)
12
SUPPLIER (1)
INDUCTOR TYPE
3 × 3 × 1.5
LPS3015
Coilcraft
3 x 3 x 1.5
LQH3NPN2R2NM0
MURATA
3.2 x 2.6 x 1.2
MIPSA3226D2R2
FDK
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9.2.2.2.2 Output Capacitor Selection
The advanced fast-response voltage mode control scheme of the TPS6229x allows the use of tiny ceramic
capacitors. Ceramic capacitors with low ESR values have the lowest output voltage ripple and are
recommended. The output capacitor requires either an X7R or X5R dielectric. Y5V and Z5U dielectric capacitors,
aside from their wide variation in capacitance over temperature, become resistive at high frequencies.
At nominal load current, the device operates in PWM mode and the RMS ripple current is calculated as:
VOUT
VIN æ 1 ö
´ç
÷
L´f
è 2´ 3 ø
1IRMSCOUT = VOUT ´
(4)
At nominal load current, the device operates in PWM mode and the overall output voltage ripple is the sum of the
voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and discharging the
output capacitor:
VOUT
VIN æ
1
ö
´ç
+ ESR ÷
L´f
8
´
Cout
´
f
è
ø
1DVOUT = VOUT ´
(5)
At light load currents the converter operates in power save mode and the output voltage ripple is dependent on
the output capacitor and inductor value. Larger output capacitor and inductor values minimize the voltage ripple
in PFM mode and tighten DC output accuracy in PFM mode.
9.2.2.2.3 Input Capacitor Selection
The buck converter has a natural pulsating input current; therefore, a low ESR input capacitor is required for best
input voltage filtering and minimizing the interference with other circuits caused by high input voltage spikes. For
most applications, a 10-μF ceramic capacitor is recommended. The input capacitor can be increased without any
limit for better input voltage filtering.
Take care when using only small ceramic input capacitors. When a ceramic capacitor is used at the input and the
power is being supplied through long wires, such as from a wall adapter, a load step at the output or VIN step on
the input can induce ringing at the VIN pin. The ringing can couple to the output and be mistaken as loop
instability or could even damage the part by exceeding the maximum ratings.
Table 3. List of Capacitor
CAPACITANCE
10 μF
(1)
TYPE
GRM188R60J106M69D
SUPPLIER (1)
SIZE
3
0603 1.6 × 0.8 × 0.8 mm
Murata
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9.2.3 Application Curves
100
100
VIN = 2.7 V
90
L = 2.2 mH
VIN = 3.3 V
VIN = 3.3 V
VIN = 4.5 V
Efficiency - %
Efficiency - %
80
VIN = 3.6 V
80
70
VIN = 5 V
60
50
30
0.01
VIN = 2.7 V
VIN = 5 V
60
VIN = 4.5 V
50
VIN = 3.6 V
30
20
0.1
100
10
1
IO - Output Current - mA
1000
Figure 7. Efficiency (Power Save Mode) vs Output Current,
VOUT = 1.8 V
100
10
IO - Output Current - mA
1
1000
Figure 8. Efficiency (Forced PWM Mode) vs Output
Current, VOUT = 1.8 V
100
100
VIN = 4.2 V
VIN = 3.8 V
VIN = 3.8 V
80
VIN = 5 V
70
Efficiency - %
VIN = 4.5 V
70
60
60
VIN = 4.5 V
50
40
30
50
VOUT = 3.3 V,
MODE = GND,
L = 2.2 mH
40
30
0.01
VIN = 4.2 V
90
VIN = 5 V
80
Efficiency - %
70
40
VOUT = 1.8 V,
MODE = GND,
L = 2.2 mH
40
90
VOUT = 1.8 V,
MODE = VIN,
90
20
VOUT = 3.3 V,
MODE = VIN,
10
L = 2.2 mH
0
0.1
100
10
1
IO - Output Current - mA
1000
Figure 9. Efficiency (Power Save Mode) vs Output Current,
VOUT = 3.3 V
100
10
IO - Output Current - mA
1
1000
Figure 10. Efficiency (Forced PWM Mode) vs Output
Current, VOUT = 3.3 V
1.854
1.90
MODE = VIN,
MODE = GND,
L = 2.2 mH
L = 2.2 mH
1.836
1.88
VIN = 3.6 V, TA = -40°C
1.818
DC Output Voltage - V
DC Output Voltage - V
VIN = 2.7 V, TA = -40°C
VIN = 4.5 V, TA = -40°C
1.8
1.782
VIN = 2.7 V,
TA = 25°C
VIN = 3.6 V,
TA = 25°C
1.764
1.746
0.01
VIN = 4.5 V,
TA = 85°C
VIN = 4.5 V,
TA = 25°C
0.1
VIN = 3.6 V,
TA = 85°C
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VI = 3.6 V, TA = -40°C
1.84
1.82
VI = 2.7 V, TA = -40°C
VI = 4.5 V, TA = -40°C
PWM Mode
VI = 4.5 V, TA = 85°C
VI = 3.6 V, TA = 85°C
VI = 4.5 V, TA = 25°C
1000
Figure 11. Output Voltage Accuracy (1.8-V Forced PWM
Mode) vs Output Current
14
PFM Mode, Voltage Positioning On
1.80 VI = 2.7 V, TA = 85°C
VIN = 2.7 V,
TA = 85°C
1
10
100
IO - Output Current - mA
1.86
1.78
0.01
VI = 3.6 V, TA = 25°C
VI = 2.7 V, TA = 25°C
0.1
1
10
100
IO - Output Current - mA
1000
Figure 12. Output Voltage Accuracy (1.8-V Power Save
Mode) vs Output Current
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3.50
3.40
VO = 3.3 V,
MODE = VI,
3.38
L = 2.2 mH
3.32
3.45
DC Output Voltage - V
DC Output Voltage - V
3.36
3.34
Mode = GND,
L = 2.2 mH
TA = 25°C
TA = -40°C
3.30
3.28
TA = 85°C
3.26
VI = 3.7 V, 4.2 V, 4.5 V
3.24
PFM Mode, Voltage Positioning On
3.40
VI = 4.5 V, TA = -40°C
VI = 4.2 V, TA = -40°C
3.35
VI = 4.5 V, TA = 25°C
VI = 4.2 V, TA = 25°C
3.30
3.22
3.20
0.01
0.1
1
10
100
IO - Output Current - mA
1000
Figure 13. Output Voltage Accuracy 3.3-V Forced PWM
Mode vs Output Current
PWM Mode
VI = 4.5 V, TA = 85°C
VI = 4.2 V, TA = 85°C
3.25
0.01
1
10
100
IO - Output Current - mA
0.1
1000
Figure 14. Output Voltage Accuracy 3.3-V Power Save
Mode vs Output Current
VIN 3.6 V,
VOUT 1.8 V, IOUT 150 mA,
VOUT 20 mV/Div
VOUT 10 mV/Div
L 2.2 mH, COUT 10 mF 0603
VIN 3.6 V,
VOUT 1.8 V, IOUT 10 mA,
SW 2 V/Div
L 2.2 mH, COUT 10 mF 0603
SW 2 V/Div
Icoil 200 mA/Div
Icoil 200 mA/Div
Time Base - 10 ms/Div
Time Base - 10 ms/Div
Figure 15. Typical Operation vs PFM Mode
SW 2V/Div
Figure 16. Typical Operation vs PWM Mode
VIN 3.6 V,
VOUT 1.8 V,
IOUT 300 mA to 800 mA,
MODE = GND VOUT 100 mV/Div
VOUT 50 mV/Div
IOUT 500 mA/Div
VIN 3.6 V,
VOUT 1.8 V,
IOUT 50 mA to 250 mA,
250 mA
MODE = GND
50 mA
800 mA
300 mA
IOUT 200 mA/Div
Icoil 500 mA/Div
Icoil 500 mA/Div
Time Base - 20 ms/Div
Figure 17. PFM Load Transient
Time Base - 20 ms/Div
Figure 18. PFM Line Transient
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VIN 3.6 V to 4.2 V
500 mV/Div
VIN 3.6 V to 4.2 V,
500 mV/Div
VOUT = 1.8 V,
50 mV/Div,
IOUT = 50 mA,
MODE = GND
VOUT = 1.8 V,
50 mV/Div,
IOUT = 250 mA,
MODE = GND
Time Base - 100 ms/Div
Figure 19. PWM Load Transient
16
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Time Base - 100 ms/Div
Figure 20. PWM Line Transient
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9.3 System Examples
L1
TPS62290DRV
VIN 3.3 V to 6.0 V
VIN
CIN
2.2 mH
SW
R1
EN
10 mF
820 kW
COUT
FB
GND
VOUT 3.3 V,
Up to 1A
C1
22 pF
10 mF
R2
MODE
182 kW
Figure 21. TPS62290DRV Adjustable 3.3 V
TPS62291DRV
VIN = 3.3 V to 6.0 V
VIN
CIN
L1
2.2 mH
EN
10 mF
GND
VOUT = 3.3 V
Up to 1 A
SW
COUT
10 mF
FB
MODE
Figure 22. TPS62291DRV Fixed 3.3 V
TPS62293DRV
VIN = 2.3 V to 6.0 V
VIN
CIN
L1
2.2 mH
SW
EN
VOUT 1.8 V
Up to 1 A
COUT
10 mF
10 mF
GND
FB
MODE
Figure 23. TPS62291DRV Fixed 1.8 V
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10 Power Supply Recommendations
The TPS6229x devices have no special requirements for its input power supply. The input power supply's output
current needs to be rated according to the supply voltage, output voltage and output current of the TPS6229x.
11 Layout
11.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design. Proper function of the device
demands careful attention to PCB layout. Care must be taken in board layout to get the specified performance. If
the layout is not carefully done, the regulator could show poor line and/or load regulation, stability issues as well
as EMI problems. It is critical to provide a low inductance, impedance ground path. Therefore, use wide and
short traces for the main current paths. The input capacitor should be placed as close as possible to the IC pins
as well as the inductor and output capacitor.
Connect the GND pin of the device to the exposed thermal pad of the PCB and use this pad as a star point. Use
a common power GND node and a different node for the signal GND to minimize the effects of ground noise.
Connect these ground nodes together to the exposed thermal pad (star point) underneath the IC. Keep the
common path to the GND pin, which returns the small signal components and the high current of the output
capacitors as short as possible to avoid ground noise. The FB line should be connected right to the output
capacitor and routed away from noisy components and traces (for example, SW line).
11.2 Layout Example
VOUT
R2
GND
C1
R1
COUT
CIN
VIN
L
G
N
D
U
Figure 24. Layout Diagram
18
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 4. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS62290
Click here
Click here
Click here
Click here
Click here
TPS62291
Click here
Click here
Click here
Click here
Click here
TPS62293
Click here
Click here
Click here
Click here
Click here
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPS62290DRVR
ACTIVE
WSON
DRV
6
3000
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
BYN
TPS62290DRVT
ACTIVE
WSON
DRV
6
250
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
BYN
TPS62290DRVTG4
ACTIVE
WSON
DRV
6
250
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
BYN
TPS62291DRVR
ACTIVE
WSON
DRV
6
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CFY
TPS62291DRVT
ACTIVE
WSON
DRV
6
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CFY
TPS62293DRVR
ACTIVE
WSON
DRV
6
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CFD
TPS62293DRVRG4
ACTIVE
WSON
DRV
6
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CFD
TPS62293DRVT
ACTIVE
WSON
DRV
6
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CFD
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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