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TPS63000, TPS63001, TPS63002
SLVS520C – MARCH 2006 – REVISED OCTOBER 2015
TPS6300x High-Efficient Single Inductor Buck-Boost Converter With 1.8-A Switches
1 Features
3 Description
•
•
The TPS6300x devices provide a power supply
solution for products powered by either a two-cell or
three-cell alkaline, NiCd or NiMH battery, or a onecell Li-ion or Li-polymer battery. Output currents can
go as high as 1200 mA while using a single-cell Li-ion
or Li-polymer battery, and discharge it down to 2.5 V
or lower. The buck-boost converter is based on a
fixed frequency, pulse width modulation (PWM)
controller using synchronous rectification to obtain
maximum efficiency. At low load currents, the
converter enters power-save mode to maintain high
efficiency over a wide load current range. The powersave mode can be disabled, forcing the converter to
operate at a fixed switching frequency. The maximum
average current in the switches is limited to a typical
value of 1800 mA. The output voltage is
programmable using an external resistor divider, or is
fixed internally on the chip. The converter can be
disabled to minimize battery drain. During shutdown,
the load is disconnected from the battery.
1
•
•
•
•
•
•
•
•
•
•
Input Voltage Range: 1.8 V to 5.5 V
Fixed and Adjustable Output Voltage Options from
1.2 V to 5.5 V
Up to 96% Efficiency
1200-mA Output Current at 3.3 V in Step-Down
Mode (VIN = 3.6 V to 5.5 V)
Up to 800-mA Output Current at 3.3 V in Boost
Mode (VIN > 2.4 V)
Automatic Transition Between Step-Down and
Boost Mode
Device Quiescent Current less than 50 μA
Power-Save Mode for Improved Efficiency at Low
Output Power
Forced Fixed Frequency Operation and
Synchronization Possible
Load Disconnect During Shutdown
Overtemperature Protection
Available in a Small 3-mm × 3-mm 10-Pin VSON
Package (QFN)
2 Applications
•
•
•
•
•
All Two-Cell and Three-Cell Alkaline, NiCd or
NiMH or Single-Cell Li Battery Powered Products
Portable Audio Players
Smart Phones
Personal Medical Products
White LEDs
The TPS6300x devices operate over a free air
temperature range of –40°C to 85°C. The devices are
packaged in a 10-pin VSON package (QFN)
measuring 3 mm × 3 mm (DRC).
Device Information(1)
PART NUMBER
TPS63001
100
90
L2
VIN
VOUT
VINA
EN
FB
PS/SYNC
GND
PGND
TPS63001
C2
10µF
C3
10µF
VOUT
3.3V up to
1200mA
80
VI = 2.4 V
70
Efficiency - %
L1
C4
0.1µF
3.00 mm x 3.00 mm
Efficiency vs Output Current
L1
R3
100S
VSON (10)
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
2.2µH
C1
10µF
BODY SIZE (NOM)
TPS63002
Typical Application Schematic
VIN
1.8V to
5.5V
PACKAGE
TPS63000
60
VI = 3.6 V
VI = 4.2 V
50
40
30
20
TPS63001
VO = 3.3 V
10
0
0.001
0.01
0.1
1
I O - Output Current - A
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS63000, TPS63001, TPS63002
SLVS520C – MARCH 2006 – REVISED OCTOBER 2015
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 7
7.1
7.2
7.3
7.4
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
7
7
8
9
8
Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Application ................................................. 10
9 Power Supply Recommendations...................... 15
10 Layout................................................................... 16
10.1 Layout Guidelines ................................................. 16
10.2 Layout Example .................................................... 16
10.3 Thermal Considerations ........................................ 16
11 Device and Documentation Support ................. 17
11.1
11.2
11.3
11.4
11.5
11.6
Device Support......................................................
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
17
17
17
17
17
17
12 Mechanical, Packaging, and Orderable
Information ........................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (August 2008) to Revision C
•
2
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
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SLVS520C – MARCH 2006 – REVISED OCTOBER 2015
5 Pin Configuration and Functions
DRC Package
10-Pin VSON
Top View
VOUT
L2
PGND
L1
VIN
(1)
Exposed
Thermal
(1)
Pad
FB
GND
VINA
PS/SYNC
EN
The exposed thermal pad is connected to PGND.
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
EN
6
IN
Enable input (1 enabled, 0 disabled)
FB
10
IN
Voltage feedback of adjustable versions, must be connected to VOUT on fixed output voltage versions
GND
9
—
Control / logic ground
L1
4
IN
Connection for inductor
L2
2
IN
Connection for inductor
PGND
3
—
Power ground
PS/SYNC
7
IN
Enable / disable power-save mode (1 disabled, 0 enabled, clock signal for synchronization)
VIN
5
IN
Supply voltage for power stage
VINA
8
IN
Supply voltage for control stage
VOUT
1
OUT
Exposed
Thermal Pad
—
—
Buck-boost converter output
The exposed thermal pad is connected to PGND.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
Input voltage on VIN, VINA, L1, L2, VOUT, PS/SYNC, EN, FB
–0.3
7
V
Operating virtual junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
6.2 ESD Ratings
VALUE
Electrostatic
discharge
V(ESD)
(1)
(2)
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
2000
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2)
1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
MAX
Supply voltage at VIN, VINA
1.8
5.5
UNIT
V
Operating free air temperature, TA
–40
85
°C
Operating virtual junction temperature, TJ
–40
125
°C
6.4 Thermal Information
TPS6300x
THERMAL METRIC (1)
DRC (VSON)
UNIT
10 PINS
RθJA
Junction-to-ambient thermal resistance
46.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
62.5
°C/W
RθJB
Junction-to-board thermal resistance
21.4
°C/W
ψJT
Junction-to-top characterization parameter
1.4
°C/W
ψJB
Junction-to-board characterization parameter
21.5
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
4.1
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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SLVS520C – MARCH 2006 – REVISED OCTOBER 2015
6.5 Electrical Characteristics
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature
range of 25°C) (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DC-DC STAGE
VIN
Input voltage range
1.8
5.5
V
VIN
Input voltage range for start-up
1.9
5.5
V
VOUT
TPS63000 output voltage range
1.2
5.5
V
VFB
TPS63000 feedback voltage
505
mV
f
Oscillator frequency
1250
1500
kHz
Frequency range for synchronization
1250
1800
kHz
2000
mA
ISW
PS/SYNC = VIN
495
1600
500
Switch current limit
VIN = VINA = 3.6 V, TA = 25°C
1800
High-side switch ON-resistance
VIN = VINA = 3.6 V
100
Low-side switch ON-resistance
VIN = VINA = 3.6 V
100
Line regulation
0.5%
VIN
Quiescent
current
IOUT = 0 mA, VEN = VIN = VINA = 3.6 V,
VOUT = 3.3 V
VINA
VOUT (adjustable output voltage)
FB input impedance (fixed output voltage)
IS
mΩ
0.5%
Load regulation
Iq
mΩ
Shutdown current
1
1.5
μA
40
50
μA
4
6
μA
1
VEN = 0 V, VIN = VINA = 3.6 V
MΩ
0.1
1
μA
1.7
1.8
V
0.4
V
CONTROL STAGE
VUVLO
Undervoltage lockout threshold
VIL
EN, PS/SYNC input low voltage
VIH
EN, PS/SYNC input high voltage
VINA voltage decreasing
1.5
1.2
EN, PS/SYNC input current
Clamped on GND or VINA
V
0.01
0.1
μA
Overtemperature protection
140
°C
Overtemperature hysteresis
20
°C
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6.6 Typical Characteristics
1800
IO - maximum output current - mA
1600
TPS63000,
VO = 1.8 V
1400
1200
1000
800
TPS63001,
VO = 3.3 V
600
TPS63002,
VO = 5 V
400
200
0
1.8
2.6
4.2
3.4
VI - Input Voltage - V
5
Figure 1. Maximum Output Current vs Input Voltage
6
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7 Detailed Description
7.1 Overview
The controlling circuit of the device is based on an average current mode topology. The average inductor current
is regulated by a fast current regulator loop which is controlled by a voltage control loop. The controller also uses
input and output voltage feedforward. Changes of input and output voltage are monitored and immediately can
change the duty cycle in the modulator to achieve a fast response to those errors. The voltage error amplifier
gets its feedback input from the FB pin. At adjustable output voltages a resistive voltage divider must be
connected to that pin. At fixed output voltages FB must be connected to the output voltage to directly sense the
voltage. Fixed output voltage versions use a trimmed internal resistive divider. The feedback voltage will be
compared with the internal reference voltage to generate a stable and accurate output voltage.
The controller circuit also senses the average input current as well as the peak input current. With this, maximum
input power can be controlled as well as the maximum peak current to achieve a safe and stable operation under
all possible conditions. To finally protect the device from overheating, an internal temperature sensor is
implemented.
The device uses 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible
operating conditions. This enables the device to keep high efficiency over a wide input voltage and output power
range.
To avoid ground shift problems due to the high currents in the switches, two separate ground pins GND and
PGND are used. The reference for all control functions is the GND pin. The power switches are connected to
PGND. Both grounds must be connected on the PCB at only one point, ideally close to the GND pin. Due to the
4-switch topology, the load is always disconnected from the input during shutdown of the converter.
7.2 Functional Block Diagram
L1
L2
VIN
VOUT
Current
Sensor
VBAT
VOUT
PGND PGND
Gate
Control
_
VINA
Modulator
PS/SYNC
Oscillator
+
+
_
FB
VREF
+
-
Device
Control
EN
Temperature
Control
PGND
PGND
GND
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7.3 Feature Description
7.3.1 Device Enable
The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In
shutdown mode, the regulator stops switching, all internal control circuitry is switched off, and the load is
disconnected from the input. This also means that the output voltage can drop below the input voltage during
shutdown. During start-up of the converter, the duty cycle and the peak current are limited in order to avoid high
peak currents flowing from the input.
7.3.2 Undervoltage Lockout
An undervoltage lockout function prevents device start-up if the supply voltage at VINA is lower than
approximately its threshold (see Electrical Characteristics ). When in operation, the device automatically enters
the shutdown mode if the voltage at VINA drops below the undervoltage lockout threshold. The device
automatically restarts if the input voltage recovers to the minimum operating input voltage.
7.3.3 Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC temperature. If the temperature
exceeds the programmed threshold (see Electrical Characteristics ) the device stops operating. As soon as the
IC temperature has decreased below the programmed threshold, it starts operating again. There is a built-in
hysteresis to avoid unstable operation at IC temperatures at the overtemperature threshold.
8
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7.4 Device Functional Modes
7.4.1 Soft-Start and Short Circuit Protection
After being enabled, the device starts operating. The average current limit ramps up from an initial 400 mA
following the output voltage increasing. At an output voltage of about 1.2 V, the current limit is at its nominal
value. If the output voltage does not increase, the current limit will not increase. There is no timer implemented.
Thus the output voltage overshoot at start-up, as well as the inrush current, is kept at a minimum. The device
ramps up the output voltage in a controlled manner even if a very large capacitor is connected at the output.
When the output voltage does not increase above 1.2 V, the device assumes a short circuit at the output and
keeps the current limit low to protect itself and the application. At a short at the output during operation the
current limit also will be decreased accordingly. At 0 V at the output, for example, the output current will not
exceed about 400 mA.
7.4.2 Buck-Boost Operation
To regulate the output voltage properly at all possible input voltage conditions, the device automatically switches
from step-down operation to boost operation and back as required by the configuration. It always uses one active
switch, one rectifying switch, one switch permanently on, and one switch permanently off. Therefore, it operates
as a step-down converter (buck) when the input voltage is higher than the output voltage, and as a boost
converter when the input voltage is lower than the output voltage. There is no mode of operation in which all 4
switches are permanently switching. Controlling the switches this way allows the converter to maintain high
efficiency at the most important point of operation; when input voltage is close to the output voltage. The RMS
current through the switches and the inductor is kept at a minimum, to minimize switching and conduction losses.
Switching losses are also kept low by using only one active and one passive switch. For the remaining 2
switches, one is kept permanently on and the other is kept permanently off, thus causing no switching losses.
7.4.3 Power-Save Mode and Synchronization
The PS/SYNC pin can be used to select different operation modes. To enable power-save mode, PS/SYNC must
be set low. Power-save mode is used to improve efficiency at light load. If power-save mode is enabled, the
converter stops operating if the average inductor current gets lower than about 300 mA and the output voltage is
at or above its nominal value. If the output voltage decreases below its nominal value, the device ramps up the
output voltage again by starting operation using a programmed average inductor current higher than required by
the current load condition. Operation can last for one or several pulses. The converter again stops operating
once the conditions for stopping operation are met again.
The power-save mode can be disabled by programming high at the PS/SYNC. Connecting a clock signal at
PS/SYNC forces the device to synchronize to the connected clock frequency. Synchronization is done by a
phase-locked loop (PLL), so synchronizing to lower and higher frequencies compared to the internal clock works
without any issues. The PLL can also tolerate missing clock pulses without the converter malfunctioning. The
PS/SYNC input supports standard logic thresholds.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TPS6300x DC–DC converters are intended for systems powered by one-cell Li-ion or Li-polymer battery with
a typical voltage between 2.3 V and 4.5 V. They can also be used in systems powered by a double or triple cell
alkaline, NiCd, or NiMH battery with a typical terminal voltage between 1.8 V and 5.5 V. Additionally, any other
voltage source with a typical output voltage between 1.8 V and 5.5 V can power systems where the TPS6300x is
used.
8.2 Typical Application
L1
L1
VIN
L2
VIN
C1
R3
VINA
R1
EN
GND
C2
FB
PS/SYNC
C3
VOUT
VOUT
R2
PGND
TPS6300X
Figure 2. Typical Application Circuit for Adjustable Output Voltage Option
8.2.1 Design Requirements
The TPS63000 series of buck-boost converters have internal loop compensation. Therefore, the external LC filter
has to be selected according to the internal compensation.
The design guideline provides a component selection to operate the device within the Recommended Operating
Conditions.
For the fixed output voltage option the feedback pin needs to be connected to VOUT.
Table 1 shows the list of components for the application curves.
Table 1. List of Components
REFERENCE
DESCRIPTION
MANUFACTURER
TPS63000 / TPS63001 / TPS63002
Texas Instruments
L1
VLF4012-2R2
TDK
C1
10 μF 6.3 V, 0603, X7R ceramic
C2
2 × 10 μF 6.3 V, 0603, X7R ceramic
C3
0.1 μF, X7R ceramic
R3
100 Ω
R1, R2
Depending on the output voltage at TPS63000, not used at TPS63001 / TPS63002
10
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8.2.2 Detailed Design Procedure
8.2.2.1 Programming the Output Voltage
Within the TPS6300x family, there are fixed and adjustable output voltage versions available. To properly
configure the fixed output voltage devices, the FB pin is used to sense the output voltage. This means that it
must be connected directly to VOUT. At the adjustable output voltage versions, an external resistor divider is
used to adjust the output voltage. The resistor divider must be connected between VOUT, FB and GND. When
the output voltage is regulated properly, the typical value of the voltage at the FB pin is 500 mV. The maximum
recommended value for the output voltage is 5.5 V. The current through the resistive divider should be about 100
times greater than the current into the FB pin. The typical current into the FB pin is 0.01 μA, and the voltage
across the resistor between FB and GND, R2, is typically 500 mV. Based on those two values, the recommended
value for R2 should be lower than 500 kΩ, in order to set the divider current at 1 μA or higher. TI recommends to
keep the value for this resistor in the range of 200 kΩ. From that, the value of the resistor connected between
VOUT and FB, R1, depending on the needed output voltage (VOUT), can be calculated using Equation 1.
æV
ö
R1 = R2 ´ ç OUT - 1÷
è VFB
ø
(1)
If as an example, an output voltage of 3.3 V is needed, a 1-MΩ resistor should be chosen for R1. To improve
control performance using a feedforward capacitor in parallel to R1 is recommended. The value for the
feedforward capacitor can be calculated using Equation 2.
Cff =
2.2 μs
R1
(2)
8.2.2.2 Inductor Selection
The inductor selection is affected by several parameter like inductor ripple current, output voltage ripple,
transition point into power-save mode, and efficiency. See Table 2 for typical inductors.
Table 2. List of Recommended Inductors
VENDOR
Coilcraft
INDUCTOR SERIES
LPS3015
LPS4012
Murata
LQH3NP
Tajo Yuden
NR3015
VLF3215
TDK
VLF4012
For high efficiencies, the inductor should have a low DC resistance to minimize conduction losses. Especially at
high-switching frequencies, the core material has a high impact on efficiency. When using small chip inductors,
the efficiency is reduced mainly due to higher inductor core losses. This needs to be considered when selecting
the appropriate inductor. The inductor value determines the inductor ripple current. The larger the inductor value,
the smaller the inductor ripple current and the lower the conduction losses of the converter. Conversely, larger
inductor values cause a slower load transient response. To avoid saturation of the inductor, the peak current for
the inductor in steady-state operation is calculated using Equation 4. Only the equation which defines the switch
current in boost mode is shown, because this provides the highest value of current and represents the critical
current value for selecting the right inductor.
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Duty Cycle Boost
D=
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V
-V
IN
OUT
V
OUT
(3)
Iout
Vin ´ D
=
+
η ´ (1 - D)
2 ´ f ´ L
IPEAK
where
•
•
•
•
D = Duty Cycle in Boost mode
f = Converter switching frequency (typical 2.5MHz)
L = Inductor value
η = Estimated converter efficiency (use the number from the efficiency curves or 0.90 as an assumption)
(4)
NOTE
The calculation must be done for the minimum input voltage which is possible to have in
boost mode.
Calculating the maximum inductor current using the actual operating conditions gives the minimum saturation
current of the inductor needed. ITI recommends to choose an inductor with a saturation current 20% higher than
the value calculated using Equation 4. Possible inductors are listed in Table 2.
8.2.2.3 Capacitor Selection
8.2.2.3.1
Input Capacitor
At least a 4.7-μF input capacitor is recommended to improve transient behavior of the regulator and EMI
behavior of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and PGND
pins of the IC is recommended.
8.2.2.3.2
Output Capacitor
For the output capacitor, use of a small ceramic capacitors placed as close as possible to the VOUT and PGND
pins of the IC is recommended. The recommended nominal output capacitance value is 15 µF.
There is also no upper limit for the output capacitance value. Larger capacitors causes lower output voltage
ripple as well as lower output voltage drop during load transients.
8.2.3 Application Curves
100
100
90
90
VI = 3.6 V
80
80
VI = 2.4 V
60
VI = 3.6 V
70
Efficiency - %
Efficiency - %
70
VI = 4.2 V
50
40
40
30
20
20
TPS63001
VO = 3.3 V
0
0.001
TPS63002
VO = 5 V
10
0
0.01
0.1
0.001
1
0.1
0.01
IO - Output Current - A
I O - Output Current - A
VO = 3.3 V
Power Save enabled
Figure 3. Efficiency vs Output Current (TPS63001)
12
VI = 2.4 V
50
30
10
VI = 4.2 V
60
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VO = 5 V
1
Power Save enabled
Figure 4. Efficiency vs Output Current (TPS63002)
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100
100
IO = 500 mA
95
90
90
85
85
IO = 100 mA
Efficiency - %
Efficiency - %
IO = 500 mA
95
80
75
70
IO = 10 mA
80
75
70
IO = 100 mA
65
65
IO = 10 mA
60
60
TPS63001
VO = 3.3 V
55
50
1.8
2.3
2.8
3.3
3.8
4.3
4.8
TPS63002
VO = 5 V
55
50
1.8
5.3
2.3
2.8
VI - input voltage - V
VO = 3.3 V
VO = 5 V
Power Save enabled
3.3
3.8
4.3
VI - Input Voltage - V
4.8
5.3
Power Save enabled
Figure 6. Efficiency vs Input Voltage (TPS63002)
Figure 5. Efficiency vs Input Voltage (TPS63001)
3.400
5.150
TPS63002
VO = 5 V
TPS63001
VO = 3.3 V
5.100
3.300
VO - Output Voltage - V
VO - Output Voltage - V
3.350
VI = 3.6 V
3.250
5.050
VI = 3.6 V
5
4.950
4.900
3.200
0.001
0.01
0.1
IO - Output Current - A
4.850
0.001
1
VO = 3.3 V
0.01
0.1
IO - Output Current - A
VO = 5 V
Figure 7. Output Voltage vs Output Current (TPS63001)
Figure 8. Output Voltage vs Output Current (TPS63002)
Output Voltage
10 mV/div
Output Voltage
10 mV/div
L1 Voltage
5 V/div
L1 Voltage
5 V/div
L2 Voltage
5 V/div
L2 Voltage
5 V/div
Inductor Current
500 mA/div
Inductor Current
500 mA/div
TPS63001
VO = 3.3 V
TPS63001,
VO = 3.3 V
VI = 4.2 V,
IO = 500 mA
VI = 4.2 V
VI = 2.4 V, IO = 500 mA
Timebase 500 ns/Div
Timebase 500 ns/div
VO = 3.3 V
1
IO = 500 mA
Figure 9. Output Voltage in Continuous Current Mode
(TPS63001, VIN > VOUT)
VO = 3.3 V
VI = 2.4 V
IO = 500 mA
Figure 10. Output Voltage in Continuous Current Mode
(TPS63001, VIN > VOUT)
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Output Voltage
10 mV/div
Output Voltage
100 mV/div
L1 Voltage
5 V/div
L2 Voltage
5 V/div
Inductor Current
500 mA/div,dc
Inductor Current
500 mA/div
TPS63001,
VO = 3.3 V
TPS63001,
VO = 3.3 V
VI = 3.3 V, IO = 500 mA
Timebase 5 ms/Div
Timebase 500 ns/div
VO = 3.3 V
VI = 4.2 V, IO = 50 mA
VI = 3.3 V
IO = 500 mA
Figure 11. Output Voltage in Continuous Current Mode
(TPS63001, VIN = VOUT)
VO = 3.3 V
VI = 4.2 V
Figure 12. Output Voltage in Power-Save Mode
(TPS63001, VIN > VOUT)
Output Voltage
100 mV/div, ac
Output Voltage
100 mV/div, ac
Output Current
200 mA/div, dc
Inductor Current
500 mA/div, dc
TPS63001,
VO = 3.3 V
TPS63001,
VO = 3.3 V
VI = 2.4 V, IO = 50 mA
VI = 3.6 V,
IO = 200 mA to 600 mA
Timebase 2 ms/div
Timebase 5 m s/div
VO = 3.3 V
IO = 50 mA
VI = 2.4 V
IO = 50 mA
VO = 3.3 V
Figure 13. Output Voltage in Power-Save Mode
(TPS63001, VIN < VOUT)
VI = 3.6 V
IO = 200 mA to 600
mA
Figure 14. Load Transient Response
(TPS63001, VIN > VOUT)
Output Voltage
100 mV/div, ac
Output Voltage
10 mV/div,ac
Output Current
200 mA/div,dc
TPS63001,
VO = 3.3 V
Input Voltage
1 V/div,dc
VI = 3 V,
IO = 200 mA to 600 mA
Timebase 2 ms/div
VO = 3.3 V
VI = 3 V
IO = 200 mA to 600
mA
Figure 15. Load Transient Response
(TPS63001, VIN < VOUT)
14
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VI = 3 V to 3.6 V,
IO = 300 mA
TPS63001,
VO = 3.3 V
Timebase 2 ms/div
VO = 3.3 V
VI = 3 V to 3.6 V
IO = 300 mA
Figure 16. Line Transient Response
(TPS63001, IOUT = 300 mA)
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TPS63000 TPS63001 TPS63002
TPS63000, TPS63001, TPS63002
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SLVS520C – MARCH 2006 – REVISED OCTOBER 2015
Enable
2 V/div,dc
Output Voltage
1 V/div,dc
Output Voltage
20 mV/div,ac
Inductor Current
200 mA/div,dc
Input Voltage
1 V/div,dc
TPS63001,
VO = 3.3 V
VI = 3.3 V, IO = 300 mA
Timebase 2 ms/div
VO = 3.3 V
Voltage at L1
2 V/div, dc
TPS63000,
VO = 2.5 V
VI = 3 V to 3.6 V,
IO = 600 mA
Timebase 50 ms/div
VI = 3 V to 3.6 V
IO = 600 mA
VO = 2.5 V
Figure 17. Line Transient Response
(TPS63001, IOUT= 600 mA)
VI = 3.3 V
IO = 300 mA
Figure 18. Start-Up After Enable (TPS63000, VOUT = 2.5 V)
Enable
2 V/div, dc
Output Voltage
2 V/div, dc
Inductor Current
500 mA/div, dc
Voltage at L2
2 V/div,dc
TPS63002,
VO = 5 V
VI = 2.4 V, IO = 300 mA
Timebase 100 ms/div
VO = 5 V
VI = 2.4 V
IO = 300 mA
Figure 19. Start-Up After Enable (TPS63002)
9 Power Supply Recommendations
The TPS6300x devices have no special requirements for its input power supply. The output current of the input
power supply needs to be rated according to the supply voltage, output voltage and output current of the
TPS6300x.
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10 Layout
10.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC.
Use a common ground node for power ground and a different one for control ground to minimize the effects of
ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the
control ground, TI recommends to use short traces as well, separated from the power ground traces. This avoids
ground shift problems, which can occur due to superimposition of power ground current and control ground
current.
10.2 Layout Example
L2
VOUT
L1
PGND
VIN
VIN
L1
VOUT
C1
FB
VINA
GND
EN
GND
PS/SYNC
C2
C3
GND
R2
R1
Figure 20. Layout Recommendation
10.3 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB by soldering the exposed thermal pad
• Introducing airflow in the system
The maximum recommended junction temperature (TJ) of the TPS6300x devices is 125°C. The thermal
resistance of the 10-pin QFN 3 mm × 3 mm package (DRC) is RθJA = 48.7°C/W, if the exposed thermal pad is
soldered. Specified regulator operation is assured to a maximum ambient temperature TA of 85°C. Therefore, the
maximum power dissipation is about 820 mW, as calculated in Equation 5. More power can be dissipated if the
maximum ambient temperature of the application is lower.
PD(MAX) =
16
TJ(MAX) - TA
RθJA
=
125°C - 85°C
= 820 mW
48.7 °C W
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(5)
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Product Folder Links: TPS63000 TPS63001 TPS63002
TPS63000, TPS63001, TPS63002
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SLVS520C – MARCH 2006 – REVISED OCTOBER 2015
11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 3. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS63000
Click here
Click here
Click here
Click here
Click here
TPS63001
Click here
Click here
Click here
Click here
Click here
TPS63002
Click here
Click here
Click here
Click here
Click here
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TPS63000 TPS63001 TPS63002
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17
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPS63000DRCR
ACTIVE
VSON
DRC
10
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
BPT
TPS63000DRCRG4
ACTIVE
VSON
DRC
10
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
BPT
TPS63000DRCT
ACTIVE
VSON
DRC
10
250
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
BPT
TPS63000DRCTG4
ACTIVE
VSON
DRC
10
250
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
BPT
TPS63001DRCR
ACTIVE
VSON
DRC
10
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
BPU
TPS63001DRCRG4
ACTIVE
VSON
DRC
10
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
BPU
TPS63001DRCT
ACTIVE
VSON
DRC
10
250
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
BPU
TPS63002DRCR
ACTIVE
VSON
DRC
10
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
BPV
TPS63002DRCT
ACTIVE
VSON
DRC
10
250
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
BPV
TPS63002DRCTG4
ACTIVE
VSON
DRC
10
250
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
BPV
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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