TSC2111IRGZT

PCN Number: Title: 20140403000 PCN Date: 04/30/2014 Add Cu as Alternative Wire Base Metal for Selected Device(s) Customer Contact: Proposed 1 st PCN Manager Ship Date: Phone: +1(214)480-6037 Estimated Sample 07/30/2014 Availability: Change Type: Assembly Site Assembly Process Assembly Materials Mechanical Specification Packing/Shipping/Labeling Design Data Sheet Part number change Test Site Test Process Dept.: Wafer Wafer Wafer Wafer Wafer Wafer Quality Services Date provided at sample request Bump Site Bump Material Bump Process Fab Site Fab Materials Fab Process PCN Details Description of Change: Texas Instruments is pleased to announce the qualification of Cu as an additional bond wire option for devices listed in “Product affected” section below. Devices will remain in current assembly facility. Group 1 Device: Wire material change only Group 2 Device: Wire material and diam change Au wire Cu wire Wire diam (mils) 1.20, 1.30 1.0 Reason for Change: Continuity of supply. 1) To align with world technology trends and use wiring with enhanced mechanical and electrical properties 2) Maximize flexibility within our Assembly/Test production sites. 3) Cu is easier to obtain and stock Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative): None. Changes to product identification resulting from this PCN: None. Texas Instruments, Inc. PCN# 20140403000 Product Affected: Group 1 Devices ADS1112IDRCR ADS1112IDRCRG4 ADS1112IDRCT ADS1112IDRCTG4 ADS7826IDRBR ADS7826IDRBRG4 ADS7826IDRBT ADS7826IDRBTG4 ADS7827IDRBR ADS7827IDRBRG4 ADS7827IDRBT ADS7827IDRBTG4 AMC7823IRTAR AMC7823IRTARG4 AMC7823IRTAT AMC7823IRTATG4 BQ27000DRKR BQ27000DRKRG4 BQ27010DRKR BQ27010DRKRG4 BQ27200DRKR BQ27200DRKRG4 BQ27210DRKR BQ27210DRKRG4 CDCM1802RGTR CDCM1802RGTRG4 CDCM1802RGTT CDCM1802RGTTG4 DAC8531IDRBR DAC8531IDRBRG4 DAC8531IDRBT DAC8531IDRBTG4 HPA00093IRGZR HPA00203DRKR HPA00211DRKR HPA00242DRKR HPA00374DRKR HPA00397RHFR HPA00425DRKR HPA00599DRKR HPA00906DRKR HPA00949DRKR HPA00972RTJR MSC1202Y2RHHT MSC1202Y2RHHTG4 MSC1202Y3RHHR MSC1202Y3RHHRG4 Texas Instruments, Inc. MSC1202Y3RHHT MSC1202Y3RHHTG4 OPA2381AIDRBT OPA2381AIDRBTG4 OPA381AIDRBR OPA381AIDRBRG4 OPA381AIDRBT OPA381AIDRBTG4 PCM1774RGPT PCM1774RGPTG4 PCM1777RHB PCM1777RHBR PCM1777RHBT PCM1870RHFR PCM1870RHFRG4 PCM1870RHFT PCM1870RHFTG4 PCM3793ARHBR PCM3793ARHBRG4 PCM3793ARHBT PCM3793ARHBTG4 PCM3793RHBR PCM3793RHBRG4 PCM3793RHBT PCM3793RHBTG4 PCM3794ARHBR PCM3794ARHBRG4 PCM3794ARHBT PCM3794ARHBTG4 PCM3794RHBR PCM3794RHBRG4 PCM3794RHBT PCM3794RHBTG4 PTLV320AIC19IRHB SN0708077DRPR SN0708077DRPRG4 SN1002034DRKR SN27210DRKR SN55LBC180RSAR SN55LBC180RSAT SN65LBC180RSAR SN65LBC180RSARG4 SN65LBC180RSAT SN65LBC180RSATG4 SN74LVC244ARGYR SN74LVC244ARGYRG4 SN75LBC180RSAT SN75LBC180RSATG4 SN75LVCP601RTJR SN75LVCP601RTJT TLV320AIC26IRHB TLV320AIC26IRHBG4 TLV320AIC26IRHBR TLV320AIC26IRHBRG4 TLV320AIC28IRGZ TLV320AIC28IRGZG4 TLV320AIC28IRGZR TLV320AIC28IRGZRG4 TLV320AIC3106IRGZR TLV320AIC3106IRGZT TLV320AIC31IRHBR TLV320AIC31IRHBRG4 TLV320AIC31IRHBT TLV320AIC31IRHBTG4 TLV320AIC32IRHBR TLV320AIC32IRHBRG4 TLV320AIC32IRHBT TLV320AIC32IRHBTG4 TLV320DA26IRHBG4 TLV320DAC26IRHB TLV320DAC26IRHBG4 TLV320DAC26IRHBR TLV320DAC26IRHBRG4 TLVAIC3106IRGZRG4 TLVAIC3106IRGZTG4 TPS61103RGER TPS61103RGERG4 TPS61107RGER TPS61107RGERG4 TPS61132RSAR TPS61132RSARG4 TPS62300DRCR TPS62300DRCRG4 TPS62301DRCR TPS62301DRCRG4 TPS62302DRCR TPS62302DRCRG4 TPS62303DRCR TPS62303DRCRG4 TPS62304DRCR TPS62304DRCRG4 TPS62305DRCR TPS62305DRCRG4 TPS62320DRCR TPS62320DRCRG4 TPS62321DRCR TPS62321DRCRG4 TRF3701IRHC TRF3701IRHCG4 TRF3701IRHCR TRF3701IRHCRG4 TRF3702IRHC TRF3702IRHCG4 TRF3702IRHCR TRF3702IRHCRG4 TRF3750IRGP TRF3750IRGPG4 TRF3750IRGPR TRF3750IRGPRG4 TSC2100IRHB TSC2100IRHBG4 TSC2100IRHBR TSC2100IRHBRG4 TSC2101IRGZ TSC2101IRGZG4 TSC2101IRGZR TSC2101IRGZRG4 TSC2111IRGZT TSC2111IRGZTG4 UCD9080RHBR UCD9080RHBRG4 UCD9080RHBT UCD9080RHBTG4 UCD9081RHBR UCD9081RHBRG4 UCD9081RHBT UCD9081RHBTG4 VCA2615RGZR VCA2615RGZRG4 VCA2615RGZT VCA2615RGZTG4 VCA2617RHBR VCA2617RHBRG4 VCA2617RHBT VCA2617RHBTG4 VSP5601RSHR VSP5602RSLR VSP5610RSHR PCN# 20140403000 Product Affected: Group 2 Devices ADS8361IRHBR OPA2277AIDRMTG4 ADS8361IRHBRG4 OPA2727AIDRBR ADS8361IRHBT OPA2727AIDRBRG4 ADS8361IRHBTG4 OPA2727AIDRBT BQ24650RVAR OPA2727AIDRBTG4 BQ24650RVAT OPA277AIDRMR BQ24651RVAR OPA277AIDRMRG4 BQ24651RVAT OPA277AIDRMT BQ24704RGER OPA277AIDRMTG4 BQ24704RGET OPA727AIDRBT BQ24730RGFT OPA727AIDRBTG4 BQ24730RGFTG4 OPA728AIDRBT BQ24753ARHDR OPA728AIDRBTG4 BQ24753ARHDT THS4211DRBR DRV10863DSNR THS4211DRBRG4 DRV601RTJR THS4211DRBT DRV601RTJRG4 THS4211DRBTG4 DRV601RTJT THS4215DRBR DRV601RTJTG4 THS4215DRBRG4 HPA00146RHFR THS4215DRBT HPA00176BRHDR THS4215DRBTG4 HPA00230MRTJRG4 THS6184RHFR HPA00388RTER THS6184RHFRG4 HPA00571RHLR THS6184RHFT HPA00899RTER THS6184RHFTG4 OPA2277AIDRMT TLV320A23BIRHDRG4 TLV320AIC23BIRHD TLV320AIC23BIRHDG4 TLV320AIC23BIRHDR TLV320AIC23BRHD TLV320AIC23BRHDG4 TLV320AIC23BRHDR TLV320AIC23BRHDRG4 TLV320DAC23IRHD TLV320DAC23IRHDG4 TLV320DAC23IRHDR TLV320DAC23IRHDRG4 TLV320DAC23RHD TLV320DAC23RHDG4 TLV320DAC23RHDR TLV320DAC23RHDRG4 TPA4411MRTJR TPA4411MRTJRG4 TPA4411MRTJT TPA4411MRTJTG4 TPA4411RTJR TPA4411RTJRG4 TPA4411RTJT TPA4411RTJTG4 TPS61181ARTER TPS61181ARTET TPS61181RTER TPS61181RTERG4 TPS61182RTER TPS61182RTERG4 TPS61182RTET TPS61182RTETG4 TPS61189RTJR TPS65190RHDR TPS75003RHLR TPS75003RHLRG4 TPS75003RHLT TPS75003RHLTG4 TSC2046EIRGVR TSC2046EIRGVRG4 TSC2046EIRGVT TSC2046EIRGVTG4 TSC2046IRGVR TSC2046IRGVRG4 TSC2046IRGVT TSC2046IRGVTG4 TSC2200IRHB TSC2200IRHBG4 TSC2200IRHBR TSC2200IRHBRG4 Qualification Data: This qualification has been developed for the validation of this change. The qualification data validates that the proposed change meets the applicable released technical specifications. Qual Vehicle 1 : ADS-8484IBRGZ (MSL 2-260C) Package Construction Details Assembly Site: # Pins-Designator, Family: Lead frame (Finish, Base): Qualification: Plan Reliability Test CRS 48-RGZ, QFN NiPdAu, Cu Test Results Mold Compound: Mount Compound: Bond Wire: Conditions Manufacturability (Assembly) (per mfg. Site specification) **High Temp Storage Bake 175C (363 Hrs) **Temperature Cycle -65/150C (500 cyc) Notes **- Preconditioning sequence: Level 2-260C. Texas Instruments, Inc. 435370 439525 1.0 Mil Dia., Cu Sample Size/Fail Lot# 1 Lot# 2 Pass 77/0 77/0 77/0 77/0 PCN# 20140403000 Qual Vehicle 2 : SN74CBTLV3245ARGYR (MSL 2-260C) Package Construction Details Assembly Site: # Pins-Designator, Family: Lead frame (Finish, Base): Qualification: Plan Reliability Test CRS 20-RGY, QFN NiPdAu, Cu Test Results Mold Compound: Mount Compound: Bond Wire: 435370 439525 1.0 Mil Dia., Cu Sample Size/Fail Conditions Lot# 1 Pass Manufacturability (Assembly) (per mfg. Site specification) 77/0 ** Biased HAST 130C/85%RH (96 Hrs) 77/0 ** Autoclave 121C (96 Hrs) 77/0 **Temperature Cycle -65/150C (500 cyc) 12/0 Moisture Sensitivity (level 2 @ 260C peak +5/-0C) Notes **- Preconditioning sequence: Level 2-260C. Qual Vehicle 3 : TLV320AIC3104IRHBR (MSL 2-260C) Package Construction Details Assembly Site: # Pins-Designator, Family: Lead frame (Finish, Base): Qualification: Plan Reliability Test CRS 32-RHB, QFN NiPdAu, Cu Test Results Mold Compound: Mount Compound: Bond Wire: Conditions Manufacturability (Assembly) (per mfg. Site specification) **High Temp Storage Bake 170C (420 Hrs) ** Autoclave 121C (96 Hrs) **Temperature Cycle -65/150C (500 cyc) Moisture Sensitivity (level 2 @ 260C peak +5/-0C) Notes **- Preconditioning sequence: Level 2-260C. Texas Instruments, Inc. Lot# 2 Lot# 3 Pass 77/0 77/0 77/0 12/0 Pass 77/0 77/0 77/0 12/0 435370 439525 0.8 Mil Dia., Cu Sample Size/Fail Lot# 1 Lot# 2 Lot# 3 Pass 80/0 80/0 77/0 12/0 Pass 80/0 80/0 77/0 12/0 Pass 80/0 80/0 77/0 12/0 PCN# 20140403000 Qual Vehicle 4 : TPA6130A2RTJR (MSL 2-260C) Package Construction Details Assembly Site: # Pins-Designator, Family: Lead frame (Finish, Base): Qualification: Plan Reliability Test CRS 20-RTJ, QFN NiPdAu, Cu Test Results Mold Compound: Mount Compound: Bond Wire: 435370 439525 0.8 Mil Dia., Cu Sample Size/Fail Conditions Lot# 1 Lot# 2 Pass Manufacturability (Assembly) (per mfg. Site specification) 77/0 **Temperature Cycle -65/150C (500 cyc) Notes **- Preconditioning sequence: Level 2-260C. Qual Vehicle 5 : TPS65192RHDR (MSL 2-260C) Package Construction Details Assembly Site: # Pins-Designator, Family: Lead frame (Finish, Base): Qualification: Plan CRS 28-RHD, QFN NiPdAu, Cu Test Results Mold Compound: Mount Compound: Bond Wire: Reliability Test Conditions Manufacturability (Assembly) Electrical Characterization (per mfg. Site specification) - 77/0 435370 439525 1.0 Mil Dia., Cu Sample Size/Fail Pass Pass For questions regarding this notice, e-mails can be sent to the regional contacts shown below or your local Field Sales Representative. Location USA Europe Asia Pacific Japan Texas Instruments, Inc. E-Mail PCNAmericasContact@list.ti.com PCNEuropeContact@list.ti.com PCNAsiaContact@list.ti.com PCNJapanContact@list.ti.com PCN# 20140403000