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TPS63700
SLVS530C – SEPTEMBER 2005 – REVISED JUNE 2013
DC-DC INVERTER
Check for Samples: TPS63700
FEATURES
1
•
•
•
•
•
•
2
•
•
•
•
Adjustable Output Voltage Down to –15 V
2.7-V to 5.5-V Input Voltage Range
Up to 360-mA Output Current
1000-mA Typical Switch Current Limit
Up to 84% Efficiency
Typical 1.4-MHz Fixed-Frequency PWM
Operation
Thermal Shutdown
Typical –19 V Output Overvoltage Protection
1.5-μA Shutdown Current
Small 3-mm × 3-mm SON-10 Package (DRC)
APPLICATIONS
•
•
•
•
DESCRIPTION
The TPS63700 is an inverting dc-dc converter
generating a negative output voltage down to –15 V
with output currents up to 360-mA, depending on
input-voltage to output-voltage ratio. With a total
efficiency up to 84%, the device is ideal for portable
battery-powered equipment. The input voltage range
of 2.7-V to 5.5-V allows the TPS63700 to be directly
powered from a Li-ion battery, from 3-cell NiMH/NiCd,
from a 3.3-V or 5-V supply rail. The TPS63700 comes
in a small 3-mm × 3-mm SON-10 package.
Furthermore, the high switching frequency of typically
1.4 MHz allows the use of small external
components. This, and the small package make a
small power supply solution possible.
The inverter operates with a fixed-frequency PWM
control topology. The device has an internal current
limit, overvoltage protection, and a thermal shutdown
for highest reliability under fault conditions.
Generic Negative Voltage Supply
Small-to-Medium Size OLED Displays
PDAs, Pocket PCs, Smartphones
Bias Supply
TPS63700
C2
VIN
R1
C1
0.1 mF
R2
VREF
0.22 mF
EN
FB
R3
OUT
PS_GND
D1
IN
VIN
2.7 V To 5.5 V
C4
10 mF
GND
VOUT
−5 V
SW
PowerPAD
COMP
L1
4.7 mH
C5
22 mF
C6
4.7 nF
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2013, Texas Instruments Incorporated
TPS63700
SLVS530C – SEPTEMBER 2005 – REVISED JUNE 2013
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
TA
SWITCH CURRENT LIMIT
PACKAGE TYPE
SYMBOL
PART NUMBER (2)
–40°C to 85°C
1000 mA
SON-10
NUB
TPS63700DRC
(1)
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
The DRC package is available taped and reeled. Add an R suffix to the device type (i.e., TPS63700DRCR) to order quantities of 3000
devices per reel. Add a T suffix to the device type (i.e., TPS63700DRCT) to order quantities of 250 devices peer reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted (1)
TPS63700
Input voltage range at VIN (2)
–0.3 V to +6.0 V
Input voltage range at IN (2)
Minimum voltage at VOUT
VIN
(2)
Voltage at EN, FB, COMP, PS
–18 V
(2)
Differential voltage between OUT to VIN
–0.3 V to VIN + 0.3 V
(2)
24 V
Operating virtual junction temperature, TJ
–40°C to 150°C
Storage temperature range, TSTG
–65°C to 150°C
(1)
(2)
Stresses beyond those listed under "absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal, unless otherwise noted.
THERMAL INFORMATION
THERMAL METRIC (1)
TPS63700
DRC 10 PINS
θJA
Junction-to-ambient thermal resistance
41.2
θJC(TOP)
Junction-to-case(top) thermal resistance
62.8
θJB
Junction-to-board thermal resistance
16.6
ψJT
Junction-to-top characterization parameter
1.2
ψJB
Junction-to-board characterization parameter
16.8
θJC(BOTTOM)
Junction-to-case(bottom) thermal resistance
4.1
(1)
UNITS
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
spacer
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
Input voltage range, VI
2.7
5.5
V
Operating free-air temperature range, TA
–40
85
°C
Operating virtual junction temperature range, TJ
–40
125
°C
2
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ELECTRICAL CHARACTERISTICS
–40°C to 85°C, over recommended input voltage range, typical at an ambient temperature of 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DC-DC STAGE
VOUT
Adjustable output
voltage range
VIN
Input voltage range
VREF
–15
–2
V
PIN VIN, IN
2.7
5.5
V
Reference voltage
IREF = 10 μA
1.2
1.225
V
IFB
Negative feedback input bias
current
VFBN = 0.1 VREF
VFB
Negative feedback
regulation voltage
VIN = 2.7 V to 5.5 V
VOUT
DC output accuracy
PWM mode, device switching,
VOVP
Output overvoltage
protection
RDS(ON)
Inverter switch on-resistance
ILIM
Inverter switch current limit
DMAX
Maximum duty cycle
inverting converter
87.5%
DMIN
Minimum duty cycle
inverting converter
12.5%
1.213
2
–0.024
0
nA
0.024
V
±3
%
–19
V
VIN = 3.6 V
440
600
VIN = 5 V
370
500
1000
1140
mA
1500
kHz
2.7 V < VIN < 5.5 V
860
mΩ
CONTROL STAGE
fS
Oscillator frequency
VEN
High level input voltage
VEN
Low level input voltage
IEN
Input current
I(Q)
Quiescent
current
ISD
Shutdown supply current
UVLO
Undervoltage lockout
threshold
1250
1380
1.4
VIN
IN
V
EN = VIN or GND
0.01
0.1
μA
VIN = 3.6 V, IOUT = 0,
EN = VIN, no switching
VOUT = –5 V
330
400
μA
640
750
μA
EN = GND
0.2
1.5
μA
2.35
2.7
V
2.1
Thermal shutdown
Thermal shutdown
hysteresis
V
0.4
Junction temperature decreasing
150
°C
5
°C
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SLVS530C – SEPTEMBER 2005 – REVISED JUNE 2013
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PIN ASSIGNMENTS
DRC PACKAGE PowerPAD™
(TOP VIEW)
COMP
1
10
GND
2
9
FB
VIN
3
8
OUT
EN
4
7
PS_GND
IN
5
6
SW
PowerPAD
VREF
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
NO.
COMP
1
I/O
EN
4
I
Enable pin (EN=GND: disabled; EN=VIN: enabled)
FB
9
I
Feedback pin for the voltage divider
GND
2
IN
5
I
supply voltage for the power switch
OUT
8
I
Output voltage sense input
PS_GND
7
I
Connect to GND for control logic
SW
6
O
Inverter switch output
Compensation pin for control, connect a 4.7nF capacitor between this pin and GND
Ground pin
VIN
3
I
supply voltage input for control logic, connect a RC circuit of 10R and 100nF to filter this supply voltage
VREF
10
O
Reference voltage output. Connect a 220-nF capacitor to ground. Connect the lower resistor of the negative
output voltage divider to this pin.
4
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SLVS530C – SEPTEMBER 2005 – REVISED JUNE 2013
Figure 1. FUNCTIONAL BLOCK DIAGRAM
VIN
VIN
VIN
Temperature
GND
Oscillator
Control
VIN
PS_GND
OUT
Control Logic
EN
−
COMP
FB
+
VREF
Gate
IN
Control
+
−
SW
IN
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TYPICAL CHARACTERISTICS
PARAMETER MEASUREMENT INFORMATION
TPS63700
C2
VIN
R2
VREF
C3
0.22 mF
10 W
C1
0.1 mF
PS_GND
R3
OUT
D1
IN
VIN
C4
10 mF
10 pF
FB
EN
SW
R4
100 kW
VOUT, −5 V
SL02/SL03
GND
PowerPAD
COMP
C5
4x4.7 mF
L1
C6
4.7 nF
Table 1. List of Components
REFERENCE
C1, C2, C3, C4,
C5
4 × 4.7 μF X7R/X5R ceramic
D1
SL03/SL02 Vishay
L1
6
DESCRIPTION
X7R/X5R ceramic
–5V: TDK VLF4012 4R7, TDK SLF6025-4R7, Coilcraft LPS4018-472,
–12V: Sumida CDRH5D18 10 μH
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Table 2. Table of Graphs
GRAPH
DESCRIPTION
Figure 2
Maximum output current versus input voltage, VOUT = –5 V, –12 V, –15 V
Figure 3
Efficiency versus output current, VOUT = –5 V
Figure 4
Efficiency versus output current, VOUT = –12 V
Figure 5
Efficiency versus output current, VOUT = –15V
Figure 6
Efficiency versus input voltage, VOUT = –5 V
Figure 7
Efficiency versus input voltage, VOUT = –12 V
Figure 8
Output voltage versus output current, VOUT = –5 V
Figure 9
Output voltage versus output current, VOUT = –12 V
Figure 10
Output voltage in discontinuous conduction mode, VIN= 3.6 V, VOUT = –5 V
Figure 11
Output voltage in continuous conduction mode, VIN= 3.6 V, VOUT = –5 V
Figure 12
Load transient response, VIN= 3.6 V, VOUT = –5 V, 45 to 150 mA
Figure 13
Line transient response, VIN= 3.6 V to 4.2 V, VOUT = –5 V
Figure 14
Start-up after enable,VI = 3.6 V, VOUT = –5 V
PERFORMANCE GRAPHS
EFFICIENCY
vs
OUTPUT CURRENT,
VOUT –5V
400
90
350
80
VIN = 3.6 V
VO = −5 V
VIN = 3.3 V
70
300
VIN = 5 V
VIN = 4.2 V
60
250
Efficiency %
Maximum Output Current − mA
MAXIMUM OUTPUT CURRENT
vs
INPUT VOLTAGE
VO = −12 V
200
VO = −15 V
150
50
40
30
100
20
50
10
VOUT = −5 V
0
2.5
0
3
3.5
4
4.5
5
5.5
0
100
200
300
400
IO − Output Current − mA
VI − Input Voltage − V
Figure 2.
Figure 3.
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PERFORMANCE GRAPHS (continued)
EFFICIENCY
vs
OUTPUT CURRENT,
VOUT –12 V
EFFICIENCY
vs
OUTPUT CURRENT,
VOUT –15 V
90
90
VIN = 5 V
80
80
VIN = 4.2 V
70
VIN = 3.6 V
VIN = 3.3 V
70
Efficiency %
60
Efficiency %
VIN = 5 V
50
40
VIN = 3.3 V
VIN = 4.2 V
60
50
40
30
30
20
20
10
10
VOUT = −15 V
VOUT = −12 V
0
0
0
100
50
150
200
250
0
20
40
IO − Output Current − mA
Figure 4.
Figure 5.
EFFICIENCY
vs
INPUT VOLTAGE,
VOUT –5 V
90
EFFICIENCY
vs
INPUT VOLTAGE,
VOUT –12 V
90
IOUT = 200 mA
IOUT = 50 mA
80
IOUT = 50 mA
IOUT = 20 mA
70
60
Efficiency %
60
Efficiency %
IOUT = 150 mA
80
IOUT = 20 mA
70
60 80 100 120 140 160 180 200
IO − Output Current − mA
50
40
50
40
30
30
20
20
10
10
VOUT = −12 V
VOUT = −5 V
0
2.5
3
3.5
4
4.5
5
5.5
0
2.5
VIN − Input Voltage − V
Figure 6.
8
3
3.5
4.5
4
VIN − Input Voltage − V
5
5.5
Figure 7.
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PERFORMANCE GRAPHS (continued)
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
−5.1
−12.4
VOUT = −5 V
VOUT = −12 V
VOUT− Output Voltage − V
VOUT− Output Voltage − V
−12.3
VIN = 5 V
−5.05
−5
VIN = 3.6 V
VIN = 3.3 V
−4.95
−12.2
VIN = 5 V
−12.1
VIN = 3.6 V
−12
VIN = 3.3 V
−11.9
−11.8
−4.9
0
−11.7
50
100
150
200
250
300
350
400
0
50
VOUT = –5 V
150
200
250
Figure 9.
OUTPUT VOLTAGE IN
DISCONTINUOUS CONDUCTION MODE
VIN = 3.6 V,
ILOAD = 20 mA
100
IOUT − Output Current − mA
IOUT − Output Current − mA
Figure 8.
OUTPUT VOLTAGE IN
CONTINUOUS CONDUCTION MODE
VIN = 3.6 V,
ILOAD = 95 mA
VOUT 20 mV/div, AC
ICOIL 200 mA/div, DC
VOUT 20 mV/div, AC
ICOIL 200 mA/div, DC
VOUT = –5 V
t - Time - 500 ns/div
t - Time - 500 ns/div
Figure 10.
Figure 11.
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PERFORMANCE GRAPHS (continued)
LOAD TRANSIENT RESPONSE,
–5 V, 45 TO 150 mA
LINE TRANSIENT RESPONSE, –5 V
VIN = 3.6 V to 4.2 V,
ILOAD = 100 mA,
VOUT = –5 V
4.2 V
VIN = 3.6V,
I
= 45mA to 150mA
LOAD
V
OUT
100mV/div, AC
VIN 500 mV/div, DC
3.6 V
VOUT 100 mV/div, DC
V OUT = –5V
I
LOAD
50mA/div, DC
t-Time-2ms/div
t - Time - 2 ms/div
Figure 13.
Figure 12.
START-UP AFTER ENABLE, –5 V
EN 2 V/div, DC
VIN = 3.6 V,
Load = 22 W,
VOUT = –5 V
ICOIL 200 mA/div, DC
VOUT 2 V/div, DC
t - Time - 500 ms/div
Figure 14.
10
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DETAILED DESCRIPTION
The TPS63700 is a dc-dc converter for negative output voltages using buck-boost topology. It operates with an
input voltage range of 2.7 V to 5.5 V and generates a negative output voltage down to –15 V. The output is
controlled by a fixed-frequency, pulse-width-modulated (PWM) regulator. In normal operation mode, the
converter operates at continuous conduction mode (CCM). At light loads it can enter discontinuous conduction
mode (DCM).
Power Conversion
The converter operates in a fixed-frequency, pulse-width-modulated control scheme. So, the on-time of the
switches varies depending on input-to-output voltage ratio and the load. During this on-time, the inductor
connected to the converter is charged with current. In the remaining time, the time period set by the fixed
operating frequency, the inductor discharges into the output capacitor via the rectifier diode. Usually, at higher
loads the inductor current is continuous. During light load, the inductor current of this converter can become
discontinuous. In this case, the control circuit of the controller output automatically takes care of these changing
conditions to always operate with an optimum control setup.
Control
The controller circuit of the converter is based on a fixed-frequency, multiple-feed-forward controller topology.
Input voltage, output voltage, and voltage drop across the switch are monitored and forwarded to the regulator.
Changes in the operating conditions of the converter directly affect the duty cycle.
The error amplifier compares the voltage on FB pin with GND to generate an accurate and stable output voltage.
The error amplifier is internally compensated. At light loads, the converter operates in discontinuous conduction
mode (DCM).
If the load will be further decreased, the energy transmitted to the output capacitor can't be absorbed by the load
and would lead to an increase of the output voltage. In this case, the converter limits the output voltage increase
by skipping switch pulses.
Enable
Applying GND signal at the EN pin disables the converter, where all internal circuitry is turned off. The device
now just consumes low shutdown current flowing into the VIN pin. The output load of the converter is also
disconnected from the battery as described in the following paragraph. Pulling the EN pin to VIN enables the
converter. Internal circuitry, necessary to operate the converter, is then turned on.
Load Disconnect
The device supports complete load disconnection when the converter is disabled. The converter turns off the
internal PMOS switch, thus no DC current path remains between load and input voltage source.
Soft Start
The converter has a soft-start function. When the converter is enabled, the implemented switch current limit
ramps up slowly to its nominal value. Soft start is implemented to limit the input current during start-up to avoid
high peak currents at the battery which could interfere with other systems connected to the same battery.
Without soft start, uncontrolled input peak currents flow to charge up the output capacitors and to supply the load
during start-up. This would cause significant voltage drops across the series resistance of the battery and its
connections.
Output Overvoltage Protection
The converter has an implemented output overvoltage protection. The output voltage is limited to –19 V in case
the feedback connection from the output to the FB pin is open.
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Undervoltage Lockout
An undervoltage lockout prevents the device from starting up and operating if the supply voltage at VIN is lower
than the programmed threshold shown in the electrical characteristics table. The device automatically shuts down
the converter when the supply voltage at VIN falls below this threshold. Nevertheless, parts of the control circuits
remain active, which is different than device shutdown using EN inputs. The undervoltage lockout function is
implemented to prevent device malfunction.
Overtemperature Shutdown
The device automatically shuts down if the implemented internal temperature detector detects a chip temperature
above the programmed threshold shown in the electrical characteristics table. It starts operating again when the
chip temperature decreases. A built-in temperature hysteresis avoids undefined operation caused by ringing from
overtemperature shutdown.
12
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APPLICATION INFORMATION
Design Procedure
The TPS63700 dc-dc converter is intended for systems typically powered by a single-cell Li-ion or Li-polymer
battery with a terminal voltage between 2.7 V up to 4.2 V. Due to the recommended input voltage going up to 5.5
V, the device is also suitable for 3-cell alkaline, NiCd, or NiMH batteries, as well as regulated supply voltages of
3.3 V or 5 V.
TPS63700
R2
150 kW
C2
VIN
VREF
EN
FB
0.22 mF
C1
0.1 mF
10 W
OUT
PS_GND
VIN
D1
10pF
R3
619 kW
SW
IN
2.7 V To 5.5 V
C3
R4
100 kW
VOUT, –5V
SL02
C4
10 mF
GND
PowerPAD
COMP
C5
4x4.7 mF
L1
4.7 mH
C6
4.7 nF
Figure 15. Circuit for –5 Volt Output
TPS63700
C2
VREF
EN
FB
0.22 mF
C1
0.1 mF
10 W
VIN
OUT
PS_GND
VIN
SW
IN
2.7 V To 5.5 V
C4
10 mF
D1
GND
PowerPAD
COMP
SL03
L1
10 mH
R2
121 kW
C3
10pF
R3
1.2 MW
R4
100 kW
VOUT, –12V
C5
4x4.7 mF
C6
4.7 nF
Figure 16. Circuit for –12 Volt Output
Programming the Output Voltage
Converter
The output voltage of the TPS63700 converter can be adjusted with an external resistor divider connected to the
FB pin. The reference point of the feedback divider is the reference voltage VREF with 1.213 V. The typical value
of the voltage at the FB pin is 0 V. The minimum recommended output voltage at the converter is –15 V. The
feedback divider current should be 10 μA. The voltage across R2 is 1.213 V. Based on those values, the
recommended value for R2 should be 120 kΩ to 200 kΩ in order to set the divider current at the required value.
The value of the resistor R3 can then be calculated using Equation 1, depending on the needed output voltage
(VOUT):
ǒ
V
R3 + R2
REF
V
*V
REF
Ǔ
OUT * 1
(1)
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For example, if an output voltage of –5 V is needed and a resistor of 150 kΩ has been chosen for R2, a 619-kΩ
resistor is needed to program the desired output voltage.
Inductor Selection
An inductive converter normally requires two main passive components for storing energy during the conversion.
An inductor and a storage capacitor at the output are required.
The average inductor current depends on the output load, the input voltage (VIN), and the output voltage VOUT.
It can be estimated with Equation 2, which shows the formula for the inverting converter.
V *V
OUT I
I
+ IN
Lavg
OUT
V
0.8
IN
(2)
with:
ILavg= average inductor current
An important parameter for choosing the inductor is the desired current ripple in the inductor.
A ripple current value between 20% and 80% of the average inductor current can be considered as reasonable,
depending on the application requirements. A smaller ripple reduces the losses in the inductor, as well as output
voltage ripple and EMI. But in the same way, the inductor becomes larger and more expensive.
Keeping those parameters in mind, the possible inductor value can be calculated using Equation 3.
V
V
IN
OUT
L+
DI
V
*V
f
L
OUT
IN
ǒ
Ǔ
(3)
with:
ΔIL = peak-to-peak ripple current
f = switching frequency
L = inductor value
With the known inductor current ripple, the peak inductor value can be approximated with Equation 4. The peak
current through the switch and the inductor depends also on the output load, the input voltage (VIN), and the
output voltage (VOUT). To select the right inductor, it is recommended to keep the possible peak inductor current
below the current-limit threshold of the power switch. For example, the current-limit threshold of the TPS63700
switch for the inverting converter is nominally 1000 mA.
V *V
DI
OUT I
I
+ IN
) L
Lmax
OUT
2
V
0.8
IN
(4)
with:
ILMAX = peak inductor current
With Equation 5, the inductor current ripple at a given inductor can be approximated.
V
V
IN
OUT
DI +
L
L
V
*V
f
OUT
IN
ǒ
Ǔ
(5)
Care has to be taken for the possibility that load transients and losses in the circuit can lead to higher currents as
estimated in Equation 4. Also, the losses caused by magnetic hysteresis losses and copper losses are a major
parameter for total circuit efficiency.
14
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The following inductor series from different suppliers have been tested with the TPS63700 converter:
Table 3. List of Inductors
Output Voltage
Vendor
SUGGESTED INDUCTOR
VLF4012 4.7 μH
–5V
TDK
–5V
Coilcraft
–12V
Sumida
CDRH5D18 10 μH
–12V
Coilcraft
MOS6020 10 μH
SLF6025-4.7 μH
LPS4018 4.7 μH
LPS3015 4.7 μH
Capacitor Selection
Input Capacitor
At least a 10-μF ceramic input capacitor is recommended for a good transient behavior of the regulator, and EMI
behavior of the total power supply circuit.
Output Capacitors
One of the major parameters necessary to define the capacitance value of the output capacitor is the maximum
allowed output voltage ripple of the converter. This ripple is determined by two parameters of the capacitor, the
capacitance and the ESR. It is possible to calculate the minimum capacitance needed for the defined ripple,
supposing that the ESR is zero, by using Equation 6 for the inverting converter output capacitor.
I
V
OUT
OUT
C
+
min
f
DV
V
*V
S
OUT
IN
(6)
ǒ
Ǔ
Parameter f is the switching frequency and ΔV is the maximum allowed ripple.
With a chosen ripple voltage in the range of 10 mV, a minimum capacitance of 12 μF is needed. The total ripple
is larger due to the ESR of the output capacitor. This additional component of the ripple can be calculated using
Equation 7 .
DV
+I
R
ESR
OUT
ESR
(7)
An additional ripple of 2 mV is the result of using a typical ceramic capacitor with an ESR in a 10-mΩ range. The
total ripple is the sum of the ripple caused by the capacitance, and the ripple caused by the ESR of the capacitor.
In this example, the total ripple is 12 mV. Additional ripple is caused by load transients. When the load current
increases rapidly, the output capacitor must provide the additional current until the inductor current has been
increased by the control loop by setting a higher on-time at the main switch (duty cycle). The higher duty cycle
results in longer inductor charging periods. But the rate of increase of the inductor current is also limited by the
inductance itself. When the load current decreases rapidly, the output capacitor needs to store the excessive
energy (stored in the inductor) until the regulator has decreased the inductor current by reducing the duty cycle.
The recommendation is to use higher capacitance values, as the previous calculations show.
Stabilizing the Control Loop
Feedback Divider
To speed up the control loop, a feed-forward capacitor of 10 pF is recommended in the feedback divider, parallel
to R3.
To avoid coupling noise into the control loop from the feed-forward capacitor, the feed-forward effect can be
bandwidth-limited by adding series resistor R4. A value in the range of 100 kΩ is suitable. The higher the
resistance, the lower the noise coupled into the control loop system.
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TPS63700
SLVS530C – SEPTEMBER 2005 – REVISED JUNE 2013
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Compensation Capacitor
The control loop of the converter is completely compensated internally. However the internal feed-forward system
requires an external capacitor. A 4.7-nF capacitor at the COMP pin of the converter is recommended.
Layout Considerations
For all switching power supplies the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current paths, and for the power-ground
tracks. The input and output capacitors should be placed as close as possible to the IC. The diode need to be
connected closest to the SW PIN to minimize parasitic inductance. For low noise operation small bypass
capacitors CIN BP and COUT BP in the nF range can be added close to the IC.
The feedback divider should be placed as close as possible to the VREF pin of the IC. Use short traces when
laying out the control ground. Figure 19 shows the layout of the EVM board.
Figure 17. Layout Considerations, Top View
16
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TPS63700
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SLVS530C – SEPTEMBER 2005 – REVISED JUNE 2013
VOUT sense
Figure 18. Layout Considerations, Bottom View
TPS63700
10 W
C4
0.1 mF
VIN
2.7V to 5.5V
VIN
VREF
EN
FB
OUT
PS_GND
10 mF
CIN BP
22 nF
D1
SL03
GND
R2
121 kW
C6
10 pF
R2
1.2 MW
SW
IN
C1
C5
0.22 mF
PowerPAD
COMP
L1
10 mH
COUT BP
10 nF
R4
100 kW
VOUT, -12 V
C8,C9,C10,C11
4x4.7 mF
C6
4.7 nF
Figure 19. Layout Circuit
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TPS63700
SLVS530C – SEPTEMBER 2005 – REVISED JUNE 2013
www.ti.com
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues, such as thermal coupling, airflow, added
heatsinks and convection surfaces, and the presence of heat-generating components affect the powerdissipation limits of a given component.
Three basic approaches for enhancing thermal performance are:
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB
• Introducing airflow to the system
The maximum recommended junction temperature (TJ) of the TPS63700 device is 125°C. The thermal resistance
of the 10-pin SON, 3 × 3-mm package (DRC) is RJA = 48.7°C/W. Specified regulator operation is ensured to a
maximum ambient temperature TA of 85°C. Therefore, the maximum power dissipation is about 821 mW. More
power can be dissipated if the maximum ambient temperature of the application is lower.
T
*T
A
P
+ JMAX
DMAX
R qJA
(8)
18
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TPS63700
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SLVS530C – SEPTEMBER 2005 – REVISED JUNE 2013
Changes from Revision B (November 2007) to Revision C
•
Page
Deleted Dissipation Ratings table and added Thermal Information table. ........................................................................... 2
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19
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPS63700DRCR
ACTIVE
VSON
DRC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
NUB
TPS63700DRCRG4
ACTIVE
VSON
DRC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
NUB
TPS63700DRCT
ACTIVE
VSON
DRC
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
NUB
TPS63700DRCTG4
ACTIVE
VSON
DRC
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
NUB
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Oct-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS63700DRCR
VSON
DRC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
TPS63700DRCR
VSON
DRC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
TPS63700DRCT
VSON
DRC
10
250
180.0
12.5
3.3
3.3
1.1
8.0
12.0
Q2
TPS63700DRCT
VSON
DRC
10
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Oct-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS63700DRCR
VSON
DRC
10
3000
367.0
367.0
35.0
TPS63700DRCR
VSON
DRC
10
3000
338.0
355.0
50.0
TPS63700DRCT
VSON
DRC
10
250
338.0
355.0
50.0
TPS63700DRCT
VSON
DRC
10
250
210.0
185.0
35.0
Pack Materials-Page 2
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