UC1846VTD2

UC1846-DIE www.ti.com SGLS409 – NOVEMBER 2012 CURRENT-MODE PWM CONTROLLER FEATURES 1 • • • • • Automatic Feed-Forward Compensation Programmable Pulse-by-Pulse Current Limiting Automatic Symmetry Correction in Push-Pull Configuration Enhanced Load-Response Characteristics Parallel Operation Capability for Modular Power Systems • • • • • Differential Current-Sense Amplifier With Wide Common-Mode Range Double Pulse Suppression Undervoltage Lockout Soft-Start Capability Shutdown Terminal DESCRIPTION The UC1846 control IC provides all of the necessary features to implement fixed-frequency, current-mode control schemes, while maintaining a minimum external parts count. The superior performance of this technique can be measured in improved line regulation, enhanced load-response characteristics, and a simpler, easier-to-design control loop. Topological advantages include inherent pulse-by-pulse current-limiting capability, automatic symmetry correction for push-pull converters, and the ability to parallel power modules, while maintaining equal current sharing. Protection circuitry includes built-in undervoltage lockout and programmable current limit, in addition to soft-start capability. A shutdown function is also available, which can initiate either a complete shutdown with automatic restart or latch the supply off. Other features include fully latched operation, double pulse suppression and deadline adjust capability. The UC1846 features low outputs in the OFF state. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE UC1846 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY UC1846VTD1 100 UC1846VTD2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated UC1846-DIE SGLS409 – NOVEMBER 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 10.5 mils. Silicon with backgrind Floating AlCu2 2000 nm Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated UC1846-DIE www.ti.com SGLS409 – NOVEMBER 2012 Table 1. Bond Pad Coordinates in Microns DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX C/S SS 1 2174.24 1661.16 2280.92 1767.84 VREF 2 2235.2 2026.92 2341.88 2133.6 C/S- 3 1996.44 2219.96 2103.12 2326.64 C/S+ 4 1635.76 2219.96 1742.44 2326.64 E/A+ 5 467.36 2219.96 574.04 2326.64 2326.64 E/A- 6 289.56 2219.96 396.24 COMP 7 142.24 1671.32 248.92 1778 CT 8 157.48 1270 264.16 1376.68 1046.48 RT 9 157.48 939.8 264.16 Sync 10 157.48 172.72 264.16 279.4 A Out 11 772.16 213.36 889 350.52 GND 12 1346.2 81.28 1463.04 208.28 VC 13 1341.12 472.44 1468.12 645.16 B Out 14 1920.24 213.36 2037.08 350.52 VIN 15 2255.52 320.04 2362.2 426.72 Shutdown 16 2214.88 1107.44 2321.56 1214.12 Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 PACKAGE OPTION ADDENDUM www.ti.com 25-Mar-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) UC1846VTD1 ACTIVE 0 100 RoHS & Green Call TI N / A for Pkg Type -55 to 125 UC1846VTD2 ACTIVE 0 10 RoHS & Green Call TI N / A for Pkg Type -55 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of