TS3DV20812RHHR

TS3DV20812 www.ti.com SCDS302 – JUNE 2010 2-Gbps DIFFERENTIAL SWITCH 8-Bit, 1:2 MULTIPLEXER/DEMULTIPLEXER WITH 3-SIDE BAND SIGNALS Check for Samples: TS3DV20812 FEATURES APPLICATIONS • • • • • • • • • • • 1 • • • • • • • • • • • • Four High-Speed Bidirectional Differential Pair Channel MUX/DEMUX Supports up to 2 Gbps Data Rate VDD Operating Range 2.5 V or 3.3 – -0 V to 3.3 V Rail To Rail at 2.5 V – -0 V to 5 V Rail To Rail at 3.3V IOFF partial Powerdown and Back-Drive Protection. 5-V Input Tolerant on Control Pin Supports Both AC- and DC-Coupled Signals Low Crosstalk: -38 dB at 825 MHz, 2.5 V or 3.3 V Insertion Loss: -1.5 dB at 825 MHz, 2.5 V or 3.3 V Off Isolation -24.67 dB at 825 MHz Low Bit-to-Bit Skew within Pair 5 ps Maximum Channel-to-Channel Skew: 30 ps Maximum Propagation Delay Times: 250 ps Maximum ESD Performance Tested per JESD 22 – 2000-V Human Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) HDMI/DVI Video MUX Panel LVDS Bus MUX LVDS, LVPECL, CML Analog Signals VGA Gigabit LAN Signal MUX Serial Backplane Signal MUX Optical Module Central Office Telecommunication Wireless Base Station High-Speed Logic Data I/O MUX RHH PACKAGE (TOP VIEW) DESCRIPTION/ORDERING INFORMATION TS3DV20812 is a High Speed Data Rate up to 2Gbps for Differential Signal Passive bi-directional Multiplexer and De-multiplexer for I/O rails up to 5V Level with Low Crosstalk and Insertion Loss. TS3DV20812 can be used in either HDMI/DVI sink side or source side with 4-differential pair supporting the high speed and control pins. The Ioff and back drive protection allowing to connect the external cable and prevent the back flow current when the Vcc is into 0V. The 3 side band signals can be used in DDC (SDAL, SCL) and CEC Signal MUX. TS3DS20812 is characterized for operation from -40C to 85C. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated TS3DV20812 SCDS302 – JUNE 2010 www.ti.com Table 1. ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C (1) (2) QFN – RHH (2) ORDERABLE PART NUMBER Tape and reel TS3DV20812RHH TOP-SIDE MARKING TBD Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. LOGIC DIAGRAM FUNCTION TABLE INPUT SEL DIFFERENTIAL SIGNAL I/Os L Dn (±), nA (AUX (±), HPD, CAD/CEC) H 2 FUNCTIONS A-PORT B-PORT DnA (±), nA_A High-impedance mode High-impedance mode DnB (±), nA_B Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV20812 TS3DV20812 www.ti.com SCDS302 – JUNE 2010 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VDD Supply voltage range VIN Control input voltage range (2) (3) VIO Switch I/O voltage range (all three I/O ports) (4) MIN MAX –0.5 4.6 V SEL –0.5 7 V I/O –0.5 7 V D0-D3, Aux, HPD, CAD/CEC –0.5 VCC + 0.5 V A port and B port –0.5 VCC + 0.5 IIK Control input clamp current VIN < 0 II/OK I/O port clamp current VO < 0 IIO Continuous output current (5) ON-state switch Continuous current through VDD or GND ΘJA Package thermal impedance Tstg Storage temperature range (1) (2) (3) (4) (5) (6) (6) RHH package –65 UNIT V –50 mA –50 mA ±128 mA ±100 mA 31.8 °C/W 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VIO. II and IO are used to denote specific conditions for IIO. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT 2.25 3. 6 V SEL 2 5.5 V Low-level control input voltage SEL 0 0.8 V Input/output voltage All ports 0 5.5 V VANALOG Analog signal range Differential signal range 0 VDD V VI Input tolerant SEL 0 5.5 V TA Operating free-air temperature –40 85 °C VDD Supply voltage VIH High-level control input voltage VIL VI/O Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV20812 3 TS3DV20812 SCDS302 – JUNE 2010 www.ti.com ELECTRICAL CHARACTERISTICS for high-frequency switching over recommended operating free-air temperature range VDD = 3.3 V ± 0.3 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER VIK SEL VDD = 3.6 V, IIN = –18 mA IIH SEL VDD = 3.6 V, VIN = VDD IIL SEL VDD = 3.6 V, VIN = GND VDD = 06 V, VO = 0 to 3.6 V , VI = 0 , VIN = 0 Switch ON or OFF IOFF ICC MIN TYP (2) MAX –0.7 –1.2 V ±1 mA ±1 mA 1 mA 250 500 mA 2 2.5 pF 4 pF VDD = 3.6 V, IIO = 0 CIN SEL f = 10 MHz , VIN = 0 COFF 3-Port f = 10 MHz , VIN = 0 , Output is Open, Switch is OFF 2.5 CON 3-Port f = 10 MHz , VIN = 0 , Output is Open, Switch is ON 8 VDD = 3.6 V 1.5 V ≤ VI ≤ VDD, IO = –40 mA 4 VDD = 3.6 V 1.5 V ≤ VI ≤ VDD, IO = –40 mA 0.5 VDD = 3.6 V 1.5 V ≤ VI ≤ VDD, IO = –40 mA 0.4 rON rON(flat) (3) Δ rON (4) (1) (2) (3) (4) UNIT pF 6 Ω Ω 1 Ω VI, VO, II, and IO refer to I/O pins, VIN refers to the control inputs. All typical values are at VDD = 3.3 V (unless otherwise noted), TA = 25°. rON(flat) is the difference of rON in a given channel at specified voltages. ΔrON is the difference of rON from center (D0 to Dn) ports to any other port. ELECTRICAL CHARACTERISTICS for high-frequency switching over recommended operating free-air temperature range VDD = 2.5 V ± 0.25 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER MIN TYP (2) MAX –0.7 UNIT VIK SEL VDD = 2.5 V , IIN = –18 mA –1.2 V IIH SEL VDD = 2.5 V , VIN = VDD ±1 mA IIL SEL VDD = 2.5 V , VIN = GND ±1 mA IOFF VDD = 06 V, VO = 0 to 2.5 V , VI = 0 , VIN = 0 ICC VDD = 2.5 V , IIO = 0 Switch ON or OFF 1 mA 250 500 mA 2 2.5 pF 4 pF CIN SEL f = 10 MHz , VIN = 0 COFF 3-Port f = 10 MHz , VIN = 0 , Output is Open, Switch is OFF 2.5 CON 3-Port f = 10 MHz , VIN = 0 , Output is Open, Switch is ON 8 VDD = 2.5 V 1.5 V ≤ VI ≤ VDD, IO = –40 mA 4 VDD = 2.5 V VI = 1.5 V and VDD, IO = –40 mA 0.5 VDD = 2.5 V 1.5 V ≤ VI ≤ VDD, IO = –40 mA 0.4 rON rON(flat) (3) Δ rON (4) (1) (2) (3) (4) 4 pF 6 Ω Ω 1 Ω VI, VO, II, and IO refer to I/O pins, VIN refers to the control inputs. All typical values are at VDD = 2.5 V (unless otherwise noted), TA = 25°. rON(flat) is the difference of rON in a given channel at specified voltages. ΔrON is the difference of rON from center (D0 to Dn) ports to any other port. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV20812 TS3DV20812 www.ti.com SCDS302 – JUNE 2010 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V, RL = 200 Ω, CL = 10 pF (unless otherwise noted) (see Figure 9 and Figure 10) MIN TYP (1) FROM (INPUT) TO (OUTPUT) tpd (2) Dn DA or DB tPZH, tPZL SEL DA or DB 0.5 15 ns tPHZ, tPLZ SEL DA or DB 0.9 12 ns PARAMETER MAX 149 UNIT ps SEL to switch turn on time DA or DB 9 14 ns SEL to switch turn off time DA or DB 5 11 ns Dn (+)(-), DA(+)(-), DB(+)(-) 22 28 ps Dn (all), DnA(all), DnB(All) 19 25 ps 22 31 ps tsk(o) (3) tsk(o) tsk(p) (4) (1) (2) (3) (4) All typical values are at VDD = 2.5 V (unless otherwise noted), TA = 25°. The propagation delay is the calculated RC time constant of the typical ON-State resistance of the switch and the specified load capacitance when driven by an ideal voltage source (zero output impedance). Output skew between center port to any other port. Skew between opposite transitions of the same output in a given device |tPHL – tPLH| SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VDD = 2.5V ± 0.25 V, RL = 200 Ω, CL = 10 pF (unless otherwise noted) (see Figure 9 and Figure 10) TO (OUTPUT) tpd (2) Dn DA or DB tPZH, tPZL SEL DA or DB 0.5 14 ns tPHZ, tPLZ SEL DA or DB 0.9 15 ns 9 17 ns SEL to switch turn on time SEL to switch turn off time tsk(o) DA or DB DA or DB (3) tsk(o) tsk(p) (1) (2) (3) (4) DA or DB MIN TYP (1) FROM (INPUT) PARAMETER MAX 149 UNIT ps 5 18 ns Dn (+)(-), DA(+)(-), DB(+)(-) 22 31 ps Dn (all), DnA(all), DnB(All) 19 23 ps 22 33 ps (4) All typical values are at VDD = 2.5 V (unless otherwise noted), TA = 25°. The propagation delay is the calculated RC time constant of the typical ON-State resistance of the switch and the specified load capacitance when driven by an ideal voltage source (zero output impedance). Output skew between center port to any other port. Skew between opposite transitions of the same output in a given device |tPHL – tPLH| Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV20812 5 TS3DV20812 SCDS302 – JUNE 2010 www.ti.com DYNAMIC CHARACTERISTICS over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V, RL = 50 Ω, CL = 10 pF (unless otherwise noted) PARAMETER TEST CONDITIONS TYP UNIT XTALK Differential crosstalk 825 MHz, 1.65Gbps, RL = 50 Ω, CL = 10 pF, see Figure 11 -34.67 dB OIRR Differential OFF isolation 825 MHz, 1.65Gbps, RL = 50 Ω, CL = 10 pF, see Figure 12 -19.09 dB ILOSS Differential insertion loss 825 MHz, 1.65Gbps, RL = 50 Ω, CL = 10 pF, seeFigure 13 -2.84 dB IRETURN Differential return loss 825 MHz, 1.65Gbps, RL = 50 Ω, CL = 10 pF, see Figure 13 -9.43 dB DR Data rate 2.20 Gbps BW Differential bandwidth 1.10 Ghz DYNAMIC CHARACTERISTICS over recommended operating free-air temperature range, VDD = 2.5 V ± 0.25 V, RL = 50 Ω, CL = 10 pF (unless otherwise noted) PARAMETER TEST CONDITIONS TYP UNIT XTALK Differential crosstalk 825 MHz, 1.65Gbps, RL = 50 Ω, CL = 10 pF, see Figure 7 -34.94 dB OIRR Differential OFF isolation 825 MHz, 1.65Gbps, RL = 50 Ω, CL = 10 pF, see Figure 8 -18.39 dB ILOSS Differential insertion loss 825 MHz, 1.65Gbps, RL = 50 Ω, CL = 10 pF, see Figure 9 -3.07 dB IRETURN Differential return loss 825 MHz, 1.65Gbps, RL = 50 Ω, CL = 10 pF, see Figure 9 -9.56 dB DR Data rate 2.20 Gbps BW Differential bandwidth 1.10 Ghz 6 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV20812 TS3DV20812 www.ti.com SCDS302 – JUNE 2010 TYPICAL PERFORMANCE Figure 1. Differential Gain vs Frequency Figure 2. Differential Off Isolation vs Frequency Figure 3. Differential Crosstalk vs Frequency Figure 4. rON vs VCOM (Differential Switch) Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV20812 7 TS3DV20812 SCDS302 – JUNE 2010 www.ti.com APPLICATION INFORMATION Figure 5. Typical Application Switching HDMI 1.2a and DVI 8 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV20812 TS3DV20812 www.ti.com SCDS302 – JUNE 2010 Figure 6. Typical Application for Dual LVDS A. The switch already has IOFF circuit and it will reduce the current flow leakage limit to 10 mA maximum and it will prevent the damage from back drive current flow from the power-on circuit. Figure 7. IOFF (Back Drive Protection) Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV20812 9 TS3DV20812 SCDS302 – JUNE 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure 8. Differential Signaling Device 10 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV20812 TS3DV20812 www.ti.com SCDS302 – JUNE 2010 PARAMETER MEASUREMENT INFORMATION (continued) Figure 9. Test Circuit for Propagation Delay and Intra-Pair Skew Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV20812 11 TS3DV20812 SCDS302 – JUNE 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) Figure 10. Test Circuit and Voltage Waveforms 12 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV20812 TS3DV20812 www.ti.com SCDS302 – JUNE 2010 PARAMETER MEASUREMENT INFORMATION (continued) Figure 11. Differential Crosstalk Test Circuit Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV20812 13 TS3DV20812 SCDS302 – JUNE 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) Figure 12. Differential OFF Isolation Test Circuit 14 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV20812 TS3DV20812 www.ti.com SCDS302 – JUNE 2010 PARAMETER MEASUREMENT INFORMATION (continued) Figure 13. Differential Insertion Loss, Return Loss, and Common-Mode Insertion Loss Test Circuit Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV20812 15 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TS3DV20812RHHR ACTIVE VQFN RHH 36 2500 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 SY812 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of