TUSB217RGYRQ1

Product Folder Order Now Support & Community Tools & Software Technical Documents TUSB217-Q1 SLLSF89A – SEPTEMBER 2018 – REVISED DECEMBER 2018 TUSB217-Q1 USB High Speed Signal Conditioner 1 Features 3 Description • The TUSB217-Q1 is a third generation USB 2.0 high speed signal conditioner designed to compensate both AC loss (due to capacitive load) and DC loss (due to resistive loss) in the transmission channel. 1 • • • • • • • • • AEC-Q100 Qualified for Automotive Applications – Device Temperature Grade 2: –40°C to 105°C TA Wide Supply Voltage Range: 2.3 - 6.5 V Ultra-low USB Disconnect and Shutdown Power Consumption Provides USB 2.0 High Speed Signal Conditioning Compatible with USB 2.0, OTG 2.0 and BC 1.2 Support for Low Speed, Full Speed, High Speed Signaling Host/Device Agnostic Supports up to 5m Cable Length – Four Selectable Signal Boost (Edge Boost Along with DC Boost) Setting via External Pull Down Resistor – Three Selectable RX Sensitivity via Pull Up or Down Configurable Pin to Compensate ISI Jitter for High Loss Applications Scalable Solution - Daisy Chain Devices for High Loss Applications Pin Compatible with TUSB213 (5V) 2 Applications • • • • • • • • Automotive Infotainment Automotive Head Unit Automotive Media Hub Laptop/Desktop/Docking Stations Tablets/Cell Phones Televisions Active Cable, Cable Extenders Backplane The TUSB217-Q1 has a patented design that speeds up transition edges of USB 2.0 high speed signal with an edge booster and increases static levels with a DC boost function. In addition, the TUSB217-Q1 includes a pre-equalization function to improve the receiver sensitivity and compensate the ISI jitter in application with longer cable length. USB low speed and full speed signal characteristics are unaffected by the TUSB217-Q1. The TUSB217-Q1 improves signal quality without altering packet timing or adding propagation delay, making it ideal for applications that require low latency. The TUSB217-Q1 helps a system to pass the USB 2.0 high speed electrical near end eye compliance tests with a cable as long as 5 meters. The TUSB217-Q1 is compatible with the USB OnThe-Go (OTG) and Battery Charging (BC 1.2) protocols. Device Information PART NUMBER TUSB217-Q1 PACKAGE BODY SIZE (NOM) VQFN (14) 3.50 mm x 3.50 mm Simplified Schematic 2.3 ± 6.5V VCC USB Host Cable D2 D1 USB Connector GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TUSB217-Q1 SLLSF89A – SEPTEMBER 2018 – REVISED DECEMBER 2018 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 4 4 4 5 5 6 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Switching Characteristics .......................................... Timing Requirements ................................................ Detailed Description .............................................. 8 7.1 Overview ................................................................... 8 7.2 Functional Block Diagram ......................................... 8 7.3 Feature Description................................................... 8 7.4 Device Functional Modes.......................................... 8 7.5 TUSB217 Registers .................................................. 9 8 Application and Implementation ........................ 12 8.1 Application Information............................................ 12 8.2 Typical Application ................................................. 12 9 Power Supply Recommendations...................... 21 10 Layout................................................................... 22 10.1 Layout Guidelines ................................................. 22 10.2 Layout Example .................................................... 22 11 Device and Documentation Support ................. 23 11.1 11.2 11.3 11.4 11.5 11.6 Documentation Support ....................................... Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 23 23 23 23 23 23 12 Mechanical, Packaging, and Orderable Information ........................................................... 23 4 Revision History Changes from Original (September 2018) to Revision A • 2 Page Changed the document status From: Advanced Information To: Production data ............................................................... 1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: TUSB217-Q1 TUSB217-Q1 www.ti.com SLLSF89A – SEPTEMBER 2018 – REVISED DECEMBER 2018 5 Pin Configuration and Functions NC 2 NC 3 BOOST RSTN 1 14 RGY Package 14 Pin (VQFN) Top View 13 SCL/CD 12 VCC 11 SDA Thermal RX_SEN/ENA_HS 4 D2P 5 10 D1P D2M 6 9 D1M 8 RESERVED GND 7 Pad Not to scale Pin Functions PIN NAME BOOST NC RESERVED NO. (RGY) 1 INTERNAL PULLUP/PULLDOWN I/O I N/A DESCRIPTION USB High Speed boost select via external pull down resistor. Both edge boost and DC boost are controlled by a single pin in non-I2C mode. In I2C mode edge boost and DC boost can be individually controlled. Sampled upon power up. Does not recognize real time adjustments. Auto selects BOOST LEVEL = 3 when left floating. 2,3 I Leave unconnected 8 O Leave unconnected or connect a decoupling cap 0.1μF RX_SEN (1)/ENA_HS 4 I/O N/A In I2C mode: Reserved for TI test purpose. In non-I2C mode: At reset: 3-level input signal RX_SEN. USB High Speed RX Sensitivity Setting to Compensate ISI Jitter H (pin is pulled high) – high RX sensitivity (high loss channel) M (pin is left floating) – medium RX sensitivity (medium loss channel) L (pin is pulled low) – low RX sensitivity (low loss channel) After reset: Output signal ENA_HS. Flag indicating that channel is in High Speed mode. Asserted upon: 1. Detection of USB-IF High Speed test fixture from an unconnected state followed by transmission of USB TEST_PACKET pattern. 2. Squelch detection following USB reset with a successful HS handshake [HS handshake is declared to be successful after single chirp J chirp K pair where each chirp is within 18 μs – 128 μs]. D2P 5 I/O N/A USB High Speed positive port. D2M 6 I/O N/A USB High Speed negative port. GND 7 P N/A Ground D1M 9 I/O N/A USB High Speed negative port.. D1P 10 I/O N/A USB High Speed positive port. (1) Pull-down and pull-up resistors for RX_SEN pin must follow RRXSEN1 and RRXSEN2 resistor recommendations in non I2C mode. Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: TUSB217-Q1 3 TUSB217-Q1 SLLSF89A – SEPTEMBER 2018 – REVISED DECEMBER 2018 www.ti.com Pin Functions (continued) PIN NO. (RGY) SDA (2) 11 I/O VCC 12 P RSTN 14 SCL (2)/CD Thermal Pad (2) INTERNAL PULLUP/PULLDOWN I/O NAME I DESCRIPTION 500 kΩ PU 1.8 MΩ PD I2C Mode: Bidirectional I2C data pin [7-bit I2C slave address = 0x2C]. In non I2C mode: Reserved for TI test purpose. N/A Supply power 500 kΩ PU 1.8 MΩ PD Device disable/enable. Low – Device is at reset and in shutdown, and High - Normal operation. Recommend 0.1-µF external capacitor to GND to ensure clean power on reset if not driven. If the pin is driven, it must be held low until the supply voltage for the device reaches within specifications. 13 I/O When RSTN asserted there is a 500 kΩ PD In I2C mode: I2C clock pin [I2C address = 0x2C]. Non I2C mode: After reset: Output CD. Flag indicating that a USB device is attached (connection detected). Asserted from an unconnected state upon detection of DP or DM pull-up resistor. De-asserted upon detection of disconnect. TPAD N/A N/A Thermal Pad is electrically not connected to device ground. Connection to board ground is optional. Pull-up resistors for SDA and SCL pins in I2C mode should be RPull-up (depending on I2C bus voltage). If both SDA and SCL are pulled up at power-up the device enters into I2C mode. 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX Supply voltage range VCC –0.3 7 V Voltage range USB data DxP, DxM –0.3 5.5 V Voltage range on BOOST pin BOOST -0.3 1.98 V Voltage range other pins -0.3 5 V –65 150 °C 125 °C SCL, SDA, RX_SEN, RSTN Storage temperature, Tstg Maximum junction temperature, TJ (max) (1) UNIT Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE Electrostatic discharge V(ESD) (1) Human-body model (HBM), per AEC Q100-002 (1) HBM ESD Classification Level 2 ±2000 Charged-device model (CDM), per AEC Q100- 011 CDM ESD Classification Level C4A ±750 UNIT V AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM 5 VCC Supply voltage 2.3 TA Operating free-air temperature (AEC-Q100) –40 TJ Junction temperature (AEC-Q100) VI2C_BUS I2C Bus Voltage 4 1.62 Submit Documentation Feedback MAX UNIT 6.5 V 105 °C 115 °C 3.6 V Copyright © 2018, Texas Instruments Incorporated Product Folder Links: TUSB217-Q1 TUSB217-Q1 www.ti.com SLLSF89A – SEPTEMBER 2018 – REVISED DECEMBER 2018 Recommended Operating Conditions (continued) over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT DxP, DxM Voltage range USB data 0 3.6 V BOOST Voltage range BOOST pin 0 1.98 V SCL, SDA, RX_SEN, RSTN Voltage range other pins (SCL, SDA, RX_SEN, RSTN) 0 3.6 V 6.4 Thermal Information RGY (VQFN) (1) THERMAL METRIC UNIT 14 PINS RθJA Junction-to-ambient thermal resistance 49.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 52.8 °C/W RθJB Junction-to-board thermal resistance 24.2 °C/W ψJT Junction-to-top characterization parameter 2.2 °C/W ψJB Junction-to-board characterization parameter 24.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.5 Electrical Characteristics Over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT POWER IACTIVE_HS High Speed Active Current USB channel = HS mode. 480 Mbps traffic. VCC supply stable, with Boost = Max 22 36 mA IIDLE_HS High Speed Idle Current USB channel = HS mode, no traffic. VCC supply stable, Boost = Max 22 36 mA IHS_SUPSPEND High Speed Suspend Current USB channel = HS Suspend mode. VCC supply stable 0.75 1.4 mA IFS Full-Speed Current USB channel = FS mode, 12 Mbps traffic, Vcc supply stable 0.75 1.4 mA IDISCONN Disconnect Power Host side application. No device attachment. 0.80 1.4 mA ISHUTDN Shutdown Power RSTN driven low, VCC supply stable 35 95 µA CONTROL PIN LEAKAGE ILKG_FS Pin failsafe leakage current for SDA, RSTN VCC = 0 V, pin at VIH, max 10 15 µA ILKG_FS Pin failsafe leakage current for BOOST, RX_SEN VCC = 0 V, pin at VIH, max 6 10 µA ILKG_FS Pin failsafe leakage current for SCL VCC = 0 V, pin at VIH, max 70 nA V INPUT RSTN VIH High level input voltage 1.5 3.6 VIL Low-level input voltage 0 0.5 V IIH High level input current VIH = 3.6 V, RPU enabled ±15 µA IIL Low level input current VIL = 0V, RPU enabled ±20 µA INPUT RX_SEN (3-level input, for mid level leave pin floating) VIH High level input voltage RRXSEN1=47kΩ, RRXSEN2=10kΩ VCC4.3V 2.0 3.6 V (1) All typical values are at VCC = 5 V, and TA = 25°C. Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: TUSB217-Q1 5 TUSB217-Q1 SLLSF89A – SEPTEMBER 2018 – REVISED DECEMBER 2018 www.ti.com Electrical Characteristics (continued) Over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT Low level input voltage 22kΩ