Sample &
Buy
Product
Folder
Support &
Community
Tools &
Software
Technical
Documents
TS3A4741, TS3A4742
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
TS3A474x 0.9-Ω Low-Voltage Single-Supply 2-Channel SPST Analog Switches
1 Features
3 Description
•
The TS3A4741 and TS3A4742 are bi-directional, 2channel single-pole/single-throw (SPST) analog
switches with low ON-state resistance (Ron), lowvoltage, that operate from a single 1.6-V to 3.6-V
supply. These devices have fast switching speeds,
handle rail-to-rail analog signals, and consume very
low quiescent power.
1
•
•
•
•
•
•
Low ON-State Resistance (Ron)
– 0.9-Ω Max (3-V Supply)
– 1.5-Ω Max (1.8-V Supply)
0.4-Ω Max Ron Flatness (3-V Supply)
1.6-V to 3.6-V Single-Supply Operation
Available in SOT-23 and VSSOP Packages
High Current-Handling Capacity (100 mA
Continuous)
1.8-V CMOS Logic Compatible (3-V Supply)
Fast Switching: tON = 14 ns, tOFF = 9 ns
The digital logic input is 1.8-V CMOS compatible
when using a single 3-V supply.
The TS3A4741 has two normally open (NO) switches,
and the TS3A4742 has two normally closed (NC)
switches.
2 Applications
•
•
•
•
•
•
•
•
•
Device Information(1)
Power Routing
Battery-Powered Systems
Audio and Video Signal Routing
Low-Voltage Data-Acquisition Systems
Communications Circuits
PCMCIA Cards
Cellular Phones
Modems
Hard Drives
PART NUMBER
TS3A4741
TS3A4742
PACKAGE
BODY SIZE (NOM)
SOT (8)
2.90 mm × 1.63 mm
VSSOP (8)
3.00 mm × 3.00 mm
SOT (8)
2.90 mm × 1.63 mm
VSSOP (8)
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Ron vs VCOM (VCC = 2.7 V)
Ron (Ω)
1.0
0.9
0.8
85C
0.7
0.6
25C
0.5
0.4
0.3
–40C
0.2
0.1
0.0
0.0
0.5
1.0
1.5
VCOM (V)
2.0
2.5
3.0
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
TS3A4741, TS3A4742
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
4
5
7
8
Absolute Maximum Ratings .....................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics (3-V Supply) .....................
Electrical Characteristics (1.8-V Supply) ..................
Typical Characteristics ..............................................
Parameter Measurement Information ................ 11
Detailed Description ............................................ 14
8.1 Overview ................................................................. 14
8.2 Functional Block Diagram ....................................... 14
8.3 Feature Description................................................. 14
8.4 Device Functional Modes........................................ 14
9
Application and Implementation ........................ 15
9.1 Application Information............................................ 15
9.2 Typical Application .................................................. 15
10 Power Supply Recommendations ..................... 17
11 Layout................................................................... 17
11.1 Layout Guidelines ................................................. 17
11.2 Layout Example .................................................... 17
12 Device and Documentation Support ................. 18
12.1
12.2
12.3
12.4
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
13 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
Changes from Revision E (December 2014) to Revision F
Page
•
Changed DCN package to clarify switch configuration. ........................................................................................................ 3
•
Changed the VIN MAX value in the Recommended Operating Conditions table from: 1.8 V to: VCC .................................... 4
Changes from Revision D (June 2014) to Revision E
•
2
Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Submit Documentation Feedback
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
TS3A4741, TS3A4742
www.ti.com
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
5 Pin Configuration and Functions
DGK PACKAGE . . .TS3A4741
(TOP VIEW)
DCN PACKAGE . . .TS3A4741
(TOP VIEW)
DGK PACKAGE . . .TS3A4742
(TOP VIEW)
NO1 1
8
VCC
IN1 1
8
NO1
COM1 2
7
IN1
VCC 2
7
COM1
IN2 3
6
COM2
NO2
3
6
IN2
GND 4
5
NO2
COM2
4
5
GND
DCN PACKAGE . . .TS3A4742
(TOP VIEW)
NC1 1
8
VCC
IN1 1
8
NC1
COM1 2
7
IN1
VCC 2
7
COM1
IN2 3
6
COM2
NC2
3
6
IN2
GND 4
5
NC2
COM2
4
5
GND
Pin Functions
PIN
NAME
TS3A4741
TS3A4742
I/O
DESCRIPTION
MSOP
SOT
MSOP
SOT
COM1
2
7
2
7
I/O
Common
COM2
6
4
6
4
I/O
Common
GND
4
5
4
5
—
Ground
IN1
7
1
7
1
I
Digital control to connect COM to NO or NC
IN2
3
6
3
6
I
Digital control to connect COM to NO or NC
NC1
—
—
1
8
I/O
Normally closed
NC2
—
—
5
3
I/O
Normally closed
NO1
1
8
—
—
I/O
Normally open
NO2
5
3
—
—
I/O
Normally open
VCC
8
2
8
2
I
Power supply
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
Submit Documentation Feedback
3
TS3A4741, TS3A4742
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage reference to GND (2)
–0.3
4
VNO
VCOM
VIN
Analog and digital voltage
–0.3
VCC + 0.3
INO
ICOM
On-state switch current
–100
100
ICC
IGND
Continuous current through VCC or GND
VNO, VCOM = 0 to VCC
Peak current pulsed at 1 ms, 10% duty cycle
TA
Operating temperature
TJ
Junction temperature
Tstg
Storage temperature
(1)
(2)
UNIT
V
mA
±100
COM, VNO, VCOM
±200
–40
85
150
–65
°C
150
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Signals on COM or NO exceeding VCC or GND are clamped by internal diodes. Limit forward diode current to maximum current rating.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±4000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage reference to ground
1.6
3.6
VNO
VCOM
Analog voltage
0
3.6
VIN
Digital Voltage
0
VCC
UNIT
V
6.4 Thermal Information
TS3A474x
THERMAL METRIC (1)
DCN/DGK
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
214.8
RθJC(top)
Junction-to-case (top) thermal resistance
191.0
RθJB
Junction-to-board thermal resistance
113.1
ψJT
Junction-to-top characterization parameter
52.4
ψJB
Junction-to-board characterization parameter
110.2
(1)
4
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Submit Documentation Feedback
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
TS3A4741, TS3A4742
www.ti.com
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
6.5 Electrical Characteristics (3-V Supply) (1) (2)
VCC = 2.7 V to 3.6 V, TA = –40 to 85°C, VIH = 1.4 V, VIL = 0.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP (3)
MAX
0.7
0.9
UNIT
ANALOG SWITCH
VCOM, VNO, VNC
Analog signal range
0
V+
Ron
ON-state resistance
VCC = 2.7 V, ICOM = –100 mA,
VNO, VNC = 1.5 V
25°C
ΔRon
ON-state resistance match between
channels (4)
VCC = 2.7 V, ICOM = –100 mA,
VNO, VNC = 1.5 V
25°C
Ron(flat)
ON-state resistance flatness (5)
VCC = 2.7 V, ICOM = –100 mA,
VNO, VNC = 1 V, 1.5 V, 2 V
25°C
INO(OFF)
NO
OFF leakage current (6)
VCC = 3.6 V, VCOM = 0.3 V, 3 V,
VNO = 3 V, 0.3 V
25°C
–2
Full
–18
ICOM(OFF)
COM
OFF leakage current (6)
VCC = 3.6 V, VCOM = 0.3 V, 3 V,
VNO = 3 V, 0.3 V
25°C
–2
Full
–18
ICOM(ON)
COM
ON leakage current (6)
VCC = 3.6 V, VCOM = 0.3 V, 3 V,
VNO = 0.3 V, 3 V, or floating
25°C
–2.5
Full
–5
tON
Turn-on time
VNO, VNC = 1.5 V, RL = 50 Ω,
CL = 35 pF, See Figure 14
25°C
tOFF
Turn-off time
VNO, VNC = 1.5 V, RL = 50 Ω,
CL = 35 pF, See Figure 14
25°C
QC
Charge injection
VGEN = 0, RGEN = 0, CL = 1 nF,
See Figure 15
25°C
3
CNO(OFF)
NO OFF capacitance
f = 1 MHz, See Figure 16
25°C
23
CCOM(OFF)
COM OFF capacitance
f = 1 MHz, See Figure 16
25°C
20
CCOM(ON)
COM ON capacitance
f = 1 MHz, See Figure 16
25°C
43
BW
Bandwidth
RL = 50 Ω, Switch ON
25°C
125
Full
1.1
0.03
Full
0.05
0.15
0.23
Full
0.4
0.5
1
2
18
1
2
18
0.01
2.5
5
V
Ω
Ω
Ω
nA
nA
nA
DYNAMIC
OISO
XTALK
THD
RL = 50 Ω, CL = 5 pF,
See Figure 17
OFF isolation (7)
RL = 50 Ω, CL = 5 pF,
See Figure 17
Crosstalk
f = 20 Hz to 20 kHz,
VCOM = 2 VP-P
Total harmonic distortion
f = 10
MHz
f=1
MHz
f = 10
MHz
f=1
MHz
RL = 32
Ω
RL = 600
Ω
5
Full
14
15
4
Full
9
10
ns
ns
pC
pF
MHz
–40
25°C
dB
–62
–73
25°C
dB
–95
0.04%
25°C
0.003%
DIGITAL CONTROL INPUTS (IN1, IN2)
VIH
Input logic high
Full
VIL
Input logic low
Full
IIN
Input leakage current
VI = 0 or VCC
1.4
0.5
25°C
Full
0.5
–20
1
20
V
nA
SUPPLY
(1)
(2)
(3)
(4)
(5)
(6)
(7)
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
Parts are tested at 85°C and specified by design and correlation over the full temperature range.
Typical values are at VCC = 3 V, TA = 25°C.
ΔRon = Ron(max) – Ron(min)
Flatness is defined as the difference between the maximum and minimum value of ron as measured over the specified analog signal
ranges.
Leakage parameters are 100% tested at the maximum-rated hot operating temperature and specified by correlation at TA = 25°C.
OFF isolation = 20log10 (VCOM/VNO), VCOM = output, VNO = input to OFF switch
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
Submit Documentation Feedback
5
TS3A4741, TS3A4742
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
www.ti.com
Electrical Characteristics (3-V Supply)(1)(2) (continued)
VCC = 2.7 V to 3.6 V, TA = –40 to 85°C, VIH = 1.4 V, VIL = 0.5 V (unless otherwise noted)
PARAMETER
VCC
ICC
6
TEST CONDITIONS
TA
Power-supply range
Positive-supply current
Submit Documentation Feedback
MIN
2.7
VCC = 3.6 V, VIN = 0 or VCC
TYP (3)
MAX
3.6
25°C
0.075
Full
0.75
UNIT
V
μA
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
TS3A4741, TS3A4742
www.ti.com
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
6.6 Electrical Characteristics (1.8-V Supply) (1)
(2)
VCC = 1.65 V to 1.95 V, TA = –40 to 85°C, VIH = 1 V, VIL = 0.4 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP (2)
MAX UNIT
ANALOG SWITCH
VCOM, VNO,
VNC
Analog signal range
Ron
ON-state resistance
VCC = 1.8 V, ICOM = –10 mA,
VNO, VNC = 0.9 V
25 °C
ΔRon
ON-state resistance match between
channels (1)
VCC = 1.8 V, ICOM = –10 mA,
VNO, VNC = 0.9 V
25 °C
Ron(flat)
ON-state resistance flatness (3)
VCC = 1.8 V, ICOM = –10 mA,
0 ≤ VNO, VNC ≤ VCC
25 °C
INO(OFF)
NO
OFF leakage current (4)
VCC = 1.95 V, VCOM = 0.15 V, 1.65 V,
VNO = 1.8 V, 0.15 V
25 °C
–1
Full
–10
ICOM(OFF)
COM
OFF leakage current (4)
VCC = 1.95 V, VCOM = 0.15 V, 1.65 V,
VNO, = 1.8 V, 0.15 V
25 °C
–1
Full
–10
ICOM(ON)
COM
ON leakage current (4)
VCC = 1.95 V, VCOM = 0.15 V, 1.65 V,
VNO = 0.15 V, 1.65 V, or floating
25 °C
–1
Full
–3
tON
Turn-on time
VNO, VNC = 1.5 V, RL = 50 Ω,
CL = 35 pF, See Figure 14
25 °C
tOFF
Turn-off time
VNO, VNC = 1.5 V, RL = 50 Ω,
CL = 35 pF, See Figure 14
25 °C
QC
Charge injection
VGEN = 0, RGEN = 0, CL = 1 nF,
See Figure 15
25 °C
3.2
CNO(OFF)
NO OFF capacitance
f = 1 MHz, See Figure 16
25 °C
23
CCOM(OFF)
COM OFF capacitance
f = 1 MHz, See Figure 16
25 °C
20
CCOM(ON)
COM ON capacitance
f = 1 MHz, See Figure 16
25 °C
43
BW
Bandwidth
RL = 50 Ω, Switch ON
25 °C
123
0
V+
1
Full
V
1.5
Ω
2
0.09
Full
0.15
Ω
0.25
0.7
Full
0.9
Ω
1.5
0.5
1
10
0.5
1
10
0.01
1
3
nA
nA
nA
DYNAMIC
OISO
OFF isolation (5)
RL = 50 Ω, CL = 5 pF,
See Figure 17
f = 10 MHz
XTALK
Crosstalk
RL = 50 Ω, CL = 5 pF,
See Figure 17
f = 10 MHz
THD
Total harmonic distortion
f = 20 Hz to 20 kHz,
VCOM = 2 VP-P
RL = 32 Ω
f = 100 MHz
f = 100 MHz
RL = 600 Ω
6
Full
18
ns
20
5
Full
10
ns
12
pC
pF
MHz
–61
25 °C
dB
–36
–95
25 °C
dB
–73
0.14%
25 °C
0.013%
DIGITAL CONTROL INPUTS (IN1, IN2)
VIH
Input logic high
Full
VIL
Input logic low
Full
IIN
Input leakage current
VI = 0 or VCC
1
25 °C
Full
V
0.4
0.1
5
–10
10
1.65
1.95
nA
SUPPLY
VCC
ICC
(1)
(2)
(3)
(4)
(5)
Power-supply range
Positive-supply current
VI = 0 or VCC
25 °C
0.05
Full
0.5
V
μA
ΔRon = Ron(max) – Ron(min)
Typical values are at TA = 25°C.
Flatness is defined as the difference between the maximum and minimum value of ron as measured over the specified analog signal
ranges.
Leakage parameters are 100% tested at the maximum-rated hot operating temperature and specified by correlation at TA = 25°C.
OFF isolation = 20log10 (VCOM/VNO), VCOM = output, VNO = input to OFF switch
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
Submit Documentation Feedback
7
TS3A4741, TS3A4742
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
www.ti.com
6.7 Typical Characteristics
1.6
1.6
1.4
1.4
1.2
1.2
VCC = 1.8 V
1.0
1.0
Ron (Ω)
Ron W
85C
25C
0.8
0.6
VCC = 2.7 V
0.8
0.4
0.4
0.2
0.2
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
–40C
0.6
0.0
0.0
0.5
1.0
VCOM (V)
85C
NO/NC (OFF)
0.7
0.6
25C
0.5
0.4
0.3
–40C
INC/ICOM (pA)
Ron (Ω)
Figure 2. Ron vs VCOM (VCC = 1.8 V)
1000.00
0.2
0.1
0.0
0.0
100.00
1.00
0.5
1.0
1.5
VCOM (V)
2.0
2.5
−40°C
3.0
°C
25 85
TA (°C)
8
30
7
VCC = 3 V
6
tON/tOFF (ns)
25
QC (pC)
°C
Figure 4. ION and IOFF vs Temperature
(VCC = 3.6 V)
35
20
15
VCC = 1.8 V
10
5
tON
4
3
tOFF
2
5
0
0.0
COM (ON)
10.00
Figure 3. Ron vs VCOM (VCC = 2.7 V)
1
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
1.6
2.0
VCOM (V)
Submit Documentation Feedback
2.4
2.8
3.2
3.6
4.0
VCC (V)
Figure 5. QC vs VCOM
8
2.0
VCOM (V)
Figure 1. Ron vs VCOM
1.0
0.9
0.8
1.5
Figure 6. tON and tOFF vs Supply Voltage
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
TS3A4741, TS3A4742
www.ti.com
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
7
1000.000
6
100.000
5
10.000
ICC (nA)
tON/tOFF (ns)
Typical Characteristics (continued)
4
TON = 1.8 V
TOFF = 1.8 V
TON = 3 V
TOFF = 3 V
3
2
85C
25C
1.000
–40C
0.100
0.010
1
0.001
0.0
0
−40°C
°C
°C 25 85
TA (°C)
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VCC (V)
Figure 8. ICC vs VCC
Figure 7. tON and tOFF vs Temperature
0
0
−2
−10
−20
Attenuation (dB)
Gain (dB)
−4
−6
−8
−10
−12
−40
−50
−60
−70
−80
−14
0.1
−30
−90
1
10
Frequency (MHz)
100
1000
0.1
0.042
0.042
0.041
0.041
0.040
0.040
0.039
0.038
0.037
0.037
100
1K
Frequency (kHz)
10K
100
1000
0.039
0.038
0.036
0
10
10
Frequency (MHz)
Figure 10. OFF Isolation vs Frequency
(VCC = 3 V)
THD (%)
THD (%)
Figure 9. Gain vs Frequency (VCC = 3 V)
1
100K
Figure 11. Total Harmonic Distortion vs Frequency
(RL = 32 Ω)
0.036
0
10
100
1K
Frequency (kHz)
10K
100K
Figure 12. Total Harmonic Distortion vs Frequency
(RL = 600 Ω)
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
Submit Documentation Feedback
9
TS3A4741, TS3A4742
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
www.ti.com
Typical Characteristics (continued)
0
−20
Crosstalk (dB)
−40
−60
−80
−100
−120
0
0.1
10
Submit Documentation Feedback
1
10
100
Frequency (MHz)
Figure 13. Crosstalk vs Frequency
(VCC = 3 V)
1000
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
TS3A4741, TS3A4742
www.ti.com
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
7 Parameter Measurement Information
VCC
VCC
IN
NO
VIH + 0.5 V
VNO
IN
VNO
VCOM
35 pF
a
50 W
50%
50%
0
VCOM
COM
GND
tR < 5 ns
tF < 5 ns
90%
90%
0
tON
tOFF
Figure 14. Switching Times
VCC
VCC
RGEN
NO
VGEN
VI
IN
a
VI
VO
COM
GND
CL
1000 pF
VCC
0
VO
DVO
Figure 15. Charge Injection (QC)
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
Submit Documentation Feedback
11
TS3A4741, TS3A4742
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
www.ti.com
Parameter Measurement Information (continued)
VCC
VCC
NO
1-MHz
Capacitance
Analyzer
As
Required
IN
COM
GND
Figure 16. NO and COM Capacitance
VCC
0.1 mF
Network
Analyzer
VCC
VI
50 W
50 W
Meas
Ref
NO
(1)
VO
VCC
IN
COM
GND
50 W 50 W
OFF isolation = 20 log VO/VI
Measurements are standardized against
short at socket terminals. OFF isolation is
measured between COM and OFF terminals
on each switch. Bandwidth is measured between
COM and ON terminals on each switch. Signal (1)Add 50-W termination for
direction through switch is reversed; worst
OFF isolation
values are recorded.
Figure 17. OFF Isolation, Bandwidth, and Crosstalk
12
Submit Documentation Feedback
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
TS3A4741, TS3A4742
www.ti.com
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
Parameter Measurement Information (continued)
VI = Vcc/2
fSOURCE = 20 Hz to 20 kHz
Channel ON: COM to NO
VSOURCE = Vcc P-P
CL = 50 pF
RL = 600 W
Vcc/2
Audio Analyzer
NO
Signal
Source
600 W
COM
CL(A)
IN
600 W
-Vcc/2
A.
CL includes probe and jig capacitance.
Figure 18. Total Harmonic Distortion (THD)
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
Submit Documentation Feedback
13
TS3A4741, TS3A4742
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
www.ti.com
8 Detailed Description
8.1 Overview
The TS3A4741 and TS3A4742 are bi-directional, 2-channel single-pole/single-throw (SPST) analog switches with
low ON-state resistance (Ron), low-voltage, that operate from a single 1.6-V to 3.6-V supply. These devices have
fast switching speeds, handle rail-to-rail analog signals, and consume very low quiescent power.
The digital logic input is 1.8-V CMOS compatible when using a single 3-V supply.
The TS3A4741 has two normally open (NO) switches, and the TS3A4742 has two normally closed (NC)
switches.
8.2 Functional Block Diagram
SPST
NO1
COM1
IN1
SPST
NO2
COM2
IN2
8.3 Feature Description
The TS3A4741 and TS3A4742 has a low on resistance and high current handling capability up to 100 mA
continuous current so it can be used for power sequencing and routing with minimal losses. The switch is also bidirectional with fast switching times in the 10 ns range which allows data acquisition and communication between
multiple devices.
With a 3-V supply these devices are compatible with standard 1.8-V CMOS logic.
8.4 Device Functional Modes
Table 1. Function Table
14
IN
NO to COM, COM to NO
(TS3A4741)
L
OFF
ON
H
ON
OFF
Submit Documentation Feedback
NC to COM, COM to NC
(TS3A4742)
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
TS3A4741, TS3A4742
www.ti.com
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
Analog signals that range over the entire supply voltage (VCC to GND) of the TS3A4741 and TS3A4742 can be
passed with very little change in Ron (see Typical Characteristics). The switches are bidirectional, so the NO, NC,
and COM pins can be used as either inputs or outputs.
9.2 Typical Application
3.3V
3.3V
0.1 PF
0.1 PF
System
Controller
VCC
SPST switch
NO1
IN1
IN2
COM1
NO2
COM2
GND
Data
0.1 PF
Device 1
3.3V
0.1 PF
Device 2
Figure 19. Typical Application Schematic
9.2.1 Design Requirements
Ensure that all of the signals passing through the switch are within the specified ranges to ensure proper
performance.
9.2.2 Detailed Design Procedure
The TS3A474x can be properly operated without any external components. However, TI recommends that
unused pins should be connected to ground through a 50-Ω resistor to prevent signal reflections back into the
device. TI also recommends that the digital control pins (INx) be pulled up to VCC or down to GND to avoid
undesired switch positions that could result from the floating pin.
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
Submit Documentation Feedback
15
TS3A4741, TS3A4742
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
www.ti.com
Typical Application (continued)
9.2.3 Application Curve
Ron (Ω)
1.0
0.9
0.8
85C
0.7
0.6
25C
0.5
0.4
0.3
–40C
0.2
0.1
0.0
0.0
0.5
1.0
1.5
VCOM (V)
2.0
2.5
3.0
Figure 20. Ron vs VCOM (VCC = 2.7 V)
16
Submit Documentation Feedback
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
TS3A4741, TS3A4742
www.ti.com
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
10 Power Supply Recommendations
Proper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maximum
ratings, because stresses beyond the listed ratings can cause permanent damage to the device. Always
sequence VCC on first, followed by NO, NC, or COM.
Although it is not required, power-supply bypassing improves noise margin and prevents switching noise
propagation from the VCC supply to other components. A 0.1-μF capacitor, connected from VCC to GND, is
adequate for most applications.
11 Layout
11.1 Layout Guidelines
High-speed switches require proper layout and design procedures for optimum performance. Reduce stray
inductance and capacitance by keeping traces short and wide. Ensure that bypass capacitors are as close to the
device as possible. Use large ground planes where possible.
11.2 Layout Example
LEGEND
VIA to Power Plane
Polygonal Copper Pour
VIA to GND Plane (Inner Layer)
Bypass Capacitor
Vcc
To System
1
NO1
2
COM1
3
IN2
4
GND
VCC 8
To System
To System
To System
IN1 7
COM2 6
NO2 5
To System
To System
Figure 21. PCB Layout Example
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
Submit Documentation Feedback
17
TS3A4741, TS3A4742
SCDS228F – AUGUST 2006 – REVISED DECEMBER 2015
www.ti.com
12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TS3A4741
Click here
Click here
Click here
Click here
Click here
TS3A4742
Click here
Click here
Click here
Click here
Click here
12.2 Trademarks
All trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
Submit Documentation Feedback
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TS3A4741DCNR
ACTIVE
SOT-23
DCN
8
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
(8BLO, 8BLR)
TS3A4741DGKR
ACTIVE
VSSOP
DGK
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
JYR
TS3A4742DCNR
ACTIVE
SOT-23
DCN
8
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
(8BPO, 8BPR)
TS3A4742DGKR
ACTIVE
VSSOP
DGK
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
L7R
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
工商网监
湘ICP备2023018690号
