TRS213CDBR

www.ti.com TRS213 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION FEATURES • • • • • • • • • ESD Protection for RS-232 Bus Pins – ±15-kV Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates at 5-V VCC Supply Four Drivers and Five Receivers Operates up to 120 kbit/s Low Supply Current in Shutdown Mode . . . 15 μA Typ External Capacitors . . . 4 × 0.1 F Designed to Be Interchangeable With Industry Standard '213 Devices Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II SLLS807 – JUNE 2007 DB, DW, OR PW PACKAGE (TOP VIEW) DOUT3 DOUT1 DOUT2 RIN2 ROUT2 DIN2 DIN1 ROUT1 RIN1 GND VCC C1+ V+ C1– 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 9 21 10 19 11 18 12 17 13 16 14 15 20 DOUT4 RIN3 ROUT3 SHDN EN RIN4 ROUT4 DIN4 DIN3 ROUT5 RIN5 V– C2– C2+ APPLICATIONS • • • • • • Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-Held Equipment DESCRIPTION/ ORDER INFORMATION The TRS213 device consists of four line drivers, five line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/μs driver output slew rate. The TRS213 has an active-low shutdown (SHDN) and an active-high enable control (EN). In shutdown mode, the charge pumps are turned off, V+ is pulled down to VCC, V– is pulled to GND, and the transmitter outputs are disabled. This reduces supply current typically to 1 μA. Two receivers of the TRS213 are active during shutdown. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated TRS213 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS807 – JUNE 2007 ORDERING INFORMATION TA PACKAGE SOIC – DW 0°C to 70°C SSOP – DB TSSOP – PW SOIC – DW –40°C to 85°C SSOP – DB TSSOP – PW (1) (2) (1) (2) ORDERABLE PART NUMBER Tube of 20 TRS213CDW Reel of 1000 TRS213CDWR Tube of 50 TRS213CDB Reel of 2000 TRS213CDBR Tape and reel TRS213CPWR Tube of 20 TRS213IDW Reel of 1000 TRS213IDWR Tube of 50 TRS213IDB Reel of 2000 TRS213IDBR Tape and reel TRS213IPWR TOP-SIDE MARKING TRS213C TRS213C TRS213C TRS213I TRS213I TRS213I Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. FUNCTION TABLE INPUTS (1) 2 RECEIVER EN DRIVER D1–D4 R1–R3 L L Z Z Z Shutdown L H Z Z Active (1) Shutdown H L All active Z Z Normal operation H H All active Active Active Normal operation SHDN R4–R5 See the VIT+ and VIT– change in the Electrical Characteristics table. Submit Documentation Feedback DEVICE STATUS TRS213 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS807 – JUNE 2007 LOGIC DIAGRAM (POSITIVE LOGIC) 7 2 DIN1 DOUT1 6 3 DIN2 TTL/CMOS Inputs DOUT2 20 RS-232 Outputs 1 DIN3 DOUT3 21 28 DIN4 DOUT4 25 24 SHDN EN 89 ROUT1 RIN1 5 4 ROUT2 TTL/CMOS Outputs RIN2 26 27 ROUT3 RIN3 22 RS-232 Inputs 23 ROUT4 RIN4 19 18 ROUT5 RIN5 Submit Documentation Feedback 3 TRS213 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS807 – JUNE 2007 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage range V+ Positive charge-pump voltage range (2) V– Negative charge-pump voltage range VI Input voltage range VO Output voltage range DOUT Short-circuit duration θJA Package thermal impedance (3) (4) (2) Drivers MIN MAX –0.3 6 V VCC – 0.3 14 V 0.3 –14 V –0.3 V+ + 0.3 ±30 Receivers Drivers Receivers V– – 0.3 V+ + 0.3 –0.3 VCC + 0.3 UNIT V V Continuous DB package 62 DW package 46 C°/W 150 C° 150 C° PW package TJ Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) –65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max),θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) See Figure 4 Supply voltage VIH VIL VI TA (1) Driver high-level input voltage DIN Control high-level input voltage EN, SHDN Driver and control low-level input voltage DIN, EN, SHDN Driver and control input voltage DIN, EN, SHDN Receiver input voltage RIN MIN NOM MAX 4.5 5 5.5 2 TRS213I V V 2.4 0.8 0 5.5 –30 30 0 70 –40 85 TRS213C Operating free-air temperature UNIT V V °C Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V. Electrical Characteristics (1) over operating free-air temperature range (unless otherwise noted) PARAMETER MIN TYP (2) MAX UNIT ICC Supply current No load, See Figure 6 14 20 mA ISHDN Shutdown supply current TA = 25°C, See Figure 1 15 50 μA (1) (2) 4 TEST CONDITIONS Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 5 V, and TA = 25°C. Submit Documentation Feedback TRS213 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS807 – JUNE 2007 DRIVER SECTION Electrical Characteristics (1) over operating free-air temperature range (unless otherwise noted) (see Figure 4) PARAMETER TEST CONDITIONS MIN TYP (2) VOH High-level output voltage DOUT at RL = 3 kΩ to GND 5 9 VOL Low-level output voltage DOUT at RL = 3 kΩ to GND –5 –9 IIH Control high-level input current EN, SHDN = 5 V Driver low-level input current DIN = 0 V Control low-level input current EN, SHDN = 0 V IOS (3) Short-circuit output current VCC = 5.5 V, VO = 0 V ro Output resistance VCC, V+, and V– = 0 V, VO = ±2 V IIL (1) (2) (3) MAX UNIT V V 3 10 –15 –200 –3 –10 ±10 ±60 μA μA mA Ω 300 Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V All typical values are at VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. Switching Characteristics (1) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT Maximum data rate CL = 50 pF to 1000 pF, One DOUT switching, RL = 3 kΩ to 7 kΩ, See Figure 3 tPLH(D) Propagation delay time, low- to high-level output CL = 2500 pF, All drivers loaded, RL = 3 kΩ, See Figure 3 2 μs tPHL(D) Propagation delay time, high- to low-level output CL = 2500 pF, All drivers loaded, RL = 3 kΩ, See Figure 3 2 μs tsk(p) Pulse skew (3) CL = 150 pF to 2500 pF, See Figure 3 RL = 3 kΩ to 7 kΩ, 300 ns SR(tr) Slew rate, transition region (see Figure 2) CL = 50 pF to 1000 pF, VCC = 5 V RL = 3 kΩ to 7 kΩ, (1) (2) (3) 120 3 kbit/s 6 30 V/μs Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 5 V, and TA = 25°C. Pulse skew is defined as (tPLH – tPHL) of each channel of the same device. ESD Protection over operating free-air temperature range (unless otherwise noted) PIN DOUT TEST CONDITIONS Human-Body Model Submit Documentation Feedback TYP UNIT ±15 kV 5 TRS213 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS807 – JUNE 2007 RECEIVER SECTION Electrical Characteristics (1) over operating free-air temperature range (unless otherwise noted) (see Figure 6) PARAMETER TEST CONDITIONS VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOH = 1.6 mA TYP (2) MAX VCC – 0.4 Active mode 1.7 2.4 Shutdown mode (R4–R5) 1.5 2.4 Positive-going input threshold voltage VCC = 5 V, TA = 25°C VIT– Negative-going input threshold voltage VCC = 5 V, TA = 25°C Vhys (3) Input hysteresis (VIT+, VIT–) VCC = 5 V rI Input resistance VCC = 5 V, TA = 25°C Output leakage current EN = 0 V, 0 ≤ ROUT ≤ VCC, R1–R3 Active mode 0.8 1.2 Shutdown mode (R4–R5) 0.6 1.5 3 UNIT V 0.4 VIT+ (1) (2) (3) MIN V V V 0.5 1 V 5 7 kΩ ±0.05 ±10 μA MIN TYP (2) MAX UNIT 0.5 10 4 40 10 Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 5 V, and TA = 25°C. No hysteresis in shudown mode Switching Characteristics (1) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS SHDN = VCC tPLH(R) Propagation delay time, low- to high-level output CL = 150 pF, See Figure 4 tPHL(R) Propagation delay time, high- to low-level output CL = 150 pF, See Figure 4 0.5 ten Output enable time CL = 150 pF, See Figure 5 600 ns tdis Output disable time CL = 150 pF, See Figure 5 200 ns (1) (2) SHDN = 0 V, R4–R5 μs μs Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 5 V, and TA = 25°C. ESD Protection over operating free-air temperature range (unless otherwise noted) PIN RIN 6 TEST CONDITIONS Human-Body Model Submit Documentation Feedback TYP UNIT ±15 kV TRS213 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS807 – JUNE 2007 PARAMETER MEASUREMENT INFORMATION 0.1 mF + – ISHDN 5.5 V 0.1 mF + – VCC V+ C1+ 0.1 mF + – V– 0.1 mF – + C1– C2+ 0.1 mF + – C2– VCC 400 kΩ 5.5 V DOUT DIN D1−D4 RIN ROUT 0-V or 5.5-V Drive 5.5 V 3 kΩ 5.5 V EN 5 kΩ R1−R5 SHDN GND Figure 1. Shutdown Current Test Circuit Submit Documentation Feedback 7 TRS213 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS807 – JUNE 2007 5-V SHDN Input Generator (see Note B) RS-232 Output 3V 1.5 V 1.5 V 0V 50 Ω RL tTHL(D) CL (see Note A) Output tTLH(D) 3V –3 V TEST CIRCUIT SR(tr) = 6V tTHL(D) or tTLH(D) VOH 3V –3 V VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Slew Rate 5-V SHDN 3V Generator (see Note B) RS-232 Output Input 1.5 V 0V 50 Ω RL 1.5 V tPHL(D) CL (see Note A) tPLH(D) VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Driver Pulse Skew and Propagation Delay Times 5-V SHDN 3V Input 1.5 V 1.5 V –3 V Output Generator (see Note B) 50 Ω tPHL(R) tPLH(R) CL (see Note A) 5-V EN VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 4. Receiver Propagation Delay Times 8 Submit Documentation Feedback TRS213 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS807 – JUNE 2007 3V 5-V SHDN VCC S1 GND 1.5 V 0V tPZH (S1 at GND) tPHZ (S1 at GND) RL 3 V or 0 V 1.5 V Input Output Output VOH 3.5 V VOH – 0.1 V CL (see Note A) EN Generator (see Note B) 50 Ω tPZL (S1 at VCC) tPLZ (S1 at VCC) VOL + 0.1 V 0.8 V Output TEST CIRCUIT NOTES: A. B. C. D. VOL VOLTAGE WAVEFORMS CL includes probe and jig capacitance. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. tPLZ and tPHZ are the same as tdis. tPZL and tPZH are the same as ten. Figure 5. Receiver Enable and Disable Times Submit Documentation Feedback 9 TRS213 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION www.ti.com SLLS807 – JUNE 2007 APPLICATION INFORMATION DOUT3 DOUT1 DOUT2 RIN2 1 28 2 27 3 RIN3 5 kΩ 4 26 5 kΩ ROUT2 DOUT4 25 ROUT3 SHDN = 5 V 24 5 EN 23 5V RIN4 5 kΩ 400 kΩ DIN2 6 22 ROUT4 5V 400 kΩ DIN1 ROUT1 RIN1 GND 5V 7 400 kΩ 21 8 9 DIN4 5V 10 5 kΩ 400 kΩ 20 – DIN3 CBYPASS = 0.1 mF + 11 VCC C3(1) = – 0.1 mF 6.3 V + 18 12 13 C1 = 0.1 mF 6.3 V 19 VCC C1+ C4 = 0.1 mF 16 V 5 kΩ V– 14 RIN5 V+ + – ROUT5 C1– C2– 17 – 16 – + C2+ + C2 = 0.1 mF 16 V 15 (1) C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. Figure 6. Typical Operating Circuit and Capacitor Values 10 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TRS213CDBR ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TRS213C TRS213IDB ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 TRS213I TRS213IDBR ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 TRS213I TRS213IDWR ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 TRS213I (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing TRS213CDBR SSOP TRS213IDBR TRS213IDWR SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.5 2.5 12.0 16.0 Q1 DB 28 2000 330.0 16.4 SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 Pack Materials-Page 1 8.2 B0 (mm) PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TRS213CDBR SSOP DB 28 2000 367.0 367.0 38.0 TRS213IDBR SSOP DB 28 2000 367.0 367.0 38.0 TRS213IDWR SOIC DW 28 1000 350.0 350.0 66.0 Pack Materials-Page 2 PACKAGE OUTLINE DB0028A SSOP - 2 mm max height SCALE 1.500 SMALL OUTLINE PACKAGE C 8.2 TYP 7.4 A 0.1 C PIN 1 INDEX AREA SEATING PLANE 26X 0.65 28 1 2X 10.5 9.9 NOTE 3 8.45 14 15 28X B 5.6 5.0 NOTE 4 SEE DETAIL A (0.15) TYP 0.38 0.22 0.15 C A B 2 MAX 0.25 GAGE PLANE 0 -8 0.95 0.55 0.05 MIN DETAIL A A 15 TYPICAL 4214853/B 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-150. www.ti.com EXAMPLE BOARD LAYOUT DB0028A SSOP - 2 mm max height SMALL OUTLINE PACKAGE SYMM 28X (1.85) (R0.05) TYP 1 28X (0.45) 28 26X (0.65) SYMM 15 14 (7) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK OPENING SOLDER MASK OPENING METAL UNDER SOLDER MASK METAL EXPOSED METAL EXPOSED METAL 0.07 MAX ALL AROUND NON-SOLDER MASK DEFINED (PREFERRED) 0.07 MIN ALL AROUND SOLDER MASK DEFINED SOLDER MASK DETAILS 15.000 4214853/B 03/2018 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DB0028A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 28X (1.85) SYMM (R0.05) TYP 1 28X (0.45) 28 26X (0.65) SYMM 14 15 (7) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4214853/B 03/2018 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. 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