TWL6040A3ZQZR

Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TWL6040 SWCS052B – AUGUST 2010 – REVISED AUGUST 2014 TWL6040 8-Channel Low-Power Audio Codec for Portable Applications 1 Device Overview 1.1 Features • Four Audio Digital-to-Analog Converter (DAC) Channels • Stereo Capless Headphone Drivers: – Up to 104-dB DR – Power Tune for Performance and Power Consumption Tradeoff • Stereo 8 Ω, 1.5 W per Channel Speaker Drivers • Differential Earpiece Driver • Stereo Line-Out • Two Audio Analog-to-Digital Converter (ADC) Channels: – 96-dBA SNR • Four Audio Inputs: – Three Differential Microphone Inputs – Stereo Line-In and FM Input • Two Vibrator and Haptics Feedback Channels: – Differential H-Bridge Drivers • Two Low-Noise Analog Microphone Bias Outputs • Two Digital Microphone Bias Outputs • Analog Low-Power Loop from Line-in to Headphone and Speaker Outputs 1.2 • • Applications Mobile and Smart Phones MP3 Players 1.3 • Dual Phase-Locked Loops (PLLs) for Flexible Clock Support: – 32-kHz Sleep Clock Input for System LowPower Playback Mode – 12-, 19.2-, 26-, and 38.4-MHz System Clock Input • Accessory Plug and Unplug Detection, Accessory Button Press Detection • Integrated Power Supplies: – Negative Charge Pump for Capless Headphone Driver – Two Low Dropout Voltage Regulators (LDOs) for High Power Supply Rejection Ratio (PSRR) 2 • I C Control • Thermal Protection: – Host Interrupt • Power Supplies: – Analog: 2.1 V – Digital I/O: 1.8 V – Battery: 2.3 to 5.5 V • Package 6-mm × 6-mm 120-Pin PBGA • Handheld Devices Description The TWL6040 device is an audio coder/decoder (codec) with a high level of integration providing analog audio codec functions for portable applications, as shown in Figure 1-1. The device contains multiple audio analog inputs and outputs, as well as microphone biases and accessory detection. The device is connected to the OMAP™ 4 host processor through a proprietary PDM interface for audio data communication enabling partitioning with optimized power consumption and performance. Multichannel audio data is multiplexed to a single wire for downlink (PDML) and uplink (PDMUL). The OMAP4 device provides the TWL6040 device with five PDM audio-input channels (DL0–DL4). Channels DL0–DL3 are connected to four parallel DAC channels multiplexed to stereo headphone (HSL, HSR), stereo speaker (HFL, HFR), and earpiece (EAR) or stereo line outputs (AUXL, AUXR). The stereo headphone path has a low-power (LP) mode operating from a 32-kHz sleep clock to enable more than 100 hours of MP3 playback time. Very-high dynamic range of 104 dBA is achieved when using the system clock input and DAC path high-performance (HP) mode. Class-AB headphone drivers provide a 1-Vrms capability output and are ground centered for capless connection to a headphone, thus enabling system size and cost reduction. The earpiece driver is a differential class-AB driver with 2 Vrms capability to a typical 32-Ω load or 1.4 Vrms to a typical 16-Ω load. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice. PRODUCT PREVIEW 1 TWL6040 SWCS052B – AUGUST 2010 – REVISED AUGUST 2014 www.ti.com Stereo speaker path has filterless class-D outputs with 1.5-W capability per channel. Output power maximization supply connections to an external boost is supported. Speaker drivers also support hearing aid coil loads. For vibrator and haptic feedback support, the TWL6040 has two PWM channels with independent input signals from DL4 or inter-integrated circuit (I2C). Vibrator drivers are differential H-bridge outputs, enabling fast acceleration and deceleration of vibrator motor. An external driver for a hearing aid coil or a piezo speaker requiring high voltage can be connected to line outputs. The TWL6040 supports three differential microphone inputs (MMIC, HMIC, and SMIC) and a stereo lineinput (AFML, AFMR) multiplexed to two parallel ADCs. The PDM output from the ADCs is transmitted to the OMAP4 processor through UL0 and UL1. AFML, AFMR inputs can also be looped to analog outputs (LB0, LB1). Two LDOs provide a voltage of 2.1 V to bias analog microphones (MBIAS and HBIAS). The maximum output current is 2 mA for each analog bias, allowing up to two microphones on one bias. Two LDOs provide a voltage of 1.8 V/1.85 V to bias digital microphones (DBIAS1 and DBIAS2). One bias generator can bias several digital microphones at the same time, with a total maximum output current of 10 mA. PRODUCT PREVIEW The TWL6040 has an integrated negative charge pump (NCP) and two LDOs (HS LDO and LS LDO) for high PSRR. The only external supply needed is 2.1 V, which is available from the 2.1-V DC-DC of the TWL6030 power-management IC (PMIC) in the OMAP4 system. By powering audio from low-noise 2.1-V DC-DC of low power consumption, high dynamic range and high output swing at headset output are achieved. All other supply inputs can be directly connected to battery or system 1.8-V I/O. Two integrated PLLs enable operation from a 12-, 19.2-, 26-, and 38.4-MHz system clock (MCLK) or, in LP playback mode, from a 32-kHz sleep clock (CLK32K). The frequency plan is based on a 48-kS/s audio data rate for all channels, and host processor uses sample-rate converters to interface with different sample rates (for example, 44.1 kHz). In the specific case of low-power audio playback, the TWL6040 supports the 44.1-kS/s and 48-kS/s rates. Transitions between sample rates or input clocks are seamless. Accessory plug and unplug detections are supported (PLUGDET). Some headsets have a manual switch for submitting send/end signal to the terminal through the microphone input pin. This feature is supported by a periodic accessory button press detection to minimize current consumption in sleep mode. Detection cycle properties can be programmed according to system requirements. Table 1-1. Device Information (1) PACKAGE BODY SIZE (NOM) TWL6040A2 PART NUMBER ZQZ (120) 6.00 mm × 6.00 mm TWL6040A3 ZQZ (120) 6.00 mm × 6.00 mm (1) 2 For more information, see Section 3, Mechanical Packaging and Orderable Information. Device Overview Copyright © 2010–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TWL6040 TWL6040 www.ti.com 1.4 SWCS052B – AUGUST 2010 – REVISED AUGUST 2014 Functional Block Diagram Figure 1-1 shows the system block diagram of the TWL6040 device. HBIAS HMBIAS MBIAS HMICP HMICN 0:30 dB MMBIAS VDDUL Uplink VDDDMBIAS DBIAS1 MMICN ADCL 1 GNDAMIC MMICP MicAmpL AAFL VDDAMBIAS VSSUL MicAmpR AAFR DMBIAS1 GNDDMIC ADCR 1 SMICP SMICN DBIAS2 DMBIAS2 0:30 dB LineInAmpR UL0 UL1 DL0 PDMUP PDMCLK PDM interface PDMCLKLB SDA SCL AFMR LineInAmpL DL1 DL2 LB0 AFML DL3 –18:24 dB DL4 PDMFRAME GPO1(2,3) LB1 EarDrv GNDVCM PRODUCT PREVIEW PDMDN VDDEAR EARP Interface EARN –24:6 dB HSLDrv 2 I C registers VSSEAR HSL PBKG 1 HSDACL –30:0 dB VDDV2V1 VDDLDO HSRDrv HSR LS LDO 1 HSDACR VDDDL –30:0 dB GNDLDO AUXLN CFLYP CFLYN Negative charge pump AUXRP Downlink AUXRN PGAL NCPOUT HFLDrv NCPFB VDDHFL HFLP Power REF REFP REFN VSSDL AUXLP VDDREGNCP GNDNCP VSSHS GNDHS HS LDO VSSLDOIN VSSLDO VDDHS 1 Reference temp sense HFLN HFDACL GNDHFL –52:6 dB PGAR GNDREF HFRDrv VDDHFR HFRP PLUGDET ACCONN VDDVIO Accessory connector detection 1 MCLK 1 PCM 8 8 HP PLL PCM to PWM 8 CLK32K VSSPLL GNDHFR –52:6 dB PDM to VDDPLL HFRN HFDACR VIBLDrv VDDVIBL VIBLP 1 VIBLN 1 GNDVIBL LP PLL Clock system 8 8 Osc 8 PCM to PWM VIBRDrv VDDVIBR VIBRP 1 1 VIBRN GNDVIBR SWCS044-001 Figure 1-1. Simplified Block Diagram Device Overview Copyright © 2010–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TWL6040 3 TWL6040 SWCS052B – AUGUST 2010 – REVISED AUGUST 2014 www.ti.com For the complete TWL60xx data sheet (SWCS044), contact your TI sales representative. PRODUCT PREVIEW 4 Device Overview Copyright © 2010–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TWL6040 TWL6040 www.ti.com SWCS052B – AUGUST 2010 – REVISED AUGUST 2014 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (January 2012) to Revision B Changed document to standard TI format ........................................................................................ 1 PRODUCT PREVIEW • Page Revision History Copyright © 2010–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TWL6040 5 TWL6040 SWCS052B – AUGUST 2010 – REVISED AUGUST 2014 www.ti.com 3 Mechanical Packaging and Orderable Information 3.1 Packaging Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. PRODUCT PREVIEW 6 Mechanical Packaging and Orderable Information Submit Documentation Feedback Product Folder Links: TWL6040 Copyright © 2010–2014, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 26-May-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TWL6040A3ZBHR ACTIVE NFBGA ZBH 120 2500 RoHS & Green SNAGCU Level-3-260C-168 HR -40 to 85 6040A3ZBH (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of