Please note that Cypress is an Infineon Technologies Company.
The document following this cover page is marked as “Cypress” document as this is the
company that originally developed the product. Please note that Infineon will continue
to offer the product to new and existing customers as part of the Infineon product
portfolio.
Continuity of document content
The fact that Infineon offers the following product as part of the Infineon product
portfolio does not lead to any changes to this document. Future revisions will occur
when appropriate, and any changes will be set out on the document history page.
Continuity of ordering part numbers
Infineon continues to support existing part numbers. Please continue to use the
ordering part numbers listed in the datasheet for ordering.
www.infineon.com
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
16-Mbit (2048K × 8/1024K × 16/512K × 32)
nvSRAM
16-Mbit (2048K × 8/1024K × 16/512K × 32) nvSRAM
Features
❐
16-Mbit nonvolatile static random access memory (nvSRAM)
❐ 25-ns, 30-ns, 35-ns, and 45-ns access times
❐ Internally organized as 2048K × 8 (CY14X116L),
1024K × 16 (CY14X116N), 512K × 32 (CY14X116S)
❐ Hands-off automatic STORE on power-down with only a
small capacitor
❐ STORE to QuantumTrap nonvolatile elements is initiated by
software, device pin, or AutoStore on power-down
❐ RECALL to SRAM initiated by software or power-up
■ High reliability
❐ Infinite read, write, and RECALL cycles
❐ 1 million STORE cycles to QuantumTrap
❐ Data retention: 20 years
■ Sleep mode operation
■ Low power consumption
❐ Active current of 75 mA at 45 ns
❐ Standby mode current of 650 A
❐ Sleep mode current of 10 A
■
■
Operating voltages:
❐ CY14B116X: VCC = 2.7 V to 3.6 V
❐ CY14E116X: VCC = 4.5 V to 5.5 V
■
Industrial temperature: –40 C to +85 C
■
Packages
❐ 44-pin thin small-outline package (TSOP II)
❐ 48-pin thin small-outline package (TSOP I)
❐ 54-pin thin small-outline package (TSOP II)
Cypress Semiconductor Corporation
Document Number: 001-67793 Rev. *P
•
❐
60-ball fine-pitch ball grid array (FBGA) package
165-ball fine-pitch ball grid array (FBGA) package
■
Restriction of hazardous substances (RoHS) compliant
■
Offered speeds
❐ 44-pin TSOP II: 25 ns, 35 ns and 45 ns
❐ 48-pin TSOP I: 30 ns, 35 ns and 45 ns
❐ 54-pin TSOP II: 25 ns, 35 ns and 45 ns
❐ 60-ball FBGA: 25 ns and 35 ns
❐ 165-ball FBGA: 25 ns, 35 ns, and 45 ns
Functional Description
The Cypress CY14X116L/CY14X116N/CY14X116S is a fast
SRAM, with a nonvolatile element in each memory cell. The
memory is organized as 2048K bytes of 8 bits each or 1024K
words of 16 bits each or 512K words of 32 bits each. The
embedded nonvolatile elements incorporate QuantumTrap
technology, producing the world’s most reliable nonvolatile
memory. The SRAM can be read and written an infinite number
of times. The nonvolatile data residing in the nonvolatile
elements do not change when data is written to the SRAM. Data
transfers from the SRAM to the nonvolatile elements (the
STORE operation) takes place automatically at power-down. On
power-up, data is restored to the SRAM (the RECALL operation)
from the nonvolatile memory. Both the STORE and RECALL
operations are also available under software control.
For a complete list of related documentation, click here.
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised September 19, 2019
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Logic Block Diagram[1, 2, 3]
V CC V CAP
POWER CONTROL
SLEEP MODE
CONTROL
A 0-A11
ROW DECODER
QUANTUMTRAP
4096 X 4096
STORE
STORE / RECALL
CONTROL
ZZ
HSB
RECALL
STATIC RAM
ARRAY
4096 X 4096
SOFTWARE
DETECT
A 2-A14
OE
[4]
CE
CONTROL LOGIC
OUTPUT BUFFERS
COLUMN IO
SENSE AMPS
DQ 0-DQ 31
INPUT BUFFERS
WE
BA /BLE
BB /BHE
BC
BD
ZZ
COLUMN DECODER
A 12-A20
Notes
1. Address A0–A20 for ×8 configuration, address A0–A19 for ×16 configuration and address A0–A18 for ×32 configuration.
2. Data DQ0–DQ7 for ×8 configuration, data DQ0–DQ15 for ×16 configuration and data DQ0–DQ31 for ×32 configuration.
3. BLE, BHE are applicable for ×16 configuration and BA, BB, BC, BD are applicable for ×32 configuration only.
4. TSOP II package is offered in single CE. TSOP I and BGA packages are offered in dual CE options. In this datasheet, for a dual CE device, CE refers to the internal
logical combination of CE1 and CE2 such that when CE1 is LOW and CE2 is HIGH, CE is LOW. For all other cases CE is HIGH.
Document Number: 001-67793 Rev. *P
Page 2 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Contents
Pinouts .............................................................................. 4
Pin Definitions .................................................................. 7
Device Operation .............................................................. 8
SRAM Read ................................................................ 8
SRAM Write ................................................................. 8
AutoStore Operation (Power-Down) ............................ 8
Hardware STORE (HSB) Operation ............................ 9
Hardware RECALL (Power-Up) .................................. 9
Software STORE ......................................................... 9
Software RECALL ....................................................... 9
Sleep Mode ............................................................... 10
Preventing AutoStore ................................................ 12
Data Protection .......................................................... 12
Maximum Ratings ........................................................... 13
Operating Range ............................................................. 13
DC Electrical Characteristics ........................................ 13
Data Retention and Endurance ..................................... 15
Capacitance .................................................................... 15
Thermal Resistance ........................................................ 15
AC Test Conditions ........................................................ 16
AC Switching Characteristics ....................................... 17
AutoStore/Power-Up RECALL Characteristics ............ 21
Sleep Mode Characteristics ........................................... 22
Document Number: 001-67793 Rev. *P
Software Controlled STORE
and RECALL Characteristics ......................................... 23
Hardware STORE Characteristics ................................. 25
Truth Table For SRAM Operations ................................ 26
For ×8 Configuration ................................................. 26
For ×8 Configuration ................................................. 26
For ×16 Configuration ............................................... 26
For ×16 Configuration ............................................... 27
For ×32 Configuration ............................................... 27
Ordering Information ...................................................... 28
Ordering Code Definitions ......................................... 29
Package Diagrams .......................................................... 30
Acronyms ........................................................................ 35
Document Conventions ................................................. 35
Units of Measure ....................................................... 35
Document History Page ................................................. 36
Sales, Solutions, and Legal Information ...................... 39
Worldwide Sales and Design Support ....................... 39
Products .................................................................... 39
PSoC® Solutions ...................................................... 39
Cypress Developer Community ................................. 39
Technical Support ..................................................... 39
Page 3 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Pinouts
Figure 1. Pin Diagram: 44-Pin TSOP II (×8)
NC
A20
A0
A1
A2
A3
A4
CE
DQ0
DQ1
VCC
VSS
DQ2
DQ3
WE
A5
A6
A7
A8
A9
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
44
43
42
41
40
39
44 - TSOP II
(x8)
Top View
(not to scale)
15
16
17
18
19
20
21
22
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
Figure 2. Pin Diagram: 54-Pin TSOP II (×16)
NC
A19
A0
HSB
NC[5]
A19
A18
A17
A16
A15
OE
DQ7
DQ6
VSS
VCC
DQ5
DQ4
VCAP
A14
A13
A1
A2
A3
A4
CE
DQ0
DQ1
DQ2
DQ3
VCC
VSS
DQ4
DQ5
DQ6
DQ7
WE
A5
A6
A7
A8
A9
NC
A12
A11
A10
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
54 - TSOP II
(x16)
Top View
(not to scale)
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
HSB
A18
A17
A16
A15
OE
BHE
BLE
DQ15
DQ14
DQ13
DQ12
VSS
VCC
DQ11
DQ10
DQ9
DQ8
VCAP
A14
A13
A12
A11
A10
NC
NC
NC
Figure 3. Pin Diagram: 48-Pin TSOP I (×8)
A15
A14
A13
A12
A11
A10
A9
A8
A19
[5]
NC
WE
CE2
VCAP
NC
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48 - TSOP I
(x8)
Top View
(not to scale)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
HSB
VSS
A20
DQ7
NC
DQ6
NC
DQ5
NC
DQ4
VCC
NC
DQ3
NC
DQ2
NC
DQ1
NC
DQ0
OE
VSS
CE1
A0
Note
5. Address expansion for 32-Mbit. NC pin not connected to die.
Document Number: 001-67793 Rev. *P
Page 4 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Pinouts (continued)
Figure 4. Pin Diagram: 48-Pin TSOP I (×16)
A15
A14
A13
A12
A11
A10
A9
A8
A19
[6]
NC
WE
CE2
VCAP
BHE
BLE
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
48 - TSOP I
(x16)
Top View
(not to scale)
A16
HSB
VSS
DQ15
DQ7
DQ 14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE
VSS
CE1
A0
Figure 5. 60-ball FBGA pinout (× 16)
60-FBGA
(x16)
Top View
(not to scale)
1
2
A
VSS
VSS
B
VSS
3
4
5
6
7
8
BLE
OE
A0
A1
A2
CE2
D
DQ8
BHE
A3
A4
CE1
DQ0
E
DQ9
DQ10
A5
A6
DQ1
DQ2
F
VSS
DQ11
A 17
A7
DQ3
VCC
G
VCC
DQ12
HSB
A16
DQ4
VSS
H
DQ14
DQ13
A 14
A 15
DQ5
DQ6
J
DQ15
VCAP
A12
A 13
WE
DQ7
K
A18
A8
A9
A 10
A 11
A 19
VSS
M
VSS
10
VSS
VSS
VSS
C
L
9
VSS
VSS
VSS
VSS
Note
6. Address expansion for 32-Mbit. NC pin not connected to die.
Document Number: 001-67793 Rev. *P
Page 5 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Pinouts (continued)
Figure 6. Pin Diagram: 165-Ball FBGA (×16)
1
2
3
4
5
6
7
8
9
10
11
A
NC
A6
A8
WE
BLE
CE1
NC
OE
A5
A3
NC
B
NC
DQ0
DQ1
A4
BHE
CE2
NC
A2
NC
NC
NC
C
ZZ
NC
NC
VSS
A0
A7
A1
VSS
NC
DQ15
DQ14
D
NC
DQ2
NC
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
E
NC
VCAP
NC
VCC
VSS
VSS
VSS
VCC
NC
DQ13
NC
F
NC
DQ3
NC
VCC
VCC
VSS
VCC
VCC
NC
NC
DQ12
G
HSB
NC
NC
VCC
VCC
VSS
VCC
VCC
NC
NC
NC
H
NC
NC
VCC
VCC
VCC
VSS
VCC
VCC
VCC
NC
NC
J
NC
NC
NC
VCC
VCC
VSS
VCC
VCC
NC
DQ8
NC
K
NC
NC
DQ4
VCC
VCC
VSS
VCC
VCC
NC
NC
NC
L
NC
DQ5
NC
VCC
VSS
VSS
VSS
VCC
NC
NC
DQ9
M
NC
NC
NC
VSS
VSS
VSS
VSS
VSS
NC
DQ10
NC
N
NC
DQ6
DQ7
VSS
A11
A10
A9
VSS
NC
NC
NC
P
NC
NC
NC
A13
A19
NC
A18
A12
NC
DQ11
NC
R
NC
NC
A15
NC
A17
NC
A16
NC[7]
A14
NC
NC
9
10
11
Figure 7. Pin Diagram: 165-Ball FBGA (×32)
1
2
3
4
5
6
7
8
A
NC
A6
A8
WE
BA
CE1
BC
OE
A5
A3
NC
B
NC
DQ0
DQ1
A4
BB
CE2
BD
A2
NC
NC
DQ31
C
ZZ
NC
DQ4
VSS
A0
A7
A1
VSS
NC
DQ27
DQ26
D
NC
DQ2
DQ5
VSS
VSS
VSS
VSS
VSS
NC
NC
DQ30
E
NC
VCAP
DQ6
VCC
VSS
VSS
VSS
VCC
NC
DQ25
DQ29
F
NC
DQ3
DQ7
VCC
VCC
VSS
VCC
VCC
NC
NC
DQ24
G
HSB
NC
DQ12
VCC
VCC
VSS
VCC
VCC
NC
NC
DQ28
H
NC
NC
VCC
VCC
VCC
VSS
VCC
VCC
VCC
NC
NC
J
NC
NC
DQ13
VCC
VCC
VSS
VCC
VCC
NC
DQ20
DQ19
K
NC
NC
DQ8
VCC
VCC
VSS
VCC
VCC
NC
NC
DQ18
L
NC
DQ9
DQ14
VCC
VSS
VSS
VSS
VCC
NC
NC
DQ21
M
NC
NC
DQ15
VSS
VSS
VSS
VSS
VSS
NC
DQ22
DQ17
N
NC
DQ10
DQ11
VSS
A11
A10
A9
VSS
NC
NC
DQ16
P
NC
NC
NC
A13
NC
NC
A18
A12
NC
DQ23
NC
A16
NC[7]
A14
NC
NC
R
NC
NC
A15
NC
A17
NC
Note
7. Address expansion for 32-Mbit. NC pin not connected to die.
Document Number: 001-67793 Rev. *P
Page 6 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Pin Definitions
Pin Name
I/O Type
A0–A20
Input
Description
Address inputs. Used to select one of the 2,097,152 bytes of the nvSRAM for the ×8 configuration.
A0–A19
Address inputs. Used to select one of the 1,048,576 words of the nvSRAM for the ×16 configuration.
A0–A18
Address inputs. Used to select one of the 524,288 words of the nvSRAM for the ×32 configuration.
DQ0–DQ7
Input/Output Bidirectional data I/O lines for the ×8 configuration. Used as input or output lines depending on
operation.
DQ0–DQ15
Bidirectional data I/O lines for the ×16 configuration. Used as input or output lines depending on
operation.
DQ0–DQ31
Bidirectional data I/O lines for ×32 configuration. Used as input or output lines depending on
operation.
WE
Input
Write Enable input, Active LOW. When selected LOW, data on the I/O pins is written to the specific
address location.
CE
Input
Chip Enable input in TSOP II package, Active LOW. When LOW, selects the chip. When HIGH,
deselects the chip.
Chip Enable input in FBGA package. The device is selected and a memory access begins on the
falling edge of CE1 (while CE2 is HIGH) or the rising edge of CE2 (while CE1 is LOW).
CE1, CE2
OE
Input
Output Enable, Active LOW. The Active LOW OE input enables the data output buffers during read
cycles. Deasserting OE HIGH causes the I/O pins to tristate.
BLE/BA[8]
Input
Byte Enable, Active LOW. When selected LOW, enables DQ7–DQ0.
BHE/BB[8]
Input
Byte Enable, Active LOW. When selected LOW, enables DQ15–DQ8.
BC[8]
BD[8]
ZZ[9]
Input
Byte Enable, Active LOW. When selected LOW, enables DQ23–DQ16.
Input
Byte Enable, Active LOW. When selected LOW, enables DQ31–DQ24.
Input
Sleep Mode Enable. When the ZZ pin is pulled LOW, the device enters a low-power Sleep mode and
consumes the lowest power. Since this input is logically AND’ed with CE, ZZ must be HIGH for normal
operation.
VCC
Power Supply Power supply inputs to the device.
VSS
Power Supply Ground for the device. Must be connected to ground of the system.
HSB
Input/Output Hardware STORE Busy (HSB).When LOW, this output indicates that a Hardware STORE is in
progress. When pulled LOW external to the chip it initiates a nonvolatile STORE operation. After each
Hardware and Software STORE operation, HSB is driven HIGH for a short time (tHHHD) with standard
output high current and then a weak internal pull-up resistor keeps this pin HIGH (external pull-up
resistor connection optional).
VCAP
Power Supply AutoStore capacitor. Supplies power to the nvSRAM during power loss to store data from SRAM to
nonvolatile elements.
NC
NC
No Connect. Die pads are not connected to the package pin.
Notes
8. BLE, BHE are applicable for ×16 configuration and BA, BB, BC, BD are applicable for ×32 configuration only.
9. Sleep mode feature is offered in 165-ball FBGA package only.
Document Number: 001-67793 Rev. *P
Page 7 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Device Operation
AutoStore Operation (Power-Down)
The CY14X116L/CY14X116N/CY14X116S nvSRAM is made up
of two functional components paired in the same physical cell.
These are an SRAM memory cell and a nonvolatile
QuantumTrap cell. The SRAM memory cell operates as a
standard fast static RAM. Data in the SRAM is transferred to the
nonvolatile cell (the STORE operation) automatically at
power-down, or from the nonvolatile cell to the SRAM (the
RECALL operation) on power-up. Both the STORE and RECALL
operations are also available under software control. Using this
unique architecture, all cells are stored and recalled in parallel.
During the STORE and RECALL operations, SRAM read and
write operations are inhibited. The CY14X116L/CY14X116N/
CY14X116S supports infinite reads and writes to the SRAM. In
addition, it provides infinite RECALL operations from the nonvolatile cells and up to 1 million STORE operations. See the Truth
Table For SRAM Operations on page 27 for a complete
description of read and write modes.
The CY14X116L/CY14X116N/CY14X116S stores data to the
nonvolatile QuantumTrap cells using one of the three storage
operations. These three operations are: Hardware STORE,
activated by the HSB; Software STORE, activated by an address
sequence; AutoStore, on device power-down. The AutoStore
operation is a unique feature of nvSRAM and is enabled by
default on the CY14X116L/CY14X116N/CY14X116S.
The CY14X116L/CY14X116N/CY14X116S performs a read
cycle whenever CE and OE are LOW, and WE, ZZ, and HSB are
HIGH. The address specified on pins A0–A20 or A0–A19 or A0–
A18 determines which of the 2,097,152 data bytes or 1,048,576
words of 16 bits or 524,288 words of 32 bits each are accessed.
Byte enables (BLE, BHE) determine which bytes are enabled to
the output, in the case of 16-bit words and byte enables (BA, BB,
BC, BD) determine which bytes are enabled to the output, in the
case of 32-bit words. When the read is initiated by an address
transition, the outputs are valid after a delay of tAA (read cycle 1).
If the read is initiated by CE or OE, the outputs are valid at tACE
or at tDOE, whichever is later (read cycle 2). The data output
repeatedly responds to address changes within the tAA access
time without the need for transitions on any control input pins.
This remains valid until another address change or until CE or
OE is brought HIGH, or WE or HSB is brought LOW.
Note If the capacitor is not connected to the VCAP pin, AutoStore
must be disabled using the soft sequence specified in the section
Preventing AutoStore on page 13. If AutoStore is enabled without
a capacitor on the VCAP pin, the device attempts an AutoStore
operation without sufficient charge to complete the STORE. This
corrupts the data stored in the nvSRAM.
Figure 8. AutoStore Mode
VCC
0.1 uF
VCC
10 k:
SRAM Read
During normal operation, the device draws current from VCC to
charge a capacitor connected to the VCAP pin. This stored
charge is used by the chip to perform a STORE operation during
power-down. If the voltage on the VCC pin drops below VSWITCH,
the part automatically disconnects the VCAP pin from VCC and a
STORE operation is initiated with power provided by the VCAP
capacitor.
WE
VCAP
V SS
VCAP
SRAM Write
A write cycle is performed when CE and WE are LOW and HSB
is HIGH. The address inputs must be stable before entering the
write cycle and must remain stable until CE or WE goes HIGH at
the end of the cycle. The data on the common I/O pins DQ0–
DQ31 is written into the memory if it is valid tSD before the end of
a WE-controlled write or before the end of a CE-controlled write.
The Byte Enable inputs (BLE, BHE determine which bytes are
written, in the case of 16-bit words and Byte Enable inputs (BA,
BB, BC, BD) determine which bytes are written, in the case of
32-bit words. Keep OE HIGH during the entire write cycle to
avoid data bus contention on the common I/O lines. If OE is left
LOW, the internal circuitry turns off the output buffers tHZWE after
WE goes LOW.
Document Number: 001-67793 Rev. *P
Figure 8 shows the proper connection of the storage capacitor
(VCAP) for the automatic STORE operation. Refer to DC
Electrical Characteristics on page 14 for the size of the VCAP. The
voltage on the VCAP pin is driven to VVCAP by a regulator on the
chip. A pull-up resistor should be placed on WE to hold it inactive
during power-up. This pull-up resistor is only effective if the WE
signal is in tristate during power-up. When the nvSRAM comes
out of power-up-RECALL, the host microcontroller must be
active or the WE held inactive until the host microcontroller
comes out of reset.
To reduce unnecessary nonvolatile STOREs, AutoStore and
Hardware STORE operations are ignored unless at least one
write operation has taken place (which sets a write latch) since
the most recent STORE or RECALL cycle. Software initiated
Page 8 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
STORE cycles are performed regardless of whether a write
operation has taken place.
Document Number: 001-67793 Rev. *P
Page 9 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Hardware STORE (HSB) Operation
The CY14X116L/CY14X116N/CY14X116S provides the HSB pin
to control and acknowledge the STORE operations. The HSB pin
is used to request a Hardware STORE cycle. When the HSB pin
is driven LOW, the device conditionally initiates a STORE
operation after tDELAY. A STORE cycle begins only if a write to
the SRAM has taken place since the last STORE or RECALL
cycle. The HSB pin also acts as an open drain driver (an internal
100-k weak pull-up resistor) that is internally driven LOW to
indicate a busy condition when the STORE (initiated by any
means) is in progress.
Note After each Hardware and Software STORE operation, HSB
is driven HIGH for a short time (tHHHD) with standard output high
current and then remains HIGH by an internal 100-k pull-up
resistor.
SRAM write operations that are in progress when HSB is driven
LOW by any means are given time (tDELAY) to complete before
the STORE operation is initiated. However, any SRAM write
cycles requested after HSB goes LOW are inhibited until HSB
returns HIGH. If the write latch is not set, HSB is not driven LOW
by the device. However, any of the SRAM read and write cycles
are inhibited until HSB is returned HIGH by the host microcontroller or another external source.
During any STORE operation, regardless of how it is initiated,
the device continues to drive the HSB pin LOW, releasing it only
when the STORE is complete. Upon completion of the STORE
operation, the nvSRAM memory access is inhibited for tLZHSB
time after the HSB pin returns HIGH. Leave the HSB unconnected if it is not used.
Hardware RECALL (Power-Up)
During power-up or after any low-power condition
(VCC < VSWITCH), an internal RECALL request is latched. When
VCC again exceeds the VSWITCH on power-up, a RECALL cycle
is automatically initiated and takes tHRECALL to complete. During
this time, the HSB pin is driven LOW by the HSB driver and all
reads and writes to nvSRAM are inhibited.
Software STORE
Data is transferred from the SRAM to the nonvolatile memory by
a software address sequence. A Software STORE cycle is
initiated by executing sequential CE or OE controlled read cycles
from six specific address locations in exact order. During the
Document Number: 001-67793 Rev. *P
STORE cycle, the previous nonvolatile data is first erased,
followed by a store into the nonvolatile elements. After a STORE
cycle is initiated, further reads and writes are disabled until the
cycle is completed.
Because a sequence of reads from specific addresses is used
for STORE initiation, it is important that no other read or write
accesses intervene in the sequence. Otherwise, the sequence is
aborted and no STORE or RECALL takes place.
To initiate the Software STORE cycle, the following read
sequence must be performed:
1. Read address 0x4E38 Valid Read
2. Read address 0xB1C7 Valid Read
3. Read address 0x83E0 Valid Read
4. Read address 0x7C1F Valid Read
5. Read address 0x703F Valid Read
6. Read address 0x8FC0 Initiate STORE cycle
The software sequence may be clocked with CE-controlled
reads or OE-controlled reads, with WE kept HIGH for all the six
read sequences. After the sixth address in the sequence is
entered, the STORE cycle commences and the chip is disabled.
HSB is driven LOW. After the tSTORE cycle time is fulfilled, the
SRAM is activated again for the read and write operation.
Software RECALL
Data is transferred from the nonvolatile memory to the SRAM by
a software address sequence. A software RECALL cycle is
initiated with a sequence of read operations in a manner similar
to the Software STORE initiation. To initiate the RECALL cycle,
perform the following sequence of CE or OE controlled read
operations:
1. Read address 0x4E38 Valid Read
2. Read address 0xB1C7 Valid Read
3. Read address 0x83E0 Valid Read
4. Read address 0x7C1F Valid Read
5. Read address 0x703F Valid Read
6. Read address 0x4C63 Initiate RECALL cycle
Internally, RECALL is a two-step procedure. First, the SRAM
data is cleared; then, the nonvolatile information is transferred
into the SRAM cells. After the tRECALL cycle time, the SRAM is
again ready for read and write operations. The RECALL
operation does not alter the data in the nonvolatile elements.
Page 10 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Sleep Mode
In Sleep mode, the device consumes the lowest power supply
current (IZZ). The device enters a low-power Sleep mode after
asserting the ZZ pin LOW. After the Sleep mode is registered,
the nvSRAM does a STORE operation to secure the data to the
nonvolatile memory and then enters the low-power mode. The
device starts consuming IZZ current after tSLEEP time from the
instance when the sleep mode is initiated. When the ZZ pin is
LOW, all input pins are ignored except the ZZ pin. The nvSRAM
is not accessible for normal operations while it is in sleep mode.
When the ZZ pin is de-asserted (HIGH), there is a delay tWAKE
before the user can access the device. If sleep mode is not used,
the ZZ pin should be tied to VCC.
Note When nvSRAM enters sleep mode, it initiates a nonvolatile
STORE cycle, which results in losing one endurance cycle for
every Sleep mode entry unless data has not been written to the
nvSRAM since the last nonvolatile STORE/RECALL operation.
Note If the ZZ pin is LOW during power-up, the device will not be
in Sleep mode. However, the I/Os are in tristate until the ZZ pin
is de-asserted (HIGH).
Figure 9. Sleep Mode (ZZ) Flow Diagram
Power Applied
After tHRECALL
After tWAKE
Device Ready
CE = HIGH
ZZ = HIGH
CE = LOW
ZZ = HIGH
CE = LOW; ZZ = HIGH
Active Mode
(ICC)
Standby Mode
(ISB)
CE = HIGH; ZZ = HIGH
CE = Don’t Care
ZZ = HIGH
ZZ = LOW
ZZ = LOW
Sleep Routine
After tSLEEP
Sleep Mode
(IZZ)
Document Number: 001-67793 Rev. *P
Page 11 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Table 1. Mode Selection
CE[10]
WE
OE
BLE, BHE / BA, BB, BC, BD[11]
A15–A0[12]
Mode
I/O
Power
H
X
X
X
X
Not selected
Output High Z
Standby
L
H
L
L
X
Read SRAM
Output Data
Active
L
L
X
L
X
Write SRAM
Input Data
Active
L
H
L
X
0x4E38
0xB1C7
0x83E0
0x7C1F
0x703F
0x8B45
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
AutoStore
Disable
Output Data
Output Data
Output Data
Output Data
Output Data
Output Data
Active [13]
L
H
L
X
0x4E38
0xB1C7
0x83E0
0x7C1F
0x703F
0x4B46
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
AutoStore
Enable
Output Data
Output Data
Output Data
Output Data
Output Data
Output Data
Active [13]
L
H
L
X
0x4E38
0xB1C7
0x83E0
0x7C1F
0x703F
0x8FC0
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Nonvolatile
STORE
Output Data Active ICC2 [13]
Output Data
Output Data
Output Data
Output Data
Output High Z
L
H
L
X
0x4E38
0xB1C7
0x83E0
0x7C1F
0x703F
0x4C63
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Nonvolatile
RECALL
Output Data
Output Data
Output Data
Output Data
Output Data
Output High Z
Active [13]
Notes
10. The TSOP II package is offered in single CE. TSOP I, and BGA packages are offered in dual CE options. In this datasheet, for a dual CE device, CE refers to the
internal logical combination of CE1 and CE2 such that when CE1 is LOW and CE2 is HIGH, CE is LOW. For all other cases CE is HIGH. Intermediate voltage levels
are not permitted on any of the chip enable pins (CE for the single chip enable device; CE1 and CE2 for the dual chip enable device).
11. BLE, BHE are applicable for the ×16 configuration and BA, BB, BC, BD are applicable for the ×32 configuration only.
12. While there are 21 address lines on the CY14X116L (20 address lines on the CY14X116N and 19 address lines on the CY14X116S), only 13 address lines (A14–A2)
are used to control software modes. The remaining address lines are don’t care.
13. The six consecutive address locations must be in the order listed. WE must be HIGH during all six cycles to enable a nonvolatile operation.
Document Number: 001-67793 Rev. *P
Page 12 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Preventing AutoStore
The AutoStore function is disabled by initiating an AutoStore
disable sequence. A sequence of read operations is performed
in a manner similar to the Software STORE initiation. To initiate
the AutoStore disable sequence, the following sequence of CE
or OE controlled read operations must be performed:
1. Read address 0x4E38 Valid Read
2. Read address 0xB1C7 Valid Read
3. Read address 0x83E0 Valid Read
4. Read address 0x7C1F Valid Read
5. Read address 0x703F Valid Read
6. Read address 0x8B45 AutoStore Disable
AutoStore is re-enabled by initiating an AutoStore enable
sequence. A sequence of read operations is performed in a
manner similar to the software RECALL initiation. To initiate the
AutoStore enable sequence, the following sequence of CE or OE
controlled read operations must be performed:
1. Read address 0x4E38 Valid Read
2. Read address 0xB1C7 Valid Read
3. Read address 0x83E0 Valid Read
Document Number: 001-67793 Rev. *P
4. Read address 0x7C1F Valid Read
5. Read address 0x703F Valid Read
6. Read address 0x4B46 AutoStore Enable
If the AutoStore function is disabled or re-enabled, a manual
software STORE operation must be performed to save the
AutoStore state through subsequent power-down cycles. The
part comes from the factory with AutoStore enabled and 0x00
written in all cells.
Data Protection
The CY14X116L/CY14X116N/CY14X116S protects data from
corruption during low-voltage conditions by inhibiting all
externally initiated
STORE and write operations.
The
low-voltage condition is detected when VCC is less than
VSWITCH. If the CY14X116L/CY14X116N/CY14X116S is in a
write mode at power-up (both CE and WE are LOW), after a
RECALL or STORE, the write is inhibited until the SRAM is
enabled after tLZHSB (HSB to output active). This protects against
inadvertent writes during power-up or brownout conditions.
Page 13 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage temperature ................................ –65 °C to +150 °C
Maximum accumulated storage time
At 150 °C ambient temperature ................................. 1000 h
At 85 °C ambient temperature ................................ 20 Years
Maximum junction temperature ................................. 150 C
Supply voltage on VCC relative to VSS
CY14B116X: ................................................–0.5 V to +4.1 V
CY14E116X: ................................................–0.5 V to +7.0 V
Package power dissipation capability
(TA = 25 °C) ................................................................ .1.0 W
Surface mount lead soldering temperature
(3 Seconds) ............................................................. +260 °C
DC output current
(1 output at a time, 1s duration) .................................. 20 mA
Static discharge voltage
(per MIL-STD-883, Method 3015) ......................... > 2001 V
Latch-up current ................................................... > 140 mA
Operating Range
Product
Range
Voltage applied to outputs
in high-Z state ..................................... –0.5 V to VCC + 0.5 V
CY14B116X Industrial
Input voltage ........................................–0.5 V to Vcc + 0.5 V
CY14E116X
Ambient
Temperature (TA)
VCC
–40 C to +85 C
2.7 V to 3.6 V
4.5 V to 5.5 V
Transient voltage (< 20 ns)
on any pin to ground potential ............ –2.0 V to VCC + 2.0 V
DC Electrical Characteristics
Over the Operating Range
Parameter
Description
VCC
Power supply
ICC1
Average VCC current
Min
Typ [14]
Max
Unit
CY14B116X
2.7
3.0
3.6
V
CY14E116X
Test Conditions
4.5
5.0
5.5
V
Values obtained
tRC = 25/30 ns
without output
loads (IOUT = 0 mA) tRC = 35 ns
tRC = 45 ns
–
–
95
mA
–
–
85
mA
–
–
75
mA
ICC2
Average VCC current during
STORE
All inputs don’t care, VCC = VCC (max).
Average current for duration tSTORE
–
–
10
mA
ICC3
Average VCC current at
tRC = 200 ns, VCC(Typ), 25 °C
All inputs cycling at CMOS Levels.
Values obtained without output loads
(IOUT = 0 mA).
–
50
–
mA
ICC4[15]
Average VCAP current during
AutoStore cycle
All inputs don’t care. Average current
for duration tSTORE
–
–
6
mA
ISB
VCC standby current
CE > (VCC – 0.2 V).
VIN < 0.2 V or
VIN > (VCC – 0.2 V).
‘Standby current
level after
nonvolatile cycle is
complete. Inputs
are static.
f = 0 MHz.
tRC = 25/30/35 ns
–
–
650
A
tRC = 45 ns
–
–
500
A
Notes
14. Typical values are at 25 °C, VCC = VCC(Typ). Not 100% tested.
15. This parameter is only guaranteed by design and is not tested.
Document Number: 001-67793 Rev. *P
Page 14 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
DC Electrical Characteristics (continued)
Over the Operating Range
Parameter
Description
Test Conditions
Min
Typ [14]
Max
Unit
IZZ
Sleep mode current
All inputs are static at CMOS Level
–
–
10
A
IIX[16]
Input leakage current (except
HSB)
VCC = VCC (max), VSS < VIN < VCC
–1
–
+1
A
Input leakage current (for HSB)
VCC = VCC (max), VSS < VIN < VCC
–100
–
+1
A
IOZ
Off state output leakage current
VCC = VCC(Max), VSS < VOUT < VCC,
CE or OE > VIH or BLE, BHE/BA, BB,
BC, BD > VIH or WE < VIL
–1
–
+1
A
VIH
Input HIGH voltage
2.0
–
VCC + 0.5
V
VIL
Input LOW voltage
VSS – 0.5
–
0.8
V
VOH
Output HIGH voltage
IOUT = –2 mA
2.4
–
–
V
VOL
Output LOW voltage
IOUT = 4 mA
–
–
0.4
V
VCAP[17]
Storage capacitor
Between VCAP pin and VSS
19.8
22.0
82.0
F
–
–
5.0
V
VVCAP[18, 19] Maximum voltage driven on VCAP VCC = VCC (max)
pin by the device
Notes
16. The HSB pin has IOUT = -2 uA for VOH of 2.4 V when both active HIGH and LOW drivers are disabled. When they are enabled standard VOH and VOL are valid. This
parameter is characterized but not tested.
17. Min VCAP value guarantees that there is a sufficient charge available to complete a successful AutoStore operation. Max VCAP value guarantees that the capacitor
on VCAP is charged to a minimum voltage during a Power-Up RECALL cycle so that an immediate power-down cycle can complete a successful AutoStore. Therefore
it is always recommended to use a capacitor within the specified min and max limits.
18. Maximum voltage on VCAP pin (VVCAP) is provided for guidance when choosing the VCAP capacitor. The voltage rating of the VCAP capacitor across the operating
temperature range should be higher than the VVCAP voltage.
19. These parameters are only guaranteed by design and are not tested.
Document Number: 001-67793 Rev. *P
Page 15 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Data Retention and Endurance
Over the Operating Range
Parameter
Description
DATAR
Data retention
NVC
Nonvolatile STORE operations
Min
Unit
20
Years
1,000,000
Cycles
Capacitance
In the following table, the capacitance parameters are listed.
Parameter [20]
Description
CIN
Input capacitance
CIO
Input/Output capacitance
COUT
Output capacitance
Test Conditions
Max
(All packages
except
60-ball FBGA and
165-ball FBGA)
Max
(60-ball FBGA
package and
165-ball FBGA
package)
Unit
8
10
pF
8
10
pF
8
10
pF
TA = 25 C, f = 1 MHz,
VCC = VCC(Typ)
Thermal Resistance
In the following table, the thermal resistance parameters are listed.
Parameter [20]
Description
JA
Thermal resistance
(junction to ambient)
JC
Thermal resistance
(junction to case)
Test Conditions
44-pin
TSOP II
48-ball
TSOP I
54-pin
TSOP II
60-ball
FBGA
165-ball Unit
FBGA
Test conditions follow
standard test methods
and procedures for
measuring
thermal
impedance, in accordance
with
EIA/JESD51.
44.6
35.6
41.1
21
15.6
C/W
2.4
2.33
4.6
3
2.9
C/W
Note
20. These parameters are only guaranteed by design and are not tested.
Document Number: 001-67793 Rev. *P
Page 16 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Figure 10. AC Test Loads and Waveforms
For 3 V (CY14B116X):
For Tristate specs
577
577
3.0 V
3.0 V
R1
R1
OUTPUT
OUTPUT
R2
789
CL
30 pF
R2
789
CL
5 pF
For 5 V (CY14E116X):
For Tristate specs
963
963
5.0 V
5.0 V
R1
R1
OUTPUT
OUTPUT
CL
30 pF
R2
512
CL
5 pF
R2
512
AC Test Conditions
Input pulse levels
CY14B116X
CY14E116X
0 V to 3 V
0 V to 3 V
Input rise and fall times (10%–90%)
VIH during address transitions.
42. TSOP II package is offered in single CE. TSOP I and BGA packages are offered in dual CE options. In this datasheet, for a dual CE device, CE refers to the internal
logical combination of CE1 and CE2 such that when CE1 is LOW and CE2 is HIGH, CE is LOW. For all other cases CE is HIGH. Intermediate voltage levels are not
permitted on any of the chip enable pins (CE for the single chip enable device; CE1 and CE2 for the dual chip enable device).
Document Number: 001-67793 Rev. *P
Page 21 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
AutoStore/Power-Up RECALL Characteristics
Over the Operating Range
Parameter
Description
Min
Max
Unit
tHRECALL [43]
Power-Up RECALL duration
–
30
ms
tSTORE [44]
STORE cycle duration
–
8
ms
tDELAY [45, 46]
Time allowed to complete SRAM write cycle
–
25
ns
VSWITCH
Low-voltage trigger level
CY14B116X
–
2.65
V
CY14E116X
–
4.40
V
150
–
s
tVCCRISE
[46]
VCC rise time
VHDIS[46]
HSB output disable voltage
–
1.9
V
tLZHSB[46]
HSB to output active time
–
5
s
tHHHD[46]
HSB HIGH active time
–
500
ns
Figure 16. AutoStore or Power-Up RECALL[47]
VCC
VSWITCH
VHDIS
[44]
t VCCRISE
Note
tHHHD
[44]
tSTORE
Note
tHHHD
[48]
Note
tSTORE
[48]
Note
HSB out
tDELAY
tLZHSB
tLZHSB
AutoStore
tDELAY
Power-Up
RECALL
tHRECALL
tHRECALL
Read & Write
Inhibited
(RWI)
Power-Up
RECALL
Read & Write
BROWN
OUT
AutoStore
Power-Up
RECALL
Read & Write
Power-down
AutoStore
Notes
43. tHRECALL starts from the time VCC rises above VSWITCH.
44. If an SRAM write has not taken place since the last nonvolatile cycle, no AutoStore or Hardware STORE takes place.
45. On a Hardware STORE and AutoStore initiation, SRAM write operation continues to be enabled for time tDELAY.
46. These parameters are only guaranteed by design and are not tested.
47. Read and Write cycles are ignored during STORE, RECALL, and while VCC is below VSWITCH.
48. During power-up and power-down, HSB glitches when HSB pin is pulled up through an external resistor.
Document Number: 001-67793 Rev. *P
Page 22 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Sleep Mode Characteristics
Over the Operating Range
Parameter
Description
Min
Max
Unit
tWAKE
Sleep mode exit time (ZZ HIGH to first access after wakeup)
–
30
ms
tSLEEP
Sleep mode enter time (ZZ LOW to CE don’t care)
–
8
ms
tZZL
ZZ active LOW time
50
–
ns
tWEZZ
Last write to sleep mode entry time
0
–
s
tZZH
ZZ active to DQ Hi-Z time
–
70
ns
Figure 17. Sleep Mode [49]
V CC
V
SWITCH
V
SWITCH
t
t
SLEEP
HRECALL
t
WAKE
ZZ
t
WEZZ
WE
t
DQ
Read & Write
Inhibited
(RWI)
ZZH
Data
Power-Up
RECALL
Read & Write
Sleep
Entry
Sleep
Sleep
Exit
Read & Write
Power-down
AutoStore
Note
49. Device initiates sleep routine and enters into Sleep mode after tSLEEP duration.
Document Number: 001-67793 Rev. *P
Page 23 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Software Controlled STORE and RECALL Characteristics
Over the Operating Range
Parameter [50, 51]
Description
25 ns
30 ns
35 ns
45 ns
Min
Max
Min
Max
Min
Max
Min
Max
Unit
tRC
STORE/RECALL initiation cycle
time
25
–
30
–
35
–
45
–
ns
tSA
Address setup time
0
–
0
–
0
–
0
–
ns
tCW
Clock pulse width
20
–
24
–
25
–
30
–
ns
tHA
Address hold time
0
–
0
–
0
–
0
–
ns
tRECALL
RECALL duration
–
600
–
600
–
600
–
600
s
tSS [52, 53]
Soft sequence processing time
–
500
–
500
–
500
–
500
s
Notes
50. The software sequence is clocked with CE controlled or OE controlled reads.
51. The six consecutive addresses must be read in the order listed in Table 1 on page 12. WE must be HIGH during all six consecutive cycles.
52. This is the amount of time it takes to take action on a soft sequence command. Vcc power must remain high to effectively register command.
53. Commands such as STORE and RECALL lock out I/O until operation is complete which further increases this time. See the specific command.
Document Number: 001-67793 Rev. *P
Page 24 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Figure 18. CE and OE Controlled Software STORE and RECALL Cycle[54]
tRC
Address
tRC
Address #1
tSA
[55]
Address #6
tCW
tCW
CE
tHA
tSA
tHA
tHA
tHA
OE
tHHHD
HSB (STORE only)
tHZCE
tLZCE
t DELAY
[56]
Note
tLZHSB
High Impedance
tSTORE/tRECALL
DQ (DATA)
RWI
Figure 19. AutoStore Enable and Disable Cycle
Address
tRC
tRC
Address #1
Address #6
tSA
[55]
CE
tCW
tCW
tHA
tSA
tHA
tHA
tHA
OE
tLZCE
tSS
tHZCE
Note
[56]
t DELAY
DQ (DATA)
RWI
Notes
54. The six consecutive addresses must be read in the order listed in Table 1 on page 12. WE must be HIGH during all six consecutive cycles.
55. TSOP II package is offered in single CE. TSOP I and BGA packages are offered in dual CE options. In this datasheet, for a dual CE device, CE refers to the internal
logical combination of CE1 and CE2 such that when CE1 is LOW and CE2 is HIGH, CE is LOW. For all other cases CE is HIGH. Intermediate voltage levels are not
permitted on any of the chip enable pins (CE for the single chip enable device; CE1 and CE2 for the dual chip enable device).
56. DQ output data at the sixth read may be invalid since the output is disabled at tDELAY time.
Document Number: 001-67793 Rev. *P
Page 25 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Hardware STORE Characteristics
Over the Operating Range
Parameter
Description
Min
Max
Unit
tDHSB
HSB to output active time when write latch not set
–
25
ns
tPHSB
Hardware STORE pulse width
15
–
ns
Figure 20. Hardware STORE Cycle[57]
Write Latch set
~
~
tPHSB
HSB (IN)
tSTORE
tHHHD
~
~
tDELAY
HSB (OUT)
tLZHSB
RWI
Write Latch not set
~
~
tPHSB
HSB (IN)
tDELAY
~
~
HSB (OUT)
HSB pin is driven HIGH to VCC only by internal
100 K: resistor, HSB driver is disabled
SRAM is disabled as long as HSB (IN) is driven LOW.
RWI
Figure 21. Soft Sequence Processing[58, 59]
Soft Sequence
Command
Address
[60]
Address #1
tSA
Address #6
tCW
tSS
Soft Sequence
Command
Address #1
tSS
Address #6
tCW
CE
V CC
Notes
57. If an SRAM write has not taken place since the last nonvolatile cycle, no AutoStore or Hardware STORE takes place.
58. This is the amount of time it takes to take action on a soft sequence command. Vcc power must remain high to effectively register command.
59. Commands such as STORE and RECALL lock out I/O until operation is complete which further increases this time. See the specific command.
60. TSOP II package is offered in single CE. TSOP I and BGA packages are offered in dual CE options. In this datasheet, for a dual CE device, CE refers to the internal
logical combination of CE1 and CE2 such that when CE1 is LOW and CE2 is HIGH, CE is LOW. For all other cases CE is HIGH. Intermediate voltage levels are not
permitted on any of the chip enable pins (CE for the single chip enable device; CE1 and CE2 for the dual chip enable device).
Document Number: 001-67793 Rev. *P
Page 26 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Truth Table For SRAM Operations
HSB should remain HIGH for SRAM Operations.
For ×8 Configuration
Single chip enable option (44-pin TSOP II package)
CE
WE
OE
Inputs and Outputs
Mode
Power
H
X
X
High-Z
Deselect/Power-down Standby
L
H
L
Data out (DQ0–DQ7)
Read
Active
L
H
H
High-Z
Output disabled
Active
L
L
X
Data in (DQ0–DQ7)
Write
Active
For ×8 Configuration
Dual chip enable option (48-pin TSOP I package)
CE1
CE2
WE
OE
Inputs and Outputs
Mode
Power
H
X
X
X
High-Z
Deselect/Power-down Standby
X
L
X
X
High-Z
Deselect/Power-down Standby
L
H
H
L
Data out (DQ0–DQ7)
Read
Active
L
H
H
H
High-Z
Output disabled
Active
L
H
L
X
Data in (DQ0–DQ7)
Write
Active
For ×16 Configuration
Single chip enable option (54-pin TSOP II package)
CE
WE
OE
BLE
BHE
H
X
X
X
X
High-Z
Deselect/Power-down Standby
L
X
X
H
H
High-Z
Output disabled
Active
L
H
L
L
L
Data out (DQ0–DQ15)
Read
Active
L
H
L
L
H
Data out (DQ0–DQ7);
DQ8–DQ15 in High-Z
Read
Active
L
H
L
H
L
Data out (DQ8–DQ15);
DQ0–DQ7 in High-Z
Read
Active
L
H
H
X
X
High-Z
Output disabled
Active
L
L
X
L
L
Data in (DQ0–DQ15)
Write
Active
L
L
X
L
H
Data in (DQ0–DQ7);
DQ8–DQ15 in High-Z
Write
Active
L
L
X
H
L
Data in (DQ8–DQ15);
DQ0–DQ7 in High-Z
Write
Active
Document Number: 001-67793 Rev. *P
Inputs and Outputs
Mode
Power
Page 27 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
For ×16 Configuration
Dual chip enable option (48-pin TSOP I package and 165-ball FBGA package)
CE1
CE2
WE
OE
BLE
BHE
Inputs and Outputs
Mode
Power
H
X
X
X
X
X
High-Z
Deselect/Power-down
Standby
X
L
X
X
X
X
High-Z
Deselect/Power-down
Standby
L
H
X
X
H
H
High-Z
Output disabled
Active
L
H
H
L
L
L
Data out (DQ0–DQ15)
Read
Active
L
H
H
L
L
H
Data out (DQ0–DQ7);
DQ8–DQ15 in High-Z
Read
Active
L
H
H
L
H
L
Data out (DQ8–DQ15);
DQ0–DQ7 in High-Z
Read
Active
L
H
H
H
X
X
High-Z
Output disabled
Active
L
H
L
X
L
L
Data in (DQ0–DQ15)
Write
Active
L
H
L
X
L
H
Data in (DQ0–DQ7);
DQ8–DQ15 in High-Z
Write
Active
L
H
L
X
H
L
Data in (DQ8–DQ15);
DQ0–DQ7 in High-Z
Write
Active
For ×32 Configuration
Dual chip enable option (165-ball FBGA package)
CE1 CE2 WE OE BA BB BC BD
DQ0–DQ7 DQ8–DQ15 DQ16–DQ23 DQ24–DQ31
Mode
Power
H
X
X
X
X
X
X
X
High-Z
High-Z
High-Z
High-Z
Deselect/Power-down Standby
X
L
X
X
X
X
X
X
High-Z
High-Z
High-Z
High-Z
Deselect/Power-down Standby
L
H
X
X
X
X
X
X
High-Z
High-Z
High-Z
High-Z
Selected
Active
L
H
H
L
L
L
L
L
Data out
Data out
Data out
Data out
Read all bits
Active
L
H
H
L
L
H
H
H
Data out
High-Z
High-Z
High-Z
Read
Active
L
H
H
L
H
L
H
H
High-Z
Data out
High-Z
High-Z
Read
Active
L
H
H
L
H
H
L
H
High-Z
High-Z
Data out
High-Z
Read
Active
L
H
H
L
H
H
H
L
High-Z
High-Z
High-Z
Data out
Read
Active
L
H
L
X
L
L
L
L
Data in
Data in
Data in
Data in
Write all bits
Active
L
H
L
X
L
H
H
H
Data in
High-Z
High-Z
High-Z
Write
Active
L
H
L
X
H
L
H
H
High-Z
Data in
High-Z
High-Z
Write
Active
L
H
L
X
H
H
L
H
High-Z
High-Z
Data in
High-Z
Write
Active
L
H
L
X
H
H
H
L
High-Z
High-Z
High-Z
Data in
Write
Active
L
H
H
H
X
X
X
X
High-Z
High-Z
High-Z
High-Z
Output disabled
Active
Document Number: 001-67793 Rev. *P
Page 28 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Ordering Information
Speed
(ns)
25
30
35
45
Ordering Code
Package
Diagram
Package Type
CY14B116L-ZS25XI
51-85087
44-pin TSOP II
CY14B116L-ZS25XIT
51-85087
44-pin TSOP II
CY14E116L-ZS25XI
51-85087
44-pin TSOP II
CY14E116L-ZS25XIT
51-85087
44-pin TSOP II
CY14B116N-ZSP25XI
51-85160
54-pin TSOP II
CY14B116N-ZSP25XIT
51-85160
54-pin TSOP II
CY14B116N-BA25XI
002-00193 60-ball FBGA
CY14B116N-BA25XIT
002-00193 60-ball FBGA
CY14B116N-BZ25XI
51-85195
165-ball FBGA
CY14B116N-BZ25XIT
51-85195
165-ball FBGA
CY14B116S-BZ25XI
51-85195
165-ball FBGA
CY14B116S-BZ25XIT
51-85195
165-ball FBGA
CY14B116N-Z30XI
51-85183
48-pin TSOP I
CY14B116N-Z30XIT
51-85183
48-pin TSOP I
CY14E116N-Z30XI
51-85183
48-pin TSOP I
CY14E116N-Z30XIT
51-85183
48-pin TSOP I
CY14B116S-BZ35XI
51-85195
165-ball FBGA
CY14B116S-BZ35XIT
51-85195
165-ball FBGA
CY14B116L-ZS45XI
51-85087
44-pin TSOP II
CY14B116L-ZS45XIT
51-85087
44-pin TSOP II
CY14B116N-Z45XI
51-85183
48-pin TSOP I
CY14B116N-Z45XIT
51-85183
48-pin TSOP I
CY14B116N-ZSP45XI
51-85160
54-pin TSOP II
CY14B116N-ZSP45XIT
51-85160
54-pin TSOP II
Operating
Range
Industrial
Industrial
Industrial
Industrial
All parts are Pb-free. Contact your local Cypress sales representative for availability of these parts.
Document Number: 001-67793 Rev. *P
Page 29 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Ordering Code Definitions
CY14 B 116 L - ZS 25 X I T
Option:
T - Tape & Reel
Blank - Std.
Pb-Free
Package:
ZS P- 44-TSOP II
ZS P- 48-TSOP I
ZSP - 54-TSOP II
BAP - 60-FBGA
BZA - 165-FBGA
Temperature:
I - Industrial (–40 to 85 °C)
Speed:
25 - 25 ns
30 - 30 ns
35 - 35 ns
45 - 45 ns
Data Bus:
L - ×8
N - ×16
S - ×32
Density:
116 - 16-Mbit
Voltage:
B - 3.0 V
E - 5.0 V
14 - nvSRAM
Cypress
Document Number: 001-67793 Rev. *P
Page 30 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Package Diagrams
Figure 22. 44-pin TSOP II Package Outline, 51-85087
51-85087 *E
Document Number: 001-67793 Rev. *P
Page 31 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Package Diagrams (continued)
Figure 23. 48-pin TSOP (18.4 × 12 × 1.2 mm) Package Outline, 51-85183
STANDARD PIN OUT (TOP VIEW)
2X (N/2 TIPS)
0.10
2X
2
1
N
SEE DETAIL B
A
0.10 C
A2
0.10
2X
8
R
B
E
(c)
5
GAUGE PLANE
e
9
N/2 +1
N/2
5
D1
D
0.20
2X (N/2 TIPS)
0.25 BASIC
0°
A1
C
PARALLEL TO
SEATING PLANE
C
L
SEATING PLANE
4
DETAIL A
B
A
B
SEE DETAIL A
0.08MM M C A-B
b
6
7
WITH PLATING
REVERSE PIN OUT (TOP VIEW)
e/2
3
1
N
7
c
c1
X
X = A OR B
b1
N/2
N/2 +1
DIMENSIONS
SYMBOL
MIN.
NOM.
MAX.
1.
2.
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN): INK OR LASER MARK.
1.00
1.05
4.
TO BE DETERMINED AT THE SEATING PLANE
0.20
0.23
A2
0.95
0.17
0.22
b
0.17
c1
0.10
0.16
c
0.10
0.21
D
20.00 BASIC
18.40 BASIC
E
12.00 BASIC
5.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
MOLD PROTRUSION ON E IS 0.15mm PER SIDE AND ON D1 IS 0.25mm PER SIDE.
6.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08mm TOTAL IN EXCESS OF b DIMENSION AT MAX.
MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON LOWER RADIUS OR
THE FOOT. MINIMUM SPACE BETWEEN PROTRUSION AND AN ADJACENT LEAD
TO BE 0.07mm .
7.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
0.10mm AND 0.25mm FROM THE LEAD TIP.
8.
LEAD COPLANARITY SHALL BE WITHIN 0.10mm AS MEASURED FROM THE
SEATING PLANE.
0.50 BASIC
0
0°
R
0.08
0.60
0.70
8
0.20
48
-C- . THE SEATING PLANE IS
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE
LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
0.27
D1
0.50
DIMENSIONS ARE IN MILLIMETERS (mm).
3.
b1
N
NOTES:
0.15
0.05
L
DETAIL B
1.20
A
A1
e
BASE METAL
SECTION B-B
9. DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
10. JEDEC SPECIFICATION NO. REF: MO-142(D)DD.
51-85183 *F
Document Number: 001-67793 Rev. *P
Page 32 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Package Diagrams (continued)
Figure 24. 54-pin TSOP II (22.4 × 11.84 × 1.0 mm) Package Outline, 51-85160
51-85160 *E
Document Number: 001-67793 Rev. *P
Page 33 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Package Diagrams (continued)
Figure 25. 60-ball FBGA (10 × 18 × 1.2 mm) BK60B Package Outline, 002-00193
002-00193 **
Document Number: 001-67793 Rev. *P
Page 34 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Package Diagrams (continued)
Figure 26. 165-ball FBGA (15 × 17 × 1.40 mm (0.50 Ball Diameter)) Package Outline, 51-85195
51-85195 *D
Document Number: 001-67793 Rev. *P
Page 35 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Acronyms
Acronym
Document Conventions
Description
Units of Measure
CMOS
Complementary Metal Oxide Semiconductor
EIA
Electronic Industries Alliance
°C
degrees celsius
FBGA
Fine-Pitch Ball Grid Array
Hz
hertz
I/O
Input/Output
Kbit
kilobit
JESD
JEDEC Standards
kHz
kilohertz
nvSRAM
nonvolatile Static Random Access Memory
k
kilohm
RoHS
Restriction of Hazardous Substances
A
microampere
RWI
Read and Write Inhibited
mA
milliampere
TSOP II
Thin Small Outline Package
F
microfarad
Mbit
megabit
MHz
megahertz
s
microsecond
ms
millisecond
ns
nanosecond
pF
picofarad
V
volt
ohm
W
watt
Document Number: 001-67793 Rev. *P
Symbol
Unit of Measure
Page 36 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Document History Page
Document Title: CY14B116L/CY14B116N/CY14B116S/CY14E116L/CY14E116N/CY14E116S, 16-Mbit (2048K × 8/1024K ×
16/512K × 32) nvSRAM
Document Number: 001-67793
Rev.
ECN No.
Orig. of
Change
Submission
Date
Description of Change
**
3186783
GVCH
03/02/2011
New data sheet.
*A
3202367
GVCH
03/22/2011
Updated DC Electrical Characteristics (Changed maximum value of ISB
parameter from 3 mA to 500 µA).
*B
3459888
GVCH
12/09/2011
Changed status from Advance to Preliminary.
Updated Pinouts (Updated Figure 6 and Figure 7).
Updated Pin Definitions (Updated ZZ pin description).
Updated DC Electrical Characteristics (Changed maximum value of ICC1
parameter from 70 mA to 95 mA for tRC = 25 ns, changed maximum value of
ICC1 parameter from 50 mA to 75 mA for tRC = 45 ns, changed typical value of
ICC3 parameter from 35 mA to 50 mA, changed maximum value of ICC4
parameter from 10 mA to 6 mA, changed maximum value of ISB parameter
from 500 µA to 650 µA, added VCAP parameter values for CY14C116X,
changed minimum value of VCAP parameter from 20 µF to 19 µF, changed
typical value of VCAP parameter from 27 µF to 22 µF respectively, added Note
16 and referred the same note in VCAP parameter).
Updated Thermal Resistance (Added values).
Updated AC Switching Characteristics (Added Note 21 and referred the same
note in “Parameters” column).
Updated AutoStore/Power-Up RECALL Characteristics (Changed maximum
value of tHRECALL parameter from 40 ms to 60 ms for CY14C116X, changed
maximum value of tHRECALL parameter from 20 ms to 30 ms for
CY14B116X/CY14E116X, changed maximum value of tWAKE parameter from
40 ms to 60 ms for CY14C116X, changed maximum value of tWAKE parameter
from 20 ms to 30 ms for CY14B116X/CY14E116X).
Updated Software Controlled STORE and RECALL Characteristics (Changed
maximum value of tRECALL parameter from 300 µs to 600 µs, changed
maximum value of tSS parameter from 200 µs to 500 µs).
Updated Ordering Information:
Updated part numbers.
Updated Package Diagrams:
spec 51-85087 – Changed revision from *C to *D.
spec 51-85183 – Changed revision from *B to *C.
spec 51-85165 – Changed revision from *B to *C.
*C
3510173
GVCH
01/27/2012
Updated Ordering Information:
Updated part numbers.
Updated to new template.
*D
3733467
GVCH
09/14/2012
Updated Device Operation:
Updated Sleep Mode:
Added Figure 9.
Updated Maximum Ratings:
Removed “Ambient temperature with power applied” and its corresponding
details.
Added “Maximum junction temperature” and its corresponding details.
Document Number: 001-67793 Rev. *P
Page 37 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Document History Page (continued)
Document Title: CY14B116L/CY14B116N/CY14B116S/CY14E116L/CY14E116N/CY14E116S, 16-Mbit (2048K × 8/1024K ×
16/512K × 32) nvSRAM
Document Number: 001-67793
Rev.
ECN No.
Orig. of
Change
Submission
Date
Description of Change
*D (cont.)
3733467
GVCH
09/14/2012
Updated DC Electrical Characteristics:
Added VVCAP parameter and its corresponding details.
Added Note 18 and referred the same note in VVCAP parameter.
Referred Note 20 in VVCAP parameter.
Updated Capacitance:
Changed maximum value of CIN and COUT parameters from 7 pF to 11.5 pF.
Added Sleep Mode Characteristics.
Updated Package Diagrams:
spec 51-85087 – Changed revision from *D to *E.
*E
4198509
GVCH
01/23/2014
Updated Features:
Removed 2.5 V operating range voltage support.
Added 54-pin TSOP II package related information.
Updated Logic Block Diagram
Updated Device Operation:
Updated AutoStore Operation (Power-Down):
Removed sentence “The HSB signal is monitored by the system to detect if an
AutoStore cycle is in progress.”
Updated DC Electrical Characteristics:
Updated details in “Test Conditions” column corresponding to ISB parameter
and also updated the corresponding values.
Changed maximum value of VIH parameter from “VCC + 0.3 V” to “VCC + 0.5 V”.
Updated VCAP value from 20 uF to 19.8 uF.
Added Note 20.
Updated Capacitance:
Changed maximum value of CIN and COUT parameters from 11.5 pF to 8 pF.
Updated Sleep Mode:
Changed maximum value of tZZH parameter from 20 ns to 70 ns.
Updated Figure 9 and Figure 17 for more clarity.
Updated Truth Table For SRAM Operations for more clarity.
Updated Ordering Information:
Updated part numbers.
Updated Package Diagrams:
Added spec 51-85160 *D.
*F
4303589
GVCH
03/20/2014
Updated Thermal Resistance:
Updated values of JA and JC parameters.
Updated to new template.
Completing Sunset Review.
*G
4366689
GVCH
05/01/2014
Updated Device Operation:
Updated Sleep Mode:
Updated description.
Updated Maximum Ratings:
Added Note 14 and referred the same note in “Static discharge voltage”.
Updated DC Electrical Characteristics:
Removed “RTC running on backup power supply” in “Test Conditions” column
corresponding to IZZ parameter.
Updated AC Switching Characteristics:
Added Note 26 and referred the same note in tHA parameter.
Document Number: 001-67793 Rev. *P
Page 38 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Document History Page (continued)
Document Title: CY14B116L/CY14B116N/CY14B116S/CY14E116L/CY14E116N/CY14E116S, 16-Mbit (2048K × 8/1024K ×
16/512K × 32) nvSRAM
Document Number: 001-67793
Rev.
ECN No.
Orig. of
Change
Submission
Date
*G (cont.)
4366689
GVCH
05/01/2014
Updated Ordering Information:
Updated part numbers.
Added Errata.
*H
4409843
GVCH
06/17/2014
Updated DC Electrical Characteristics:
Updated maximum value of VVCAP parameter from “VCC – 0.5 V” to 5.0 V.
Removed CY14B116X and CY14E116X in “Test Condition” column
corresponding to VVCAP parameter.
*I
4417851
GVCH
06/24/2014
Updated DC Electrical Characteristics:
Added Note 15 and referred the same note in ICC4 parameter.
Updated Capacitance:
Changed maximum value of CIN and COUT parameters from 8 pF to 10 pF
corresponding to 165-ball FBGA package.
Added CIO parameter.
Updated Ordering Information:
No change in part numbers.
Updated Ordering Code Definitions.
*J
4432183
GVCH
07/07/2014
Updated DC Electrical Characteristics:
Changed maximum value of VCAP parameter from 120.0 F to 82.0 F.
*K
4456803
ZSK
07/31/2014
Removed Errata section.
Added note at the end of the document mentioning when the errata items were
fixed.
*L
4562106
GVCH
11/05/2014
Updated Functional Description:
Added “For a complete list of related documentation, click here.” at the end.
Updated Package Diagrams:
spec 51-85160 – Changed revision from *D to *E.
*M
4616093
GVCH
01/07/2015
Changed status from Preliminary to Final.
Updated Package Diagrams:
spec 51-85183 – Changed revision from *C to *D.
*N
5364155
GVCH
22/07/2016
Added 60-ball FBGA package related information in all instances across the
document.
Updated Ordering Information:
Updated part numbers.
Updated Ordering Code Definitions.
Updated Package Diagrams:
Added spec 002-00193 **.
spec 51-85195 – Changed revision from *C to *D.
Updated to new template.
*O
6403761
ZSK
12/07/2018
Added 35 ns speed bin related information in all instances across the
document.
Updated Ordering Information:
No change in part numbers.
Updated Ordering Code Definitions.
Updated Package Diagrams:
spec 51-85183 – Changed revision from *D to *F.
Removed note at the end of the document mentioning when the errata items
were fixed.
Updated to new template.
*P
6677972
GVCH
09/19/2019
Updated Ordering Information
Document Number: 001-67793 Rev. *P
Description of Change
Page 39 of 40
CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
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© Cypress Semiconductor Corporation, 2006-2019. This document is the property of Cypress Semiconductor Corporation and its subsidiaries ("Cypress"). This document, including any software or
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Document Number: 001-67793 Rev. *P
Revised September 19, 2019
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