User's Guide
SCDU006 – September 2013
TS3DDR32611 Evaluation Board
This user guide describes the TS3DDR32611 evaluation module (EVM) usage. This guide contains the
EVM schematics, evaluation examples, and bill of materials to evaluate the performance of the
TS3DDR32611 device.
1
2
3
4
5
6
7
Contents
Introduction .................................................................................................................. 2
EVM Setup ................................................................................................................... 2
2.1
Boards ............................................................................................................... 2
2.2
Setup Procedure ................................................................................................... 3
2.3
Configurations ...................................................................................................... 5
Test Procedure .............................................................................................................. 6
3.1
0.75VTT/ 0.675VTT/0.625VTT Source Load Regulation ..................................................... 6
3.2
0.75VTT/ 0.675VTT/0.625VTT Sink/Source Current Transient .............................................. 7
3.3
Equipment Shutdown .............................................................................................. 7
Performance Data and Typical Characteristic Curves ................................................................. 8
4.1
VTT Load Regulation .............................................................................................. 8
4.2
VREF Load Regulation .......................................................................................... 11
4.3
VTT Sink/Source Load Transient ............................................................................... 14
4.4
0.75VTT Turn on/Turn off ....................................................................................... 17
EVM Schematics .......................................................................................................... 19
EVM Assembly Drawing and PCB Layout ............................................................................. 22
Bill of Materials ............................................................................................................. 28
List of Figures
1
TS3DDR32611 Evaluation board .........................................................................................
3
2
TS3DDR32611 EVM Recommended Test Setup
......................................................................
5
3
0.75VTT Load Regulation ..................................................................................................
8
4
0.675VTT Load Regulation ................................................................................................
9
5
0.625VTT Load Regulation ...............................................................................................
10
6
0.75VREF Load Regulation ..............................................................................................
11
7
0.675VREF Load Regulation
............................................................................................
............................................................................................
0.75VTT 685mA Sink/Source ............................................................................................
0.675VTT 615mA Sink/Source ..........................................................................................
0.625VTT 570mA Sink/Source ..........................................................................................
ODT_EN Enable Turn on .................................................................................................
ODT_EN Enable Turn off .................................................................................................
TS3DDR32611 EVM Schematic 1 ......................................................................................
TS3DDR32611 EVM Schematic 2 ......................................................................................
TS3DDR32611 EVM Top Layer Assembly Drawing ..................................................................
TS3DDR32611 EVM Top Layer ........................................................................................
TS3DDR32611 EVM Internal Layer 1 (GND Layer) ..................................................................
TS3DDR32611 EVM Internal Layer 2 (Power Layer).................................................................
TS3DDR32611 EVM Bottom Layer ....................................................................................
12
8
0.625VREF Load Regulation
9
10
11
12
13
14
15
16
17
18
19
20
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
13
14
15
16
17
18
19
20
22
23
24
25
26
1
Introduction
21
www.ti.com
TS3DDR32611 EVM Bottom Layer Assembly Drawing ..............................................................
27
List of Tables
1
TS3DDR32611 Function Table
...........................................................................................
2
2
TS3DDR32611 Evaluation Module Signal Connections ...............................................................
3
3
Transient Load Selection
..................................................................................................
Source Transient Load Selection .........................................................................................
Sink Transient Load Selection ............................................................................................
Transient Load Selection ..................................................................................................
Bill of Materials.............................................................................................................
6
4
5
6
7
1
6
6
6
28
Introduction
The TS3DDR32611 is a sink/source low power double data rate type III (PCDDR3) termination regulator
with a 1% accuracy buffered reference output. It has 26 built-in termination SPST switches that can be
shut off when the memory system undergoes lower speed operation without the need of termination
resistors. Turning off these switches enables huge power saving on the memory system. The switches
have low on-state resistance (typical of 1.75Ω and maximum of 4Ω), which helps retain signal integrity of
the signal lines.
The TS3DDR32611 is powered from a 3.3V supply. The VDDQ pin takes 1.2V to 1.8V input while the
output voltage at VTT pin is 1/2VDDQ±1% × VDDQ. The regulator’s VTT output is capable of
sinking/sourcing up to 1A current. The TS3DDR32611 maintains fast transient response with the use of a
10uF ceramic output capacitor. While the VREF pin’s output is 1/2VDDQ±1% × VDDQ with 10mA current
sinking/sourcing capability. The TS3DDR32611 has three modes of operation: high speed, low speed and
power down mode, depending on the control signals VTT_EN and ODT_EN. These different modes of
operation provide flexibility on controlling the memory system’s power usage.
Table 1. TS3DDR32611 Function Table
State
VTT_EN
ODT_EN
VTT
VREF
Switch
Power Down mode(2)
L
L
OFF(Discharge)
OFF(Discharge)
Disabled
Low Speed mode
H
L
ON
ON
Disabled
High Speed mode
H
H
ON
ON
Enabled
The TS3DDR2611 EVM is an evaluation module for the Texas Instruments TS3DDR32611 switchable
termination regulator and it provides the basic functionality evaluation for the device.
2
EVM Setup
2.1
Boards
One TS3DDR32611 Evaluation board is provided per EVM kit:
2
TS3DDR32611 Evaluation Board
SCDU006 – September 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
EVM Setup
www.ti.com
Figure 1. TS3DDR32611 Evaluation board
This evaluation module provides the following signal connection capabilities:
Table 2. TS3DDR32611 Evaluation Module Signal Connections
Type
Description
Purpose
J1
Jumper
Power enable/disable for sink/source
transient load
Provide the power control for sink/source
transient load circuit
J2
Power Input Connector
5V IN input
Power supply for sink/source transient load
circuit
J3
Jumper
Jumper for source current transient
load enable
Source current transient load can be enabled or
disabled
J4
Jumper
Jumper for sink current transient load
enable
Sink current transient load can be enabled or
disabled
J5
Power Input Connector
VDD input
Power supply for VDD
J6
Power Input Connector
VLDOIN input
Power supply for VLDOIN
J7
Power Input Connector
VDDQ input
Power supply for VDDQ
J8
Power Output Connector
VREF output
Power output for VREF
J9
Power Output Connector
VTT output
Power output for VTT
Test points and headers are placed throughout the board to provide testing capability for each pin of the
device and are labeled with the corresponding pin name beside the header pins.
2.2
Setup Procedure
2.2.1
Equipment Required
• Power Supply
– VDD: The VDD DC Source must be a 0-V to 6-V variable dc source capable of supplying 0.5 Adc.
– VLDOIN: The VLDOIN DC Source must be a 0-V to 6-V variable dc source capable of supplying 5
Adc.
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
3
EVM Setup
•
•
•
2.2.2
www.ti.com
– VDDQ: The VDD DC Source must be a 0-V to 6-V variable dc source capable of supplying 0.5 Adc.
– 5V IN: The 5V IN DC Source must be a 0-V to 6-V variable dc source capable of supplying 0.5 Adc.
Meters
– V1: DC voltmeter for VTT at TP10 (VTT) and TP15 (GND)
– V2: DC voltmeter for VREF at TP9 (VREF) and TP14 (GND)
Load
– VTT Load: The VTT load must be an electronic constant-current load capable of 0A to 1A at 0.9
Vdc
– VREF Load: The VTT load must be an electronic constant-current load capable of 0A to 10mA at
0.9 Vdc
Oscilloscope
A digital or analog oscilloscope can be used to measure VTT sink/source current transient. The
oscilloscope is recommended to set to 1-MΩ impedance, 20-MHz bandwidth, ac coupling, 200μs/division horizontal resolution, 20-µV/division vertical resolution for VTT transient test. Test point
TP10 (VTT) and TP15 (GND) can be used to measure VTT transient. Set horizontal cursor to measure
transient load regulation.
Recommended Test Setup
Figure 2 is the recommended test setup to evaluate the TS3DDR32611 EVM. Working at an ESD
workstation, ensure that any wrist straps, bootstraps, or mats are connected referencing the user to earth
ground before power is applied to the EVM.
4
TS3DDR32611 Evaluation Board
SCDU006 – September 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
EVM Setup
www.ti.com
Figure 2. TS3DDR32611 EVM Recommended Test Setup
2.3
Configurations
All jumper selections must be made prior to applying power to the EVM. Users can configure this EVM per
the following configurations.
2.3.1
Transient Load Selection
The transient load selection can be set by J1.
Default setting: Jumper shorts on Pin2 and Pin3 of J1 to disable transient load.
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
5
Test Procedure
www.ti.com
Table 3. Transient Load Selection
Jumper Set to
2.3.2
Transient Load
1-2 pin shorted
Enable
2-3 pin shorted
Disable
Source Transient Load Selection
The source transient load selection can be set by J3.
Default setting: Jumper shorts on Pin1 and Pin2 of J3 to enable source transient load.
Table 4. Source Transient Load Selection
Jumper Set to
2.3.3
Transient Load
1-2 pin shorted
Enable
2-3 pin shorted
Disable
Sink Transient Load Selection
The sink transient load selection can be set by J4.
Default setting: Jumper shorts on Pin1 and Pin2 of J4 to enable transient load.
Table 5. Sink Transient Load Selection
Jumper Set to
2.3.4
Transient Load
1-2 pin shorted
Enable
No Jumper shorted
Disable
VTT_EN, ODT_EN Enable or Disable Selection
The VTT_EN, ODT_EN can be controlled by S1 and S2.
Default setting: Push S1 and S2 to the Bottom (OFF position) to control the ODT_EN and VTT_EN
to GND. Short Pin2 and Pin3 of J10 connects the high voltage for VTT_EN and ODT_EN to VDD.
Table 6. Transient Load Selection
S1
S2
VTT_EN
ODT_EN
VTT
VREF
SWITCH
OFF
OFF
L
L
OFF(Discharge)
OFF(Discharge)
Disabled
ON
OFF
H
L
ON
ON
Disabled
ON
ON
H
H
ON
ON
Enabled
NOTE: To use an external power supply for the high voltage of VTT_EN and ODT_EN, short pin1
and pin2 of J10 with a jumper and connect the external power supply to TP23 (VIO).
3
Test Procedure
3.1
0.75VTT/ 0.675VTT/0.625VTT Source Load Regulation
1.
2.
3.
4.
5.
6.
6
Ensure jumper shorts on Pin2 and Pin3 of J1.
Ensure jumper shorts on Pin1 and Pin2 of J7, J8.
Ensure switches S1 and S2 to OFF position.
Set VTT load to 0 A.
Increase VDD (VDD DC Source) from 0 V to 3.3V at J5. This is the main power for the DUT.
Increase VLDOIN voltage (VLDOIN DC Source) from 0 V to 1.5 V for 0.75VTT or 1.35 V for 0.675VTT
TS3DDR32611 Evaluation Board
SCDU006 – September 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Test Procedure
www.ti.com
or 1.25V for 0.625VTT at J6. This is the LDO input.
7. Increase VDDQ voltage (VDDQ DC Source) from 0 V to 1.5 V for 0.75VTT or 1.35 V for 0.675VTT or
1.25V for 0.625VTT at J7. This is the VTT and VREF reference input.
8. Set switches S1, S2 to ON position.
9. Use V1, V2 to measure VTT, VREF voltage.
10. Increase VTT load from 0A to 1A and VREF load from 0A to 10mA.
11. Use V1, V2 to measure VTT, VREF voltage.
12. Decrease load to 0 A.
13. Set switches S1, S2 to OFF position.
3.2
0.75VTT/ 0.675VTT/0.625VTT Sink/Source Current Transient
1.
2.
3.
4.
5.
6.
7.
8.
Remove VTT load and VREF load from J9 and J8.
Remove V1 from TP10 (VTT) and TP15 (GND).
Add scope probe Channel 1 on TP4 (CLK_IN) and TP5 (GND).
Add scope probe Channel 2 on TP10 (VTT) and TP15 (GND).
Remove jumper on Pin2 and Pin3 of J1 and put this jumper on Pin1 and Pin2 of J1.
Set switches S1, S2 to ON position.
TS3DDR32611 is now operating at sink/source load transient.
Use scope probe at TP10 (VTT) and TP15 (GND) to monitor VTT load transient operation, and use
cursor to make measurement. The waveform is shown in Section 4.3.
9. Set switch S1, S2 to OFF position.
10. Decrease dc source to 0 V.
3.3
Equipment Shutdown
1. Shut down VDD DC Source, VDDQ DC Source, 5V IN DC Source and VLDOIN SC Source
2. Shut down VTT load and VREF load.
3. Shut down oscilloscope.
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
7
Performance Data and Typical Characteristic Curves
4
Performance Data and Typical Characteristic Curves
4.1
VTT Load Regulation
www.ti.com
Figure 3. 0.75VTT Load Regulation
8
TS3DDR32611 Evaluation Board
SCDU006 – September 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
www.ti.com
Performance Data and Typical Characteristic Curves
Figure 4. 0.675VTT Load Regulation
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
9
Performance Data and Typical Characteristic Curves
www.ti.com
Figure 5. 0.625VTT Load Regulation
10
TS3DDR32611 Evaluation Board
SCDU006 – September 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
www.ti.com
4.2
Performance Data and Typical Characteristic Curves
VREF Load Regulation
Figure 6. 0.75VREF Load Regulation
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
11
Performance Data and Typical Characteristic Curves
www.ti.com
Figure 7. 0.675VREF Load Regulation
12
TS3DDR32611 Evaluation Board
SCDU006 – September 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
www.ti.com
Performance Data and Typical Characteristic Curves
Figure 8. 0.625VREF Load Regulation
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
13
Performance Data and Typical Characteristic Curves
4.3
www.ti.com
VTT Sink/Source Load Transient
Figure 9. 0.75VTT 685mA Sink/Source
14
TS3DDR32611 Evaluation Board
SCDU006 – September 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
www.ti.com
Performance Data and Typical Characteristic Curves
Figure 10. 0.675VTT 615mA Sink/Source
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
15
Performance Data and Typical Characteristic Curves
www.ti.com
Figure 11. 0.625VTT 570mA Sink/Source
16
TS3DDR32611 Evaluation Board
SCDU006 – September 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
www.ti.com
4.4
Performance Data and Typical Characteristic Curves
0.75VTT Turn on/Turn off
Figure 12. ODT_EN Enable Turn on
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
17
Performance Data and Typical Characteristic Curves
www.ti.com
Figure 13. ODT_EN Enable Turn off
18
TS3DDR32611 Evaluation Board
SCDU006 – September 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
EVM Schematics
www.ti.com
5
EVM Schematics
Figure 14. TS3DDR32611 EVM Schematic 1
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
19
EVM Schematics
www.ti.com
Figure 15. TS3DDR32611 EVM Schematic 2
20
TS3DDR32611 Evaluation Board
SCDU006 – September 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
EVM Schematics
www.ti.com
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
21
EVM Assembly Drawing and PCB Layout
6
www.ti.com
EVM Assembly Drawing and PCB Layout
Figure 16. TS3DDR32611 EVM Top Layer Assembly Drawing
22
TS3DDR32611 Evaluation Board
SCDU006 – September 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
EVM Assembly Drawing and PCB Layout
www.ti.com
Figure 17. TS3DDR32611 EVM Top Layer
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
23
EVM Assembly Drawing and PCB Layout
www.ti.com
Figure 18. TS3DDR32611 EVM Internal Layer 1 (GND Layer)
24
TS3DDR32611 Evaluation Board
SCDU006 – September 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
EVM Assembly Drawing and PCB Layout
www.ti.com
Figure 19. TS3DDR32611 EVM Internal Layer 2 (Power Layer)
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
25
EVM Assembly Drawing and PCB Layout
www.ti.com
Figure 20. TS3DDR32611 EVM Bottom Layer
26
TS3DDR32611 Evaluation Board
SCDU006 – September 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
EVM Assembly Drawing and PCB Layout
www.ti.com
Figure 21. TS3DDR32611 EVM Bottom Layer Assembly Drawing
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
27
Bill of Materials
7
www.ti.com
Bill of Materials
Table 7. Bill of Materials
Quantity
28
Designator
Value
Description
Footprint
Part Number
1
!PCB
HVL043
Printed Circuit Board
10.4cmX7.4cm
HVL043
6
1,6,7, 8, 9, 23
5005
Test Point, Red, Thru Hole Compact Style
TH-63
5005
9
2, 3, 5, 11, 12, 13, 14, 20, 44
5006
Test Point, Black, Thru Hole Compact Style
TH-63
5006
3
4, 45, 46
5007
Test Point, White, Thru Hole Compact Style
TH-63
5007
1
10
5000
Test Point, Red, Thru Hole Color Keyed
TH-40
5000
8
15, 16, 17, 18, 19, 49, 50, 56
5001
Test Point, Black, Thru Hole Color Keyed
TH-40
5001
3
21, 36, 37
PEC01SAAN
CONN HEADER .100 SINGL STR 1POS
0.100 inch x 1
PEC01SAAN
27
22, 24, 25, 26, 27, 28, 29, 30,
31, 32, 33, 34, 35, 38, 39, 40,
41, 42, 43, 47, 48, 51, 52, 53,
54, 55, 57
5002
Test Point, White, Thru Hole Color Keyed
TH-40
5002
3
C1, C2, C3
10uF
Capacitor, Ceramic Chip, 10V,X5R, 20%
C0805
STD
2
C4, C27
1uF
Capacitor, Ceramic Chip, 10V,X5R, 20%
C0603
STD
4
C5, C6, C7, C28
0.1uF
Capacitor, Ceramic Chip, 10V, X5R, 20%
C0603
STD
6
C8, C9, C10, C12, C16, C17
10uF
Capacitor, Ceramic Chip, 6.3V, X5R,20%
C0603
JMK107BJ106
MA
2
C11, C14
0.1uF
Capacitor, Ceramic Chip, 6.3V, X5R, 20%
C0603
EMK107BJ104
KA
1
C15
0.22uF
Capacitor, Ceramic Chip, 6.3V,X5R,10%
C0402
JMK105BJ224
KA
2
C13,C19
1uF
Capacitor, Ceramic Chip, 6.3V,X5R,10%
C0603
EMK107BJ105
KA
3
J1, J3, J10
PEC03SAAN
Header, Male 3-pin, 100mil spacing,
HDR100_1X3
PEC03SAAN
6
J2, J5, J6, J7, J8, J9
ED555/2DS
Connector, Male 2 Pole 3.5 mm, 6A, 150V
CONN_ED555/ ED555/2DS
2
1
J4
PEC02SAAN
Header, Male 2-pin, 100mil spacing,
HDR100_1X2
2
Q1, Q2
25V
MOSFET, N-CH, 25V, 100A, SON 5x6mm
TRANS_NexFE CSD16407Q5
T_Q5
2
R1, R6
100k
Resistor, Chip, 1/16W, 1%
R0603
STD
4
R2, R3, R7, R8
2
Resistor, Chip 1W, 5%
R2512
STD
2
R4, R9
100
Resistor, Chip, 1/10W, 5%
R0805
STD
1
R5
0
Resistor, Chip 1W, 5%
R2512
STD
1
R10
330
Resistor, Chip, 1/16W, 1%
R0603
STD
1
R11
7.5k
Resistor, Chip, 1/16W, 1%
R0603
STD
3
R13,R14,R29
0
Resistor, Chip, 1/16W, 5%
R0603
STD
TS3DDR32611 Evaluation Board
PEC02SAAN
SCDU006 – September 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Bill of Materials
www.ti.com
Table 7. Bill of Materials (continued)
Quantity
Designator
Value
Description
Footprint
Part Number
2
R26,R41
0
Resistor, Chip, 1/16W, 1%
R0402
STD
24
R15,
R21,
R28,
R35,
35
Resistor, Chip, 1/16W, 1%
R0402
STD
2
S1, S2
G13AP
Switch, Toggle, SPDT 1Pos, TH
SW_G13AP
G13AP
1
U1
SN74AHC00D
IC, QUAD, 2-Input Positive NAND Gates
SO14
SN74AHC00D
1
U2
UCC27325D
DUAL 4-A PEAK HIGH SPEED LOW- SIDE POWER MOSFET DRIVERS, D0008A
D0008A_N
UCC27325D
1
U3
SA555D
IC, Precision Timer
SO8
SA555D
1
U4
TS3DDR32611 1A Peak Sink/Source PCDDR3 Termination Regulator with Integrated Isolation
ZQC
Switch and Low Power Mode Operation, ZQC0048A
ZQC0048A
TS3DDR32611
ZQC
R16,
R22,
R30,
R36,
R17,
R23,
R31,
R37,
R18,
R24,
R32,
R38,
R19,
R25,
R33,
R39,
R20,
R27,
R34,
R40,
SCDU006 – September 2013
Submit Documentation Feedback
TS3DDR32611 Evaluation Board
Copyright © 2013, Texas Instruments Incorporated
29
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
SPACER
SPACER
SPACER
SPACER
SPACER
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
SPACER
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
spacer
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
