TPS62743, TPS627431
SLVSCQ0B – JUNE 2015 – REVISED MARCH 2021
TPS62743 TPS627431 300/400 mA High Efficiency Buck Converter with Ultra-low
Quiescent Current
1 Features
3 Description
•
•
•
The TPS62743 is a high efficiency step down
converter with ultra low quiescent current of typical
360 nA. The device is optimized to operate with a 2.2µH inductor and 10µF output capacitor. The device
uses DCS-Control™ and operates with a typical
switching frequency of 1.2 MHz. In Power Save Mode
the device extends the light load efficiency down to
a load current range of 10-µA and below. TPS62743
provides an output current of 300 mA. Once started
the device operates down to an input voltage range of
2.0 V. This allows to operate the device directly from a
single Li-MnO2 coin cell.
•
•
•
•
•
•
2 Applications
•
•
•
•
•
•
•
Wearables
Fitness tracker
Smartwatch
Health monitoring
Bluetooth® low energy, RF4CE, Zigbee
High-efficiency, ultra-low power applications
Energy harvesting
VIN
2.0 V to 5.5 V
CIN
4.7 PF
TPS62743
VIN
SW
EN
VOS
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS62743
DSBGA (8)
1.57 mm × 0.88 mm
TPS627431
DSBGA (8)
1.57 mm x 0.88 mm
100%
L 2.2 PH
VOUT
95%
Low Power
MCU & RF
COUT
10 PF
VSEL1
VSEL2
VSEL3
The TPS62743 provides 8 programmable output
voltages between 1.2V and 3.3V selectable by three
selection pins. The TPS62743 is optimized to provide
a low output voltage ripple and low noise using a
small output capacitor. Once the input voltage comes
close to the output voltage the device enters the No
Ripple 100% mode to prevent an increase of output
ripple voltage. In this operation mode the device stops
switching and turns the high side MOSFET switch on.
GND
90%
85%
Efficiency
•
•
•
•
Input voltage range VIN from 2.15 V to 5.5 V
Input voltage range down to 2.0 V once started
output current
– TPS62743 300 mA
– TPS627431 400 mA
360-nA operational quiescent current
Up to 90% efficiency at 10-µA output current
Power save mode operation
Selectable output voltages
– Eight voltage options between 1.2 V to 3.3 V
Output voltage discharge
Low output voltage ripple
Automatic transition to no ripple 100% mode
RF friendly DCS-Control™
Total solution size < 10 mm2
Small 1.6-mm × 0.9-mm, 8-ball WCSP package
80%
75%
70%
65%
Copyright © 2016, Texas Instruments Incorporated
Typical Application
60%
VIN = 3.6 V
VIN = 4.2 V
VIN = 5.0 V
55%
50%
0.001
0.01
0.1
1
IOUT (mA)
10
100
1000
D006
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS62743, TPS627431
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SLVSCQ0B – JUNE 2015 – REVISED MARCH 2021
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings........................................ 4
7.2 ESD Ratings............................................................... 4
7.3 Recommended Operating Conditions.........................4
7.4 Thermal Information....................................................5
7.5 Electrical Characteristics.............................................5
7.6 Timing Requirements.................................................. 6
7.7 Typical Characteristics................................................ 7
8 Detailed Description........................................................8
8.1 Overview..................................................................... 8
8.2 Functional Block Diagram........................................... 8
8.3 Feature Description.....................................................8
8.4 Device Functional Modes..........................................10
9 Application and Implementation.................................. 11
9.1 Application Information..............................................11
9.2 Typical Application.................................................... 11
9.3 System Example....................................................... 17
10 Power Supply Recommendations..............................18
11 Layout........................................................................... 19
11.1 Layout Guidelines................................................... 19
11.2 Layout Example...................................................... 19
12 Device and Documentation Support..........................20
12.1 Device Support....................................................... 20
12.2 Receiving Notification of Documentation Updates..20
12.3 Support Resources................................................. 20
12.4 Trademarks............................................................. 20
12.5 Electrostatic Discharge Caution..............................20
12.6 Glossary..................................................................20
13 Mechanical, Packaging, and Orderable
Information.................................................................... 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (May 2016) to Revision B (March 2021)
Page
• Updated the numbering format for tables, figures and cross-references throughout the document. .................1
Changes from Revision * (June 2015) to Revision A (May 2016)
Page
• Added TPS627431 device to data sheet ........................................................................................................... 1
• Added device option TPS627431: 400mA output current, other output voltages than TPS62743..................... 1
• Added TPS627431 to Section 5 ........................................................................................................................ 3
• Added Figure 9-2 ............................................................................................................................................. 11
2
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5 Device Comparison Table
PART NUMBER
OUTPUT VOLTAGE SETTINGS (VSEL 1 - 3)
OUTPUT
CURRENT
PACKAGE
MARKING
–40°C to 85°C
TPS62743
1.2 V, 1.5 V, 1.8 V, 2.1 V, 2.5 V, 2.8 V, 3.0 V, 3.3 V
300 mA
TPS743
–40°C to 85°C
TPS627431
1.3 V, 1.4 V, 1.6 V, 1.7 V, 1.9 V, 2.0 V, 2.9 V, 3.1 V
400 mA
627431
TA
6 Pin Configuration and Functions
1
2
A
SW
VIN
B
EN
GND
C
VSEL1
VOS
D
VSEL2
VSEL3
Figure 6-1. YFP Package 8-Pin DSBGA Top View
Table 6-1. Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO
VIN
A2
PWR
VIN power supply pin. Connect the input capacitor close to this pin for best noise and voltage spike
suppression. A ceramic capacitor of 4.7 µF is required.
SW
A1
OUT
The switch pin is connected to the internal MOSFET switches. Connect the inductor to this terminal.
GND
B2
PWR
GND supply pin. Connect this pin close to the GND terminal of the input and output capacitor.
VOS
C2
IN
Feedback pin for the internal feedback divider network and regulation loop. Discharges VOUT when the
converter is disabled. Connect this pin directly to the output capacitor with a short trace.
VSEL3
D2
IN
VSEL2
D1
IN
Output voltage selection pins. See Table 6-2 for VOUT selection. These pin must be terminated. The pins
can be dynamically changed during operation.
VSEL1
C1
IN
EN
B1
IN
High level enables the devices, low level turns the device off. The pin must be terminated.
Table 6-2. Output Voltage Setting
OUTPUT VOLTAGE SETTING VOUT [V]
VSEL SETTING
TPS62743
TPS627431
VSEL3
VSEL2
VSEL1
1.2
1.3
0
0
0
1.5
1.4
0
0
1
1.8
1.6
0
1
0
2.1
1.7
0
1
1
2.5
1.9
1
0
0
2.8
2.0
1
0
1
3.0
2.9
1
1
0
3.3
3.1
1
1
1
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Pin voltage(2)
MIN
MAX
UNIT
VIN
–0.3
6
V
SW,
–0.3
VIN +0.3V
V
EN, VSEL1-3
–0.3
VIN +0.3V
V
VOS
–0.3
3.7
V
Operating junction temperature, TJ
–40
125
°C
Storage temperature, Tstg
–65
150
°C
(1)
(2)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal GND.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins(1)
±2000
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins(2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. The human body
model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN NOM
4
VIN
Supply voltage VIN
VIN
Supply voltage VIN , once started
IOUT
Device output current
TJ
Operating junction temperature range
MAX UNIT
2.15
5.5
V
2.0
5.5
V
TPS62743 / TPS627431 5.5V ≥ VIN ≥ (VOUTnom + 0.7V) ≥ 2.15V
300
5.5V ≥ VIN ≥ (VOUTnom + 0.7V) ≥ 3V
400
-40
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125
mA
°C
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7.4 Thermal Information
TPS62743
THERMAL METRIC
(1)
UNIT
YFP
8 PINS
RθJA
Junction-to-ambient thermal resistance
103
°C/W
RθJCtop
Junction-to-case (top) thermal resistance
1.0
°C/W
RθJB
Junction-to-board thermal resistance
20
°C/W
ψJT
Junction-to-top characterization parameter
0.3
°C/W
ψJB
Junction-to-board characterization parameter
20
°C/W
RθJCbot
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.5 Electrical Characteristics
VIN = 3.6V, TA = –40°C to 85°C typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
360
1800
UNIT
SUPPLY
IQ
Operating quiescent EN = VIN, IOUT = 0µA, VOUT = 1.8V, device not switching
current
EN = VIN, IOUT = 0mA, VOUT = 1.8V , device switching
ISD
Shutdown current
EN = GND, shutdown current into VIN
VTH_ UVLO+
Undervoltage
lockout threshold
VTH_UVLO-
460
70
1000
Rising VIN
2.075
2.15
Falling VIN
1.925
2
nA
nA
V
INPUTS (EN, VSEL1-3 )
VIH TH
High level input
threshold
2.2V ≤ VIN ≤ 5.5V
VIL TH
Low level input
threshold
2.2V ≤ VIN ≤ 5.5V
IIN
Input bias Current
1.1
0.4
V
V
10
25
0.45
1.12
0.22
0.65
nA
POWER SWITCHES
RDS(ON)
ILIMF
High side MOSFET
on-resistance
Low Side MOSFET
on-resistance
IOUT = 50mA
Ω
High side MOSFET
switch current limit
TPS62743 3.0V ≤ VIN ≤ 5.5V
480
600
720
TPS627431 3.0V ≤ VIN ≤ 5.5V
590
650
800
Low side MOSFET
switch current limit
TPS62743
600
TPS627431
650
mA
OUTPUT VOLTAGE DISCHARGE
RDSCH_VOS
MOSFET onresistance
EN = GND, IVOS = -10mA into VOS pin
30
65
Ω
IIN_VOS
Bias current into
VOS pin
EN = VIN, VOUT = 2V
40
1010
nA
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VIN = 3.6V, TA = –40°C to 85°C typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
150
250
350
85
200
290
80
150
200
UNIT
AUTO 100% MODE TRANSITION
VTH_100+
Auto 100% Mode
leave detection
threshold (1)
Rising VIN,100% Mode is left with VIN = VOUT + VTH_100+
VTH_100-
Auto 100% Mode
enter detection
threshold (1)
Falling VIN, 100% Mode is entered with VIN = VOUT + VTH_100-
mV
OUTPUT
ILIM_softstart
High side softstart
switch current limit
Low side softstart
switch current limit
Output voltage
range
Output voltage
accuracy
VOUT
(1)
EN=low to high
mA
150
Output voltages are selected with pins VSEL 1 - 3
IOUT = 10mA, VOUT = 1.8V
IOUT = 100mA, VOUT = 1.8V
DC output voltage
load regulation
VOUT = 1.8V
DC output voltage
line regulation
VOUT = 1.8V, IOUT = 100mA, 2.2V ≤ VIN ≤ 5.0V
1.2
3.3
-2.5
0%
2.5
–2
0%
2
0.001
V
%/mA
0
%/V
VIN is compared to the programmed output voltage (VOUT). When VIN–VOUT falls below VTH_100- the device enters 100% Mode by
turning the high side MOSFET on. The 100% Mode is exited when VIN–VOUT exceeds VTH_100+ and the device starts switching. The
hysteresis for the 100% Mode detection threshold VTH_100+ - VTH_100- will always be positive and will be approximately 50 mV(typ)
7.6 Timing Requirements
VIN = 3.6V, TJ = –40°C to 85°C typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OUTPUT
6
tONmin
Minimum ON time
VOUT = 2.0V, IOUT = 0 mA
225
ns
tOFFmin
Minimum OFF time
tStartup_delay
Regulator start up
delay time
VIN = 2.3V
50
ns
From transition EN = low to high until device starts switching
10
25
ms
tSoftstart
Softstart time
2.2V ≤ VIN ≤ 5.5V, EN = VIN
700
1200
µs
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7.7 Typical Characteristics
700
VIN = 2.2 V
VIN = 2.5 V
VIN = 3.6 V
VIN = 5.5 V
VIN = 6.0 V
225
200
Shutdown Current (nA)
Quiescent Current (nA)
600
250
VIN = 2.2 V
VIN = 2.5 V
VIN = 3.6 V
VIN = 5.5 V
VIN = 6.0 V
500
400
300
175
150
125
100
75
50
25
200
-60
-40
-20
0
20
40
Temperature (qC)
EN = VIN, VOUT = 1.8V
60
80
0
-60
100
Device Not Switching
Figure 7-1. Quiescent Current vs Temperature
0
20
40
Temperature (qC)
60
80
100
D002
Figure 7-2. Shutdown Current ISD vs Temperature
1
0.5
0.45
0.4
Low Side RDSON (:)
0.8
High Side RDSON (:)
-20
EN = GND
0.9
0.7
0.6
0.5
0.4
0.3
0.2
-40
-20
0
20
40
Temperature (qC)
60
80
0.35
0.3
0.25
0.2
0.15
0.1
VIN = 2.2 V
VIN = 2.5 V
VIN = 3.6 V
0.1
0
-60
-40
D001
VIN = 2.2 V
VIN = 2.5 V
VIN = 3.6 V
0.05
100
0
-60
-40
D003
Figure 7-3. High Side RDSON vs Temperature
-20
0
20
40
Temperature (qC)
60
80
100
D004
Figure 7-4. Low-side RDSON vs Temperature
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8 Detailed Description
8.1 Overview
The TPS62743 is a high frequency step down converter with ultra low quiescent current. The device operates
with a quasi fixed switching frequency typically at 1.2 MHz. Using TI's DCS-Control™ topology the device
extends the high efficiency operation area down to a few microamperes of load current during Power Save Mode
Operation.
8.2 Functional Block Diagram
Ultra Low Power
Reference
EN
Softstart
VOS
UVLO
EN
VOS
VSEL1
Internal
VFB feedback
divider
network*
VSEL2
VSEL3
UVLO
Comp
̶
VIN
UVLO
Auto 100% Mode
Comp
100%
̶
VIN
Mode
VTH_100 +
VTH_UVLO +
Current
Limit Comparator
Timer
DCS
Control
VOS
VFB
VREF
VIN
VOS
VOUT
Discharge
Min. On
UVLO
Limit
High Side
VIN
PMOS
Min. OFF
Direct Control
& Compensation
EN
̶
Control
Logic
Gate Driver
Anti
Shoot-Through
+
Error
amplifier
Power Stage
Main
Comparator
Limit
Low Side
Current
Limit Comparator
SW
NMOS
GND
* typical 50 MW
8.3 Feature Description
8.3.1 DCS-Control™
TI's DCS-Control™ (Direct Control with Seamless Transition into Power Save Mode) is an advanced regulation
topology, which combines the advantages of hysteretic and voltage mode control. Characteristics of DCSControl™ are excellent AC load regulation and transient response, low output ripple voltage and a seamless
transition between PFM and PWM mode operation. DCS-Control™ includes an AC loop which senses the output
voltage (VOS pin) and directly feeds the information to a fast comparator stage. This comparator sets the
switching frequency, which is constant for steady state operating conditions, and provides immediate response
to dynamic load changes. In order to achieve accurate DC load regulation, a voltage feedback loop is used. The
internally compensated regulation network achieves fast and stable operation with small external components
and low ESR capacitors.
The DCS-Control™ topology supports PWM (Pulse Width Modulation) mode for medium and high load
conditions and a Power Save Mode at light loads. During PWM mode, it operates in continuous conduction
mode. The switching frequency is typically 1.2 MHz with a controlled frequency variation depending on the input
voltage and load current. If the load current decreases, the converter seamlessly enters Power Save Mode to
maintain high efficiency down to very light loads. In Power Save Mode, the switching frequency varies linearly
with the load current. Since DCS-Control™ supports both operation modes within one single building block,
the transition from PWM to Power Save Mode is seamless with minimum output voltage ripple. The TPS62743
8
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offers both excellent DC voltage and superior load transient regulation, combined with low output voltage ripple,
minimizing interference with RF circuits.
8.3.2 Power Save Mode Operation
In Power Save Mode the device operates in PFM (Pulse Frequency Modulation) that generates a single
switching pulse to ramp up the inductor current and recharges the output capacitor, followed by a sleep period
where most of the internal circuits are shutdown to achieve lowest operating quiescent current. During this
time, the load current is supported by the output capacitor. The duration of the sleep period depends on the
load current and the inductor peak current. During the sleep periods, the current consumption of TPS62743 is
reduced to 360 nA. This low quiescent current consumption is achieved by an ultra low power voltage reference,
an integrated high impedance feedback divider network and an optimized Power Save Mode operation.
8.3.3 Output Voltage Selection
The TPS62743 doesn't require an external resistor divider network to program the output voltage. The device
integrates a high impedance feedback resistor divider network that is programmed by the pins VSEL1-3.
TPS62743 supports an output voltage range from 1.2 V to 3.3 V. The output voltage is programmed according
to Table 6-2. The output voltage can be changed during operation. This can be used for simple dynamic output
voltage scaling.
8.3.4 Output Voltage Discharge of the Buck Converter
The device provides automatic output voltage discharge when EN is pulled low or the UVLO is triggered. The
output of the buck converter is discharged over VOS. Because of this the output voltage will ramp up from zero
once the device is enabled again. This is very helpful for accurate start-up sequencing.
8.3.5 Undervoltage Lockout UVLO
To avoid misoperation of the device at low input voltages, an undervoltage lockout is used. The UVLO shuts
down the device at a maximum voltage level of 2.0 V. The device will start at a UVLO level of 2.15 V.
8.3.6 Short circuit protection
The TPS6274x integrates a current limit on the high side, as well on the low side MOSFETs to protect the device
against overload or short circuit conditions. The peak current in the switches is monitored cycle by cycle. If the
high side MOSFET current limit is reached, the high side MOSFET is turned off and the low side MOSFET
is turned on until the switch current decreases below the low side MOSFET current limit. Once the low side
MOSFET current limit trips, the low side MOSFET is turned off and the high side MOSFET turns on again.
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8.4 Device Functional Modes
8.4.1 Enable and Shutdown
The device is turned on with EN=high. With EN=low the device enters shutdown . This pin must be terminated.
8.4.2 Device Start-up and Softstart
The device has an internal softstart to minimize input voltage drop during start-up. This allows the operation from
high impedance battery cells. Once the device is enabled the device starts switching after a typical delay time
of 10ms. Then the softstart time of typical 700 µs begins with a reduced current limit of typical 150 mA. When
this time passed by the device enters full current limit operation. This allows a smooth start-up and the device
can start into full load current. Furthermore, larger output capacitors impact the start-up behaviour of the DC/DC
converter. Especially when the output voltage does not reach its nominal value after the typical soft-start time of
700 µs, has passed.
8.4.3 Automatic Transition Into No Ripple 100% Mode
Once the input voltage comes close to the output voltage, the DC/DC converter stops switching and enters
100% duty cycle operation. It connects the output VOUT via the inductor and the internal high side MOSFET
switch to the input VIN, once the input voltage VIN falls below the 100% mode enter threshold, VTH_100-. The
DC/DC regulator is turned off, switching stops and therefore no output voltage ripple is generated. Since the
output is connected to the input, the output voltage follows the input voltage minus the voltage drop across
the internal high side switch and the inductor. Once the input voltage increases and trips the 100% mode exit
threshold, VTH_100+ , the DC/DC regulator turns on and starts switching again. See Figure 8-1 and Figure 9-21.
VIN
VIN,
VOUT
100%
Mode
100%
Mode
VTH_100+
VTH_100VOUT
tracks VIN
Step Down Operation
VOUT
tracks VIN
VUVLO+
VUVLOVOUT
discharge
tsoftstart
Figure 8-1. Automatic Transition into 100% Mode
10
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
The TPS62743 is a high efficiency step down converter with ultra low quiescent current of typically 360 nA.
The device operates with a tiny 2.2-µH inductor and 10-µF output capacitor over the entire recommended
operation range. A dedicated measurement set-up is required for the light load efficiency measurement and
device quiescent current due to the operation in the sub microampere range. In this range any leakage current in
the measurement set-up will impact the measurement results.
9.2 Typical Application
VIN
2.0 V to 5.5 V
L 2.2 PH
TPS62743
CIN
4.7 PF
VIN
SW
EN
VOS
VOUT
Low Power
MCU & RF
COUT
10 PF
VSEL1
VSEL2
VSEL3
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 9-1. TPS62743 Typical Application Circuit
VIN
2.0 V to 5.5 V
CIN
4.7 mF
TPS627431
VIN
SW
EN
VOS
L 2.2 mH
VOUT = 1.4 V
up to 400 mA
COUT
10 mF
VSEL1
VSEL2
VSEL3
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 9-2. TPS627431 Typical Application Circuit
9.2.1 Design Requirements
The TPS62743 is a highly integrated DC/DC converter. The output voltage is set via a VSEL pin interface.
The design guideline provides a component selection to operate the device within the recommended operating
conditions.
Table 9-1 shows the list of components for the Application Characteristic Curves.
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Table 9-1. Components for Application Characteristic Curves
Reference
Description
TPS62743
360nA Iq step down converter
Value
Manufacturer
Texas Instruments
CIN
Ceramic capacitor, GRM155R61C475ME15
4.7 µF
Murata
COUT
Ceramic capacitor, GRM155R60J106ME11
10 µF
Murata
L
Inductor DFE201610C
2.2 µH
Toko
9.2.2 Detailed Design Procedure
The first step in the design procedure is the selection of the output filter components. To simplify this process,
Table 9-2 outlines possible inductor and capacitor value combinations.
Table 9-2. Recommended LC Output Filter Combinations
Output Capacitor Value [µF](1)
Inductor Value
[µH](2)
4.7µF
10µF
22µF
47µF
√
√(3)
√
√
2.2
(1)
(2)
(3)
100µF
Capacitance tolerance and bias voltage de-rating is anticipated. The effective capacitance varies by +20% and –50%.
Inductor tolerance and current de-rating is anticipated. The effective inductance can vary by 20% and -30%.
Typical application configuration. Other check marks indicate alternative filter combinations.
9.2.2.1 Inductor Selection
The inductor value affects the peak-to-peak ripple current, the PWM-to-PFM transition point, the output voltage
ripple and the efficiency. The selected inductor has to be rated for its DC resistance and saturation current. The
inductor ripple current (ΔIL) decreases with higher inductance and increases with higher VIN or V OUT and can be
estimated according to Equation 1.
Equation 2 calculates the maximum inductor current under static load conditions. The saturation current of
the inductor should be rated higher than the maximum inductor current, as calculated with equation 2. This is
recommended because during a heavy load transient the inductor current rises above the calculated value. A
more conservative way is to select the inductor saturation current according to the high-side MOSFET switch
current limit, ILIMF.
Vout
Vin
L ´ ¦
1D IL = Vout ´
ILmax = Ioutmax +
(1)
DIL
2
(2)
where
•
•
•
•
f = Switching Frequency
L = Inductor Value
ΔIL= Peak to Peak inductor ripple current
ILmax = Maximum Inductor current
Table 9-3 shows a list of possible inductors.
12
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Table 9-3. List of Possible Inductors
DIMENSIONS
[mm3]
INDUCTANCE [µH]
(1)
INDUCTOR TYPE
Isat/DCR
SUPPLIER(1)
Comment
Efficiency plot
Figure 9-9
2.2
2.0 x 1.6 x 1.0
DFE201610C
1.4 A/170 mΩ
TOKO
2.2
2.0 × 1.25 × 1.0
MIPSZ2012D 2R2
0.7 A/230 mΩ
FDK
2.2
2.0 x 1.2 x 1.0
744 797 752 22
0.7 A/200 mΩ
Würth Elektronik
2.2
1.6 x 0.8 x 0.8
MDT1608CH2R2M
0.7 A/300 mΩ
TOKO
See Third-party Products Disclaimer
9.2.2.2 Output Capacitor Selection
The DCS-Control™ scheme of the TPS62743 allows the use of tiny ceramic capacitors. Ceramic capacitors with
low ESR values have the lowest output voltage ripple and are recommended. The output capacitor requires
either an X7R or X5R dielectric. At light load currents, the converter operates in Power Save Mode and the
output voltage ripple is dependent on the output capacitor value. A larger output capacitors can be used
reducing the output voltage ripple. The leakage current of the output capacitor adds to the overall quiescent
current.
9.2.2.3 Input Capacitor Selection
Because the buck converter has a pulsating input current, a low ESR input capacitor is required for best input
voltage filtering to minimize input voltage spikes. For most applications a 4.7-µF input capacitor is sufficient.
When operating from a high impedance source, like a coin cell a larger input buffer capacitor ≥10uF is
recommended avoiding voltage drops during start-up and load transients. The input capacitor can be increased
without any limit for better input voltage filtering. The leakage current of the input capacitor adds to the overall
quiescent current. Table 9-4 shows a selection of input and output capacitors.
Table 9-4. List of Possible Capacitors(1)
CAPACITANCE [μF]
SIZE
CAPACITOR TYPE
SUPPLIER
4.7
0402
GRM155R61C475ME15
Murata
10
0402
GRM155R60J106ME11
Murata
(1)
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9.2.3 Application Curves
100%
100%
95%
95%
90%
90%
85%
80%
80%
Efficiency
Efficiency
85%
75%
70%
75%
70%
65%
60%
65%
VIN = 2.5 V
VIN = 3.0 V
VIN = 3.6 V
VIN = 4.2 V
VIN = 5.0 V
55%
60%
VIN = 3.6 V
VIN = 4.2 V
VIN = 5.0 V
55%
50%
0.001
0.01
0.1
1
IOUT (mA)
10
100
50%
45%
40%
0.001
1000
TPS62743
Figure 9-3. Efficiency vs Load Current, VOUT = 3.3 V
1
IOUT (mA)
10
100
1000
D007
Figure 9-4. Efficiency vs Load Current; VOUT = 2.1 V
100%
95%
90
90%
80
85%
VIN = 5.0V
70
80%
Efficiency
Efficiency [%]
0.1
TPS62743
100
VIN = 4.2V
60
VIN = 3.6V
50
VIN = 3.0V
40
VIN = 2.6V
30
0.001
0.01
D006
75%
70%
65%
60%
VIN = 2.5 V
VIN = 3.0 V
VIN = 3.6 V
VIN = 4.2 V
VIN = 5.0 V
55%
50%
0.01
0.1
1
10
100
45%
1000
IOUT [mA]
40%
0.001
C001
TPS627431
Figure 9-5. Efficiency vs Load Current; VOUT = 1.9 V
0.01
0.1
1
IOUT (mA)
10
100
1000
D008
TPS62743
Figure 9-6. Efficiency vs Load Current; VOUT = 1.8 V
90%
90
85%
80
75%
VIN = 5.0V
60
Efficiency
Efficiency [%]
80%
70
VIN = 4.2V
VIN = 3.6V
50
VIN = 3.0V
40
70%
65%
60%
55%
VIN = 2.6V
VIN = 2.5 V
VIN = 3.0 V
VIN = 3.6 V
VIN = 4.2 V
VIN = 5.0 V
50%
30
0.001
0.01
0.1
1
10
100
1000
45%
40%
0.001
IOUT [mA]
TPS627431
Figure 9-7. Efficiency vs Load Current; VOUT = 1.4 V
0.01
0.1
1
IOUT (mA)
10
100
1000
D009
TPS62743
Figure 9-8. Efficiency vs Load Current; VOUT = 1.2 V
14
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9.2.3 Application Curves (continued)
1800
90%
1600
Switching Frequency (kHz)
95%
85%
Efficiency
80%
75%
70%
65%
DEF201610
MIPSZ2012
WE 744 797 752 22
MDT1608
60%
55%
50%
0.001
VIN = 5.0 V
VIN = 3.6 V
1400
1200
1000
800
600
400
200
0
0.01
0.1
1
IOUT (mA)
10
100
0
1000
50
TPS62743
150
200
IOUT (mA)
250
300
350
D011
TPS62743
Figure 9-9. Efficiency vs Load Current; VOUT = 1.8 V
Figure 9-10. Switching Frequency vs Load Current VOUT = 3.3 V
1600
1400
1400
1200
Switching Frequency [kHz]
Switching Frequency (kHz)
100
D010
1200
1000
800
VIN = 5.0 V
VIN = 3.6 V
VIN = 3.0 V
VIN = 2.2 V
600
400
1000
800
VIN = 5.0V
600
VIN = 4.2V
VIN = 3.6V
400
VIN = 3.0V
200
VIN = 2.6V
0
200
0
50
100
150
200
250
IOUT [mA]
0
0
50
100
150
200
IOUT (mA)
250
300
350
D012
TPS62743
300
350
400
450
C002
TPS627431
Figure 9-12. Switching Frequency vs Load Current VOUT = 1.4 V
Figure 9-11. Switching Frequency vs Load Current VOUT = 1.8 V
1400
50
45
VIN = 4.2V
40
VIN = 3.6V
35
1000
VOUTpp [mVpp]
Switching Frequency (kHz)
1200
800
600
VIN = 3.0V
30
C001
25
20
15
10
400
VIN = 5.0 V
VIN = 3.6 V
VIN = 3.0 V
VIN = 2.0 V
200
5
0
0.01
0.1
0
0
50
100
150
200
IOUT (mA)
250
300
10
IOUT [mA]
350
TPS627431
L = 2.2µH
D013
TPS62743
Figure 9-13. Switching Frequency vs Load Current VOUT = 1.2 V
1
100
1000
C001
VOUT = 1.4V
COUT = 10µF
(0402)
Figure 9-14. Typical Output Ripple Voltage VOUT = 1.4V
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9.2.3 Application Curves (continued)
Figure 9-15. PFM (Power Save Mode) Mode Operation
Figure 9-16. PWM Mode Operation
IL
IL
Figure 9-17. Startup Into 100 mA Electronic Load EN Delay +
Soft-Start Delay
IL
IL
Figure 9-19. Load Transient Response; 100 mA to 290 mA
16
Figure 9-18. Startup Into 300 mA Electronic Load Soft-Start
Delay
Figure 9-20. Load Transient Response; 5 mA to 290 mA
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9.2.3 Application Curves (continued)
Figure 9-21. 100% Mode Entry and Leave Operation IOUT = 30 mA
9.3 System Example
Temperature
Sensor
Electronic
Compass
3-Axis Sensor
Radio
VIN
2.0 V to 5.5 V
CIN
4.7 PF
TPS62743
VIN
SW
EN
VOS
VSEL1
L 2.2 PH
VOUT = 1.8 V
Main Rail
COUT
10 PF
MCU
VSEL2
VSEL3
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 9-22. Example Of Implementation In A Master MCU Based System
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10 Power Supply Recommendations
The power supply must provide a current rating according to the supply voltage, output voltage and output
current of the TPS62743.
18
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11 Layout
11.1 Layout Guidelines
•
•
•
•
As for all switching power supplies, the layout is an important step in the design. Care must be taken in board
layout to get the specified performance.
It is critical to provide a low inductance, impedance ground path. Therefore, use wide and short traces for the
main current paths.
The input capacitor should be placed as close as possible to the IC pins VIN and GND. This is the most
critical component placement.
The VOS line is a sensitive high impedance line and should be connected to the output capacitor and routed
away from noisy components and traces (e.g. SW line) or other noise sources.
11.2 Layout Example
VOUT
GND
COUT
L
CIN
VIN
Figure 11-1. Recommended PCB Layout
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
DCS-Control™ and TI E2E™ are trademarks of Texas Instruments.
Bluetooth® is a registered trademark of Bluetooth SIG, Inc.
All trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
20
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PACKAGE OUTLINE
YFP0008-C01
DSBGA - 0.531 mm max height
SCALE 10.000
DIE SIZE BALL GRID ARRAY
B
E
A
BALL A1
CORNER
D
0.341
0.283
C
0.531 MAX
SEATING PLANE
0.19
0.13
0.05 C
SYMM
D
C
SYMM
1.2
TYP
D: Max = 1.592 mm, Min = 1.531 mm
B
E: Max = 0.896 mm, Min = 0.836 mm
0.4 TYP
A
8X
0.015
0.25
0.21
C A B
1
2
0.4 TYP
4226583/A 03/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
YFP0008-C01
DSBGA - 0.531 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
8X ( 0.23)
1
2
A
(0.4) TYP
B
SYMM
C
D
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 50X
0.05 MAX
0.05 MIN
METAL UNDER
SOLDER MASK
( 0.23)
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
( 0.23)
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4226583/A 03/2021
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
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EXAMPLE STENCIL DESIGN
YFP0008-C01
DSBGA - 0.531 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
(R0.05) TYP
8X ( 0.25)
1
2
A
(0.4) TYP
B
SYMM
METAL
TYP
C
D
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 50X
4226583/A 03/2021
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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PACKAGE OPTION ADDENDUM
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12-Mar-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPS627431YFPR
ACTIVE
DSBGA
YFP
8
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
627431
TPS627431YFPT
ACTIVE
DSBGA
YFP
8
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
627431
TPS62743YFPR
ACTIVE
DSBGA
YFP
8
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TPS743
TPS62743YFPT
ACTIVE
DSBGA
YFP
8
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TPS743
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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