TPS63060, TPS63061
TPS63060,
TPS63061
SLVSA92C – NOVEMBER 2011 – REVISED
SEPTEMBER
2020
SLVSA92C – NOVEMBER 2011 – REVISED SEPTEMBER 2020
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TPS6306x High Input Voltage, Buck-Boost Converter With 2-A Switch Current
1 Features
3 Description
•
•
•
The TPS6306x devices provide a power supply
solution for products powered by either three-cell up
to six-cell alkaline, NiCd or NiMH battery, or a one-cell
or dual-cell Li-Ion or Li-polymer battery. Output
currents can go as high as 2 A while using a dual-cell
Li-Ion or Li-polymer battery, and discharge to 5 V or
lower. The buck-boost converter is based on a fixed
frequency, pulse width modulation (PWM) controller
using synchronous rectification to obtain maximum
efficiency. At low load currents, the converter enters
power save mode to maintain high efficiency over a
wide load current range. The power save mode can
be disabled, forcing the converter to operate at a fixed
switching frequency. The maximum average current in
the switches is limited to a typical value of 2.25 A. The
output voltage is programmable using an external
resistor divider, or is fixed internally on the chip. The
converter can be disabled to minimize battery drain.
During shutdown, the load disconnects from the
battery.
•
•
•
•
•
•
•
•
•
•
•
Input voltage range: 2.5 V to 12 V
Efficiency: Up to 93%
Output current at 5 V (VIN < 10 V):
2 A in buck mode
Output current at 5 V (VIN > 4 V):
1.3 A in boost mode
Automatic transition between step down and boost
mode
Typical device quiescent current: < 30 μA
Fixed and adjustable output voltage options from
2.5 V to 8 V
Power save mode for improved efficiency at low
output power
Forced fixed-frequency operation at 2.4 MHz and
synchronization possible
Power good output
Buck-Boost Overlap Control™
Load disconnect during shutdown
Overtemperature protection
Overvoltage protection
2 Applications
•
•
•
•
•
•
•
Dual Li-ion application
Digital still cameras (DSC) and camcorders
Notebook computer
Industrial metering equipment
Ultra mobile PCs and mobile internet devices
Personal medical products
High-power LEDs
The devices are available in a 3 mm × 3 mm, 10-pin,
WSON (DSC) package.
Device Information (1)
PART NUMBER
TPS63060
TPS63061
(1)
PACKAGE
BODY SIZE (NOM)
WSON (10)
3.00 mm × 3.00 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
100
90
80
L1
VIN
CIN
VOUT
5 V, 800 mA
L2
VOUT
COUT
EN
VAUX
FB
CAUX
70
Efficiency (%)
TPS63060
VIN
2.5 V to 12 V
60
50
40
30
20
PS/SYNC
10
PG
VOUT = 5 V
TPS63061
Power Save Enabled
0
0.0001
GND
PGND
0.001
0.01
VIN = 4.8 V
VIN = 7.2 V
0.1
1
10
Output Current (A)
Efficiency vs Output Current
Simplified Application
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
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Incorporated
intellectual
property
matters
and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison......................................................... 3
6 Pin Configuration and Functions...................................4
Pin Functions.................................................................... 4
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings........................................ 5
7.2 ESD Ratings............................................................... 5
7.3 Recommended Operating Conditions.........................5
7.4 Thermal Information....................................................5
7.5 Electrical Characteristics.............................................6
7.6 Typical Characteristics................................................ 7
8 Detailed Description........................................................8
8.1 Overview..................................................................... 8
8.2 Functional Block Diagrams......................................... 8
8.3 Feature Description.....................................................9
8.4 Device Functional Modes..........................................10
9 Application and Implementation.................................. 13
9.1 Application Information............................................. 13
9.2 Typical Application.................................................... 13
10 Power Supply Recommendations..............................20
11 Layout........................................................................... 21
11.1 Layout Guidelines................................................... 21
11.2 Layout Example...................................................... 21
12 Device and Documentation Support..........................22
12.1 Device Support....................................................... 22
12.2 Documentation Support.......................................... 22
12.3 Receiving Notification of Documentation Updates..22
12.4 Community Resources............................................22
12.5 Trademarks............................................................. 22
13 Mechanical, Packaging, and Orderable
Information.................................................................... 22
4 Revision History
Changes from Revision B (December 2014) to Revision C (September 2020)
Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
• Changed Application From: DSCs and Camcorders To: Digital Still Cameras (DSC) and Camcorders............ 1
• Deleted PowerPAD™ package from the Description .........................................................................................1
• Changed the Typical Application Schematic ..................................................................................................... 1
• Removed PACKAGE MARKING from the Device Comparison Table ............................................................... 3
• Changed From: PowerPAD™ To: Exposed Thermal Pad in the Pin Functions table......................................... 4
• Changed L1 and L2 values in the Absolute Maximum Ratings table................................................................. 5
• Deleted Machine model (MM) from the ESD Ratings table................................................................................ 5
• Added "Thermal shutdown" and "Thermal Shutdown hysteresis" to the Electrical Characteristics table........... 6
• Deleted "Overtemperature protection" and "Overtemperature hysteresis" from the Electrical Characteristics
table.................................................................................................................................................................... 6
• Added "Maximum reverse current" to the Electrical Characteristics table..........................................................6
• Added condition footnote to Electrical Characteristics table...............................................................................6
• Changed the Overview section...........................................................................................................................8
• Changed Figure 8-1 Title From: TPS63061 Fixed Output To: TPS63060 Adjustable.........................................8
• Changed Figure 8-2 Title From: TPS63060 Adjustable To: TPS63061 Fixed Output.........................................8
• Split the Soft-Start Function and Short-Circuit Protection into two separate sections........................................ 9
• Moved Synchronization from the Power-Save Mode section into a separate section...................................... 11
• Changed C2 (2 x 10 µF) To: C1 (2 x 10 µF) in Figure 9-1 ............................................................................... 13
• Deleted two graphs "Output Current vs Input Voltage" and "Output Current vs Input Voltage" from the
Application Curves ...........................................................................................................................................16
Changes from Revision A (February 2012) to Revision B (December 2014)
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section................... 1
2
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5 Device Comparison
(1)
(2)
Part Number (2) (1)
Output Voltage
DC/DC
TPS63060DSC
Adjustable
TPS63061DSC
5V
Contact the factory to confirm availability of other fixed-output voltage versions.
For detailed ordering information please check the Package Option Addendum section at the end of
this data sheet.
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6 Pin Configuration and Functions
L1
1
VIN
2
10
L2
9
VOUT
8
FB
Th ermal
EN
3
Pad
PS/SYNC
4
7
GND
PG
5
6
VAUX
No t to scale
Figure 6-1. DSC Package 10 Pins (Top View)
Pin Functions
Pin
Name
No.
Description
EN
3
I
Enable input (1 enabled, 0 disabled)
FB
8
I
Voltage feedback of adjustable versions, must be connected to VOUT on fixed output voltage versions
GND
7
L1
1
L2
PG
Control and logic ground
I
Connection for inductor
10
I
Connection for inductor
5
O
Output power good (1 good, 0 failure, open drain)
PS/SYNC
4
I
Enable / disable power save mode (1 disabled, 0 enabled, clock signal for synchronization)
VAUX
6
VIN
2
I
Supply voltage for power stage
VOUT
9
O
Buck-boost converter output
Exposed Thermal Pad
4
I/O
Connection for capacitor
Must be soldered to achieve the appropriate power dissipation. Must be connected to PGND.
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
EN, FB, PS/SYNC, VIN, VOUT, PG, L1, L2
Voltage range
MIN
MAX
–0.3
17
V
L1, L2 (AC, less than 10ns)
UNIT
-5
18
V
–0.3
7.5
V
Operating virtual junction temperature range, TJ
–40
125
°C
Storage temperature, Tstg
–65
150
°C
VAUX, FB
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
7.2 ESD Ratings
VALUE
Human-body model (HBM), per ANSI/ESDA/JEDEC
V(ESD)
(1)
(2)
Electrostatic discharge
JS-001(1)
UNIT
±3000
Charged-device model (CDM), per JEDEC specification JESD22-C101 or
ANSI/ESDA/JEDEC JS-002(2)
V
±1500
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
MAX
2.5
12
1
A
Operating free air temperature range, TA
–40
85
°C
Operating virtual junction temperature range, TJ
–40
125
°C
Supply voltage at VIN
Output current IOUT
(1)
(1)
UNIT
V
10 ≤ VIN ≤ 12 V
7.4 Thermal Information
THERMAL METRIC(1)
TPS63060
TPS63061
DSC
UNIT
10 PINS
RθJA
Junction-to-ambient thermal resistance
48.7
RθJC(top)
Junction-to-case (top) thermal resistance
54.8
RθJB
Junction-to-board thermal resistance
19.8
ψJT
Junction-to-top characterization parameter
1.1
ψJB
Junction-to-board characterization parameter
19.6
RθJC(bot)
Junction-to-case (bottom) thermal resistance
4.2
(1)
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
Over operating free-air temperature range (unless otherwise noted) TA = 25°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DC/DC STAGE
VIN
Input voltage range
VIIN
Minimum input voltage for startup
VOUT
Output voltage
DMIN
Minimum duty-cycle in step down
conversion
2.5
VPS/SYNC = GND referenced to 5 V
Output current at 5V in boost mode
V
V
V
TPS63060
2.5
8
TPS63061
0.6%
5%
10%
Output current at 5V in buck mode
IOUT
12
2.5
VIN 4 V
A
1.3
VPS/SYNC = VIN
495
A
505
mV
VFB
Feedback voltage
fOSC
Oscillator frequency
2200
2400
2600
kHz
Frequency range for synchronization
2200
2400
2600
kHz
2000
2250
2500
VPS/SYNC = GND referenced to
500 mV
ISW
Average inductance current limit
VIN = 5 V
RDS(on)H
High-side MOSFET on-resistance
VIN = 5 V
RDS(on)L
IQ
TPS63060
500
0.6%
Low-side switch MOSFET on-resistance VIN = 5 V
5%
mΩ
95
mΩ
Line regulation
Power save mode disabled
0.5%
Load regulation
Power save mode disabled
0.5%
Input voltage quiescent current
IQ
Output voltage quiescent current
IOUT = 0 mA, VEN = VIN = 5 V,
VOUT = 5 V
RFB
FB input impedance
VEN = HIGH
IS
Shutdown current
VEN = 0 V, VIN = 5 V
TPS63061
mA
90
30
60
7
15
1.5
0.3
μA
μA
MΩ
2
μA
CONTROL STAGE
VAUX
Maximum bias voltage
IAUX
Load current at VAUX
UVLO
Under voltage lockout threshold
VIN > VOUT
VIN
7
V
VIN < VOUT
VOUT
7
V
1
mA
VIN falling
1.8
Under voltage lockout hysteresis
Thermal shutdown
Temperature rising
Thermal Shutdown hysteresis
VIL
EN, PS/SYNC input low voltage
VIH
EN, PS/SYNC input high voltage
V
300
mV
140
°C
°C
0.4
V
μA
1.2
V
EN, PS/SYNC input current
Clamped on GND or VIN
0.01
0.1
PG output low voltage
VOUT = 5 V, IPGL = 10 μA
0.04
0.4
V
0.01
0.1
μA
16
V
900
mA
Output overvoltage protection
6
2.2
20
PG output leakage current
12
Ilim_neg
Maximum reverse current
ttrans
Time from PS/SYNC pin going low to
start operating in PFM(1)
(1)
1.9
VIN = 5 V
4.8
10
μs
Specified by design. Not production tested.
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7.6 Typical Characteristics
1
55
0.8
Quiescent Current (µA)
Shutdown Current (µA)
0.9
0.7
0.6
0.5
0.4
50
45
40
0.3
0.2
35
2
3
4
5
6
7
8
9
10
11
12
2
3
4
Input Voltage (V)
5
6
7
8
9
10
11
12
Input Voltage (V)
Figure 7-1. Shutdown Current vs Input Voltage
Figure 7-2. Quiescent Current vs Input Voltage
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8 Detailed Description
8.1 Overview
The TPS6306x use 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible
operating conditions. This enables the device to keep high efficiency over the complete input voltage and output
power range. To regulate the output voltage at all possible input voltage conditions, the device automatically
switches from buck operation to boost operation and back as required by the configuration. It always uses one
active switch, one rectifying switch, one switch is held on, and one switch held off. Therefore, it operates as a
buck converter when the input voltage is higher than the output voltage, and as a boost converter when the input
voltage is lower than the output voltage. There is no mode of operation in which all 4 switches are switching at
the same time. Keeping one switch on and one switch off eliminates their switching losses. The RMS current
through the switches and the inductor is kept at a minimum, to minimize switching and conduction losses.
Controlling the switches this way allows the converter to always keep higher efficiency.
The device provides a seamless transition from buck to boost or from boost to buck operation.
8.2 Functional Block Diagrams
L1
L2
VIN
VOUT
VIN
VOUT
Bias
Regulator
VIN
VAUX
VOUT
VAUX
VAUX
PG
PS/SYNC
EN
Current
Sensor
PGND
PGND
Gate
Control
_
Modulator
+
Oscillator
Device
Control
+
_
FB
+
-
Temperature
Control
GND
VREF
PGND
PGND
Figure 8-1. TPS63060 Adjustable
8
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L1
L2
VIN
VOUT
VIN
VOUT
Bias
Regulator
Current
Sensor
VIN
VAUX
VOUT
VAUX
VAUX
PG
PS/SYNC
PGND
FB
_
Modulator
+
Oscillator
Device
Control
EN
PGND
Gate
Control
+
_
+
-
VREF
Temperature
Control
GND
PGND
PGND
Figure 8-2. TPS63061 Fixed Output
8.3 Feature Description
8.3.1 Power Good
The device has a built in power good function to indicate whether the output voltage is regulated properly. As
soon as the average inductor current gets limited to a value below the current the voltage regulator demands for
maintaining the output voltage the power good output gets low impedance. The output is open drain, so its logic
function can be adjusted to any voltage level the connected logic is using, by connecting a pull up resistor to the
supply voltage of the logic. By monitoring the status of the current control loop, the power good output provides
the earliest indication possible for an output voltage break down and leaves the connected application a
maximum time to safely react.
8.3.2 Soft-Start Function
After being enabled, the device starts operating. The average current limit ramps up from an initial 400 mA
following the output voltage increasing. At an output voltage of about 1.2 V, the current limit is at its nominal
value. If the output voltage does not increase, the current limit does not increase. The device implements no
timer. Thus, the output voltage overshoot at startup, as well as the inrush current, remains at a minimum. The
device ramps up the output voltage in a controlled manner even if a large capacitor is connected at the output.
8.3.3 Short-Circuit Protection
When the output voltage does not increase above 1.2 V, the device assumes a short circuit at the output, and
keeps the current limit low to protect itself and the application. During a short-circuit situation on the output, the
device maintains the current limit below 2 A typically (minimum average inductance current).
8.3.4 Overvoltage Protection
If, for any reason, the output voltage is not fed back properly to the input of the voltage amplifier, control of the
output voltage no longer works. Therefore, overvoltage protection is implemented to avoid the output voltage
exceeding critical values for the device and possibly for the system it supplies. The implemented overvoltage
protection circuit monitors the output voltage internally as well. If it reaches the overvoltage threshold, the
voltage amplifier regulates the output voltage to this value.
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8.3.5 Undervoltage Lockout
An undervoltage lockout function prevents device start-up if the supply voltage on VIN is lower than
approximately its threshold (see the Section 7.5 table). When in operation, the device automatically enters the
shutdown mode if the voltage on VIN drops below the undervoltage lockout threshold. The device automatically
restarts if the input voltage recovers to the minimum operating input voltage.
8.3.6 Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal device temperature. If the temperature
exceeds the programmed threshold (see the Section 7.5 table) the device stops operating. As soon as the
device temperature has decreased below the programmed threshold, it starts operating again. There is a built-in
hysteresis to avoid unstable operation at device temperatures at the overtemperature threshold.
8.4 Device Functional Modes
8.4.1 Buck-Boost Operation
To regulate the output voltage at all possible input voltage conditions, the device automatically switches from
buck operation to boost operation and back as required. It always uses one active switch, one rectifying switch,
one switch permanently on, and one switch permanently off. Therefore, it operates as a step down converter
(buck) when the input voltage is higher than the output voltage, and as a boost converter when the input voltage
is lower than the output voltage. There is no mode of operation in which all 4 switches are permanently
switching. Controlling the switches this way allows the converter to maintain high efficiency at the most important
point of operation, when the input voltage is close to the output voltage. The RMS current through the switches
and the inductor is kept at a minimum, to minimize switching and conduction losses.
8.4.2 Control Loop
The controller circuit of the device is based on an average current mode topology. The average inductor current
is regulated by a fast current regulator loop which is controlled by a voltage control loop. Figure 8-3 shows the
control loop.
L2
L1
Vin
Vout
Boost
Drive
Buck
Drive
PWM
PWM
Buck
Ramp
Boost
Ramp
gmc
Rs
gmv
Ramp Generator
FB
Vref
0.5V
Figure 8-3. Average Current Mode Control
10
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The non inverting input of the transconductance amplifier, gMV, is assumed to be constant. The output of gMV
defines the average inductor current. The inductor current is reconstructed by measuring the current through the
high side buck MOSFET. This current corresponds exactly to the inductor current in boost mode. In buck mode
the current is measured during the on time of the same MOSFET. During the off time, the current is
reconstructed internally starting from the peak value at the end of the on-time cycle. The average current is
compared to the desired value and the difference, or current error, is amplified and compared to the buck or the
boost sawtooth ramp. Depending on which of the two ramps the gMC amplified output crosses, the device
acitvates either the buck MOSFETs or the boost MOSFETs. When the input voltage is close to the output
voltage, one boost cycle always follows a buck cycle. In this condition, no more than three cycles in a row of the
same mode are allowed. This control method in the buck-boost region ensures a robust control and the highest
efficiency.
8.4.3 Power-Save Mode
The PS/SYNC pin can be used to select different operation modes. Power save mode improves efficiency at
light load. To enable power save mode, PS/SYNC must be set low. The device enters power save mode when
the average inductor current falls to a level lower than approximately 100 mA. In that situation, the converter
operates with reduced switching frequency and with a minimum quiescent current to maintain high efficiency.
During the power save mode operation, the output voltage is monitored with a comparator by the threshold
comparator low and comparator high. When the device enters power save mode, the converter stops operating
and the output voltage drops. The slope of the output voltage depends on the load and the value of output
capacitance. As the output voltage falls below the comparator low threshold set to 2.5% typical above the output
voltage, the device ramps up the output voltage again, by starting operation using a programmed average
inductor current higher than required by the current load condition. Operation can last for one or several pulses.
The converter continues these pulses until the comparator high threshold, set to typically 3.5% above the
nominal output voltage, is reached and the average inductor current gets lower than about 100 mA. When the
load increases above the minimum forced inductor current of about 100 mA, the device automatically switches to
PWM mode.
The power save mode can be disabled by programming the PS/SYNC high.
Heavy Load Transient Step
Comp High
3.5 %
3%
2.5 %
Comp Low
VOUT
Absolute voltage drop
with positioning
PFM Mode
at Light Load Current.
PWM Mode .
Figure 8-4. Power-Save Mode Thresholds and Dynamic Voltage Positioning
8.4.4 Synchronization
Connecting a clock signal at PS/SYNC forces the device to synchronize to the connected clock frequency.
Synchronization is done by a PLL to lower and higher frequencies compared to the internal clock. The PLL can
also tolerate missing clock pulses without the converter malfunctioning. The PS/SYNC input supports standard
logic thresholds.
8.4.5 Dynamic Voltage Positioning
The output voltage is typically 3% above the nominal output voltage at light-load currents, as the device is
operating in power save mode. This operation mode allows additional headroom for the voltage drop during a
load transient from light load to full load. This additional headroom allows the converter to operate with a small
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output capacitor and maintain a low absolute voltage drop during heavy load transient changes. See Figure 8-4
for detailed operation of the power save mode operation.
8.4.6 Dynamic Current Limit
The dynamic current limit function maintains the output voltage regulation when the power source becomes
weaker. The maximum current allowed through the switch depends on the voltage applied at the input terminal
of the TPS6306x devices. Figure 8-5 shows this dependency, and the ISW vs VIN. The dynamic current limit has
its lowest value when reaching the minimum recommended supply voltage at VIN.
Given the ISW value from Figure 8-5, is then possible to calculate the output current reached in boost mode using
Equation 1 and Equation 2 and in buck mode using Equation 3 and Equation 4.
Duty Cycle Boost
D=
V
-V
IN
OUT
V
OUT
Maximum Output Current Boost
Duty Cycle Buck
D=
(1)
I
=hxI
x (1 - D)
OUT
SW
(2)
V
OUT
V
IN
Maximum Output Current Buck
(3)
I
=I
OUT
SW
(4)
where
•
•
•
η is the estimated converter efficiency (use the number from the efficiency curves or 0.80 as an assumption)
f is the converter switching frequency (typical 2.4 MHz)
L is the selected inductor value
Average Inductance Current (A)
If the die temperature increases above the recommended maximum temperature, the dynamic current limit
becomes active. The current limit is reduced with temperature increasing.
3.2
3
2.8
2.5
2.2
2
1.8
1.5
2
3
4
5
6
7
8
Input Voltage (V)
9
10
11
12
Figure 8-5. Average Inductance Current vs Input Voltage
8.4.7 Device Enable
The device operates when EN is set high. The device enters a shutdown sequence when EN is set to GND.
During the shutdown sequence, the regulator stops switching, all internal control circuitry is switched off, and the
load is disconnected from the input. It is possible for the output voltage to drop below the input voltage during
shutdown. During the start-up sequence, the device limits the duty cycle and the peak current in order to avoid
high peak currents flowing from the input.
12
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
9.1 Application Information
The TPS6306x devices provide a power supply solution for products powered by either three-cell up to six-cell
alkaline, NiCd or NiMH battery, or a one-cell or dual-cell Li-Ion or Li-polymer battery. Output currents can go as
high as 2-A while using a dual-cell Li-Ion or Li-polymer battery, and discharge it down to 5 V or lower.
9.2 Typical Application
L1
1 µH
TPS63060
VIN
2.5 V to 12 V
L1
VIN
VOUT
R1
1 MŸ
EN
FB
VAUX
C1
2 × 10 µF
VOUT
5 V, 800 mA
L2
R2
111 kŸ
C3
0.1 µF
PS/SYNC
R3
1 MŸ
C4
10 pF
PG
GND
C2
3 × 22 µF
PG
PGND
Figure 9-1. 5-V Adjustable Buck-Boost Converter Application
9.2.1 Design Requirements
The design guideline provides a component selection to operate the device within the recommended operating
conditions. Table 9-1 lists the components used in this application.
Table 9-1. Components for Application Characteristic Curves
Description
Manufacturer(1)
TPS63060 and TPS63061
Texas Instruments
L1
1 μH, 3 mm x 3 mm x 1.5 mm
Coilcraft , XFL4020-102
C1
2 × 10 μF 16V, 0805, X5R ceramic
Taiyo Yuden, EMK212BJ
Taiyo Yuden, LMK212BJ
Reference
C2
3 × 22 μF 16V, 0805, X5R ceramic
C3
0.1 μF, X5R ceramic
C4
10 pF, ceramic
R1, R2
Depending on the output voltage at TPS63060 and TPS63061: R1=0, C4 and R2 n.a.
(1)
See Section 12.1
9.2.2 Detailed Design Procedure
The first step is the selection of the output filter components. To simplify this process, use Table 9-2 to compare
inductor and capacitor value combinations.
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9.2.2.1 Step One: Output Filter Design
Table 9-2. Output Capacitor and Inductor Combinations
Output Capacitor Value [µF](2)
Inductor Value [µH](1)
(1)
(2)
(3)
44
66
100
1.0
√
√(3)
1.5
√
√
√
√
Inductor tolerance and current de-rating is anticipated. The effective inductance can vary by 20%
and –30%.
Capacitance tolerance and bias voltage de-rating is anticipated. The effective capacitance can vary
by 20% and –50%.
Typical application. Other check mark indicates recommended filter combinations
9.2.2.2 Step Two: Inductor Selection
The inductor selection is affected by several parameters including inductor ripple current, output voltage ripple,
transition point into power-save mode, and efficiency. See Table 9-3 for typical inductors.
Table 9-3. List of Recommended Inductors
Current Saturation
(ISAT) (A)
Inductor Value (µH)
Component Suplier(1)
Size (L×W×H) (mm)
1
Coilcraft XFL4020-102
4 × 4 × 2.1
5.1
1
TOKO DEM2815 1226AS-H-1R0N
3 × 3.2 × 1.5
2.7
27
1.5
Coilcraft XFL4020-152
4 × 4 × 2.1
4.4
14.4
(1)
DCR (mΩ)
10.8
See Section 12.1
For high efficiencies, the inductor should have a low dc resistance to minimize conduction losses. Especially at
high-switching frequencies the core material has a higher impact on efficiency. When using small chip inductors,
the efficiency is reduced mainly due to higher inductor core losses. This needs to be considered when selecting
the appropriate inductor. The inductor value determines the inductor ripple current. The larger the inductor value,
the smaller the inductor ripple current and the lower the conduction losses of the converter. Conversely, larger
inductor values cause a slower load transient response. To avoid saturation of the inductor, with the chosen
inductance value, the peak current for the inductor in steady state operation can be calculated. Equation 1 and
Equation 5 show how to calculate the peak current IPEAK. Only the equation which defines the switch current in
boost mode is reported because this is providing the highest value of current and represents the critical current
value for selecting the right inductor.
IPEAK =
IOUT
VIN ´ D
+
h ´ (1 - D ) 2 ´ fSW ´ L
(5)
where
•
•
•
•
•
D is the duty cycle during boost mode operation
f SW is the converter switching frequency (typical 2.4 MHz)
L is the selected inductor value
η is the estimated converter efficiency (use the number from the efficiency curves or 0.80 as an assumption)
The calculation must be done for the minimum input voltage which is possible to have in boost mode
Calculating the maximum inductor current using the actual operating conditions gives the minimum saturation
current of the inductor needed. It's recommended to choose an inductor with a saturation current 20% higher
than the value calculated using Equation 5. Possible inductors are listed in Table 9-3.
14
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9.2.2.3 Step Three: Capacitor Selection
9.2.2.3.1 Input Capacitors
To improve transient behavior of the regulator and EMI behavior of the total power supply circuit, this design
suggests a minimum input capacitance of 20 μF. Place a ceramic capacitor placed as close as possible to the
VIN and PGND pins of the device.
9.2.2.3.2 Output Capacitor
For the output capacitor, use of a small ceramic capacitor placed as close as possible to the VOUT and PGND
pins of the device is recommended. If, for any reason, the application requires the use of large capacitors which
can not be placed close to the device, use a smaller ceramic capacitor in parallel to the large capacitor. The
small capacitor should be placed as close as possible to the VOUT and PGND pins of the device. The
recommended typical output capacitor value is 66 µF with a variance as outlined in Table 9-1.
There is also no upper limit for the output capacitance value. Larger capacitors cause lower output voltage ripple
as well as lower output voltage drop during load transients.
When choosing input and output capacitors, it needs to be kept in mind, that the value of capacitance
experiences significant losses from their rated value depending on the operating temperature and the operating
DC voltage. It is not uncommon for a small surface mount ceramic capacitor to lose 50% and more of its rated
capacitance. For this reason, it is important to use a larger value of capacitance or a capacitor with higher
voltage rating in order to ensure the required capacitance at the full operating voltage.
9.2.2.3.3 Bypass Capacitor
To make sure that the internal control circuits are supplied with a stable low noise supply voltage, a capacitor is
connected between VAUX and GND. Using a ceramic capacitor with a value of 0.1 μF is recommended. The
capacitor needs to be placed close to the VAUX pin. The value of this capacitor should not be higher than
0.22μF.
9.2.2.4 Step Four: Setting the Output Voltage
When the adjustable output voltage version TPS63060 is used, the output voltage is set by the external resistor
divider. The resistor divider must be connected between VOUT, FB and GND. When the output voltage is
regulated properly, the typical value of the voltage at the FB pin is 500mV. The maximum recommended value
for the output voltage is 8V. The current through the resistive divider should be about 100 times greater than the
current into the FB pin. The typical current into the FB pin is 0.01 μA, and the voltage across the resistor
between FB and GND, R2, is typically 500 mV. Based on these two values, the recommended value for R2
should be lower than 500 kΩ, in order to set the divider current at 3 μA or higher. It is recommended to keep the
value for this resistor in the range of 200 kΩ. From that, the value of the resistor connected between the VOUT
pin and the FB pin, (R1) depending on the needed output voltage can be calculated using Equation 6.
æV
ö
R1 = R2 × ç OUT - 1÷
è VFB
ø
(6)
Place a small capacitor (C4, 10 pF) in parallel with R2 when using the power save mode and the adjustable
version, to provide filtering and improve the efficiency at light load.
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9.2.3 Application Curves
100
100
90
90
80
80
VIN = 7.2 V
VOUT = 2.5 V
60
VIN = 4.8 V
VOUT = 8 V
50
40
30
70
Efficiency (%)
Efficiency (%)
70
VIN = 7.2 V
VOUT = 8 V
VIN = 7.2 V
VOUT = 2.5 V
60
50
20
10
0.01
VIN = 7.2 V
VOUT = 2.5 V
30
10
0.001
0.1
1
0
0.0001
10
0.001
Output Current (A)
TPS63060
Power Save Enabled
TPS63060
0.1
1
100
100
VIN = 4.8 V
VIN = 7.2 V
90
80
80
70
70
60
50
40
60
50
40
30
30
20
20
10
10
0
0.0001
0.001
0.01
0.1
1
10
0
0.0001
VIN = 4.8 V
VIN = 7.2 V
0.001
Output Current (A)
TPS63061
10
Power Save Disabled
Figure 9-3. Efficiency vs. Output Current
Efficiency (%)
Efficiency (%)
0.01
Output Current (A)
Figure 9-2. Efficiency vs. Output Current
90
0.01
0.1
1
10
Output Current (A)
Power Save Disabled
Figure 9-4. Efficiency vs. Output Current
16
VIN = 4.8 V
VOUT = 8 V
VIN = 4.8 V
VOUT = 2.5 V
40
20
0
0.0001
VIN = 7.2 V
VOUT = 8 V
TPS63061
Power Save Enabled
Figure 9-5. Efficiency vs. Output Current
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100
100
90
90
80
80
70
70
Efficiency (%)
Efficiency (%)
www.ti.com
60
50
40
0.01
0.50
1
1.3
20
10
0
2.5
4.5
6.5
8.5
10.5
0.01
0.50
1
1.3
50
40
30
IOUT (A)
30
IOUT (A)
60
20
10
0
2.5
12.5
4.5
TPS63060
Power Save Enabled
100
100
90
90
80
80
70
70
Efficiency (%)
Efficiency (%)
12.5
Power Save Disabled
Figure 9-7. Efficiency vs. Input Voltage
Figure 9-6. Efficiency vs. Input Voltage
60
50
40
IOUT (A)
30
10
4.5
6.5
8.5
10.5
60
50
40
IOUT (A)
30
0.01
0.50
1
1.3
20
20
10
12.5
0.01
0.50
1
1.3
0
2.5
4.5
Input Voltage (V)
TPS63060
10.5
VOUT = 2.5 V
VOUT = 2.5 V
0
2.5
8.5
Input Voltage (V)
Input Voltage (V)
TPS63060
6.5
6.5
8.5
10.5
12.5
Input Voltage (V)
Power Save Enabled
TPS63060
VOUT = 8 V
Power Save Disabled
VOUT = 8 V
Figure 9-8. Efficiency vs. Input Voltage
Figure 9-9. Efficiency vs. Input Voltage
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100
100
95
95
90
90
85
85
Efficiency (%)
Efficiency (%)
SLVSA92C – NOVEMBER 2011 – REVISED SEPTEMBER 2020
80
75
70
IOUT (A)
65
55
50
2.5
4.5
6.5
8.5
10.5
75
70
IOUT (A)
65
0.01
0.50
1
1.3
60
80
60
55
0.01
0.50
1
1.3
50
2.5
12.5
4.5
Input Voltage (V)
TPS63061
Power Save Enabled
TPS63061
10.5
Power Save Disabled
Figure 9-10. Efficiency vs. Input Voltage
Figure 9-11. Efficiency vs. Input Voltage
2.8
5.3
PWM
PFM
PWM
PFM
5.25
2.7
Output Voltage (V)
5.2
2.65
2.6
2.55
5.15
5.1
5.05
2.5
5
2.45
4.95
2.4
0.0001
12.5
VOUT = 5 V
2.75
Output Voltage (V)
8.5
Input Voltage (V)
VOUT = 5 V
0.001
0.01
0.1
1
10
4.9
0.0001
0.001
Output Current (A)
0.01
0.1
1
10
Output Current (A)
TPS63060
Power Save Disabled
VOUT = 2.5 V
VIN = 7.2 V
TPS63061
VIN = 7.2 V
Figure 9-12. Output Voltage vs Output Current
18
6.5
Figure 9-13. Output Voltage vs Output Current
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8.4
Vin=4.5V, Iload=600mA to 1A
PWM
PFM
8.35
Vout 200mV/div
Offset=5V
Output Voltage (V)
8.3
8.25
Iout 200mA/div
Offset=600mA
8.2
8.15
8.1
8.05
8
7.95
IL 1A/div
7.9
0.0001
0.001
0.01
0.1
1
10
TPS63061, Vo=5V
Output Current (A)
100us/div
Figure 9-15. Load Transient Response
TPS63060
VOUT = 8 V
VIN = 7.2 V
Figure 9-14. Output Voltage vs Output Current
Vin=8V, Iload=600mA to 1A
Vin=4.5V to 5.5V, Iout=500mA
Vout 200mV/div
Offset=5V
Input Voltage
500mV/div, Offset=4.5V
Iout 200mA/div
Offset=600mA
Output Voltage
50mV/div, Offset=5V
IL 1A/div
TPS63061, Vo=5V
TPS63061, Vo=5V
200us/div
Figure 9-16. Load Transient Response
Enable 5V/div
200us/div
Figure 9-17. Line Transient Response
Enable 5V/div
PG 5V/div
PG 5V/div
Output Voltage 2V/div
Output Voltage 2V/div
Inductor Current 1A/div
Inductor Current 1A/div
TPS63061, Vo=5V
100us/div
Vin=4.5V, Io=1A
Figure 9-18. Startup After Enable
TPS63061, Vo=5V
100us/div
Vin=8V, Io=2A
Figure 9-19. Startup After Enable
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Vin=5V,
Vin=12V,
Iload=600mA to 1A
Iload=600mA to 1A
Vout 200mV/div
Offset=8V
Vout 200mV/div
Offset=8V
Vout 200mA/div
Offset=600mA
Iout 200mA/div
Offset=600mA
IL 1A/div
TPS63060, Vo=8V
IL 1A/div
200us/div
TPS63060, Vo=8V
Figure 9-20. Load Transient
200us/div
Figure 9-21. Load Transient
Vin=8V to 8.6V, Iout=500mA
Enable
5V/div
PG 5V/div
Input Voltage
200mV/div, offset=8V
Output Voltage 5V/div
Output
Voltage
50mV/div, offset=8V
TPS63060 Vo=8V
Inductor Current 1A/div
TPS63060, Vo=8V
200us/div
Figure 9-22. Line Transient
100us/div
Vin=5V, Io=1A
Figure 9-23. Startup After Enable
Enable 5V/div
PG 5V/div
Output Voltage 5V/div
Inductor Current 1A/div
TPS63060, Vo=8V
100us/div
Vin=12V, Io=1A
Figure 9-24. Startup After Enable
10 Power Supply Recommendations
The TPS6306x device family has no special requirements for its input power supply. The input supply output
current must be rated according to the supply voltage, output voltage and output current of the TPS6306x.
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11 Layout
11.1 Layout Guidelines
For all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the
device. Use a common ground node for power ground and a different one for control ground to minimize the
effects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the device.
The feedback divider should be placed as close as possible to the control ground pin of the device. To lay out
the control ground, short traces are recommended as well, separation from the power ground traces. This avoids
ground shift problems, which can occur due to superimposition of power ground current and control ground
current.
11.2 Layout Example
L
GND
COUT
COUT
COUT
CIN
CIN
GND
VIN
R2
GND
C1
C2
PS
/S E
YN N
PGC
C3
R1
Figure 11-1. TPS6306x Layout
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Development Support
•
•
•
TPS63060EVM-619 2.25-A, Buck-Boost Converter Evaluation Module (click here)
TPS63060EVM-619 Gerber Files (SLVC409)
TPS63060 PSpice Transient Model (SLVM477)
12.2 Documentation Support
12.2.1 Related Documentation
For related documentation see the following:
•
•
•
Design Calculations for Buck-Boost Converters (SLVA535)
Extending the Soft-Start Time in the TPS63010 Buck-Boost Converter (SLVA553)
Different Methods to Drive LEDs Using TPS63xxx Buck-Boost Converters (SLVA419)
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.4 Community Resources
12.5 Trademarks
Buck-Boost Overlap Control™ is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
22
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPS63060DSCR
ACTIVE
WSON
DSC
10
3000
RoHS & Green NIPDAU | NIPDAUAG
Level-2-260C-1 YEAR
-40 to 85
QUJ
TPS63060DSCT
ACTIVE
WSON
DSC
10
250
RoHS & Green NIPDAU | NIPDAUAG
Level-2-260C-1 YEAR
-40 to 85
QUJ
TPS63061DSCR
ACTIVE
WSON
DSC
10
3000
RoHS & Green NIPDAU | NIPDAUAG
Level-2-260C-1 YEAR
-40 to 85
QUK
TPS63061DSCT
ACTIVE
WSON
DSC
10
250
RoHS & Green NIPDAU | NIPDAUAG
Level-2-260C-1 YEAR
-40 to 85
QUK
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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