CY14V116N-BZ30XI

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Please continue to use the ordering part numbers listed in the datasheet for ordering. www.infineon.com CY14V116N 16-Mbit (1024K × 16) nvSRAM CY14V116N, 16-Mbit (1024K × 16) nvSRAM Features 16-Mbit nonvolatile static random access memory (nvSRAM) ❐ 30-ns and 45-ns access times ❐ Logically organized as 1024K × 16 ❐ Hands-off automatic STORE on power-down with only a small capacitor ❐ STORE to QuantumTrap nonvolatile elements is initiated by software, device pin, or AutoStore on power-down ❐ RECALL to SRAM initiated by software or power-up ■ High reliability ❐ Infinite read, write, and RECALL cycles ❐ 1 million STORE cycles to QuantumTrap ❐ Data retention: 20 years ■ Sleep mode operation ■ Low power consumption ❐ Active current of 75 mA at 45 ns ❐ Standby mode current of 650 µA ❐ Sleep mode current of 10 µA ■ Operating voltage ❐ Core VCC = 2.7 V to 3.6 V; I/O VCCQ = 1.65 V to 1.95 V ■ ■ Industrial temperature: –40 C to +85 C ■ 165-ball fine-pitch ball grid array (FBGA) package ■ Restriction of hazardous substances (RoHS) compliant Functional Description The Cypress CY14V116N is a fast SRAM, with a nonvolatile element in each memory cell. The memory is organized as 1024K words of 16 bits each. The embedded nonvolatile elements incorporate QuantumTrap technology, producing the world’s most reliable nonvolatile memory. The SRAM can be read and written an infinite number of times. The nonvolatile data residing in the nonvolatile elements do not change when data is written to the SRAM. Data transfers from the SRAM to the nonvolatile elements (the STORE operation) takes place automatically at power-down. On power-up, data is restored to the SRAM (the RECALL operation) from the nonvolatile memory. Both the STORE and RECALL operations are also available under software control. For a complete list of related documentation, click here. V CC V CAP V CCQ Logic Block Diagram POWER CONTROL SLEEP MODE CONTROL A 0-A11 ROW DECODER QUANTUMTRAP 4096 X 4096 STORE STORE / RECALL CONTROL ZZ HSB RECALL STATIC RAM ARRAY 4096 X 4096 SOFTWARE DETECT A 2-A14 OE CE CONTROL LOGIC OUTPUT BUFFERS COLUMN IO SENSE AMPS DQ 0-DQ 15 INPUT BUFFERS WE [1] BLE BHE ZZ COLUMN DECODER A 12-A19 Note 1. In this datasheet, CE refers to the internal logical combination of CE1 and CE2, such that when CE1 is LOW and CE2 is HIGH, CE is LOW. For all other cases CE is HIGH. Cypress Semiconductor Corporation Document Number: 001-75791 Rev. *J • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised September 24, 2019 CY14V116N Contents Pinout ................................................................................ 3 Pin Definitions .................................................................. 4 Device Operation .............................................................. 5 SRAM Read ................................................................ 5 SRAM Write ................................................................. 5 AutoStore Operation (Power-Down) ............................ 5 Hardware STORE (HSB) Operation ............................ 6 Hardware RECALL (Power-Up) .................................. 6 Software STORE ......................................................... 6 Software RECALL ....................................................... 6 Sleep Mode ................................................................. 8 Preventing AutoStore .................................................. 9 Data Protection ............................................................ 9 Maximum Ratings ........................................................... 10 Operating Range ............................................................. 10 DC Electrical Characteristics ........................................ 10 Data Retention and Endurance ..................................... 12 Capacitance .................................................................... 12 Thermal Resistance ........................................................ 12 AC Test Loads and Waveforms ..................................... 12 AC Test Conditions ........................................................ 12 Document Number: 001-75791 Rev. *J AC Switching Characteristics ....................................... 13 AutoStore/Power-Up RECALL Characteristics ............ 17 Sleep Mode Characteristics ........................................... 19 Software Controlled STORE and RECALL Characteristics ................................................................ 20 Hardware STORE Characteristics ................................. 22 Truth Table For SRAM Operations ................................ 23 Ordering Information ...................................................... 24 Ordering Code Definitions ......................................... 24 Package Diagram ............................................................ 25 Acronyms ........................................................................ 26 Document Conventions ............................................. 26 Units of Measure ....................................................... 26 Document History Page ................................................. 27 Sales, Solutions, and Legal Information ...................... 29 Worldwide Sales and Design Support ....................... 29 Products .................................................................... 29 PSoC® Solutions ...................................................... 29 Cypress Developer Community ................................. 29 Technical Support ..................................................... 29 Page 2 of 29 CY14V116N Pinout Figure 1. Pin Diagram: 165-Ball FBGA (×16) 1 2 3 4 5 6 7 8 9 10 11 A NC A6 A8 WE BLE CE1 NC OE A5 A3 NC B NC DQ0 DQ1 A4 BHE CE2 NC A2 NC NC NC C ZZ NC NC VSS A0 A7 A1 VSS NC DQ15 DQ14 D NC DQ2 NC VSS VSS VSS VSS VSS NC NC NC E NC VCAP NC VCCQ VSS VSS VSS VCCQ NC DQ13 NC F NC DQ3 NC VCCQ VCC VSS VCC VCCQ NC NC DQ12 G HSB NC NC VCCQ VCC VSS VCC VCCQ NC NC NC H NC NC VCCQ VCCQ VCC VSS VCC VCCQ VCCQ NC NC J NC NC NC VCCQ VCC VSS VCC VCCQ NC DQ8 NC K NC NC DQ4 VCCQ VCC VSS VCC VCCQ NC NC NC L NC DQ5 NC VCCQ VSS VSS VSS VCCQ NC NC DQ9 M NC NC NC VSS VSS VSS VSS VSS NC DQ10 NC N NC DQ6 DQ7 VSS A11 A10 A9 VSS NC NC NC P NC NC NC A13 A19 NC A18 A12 NC DQ11 NC R NC NC A15 NC A17 NC A16 NC[2] A14 NC NC Note 2. Address expansion for 32-Mbit. NC pin not connected to die. Document Number: 001-75791 Rev. *J Page 3 of 29 CY14V116N Pin Definitions Pin Name I/O Type A0–A19 Input Description Address inputs. Used to select one of the 1,048,576 words of the nvSRAM. DQ0–DQ15 Input/Output Bidirectional data I/O lines. Used as input or output lines depending on operation. WE Input Write Enable input, Active LOW. When selected LOW, data on the I/O pins is written to the specific address location. CE1, CE2 Input Chip Enable input. The device is selected and a memory access begins on the falling edge of CE1 (while CE2 is HIGH) or the rising edge of CE2 (while CE1 is LOW). OE Input Output Enable, Active LOW. The active LOW OE input enables the data output buffers during read cycles. Deasserting OE HIGH causes the I/O pins to tristate. BLE Input Byte Enable, Active LOW. When selected LOW, enables DQ7–DQ0. BHE Input Byte Enable, Active LOW. When selected LOW, enables DQ15–DQ8. ZZ Input Sleep Mode Enable. When the ZZ pin is pulled LOW, the device enters a low-power Sleep mode and consumes the lowest power. Because this input is logically AND’ed with CE, ZZ must be HIGH for normal operation. VCC VCCQ VSS Power supply Power. Power supply inputs to the core of the device. Power supply I/O Power. Power supply inputs for the inputs and outputs of the device. Power Supply Ground for the device. Must be connected to ground of the system. HSB Input/Output Hardware STORE Busy (HSB).When LOW, this output indicates that a Hardware STORE is in progress. When pulled LOW external to the chip, it initiates a nonvolatile STORE operation. After each Hardware and Software STORE operation, HSB is driven HIGH for a short time (tHHHD) with standard output high current and then a weak internal pull-up resistor keeps this pin HIGH (external pull-up resistor connection optional). VCAP Power Supply AutoStore capacitor. Supplies power to the nvSRAM during power loss to store data from SRAM to nonvolatile elements. NC NC No Connect. Die pads are not connected to the package pin. Document Number: 001-75791 Rev. *J Page 4 of 29 CY14V116N Device Operation The CY14V116N nvSRAM is made up of two functional components paired in the same physical cell. These are an SRAM memory cell and a nonvolatile QuantumTrap cell. The SRAM memory cell operates as a standard fast static RAM. Data in the SRAM is transferred to the nonvolatile cell (the STORE operation) automatically at power-down, or from the nonvolatile cell to the SRAM (the RECALL operation) on power-up. Both the STORE and RECALL operations are also available under software control. Using this unique architecture, all cells are stored and recalled in parallel. During the STORE and RECALL operations, SRAM read and write operations are inhibited. The CY14V116N supports infinite reads and writes to the SRAM. In addition, it provides infinite RECALL operations from the nonvolatile cells and up to 1 million STORE operations. See the Truth Table For SRAM Operations on page 23 for a complete description of read and write modes. During normal operation, the device draws current from VCC to charge a capacitor connected to the VCAP pin. This stored charge is used by the chip to perform a STORE operation during power-down. If the voltage on the VCC pin drops below VSWITCH, the part automatically disconnects the VCAP pin from VCC and a STORE operation is initiated with power provided by the VCAP capacitor. Note If the capacitor is not connected to the VCAP pin, AutoStore must be disabled using the soft sequence specified in the section Preventing AutoStore on page 9. If AutoStore is enabled without a capacitor on the VCAP pin, the device attempts an AutoStore operation without sufficient charge to complete the STORE. This corrupts the data stored in the nvSRAM. Figure 2. AutoStore Mode VCCQ VCC SRAM Read SRAM Write A write cycle is performed when CE and WE are LOW and HSB is HIGH. The address inputs must be stable before entering the write cycle and must remain stable until CE or WE goes HIGH at the end of the cycle. The data on the common I/O pins DQ0–DQ15 is written into the memory if it is valid tSD before the end of a WE-controlled write or before the end of a CE-controlled write. The Byte Enable inputs (BHE, BLE) determine which bytes are written. Keep OE HIGH during the entire write cycle to avoid data bus contention on common I/O lines. If OE is left LOW, the internal circuitry turns off the output buffers tHZWE after WE goes LOW. AutoStore Operation (Power-Down) The CY14V116N stores data to the nonvolatile QuantumTrap cells using one of the three storage operations. These three operations are: Hardware STORE, activated by the HSB; Software STORE, activated by an address sequence; AutoStore, on device power-down. The AutoStore operation is a unique feature of nvSRAM and is enabled by default on the CY14V116N device. Document Number: 001-75791 Rev. *J 0.1uF 0.1uF 10 k: The CY14V116N performs a read cycle whenever CE and OE are LOW, and WE, ZZ, and HSB are HIGH. The address specified on pins A0–A19 determines which of the 1,048,576 words of 16 bits each are accessed. Byte enables (BHE, BLE) determine which bytes are enabled to the output. When the read is initiated by an address transition, the outputs are valid after a delay of tAA (read cycle 1). If the read is initiated by CE or OE, the outputs are valid at tACE or at tDOE, whichever is later (read cycle 2). The data output repeatedly responds to address changes within the tAA access time without the need for transitions on any control input pins. This remains valid until another address change or until CE or OE is brought HIGH, or WE or HSB is brought LOW. VCCQ VCC WE VCAP VCAP VSS Figure 2 shows the proper connection of the storage capacitor (VCAP) for automatic STORE operation. Refer to DC Electrical Characteristics on page 10 for the size of the VCAP. The voltage on the VCAP pin is driven to VVCAP by a regulator on the chip. A pull-up resistor should be placed on WE to hold it inactive during power-up. This pull-up resistor is only effective if the WE signal is in tristate during power-up. When the nvSRAM comes out of power-up-RECALL, the host microcontroller must be active or the WE held inactive until the host microcontroller comes out of reset. To reduce unnecessary nonvolatile STOREs, AutoStore and Hardware STORE operations are ignored unless at least one write operation has taken place (which sets a write latch) since the most recent STORE or RECALL cycle. Software initiated STORE cycles are performed regardless of whether a write operation has taken place. Page 5 of 29 CY14V116N Hardware STORE (HSB) Operation The CY14V116N provides the HSB pin to control and acknowledge the STORE operations. The HSB pin is used to request a Hardware STORE cycle. When the HSB pin is driven LOW, the device conditionally initiates a STORE operation after tDELAY. A STORE cycle begins only if a write to the SRAM has taken place since the last STORE or RECALL cycle. The HSB pin also acts as an open drain driver (an internal 100-k weak pull-up resistor) that is internally driven LOW to indicate a busy condition when the STORE (initiated by any means) is in progress. Note After each Hardware and Software STORE operation, HSB is driven HIGH for a short time (tHHHD) with standard output high current and then remains HIGH by an internal 100-k pull-up resistor. SRAM write operations that are in progress when HSB is driven LOW by any means are given time (tDELAY) to complete before the STORE operation is initiated. However, any SRAM write cycles requested after HSB goes LOW are inhibited until HSB returns HIGH. If the write latch is not set, HSB is not driven LOW by the device. However, any of the SRAM read and write cycles are inhibited until HSB is returned HIGH by the host microcontroller or another external source. During any STORE operation, regardless of how it is initiated, the device continues to drive the HSB pin LOW, releasing it only when the STORE is complete. Upon completion of the STORE operation, the nvSRAM memory access is inhibited for tLZHSB time after the HSB pin returns HIGH. Leave the HSB unconnected if it is not used. Hardware RECALL (Power-Up) During power-up or after any low-power condition (VCC < VSWITCH), an internal RECALL request is latched. When VCC again exceeds the VSWITCH on power-up, a RECALL cycle is automatically initiated and takes tHRECALL to complete. During this time, the HSB pin is driven LOW by the HSB driver and all reads and writes to nvSRAM are inhibited. To initiate the Software STORE cycle, the following read sequence must be performed: 1. Read address 0x4E38 Valid Read 2. Read address 0xB1C7 Valid Read 3. Read address 0x83E0 Valid Read 4. Read address 0x7C1F Valid Read 5. Read address 0x703F Valid Read 6. Read address 0x8FC0 Initiate STORE cycle The software sequence may be clocked with CE-controlled reads or OE-controlled reads, with WE kept HIGH for all the six read sequences. After the sixth address in the sequence is entered, the STORE cycle commences and the chip is disabled. HSB is driven LOW. After the tSTORE cycle time is fulfilled, the SRAM is activated again for the read and write operation. Software RECALL Data is transferred from the nonvolatile memory to the SRAM by a software address sequence. A software RECALL cycle is initiated with a sequence of read operations in a manner similar to the Software STORE initiation. To initiate the RECALL cycle, perform the following sequence of CE or OE controlled read operations: 1. Read address 0x4E38 Valid Read 2. Read address 0xB1C7 Valid Read 3. Read address 0x83E0 Valid Read 4. Read address 0x7C1F Valid Read 5. Read address 0x703F Valid Read 6. Read address 0x4C63 Initiate RECALL cycle Internally, RECALL is a two-step procedure. First, the SRAM data is cleared; then, the nonvolatile information is transferred into the SRAM cells. After the tRECALL cycle time, the SRAM is again ready for read and write operations. The RECALL operation does not alter the data in the nonvolatile elements. Software STORE Data is transferred from the SRAM to the nonvolatile memory by a software address sequence. A Software STORE cycle is initiated by executing sequential CE or OE controlled read cycles from six specific address locations in exact order. During the STORE cycle, the previous nonvolatile data is first erased, followed by a store into the nonvolatile elements. After a STORE cycle is initiated, further reads and writes are disabled until the cycle is completed. Because a sequence of reads from specific addresses is used for STORE initiation, it is important that no other read or write accesses intervene in the sequence. Otherwise, the sequence is aborted and no STORE or RECALL takes place. Document Number: 001-75791 Rev. *J Page 6 of 29 CY14V116N Table 1. Mode Selection CE[3] H WE X OE X BHE, BLE X A15–A0[4] X Mode I/O Power Not selected Output High Z Standby L H L L X Read SRAM Output Data Active L L X L X Write SRAM Input Data Active L H L X 0x4E38 0xB1C7 0x83E0 0x7C1F 0x703F 0x8B45 Read SRAM Read SRAM Read SRAM Read SRAM Read SRAM AutoStore Disable Output Data Output Data Output Data Output Data Output Data Output Data Active[5] L H L X 0x4E38 0xB1C7 0x83E0 0x7C1F 0x703F 0x4B46 Read SRAM Read SRAM Read SRAM Read SRAM Read SRAM AutoStore Enable Output Data Output Data Output Data Output Data Output Data Output Data Active[5] L H L X 0x4E38 0xB1C7 0x83E0 0x7C1F 0x703F 0x8FC0 Read SRAM Read SRAM Read SRAM Read SRAM Read SRAM Nonvolatile STORE Output Data Output Data Output Data Output Data Output Data Output High Z Active ICC2[5] L H L X 0x4E38 0xB1C7 0x83E0 0x7C1F 0x703F 0x4C63 Read SRAM Read SRAM Read SRAM Read SRAM Read SRAM Nonvolatile RECALL Output Data Output Data Output Data Output Data Output Data Output High Z Active[5] Notes 3. In this datasheet, CE refers to the internal logical combination of CE1 and CE2 such that when CE1 is LOW and CE2 is HIGH, CE is LOW. Intermediate voltage levels are not permitted on any of the chip enable pins. 4. While there are 20 address lines on the CY14V116N, only 13 address lines (A14–A2) are used to control software modes. The remaining address lines are don’t care. 5. The six consecutive address locations must be in the order listed. WE must be HIGH during all six cycles to enable a nonvolatile operation. Document Number: 001-75791 Rev. *J Page 7 of 29 CY14V116N Sleep Mode In Sleep mode, the device consumes the lowest power supply current (IZZ). The device enters a low-power Sleep mode after asserting the ZZ pin LOW. After the Sleep mode is registered, the nvSRAM does a STORE operation to secure the data to the nonvolatile memory and then enters the low-power mode. The device starts consuming IZZ current after tSLEEP time from the instance when the Sleep mode is initiated. When the ZZ pin is LOW, all input pins are ignored except the ZZ pin. The nvSRAM is not accessible for normal operations while it is in Sleep mode. Note When nvSRAM enters the Sleep mode, it initiates a nonvolatile STORE cycle, which results in losing one endurance cycle for every Sleep mode entry unless the data was not written to the nvSRAM since the last nonvolatile STORE/RECALL operation. When the ZZ pin is de-asserted (HIGH), there is a delay tWAKE before you can access the device. If Sleep mode is not used, the ZZ pin should be tied to VCCQ. Figure 3. Sleep Mode (ZZ) Flow Diagram Power Applied After tHRECALL After tWAKE Device Ready CE = LOW ZZ = HIGH CE = HIGH ZZ = HIGH CE = LOW; ZZ = HIGH Active Mode (ICC) Standby Mode (ISB) CE = HIGH; ZZ = HIGH CE = Don’t Care ZZ = HIGH ZZ = LOW ZZ = LOW Sleep Routine After tSLEEP Sleep Mode (IZZ) Document Number: 001-75791 Rev. *J Page 8 of 29 CY14V116N Preventing AutoStore Data Protection The AutoStore function is disabled by initiating an AutoStore disable sequence. A sequence of read operations is performed in a manner similar to the Software STORE initiation. The CY14V116N protects data from corruption during low-voltage conditions by inhibiting all externally initiated STORE and write operations. The low-voltage condition is detected when VCC is less than VSWITCH. If the CY14V116N is in a Write mode at power-up (both CE and WE are LOW), after a RECALL or STORE, the write is inhibited until the SRAM is enabled after tLZHSB (HSB to output active). When VCC < VIODIS, I/Os are disabled (no STORE takes place). This protects against inadvertent writes during power-up or brown out conditions. To initiate the AutoStore disable sequence, the following sequence of CE or OE controlled read operations must be performed: 1. Read address 0x4E38 Valid Read 2. Read address 0xB1C7 Valid Read 3. Read address 0x83E0 Valid Read 4. Read address 0x7C1F Valid Read 5. Read address 0x703F Valid Read 6. Read address 0x8B45 AutoStore Disable AutoStore is re-enabled by initiating an AutoStore enable sequence. A sequence of read operations is performed in a manner similar to the software RECALL initiation. To initiate the AutoStore enable sequence, the following sequence of CE or OE controlled read operations must be performed: 1. Read address 0x4E38 Valid Read 2. Read address 0xB1C7 Valid Read 3. Read address 0x83E0 Valid Read 4. Read address 0x7C1F Valid Read 5. Read address 0x703F Valid Read 6. Read address 0x4B46 AutoStore Enable If the AutoStore function is disabled or re-enabled, a manual software STORE operation must be performed to save the AutoStore state through subsequent power-down cycles. The part comes from the factory with AutoStore enabled and 0x00 written in all cells. Document Number: 001-75791 Rev. *J Page 9 of 29 CY14V116N Maximum Ratings Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested. Storage temperature ................................ –65 C to +150 C Maximum accumulated storage time At 150 C ambient temperature ................................. 1000 h At 85 C ambient temperature ................................ 20 Years Maximum junction temperature ................................. 150 C Supply voltage on VCC relative to VSS .........–0.5 V to +4.1 V Supply voltage on VCCQ relative to VSS .....–0.5 V to +2.45 V Voltage applied to outputs in high-Z state ...................................–0.5 V to VCCQ + 0.5 V Input voltage .....................................–0.5 V to VCCQ + 0.5 V Transient voltage ( 2001 V Latch-up current ................................................... > 140 mA Operating Range Ambient VCC VCCQ Temperature (TA) Industrial –40 C to +85 C 2.7 V to 3.6 V 1.65 V to 1.95 V Range DC Electrical Characteristics Over the Operating Range Parameter Description VCC Core power supply VCCQ I/O power supply ICC1 Average VCC current ICCQ1 Average VCCQ current Test Conditions – Min Typ[6] Max Unit 2.7 3.0 3.6 V 1.65 1.80 1.95 V Values obtained without tRC = 30 ns output loads tRC = 45 ns (IOUT = 0 mA) – – 95 mA – – 75 mA Values obtained without tRC = 30 ns output loads tRC = 45 ns (IOUT = 0 mA) – – 30 mA – – 25 mA ICC2 Average VCC current during STORE All inputs don’t care, VCC = VCC (max). Average current for duration tSTORE – – 10 mA ICC3 All inputs cycling at CMOS levels. Average VCC current at tRC = 200 ns, VCC (typ), 25 °C Values obtained without output loads (IOUT = 0 mA). – 50 – mA ICCQ3 Average VCC current All inputs cycling at CMOS levels. at tRC = 200 ns, VCCQ (typ), 25 °C Values obtained without output loads (IOUT = 0 mA). – 15 – mA ICC4[7] Average VCAP current during AutoStore cycle – – 6 mA All inputs don’t care. Average current for duration tSTORE Notes 6. Typical values are at 25 °C, VCC = VCC (typ) and VCCQ = VCCQ (typ). Not 100% tested. 7. This parameter is only guaranteed by design and is not tested. 8. The HSB pin has IOUT = -4 µA for VOH of 1.07 V when both active HIGH and LOW drivers are disabled. When they are enabled standard VOH and VOL are valid. This parameter is characterized but not tested. 9. Min VCAP value guarantees that there is a sufficient charge available to complete a successful AutoStore operation. Max VCAP value guarantees that the capacitor on VCAP is charged to a minimum voltage during a Power-Up RECALL cycle so that an immediate power-down cycle can complete a successful AutoStore. Therefore, it is always recommended to use a capacitor within the specified min and max limits. 10. Maximum voltage on VCAP pin (VVCAP) is provided for guidance when choosing the VCAP capacitor. The voltage rating of the VCAP capacitor across the operating temperature range should be higher than the VVCAP voltage. 11. These parameters are only guaranteed by design and are not tested. Document Number: 001-75791 Rev. *J Page 10 of 29 CY14V116N DC Electrical Characteristics (continued) Over the Operating Range Parameter ISB Test Conditions Min Typ[6] Max Unit CE > (VCCQ – 0.2 V). tRC = 30 ns VIN < 0.2 V or tRC = 45 ns > (VCCQ – 0.2 V). Standby current level after nonvolatile cycle is complete. Inputs are static. f = 0 MHz. – – 650 µA – – 500 µA Description VCC standby current IZZ Sleep mode current All inputs are static at CMOS level – – 10 µA IIX[8] Input leakage current (except HSB) VCC = VCC (max), VSS < VIN < VCC –1 – +1 µA Input leakage current (for HSB) VCC = VCC (max), VSS < VIN < VCC –100 – +1 µA Off state output leakage current VCC = VCC (max), VSS < VOUT < VCC, –1 – +1 µA – 0.7 × VCCQ – VCCQ + 0.3 V IOZ CE or OE > VIH or BLE/BHE > VIH or WE < VIL VIH Input HIGH voltage VIL Input LOW voltage – Vss – 0.3 – 0.3 × VCCQ V VOH Output HIGH voltage IOUT = –1 mA VCCQ – 0.45 – – V VOL Output LOW voltage IOUT = 2 mA – – 0.45 V VCAP[9 VVCAP[10, 11] Storage capacitor Between VCAP pin and VSS 19.8 22.0 82.0 F Maximum voltage driven on VCAP pin by the device VCC = VCC (max) – – 5.0 V Notes 6. Typical values are at 25 °C, VCC = VCC (typ) and VCCQ = VCCQ (typ). Not 100% tested. 7. This parameter is only guaranteed by design and is not tested. 8. The HSB pin has IOUT = -4 µA for VOH of 1.07 V when both active HIGH and LOW drivers are disabled. When they are enabled standard VOH and VOL are valid. This parameter is characterized but not tested. 9. Min VCAP value guarantees that there is a sufficient charge available to complete a successful AutoStore operation. Max VCAP value guarantees that the capacitor on VCAP is charged to a minimum voltage during a Power-Up RECALL cycle so that an immediate power-down cycle can complete a successful AutoStore. Therefore, it is always recommended to use a capacitor within the specified min and max limits. 10. Maximum voltage on VCAP pin (VVCAP) is provided for guidance when choosing the VCAP capacitor. The voltage rating of the VCAP capacitor across the operating temperature range should be higher than the VVCAP voltage. 11. These parameters are only guaranteed by design and are not tested. Document Number: 001-75791 Rev. *J Page 11 of 29 CY14V116N Data Retention and Endurance Over the Operating Range Parameter Description DATAR Data retention NVC Nonvolatile STORE operations Min Unit 20 Years 1,000,000 Cycles Capacitance In the following table, the capacitance parameters are listed. Parameter [12] Description CIN Input capacitance CIO Input/Output capacitance COUT Output capacitance Test Conditions TA = 25 C, f = 1 MHz, VCC = VCC (typ), VCCQ = VCCQ (typ) Max Unit 10 pF 10 pF 10 pF Thermal Resistance In the following table, the thermal resistance parameters are listed. Parameter [12] Test Conditions 165-ball FBGA Unit Test conditions follow standard test methods and procedures for measuring thermal impedance, in accordance with EIA/JESD51. 15.6 C/W 2.9 C/W Description JA Thermal resistance (junction to ambient) JC Thermal resistance (junction to case) AC Test Loads and Waveforms Figure 4. AC Test Loads and Waveforms For Tristate specs 13636  514  1.8 V 1.8 V R1 R1 OUTPUT OUTPUT CL 30 pF R2 720  CL 5 pF R2 11538  AC Test Conditions Input pulse levels ................................................0 V to 1.8 V Input rise and fall times (10%–90%) ........................... < 3 ns Input and output timing reference levels ....................... 0.9 V Note 12. These parameters are only guaranteed by design and are not tested. Document Number: 001-75791 Rev. *J Page 12 of 29 CY14V116N AC Switching Characteristics Over the Operating Range Parameters [13] Cypress Parameter 30 ns Description Alt Parameter 45 ns Unit Min Max Min Max 30 – 45 ns SRAM Read Cycle tACE tACS Chip enable access time – [14] tRC Read cycle time 30 – 45 – ns tAA [15] tAA Address access time – 30 – 45 ns tDOE tOE Output enable to data valid – 14 – 20 ns tOHA[15] tLZCE [16] tHZCE [16, 17] tLZOE [16] tHZOE [16, 17] tPU [16] tPD [16] tOH Output hold after address change 3 – 3 – ns tLZ Chip enable to output active 3 – 3 – ns tHZ Chip disable to output inactive – 12 – 15 ns tOLZ Output enable to output active 0 – 0 – ns tOHZ Output disable to output inactive – 12 – 15 ns tPA Chip enable to power active 0 – 0 – ns tPS Chip disable to power standby – 30 – 45 ns tDBE - Byte enable to data valid – 14 – 20 ns tLZBE[16] tHZBE[16, 17] - Byte enable to output active 0 – 0 – ns - Byte disable to output inactive – 12 – 15 ns tRC SRAM Write Cycle tWC tWC Write cycle time 30 – 45 – ns tPWE tWP Write pulse width 24 – 30 – ns tSCE tCW Chip enable to end of write 24 – 30 – ns tSD tDW Data setup to end of write 14 – 15 – ns tHD tDH Data hold after end of write 0 – 0 – ns tAW tAW Address setup to end of write 24 – 30 – ns tSA tAS Address setup to start of write 0 – 0 – ns tHA tWR Address hold after end of write 0 – 0 – ns tHZWE [16, 17, 18] tWZ Write enable to output disable – 12 – 15 ns tLZWE [16] tOW Output active after end of write 3 – 3 – ns - Byte enable to end of write 24 – 30 – ns tBW Notes 13. Test conditions assume a signal transition time of 3 ns or less, timing reference levels of VCCQ/2, input pulse levels of 0 to VCCQ (typ), and output loading of the specified IOL/IOH and 30-pF load capacitance, as shown in Figure 4 on page 12. 14. WE must be HIGH during SRAM read cycles. 15. Device is continuously selected with CE, OE and BLE, BHE LOW. 16. These parameters are only guaranteed by design and are not tested. 17. tHZCE, tHZOE, tHZBE, and tHZWE are specified with a load capacitance of 5 pF. Transition is measured ±200 mV from the steady state output voltage. 18. If WE is LOW when CE goes LOW, the outputs remain in the high impedance state. Document Number: 001-75791 Rev. *J Page 13 of 29 CY14V116N Figure 5. SRAM Read Cycle 1: Address Controlled[19, 20, 21] tRC Address Address Valid tAA Data Output Output Data Valid Previous Data Valid tOHA Figure 6. SRAM Read Cycle 2: CE and OE Controlled[22, 23] Address Address Valid tRC [26] tHZCE tACE CE tAA tLZCE tHZOE tDOE OE tHZBE tLZOE tDBE BHE, BLE tLZBE Data Output High Impedance Output Data Valid tPU ICC Standby tPD Active Notes 19. WE must be HIGH during SRAM read cycles. 20. Device is continuously selected with CE, OE and BLE, BHE LOW. 21. HSB must remain HIGH during Read and Write cycles. 22. WE must be HIGH during SRAM read cycles. 23. HSB must remain HIGH during Read and Write cycles. Document Number: 001-75791 Rev. *J Page 14 of 29 CY14V116N Figure 7. SRAM Write Cycle 1: WE Controlled[27, 25, 28] tWC Address Address Valid tSCE tHA [26] CE tBW BHE, BLE tAW tPWE WE tSA tSD Data Input Input Data Valid tHZWE Data Output tHD Previous Data tLZWE High Impedance Notes 24. WE must be HIGH during SRAM read cycles. 25. HSB must remain HIGH during Read and Write cycles. 26. In this datasheet CE refers to the internal logical combination of CE1 and CE2 such that when CE1 is LOW and CE2 is HIGH, CE is LOW. Intermediate voltage levels are not permitted on any of the chip enable pins. 27. If WE is LOW when CE goes LOW, the outputs remain in the high impedance state. 28. CE or WE must be >VIH during address transitions. Document Number: 001-75791 Rev. *J Page 15 of 29 CY14V116N Figure 8. SRAM Write Cycle 2: CE Controlled[29, 30, 31] tWC Address Valid Address tSA tSCE tHA [32] CE tBW BHE, BLE tPWE WE tHD tSD Data Input Input Data Valid High Impedance Data Output Figure 9. SRAM Write Cycle 3: BHE, BLE Controlled[29, 30, 31] tWC Address Address Valid tSCE [32] CE tSA tHA tBW BHE, BLE tAW tPWE WE tSD Data Input Data Output tHD Input Data Valid High Impedance Notes 29. If WE is LOW when CE goes LOW, the outputs remain in the high-impedance state. 30. HSB must remain HIGH during Read and Write cycles. 31. CE or WE must be >VIH during address transitions. 32. In this datasheet, CE refers to the internal logical combination of CE1 and CE2 such that when CE1 is LOW and CE2 is HIGH, CE is LOW. Intermediate voltage levels are not permitted on any of the chip enable pins. Document Number: 001-75791 Rev. *J Page 16 of 29 CY14V116N AutoStore/Power-Up RECALL Characteristics Over the Operating Range Parameter tHRECALL [33] tSTORE [34] tDELAY [35, 36] VSWITCH [36] Description Min Max Unit Power-Up RECALL duration – 30 ms STORE cycle duration – 8 ms Time allowed to complete SRAM write cycle – 25 ns Low voltage trigger level – 2.65 V 150 – s VIODIS[37] I/O disable voltage on VCCQ – 1.5 V VHDIS[36] tLZHSB[36] tHHHD[36] HSB output disable voltage – 1.9 V HSB to output active time – 5 s HSB HIGH active time – 500 ns tVCCRISE VCC rise time Notes 33. tHRECALL starts from the time VCC rises above VSWITCH. 34. If an SRAM write has not taken place since the last nonvolatile cycle, no AutoStore or Hardware STORE takes place. 35. On a Hardware STORE and AutoStore initiation, SRAM write operation continues to be enabled for time tDELAY. 36. These parameters are only guaranteed by design and are not tested. 37. HSB is not defined below VIODIS voltage. Document Number: 001-75791 Rev. *J Page 17 of 29 CY14V116N Figure 10. AutoStore or Power-Up RECALL[38] VCC VSWITCH VIODIS VCCQ VIODIS t VCCRISE [39] tHHHD Note Note t HHHD [40] HSB out VCCQ [39] tSTORE tSTORE Note Note [40] tDELAY tLZHSB AutoStore t LZHSB tDELAY Power-Up RECALL tHRECALL tHRECALL Read & Write Inhibited (RWI ) Power-Up RECALL Read & Write Power-Up RECALL VCC BROWN OUT AutoStore Read Read Power-down AutoStore & & Write V Write CCQ BROWN OUT I/O Disable Notes 38. Read and Write cycles are ignored during STORE, RECALL, and while VCC is below VSWITCH. 39. If an SRAM write has not taken place since the last nonvolatile cycle, no AutoStore or Hardware STORE takes place. 40. During power-up and power-down, HSB glitches when HSB pin is pulled up through an external resistor. Document Number: 001-75791 Rev. *J Page 18 of 29 CY14V116N Sleep Mode Characteristics Over the Operating Range Parameter Description Min Max Unit tWAKE Sleep mode exit time (ZZ HIGH to first access after wakeup) – 30 ms tSLEEP Sleep mode enter time (ZZ LOW to CE don’t care) – 8 ms tZZL ZZ active LOW time 50 – ns tWEZZ Last write to Sleep mode entry time 0 – s tZZH ZZ active to DQ Hi-Z time – 70 ns Figure 11. Sleep Mode [41] V CC V SWITCH V SWITCH t t SLEEP HRECALL t WAKE ZZ t WEZZ WE t DQ Read & Write Inhibited (RWI) ZZH Data Power-Up RECALL Read & Write Sleep Entry Sleep Sleep Exit Read & Write Power-down AutoStore Note 41. Device initiates sleep routine and enters into Sleep mode after tSLEEP duration. Document Number: 001-75791 Rev. *J Page 19 of 29 CY14V116N Software Controlled STORE and RECALL Characteristics Over the Operating Range Parameter [42, 43] Description 30 ns 45 ns Unit Min Max Min Max 30 – 45 – ns tRC STORE/RECALL initiation cycle time tSA Address setup time 0 – 0 – ns tCW Clock pulse width 24 – 30 – ns tHA Address hold time 0 – 0 – ns RECALL duration – 600 – 600 s Soft sequence processing time – 500 – 500 s tRECALL tSS [44, 45] Notes 42. The software sequence is clocked with CE controlled or OE controlled reads. 43. The six consecutive addresses must be read in the order listed in Table 1 on page 7. WE must be HIGH during all six consecutive cycles. 44. This is the amount of time it takes to take action on a soft sequence command. Vcc power must remain high to effectively register command. 45. Commands such as STORE and RECALL lock out I/O until the operation is complete which further increases this time. See the specific command. Document Number: 001-75791 Rev. *J Page 20 of 29 CY14V116N Figure 12. CE and OE Controlled Software STORE and RECALL Cycle[46] tRC Address tRC Address #1 tSA [47] Address #6 tCW tCW CE tHA tSA tHA tHA tHA OE tHHHD HSB (STORE only) tHZCE tLZCE t DELAY [48] Note tLZHSB High Impedance tSTORE/tRECALL DQ (DATA) RWI Figure 13. AutoStore Enable and Disable Cycle Address tRC tRC Address #1 Address #6 tSA [47] CE tCW tCW tHA tSA tHA tHA tHA OE tLZCE tSS tHZCE Note [48] t DELAY DQ (DATA) RWI Notes 46. The six consecutive addresses must be read in the order listed in Table 1 on page 7. WE must be HIGH during all six consecutive cycles. 47. In this datasheet, CE refers to the internal logical combination of CE1 and CE2 such that when CE1 is LOW and CE2 is HIGH, CE is LOW. Intermediate voltage levels are not permitted on any of the chip enable pins. 48. DQ output data at the sixth read may be invalid because the output is disabled at tDELAY time. Document Number: 001-75791 Rev. *J Page 21 of 29 CY14V116N Hardware STORE Characteristics Over the Operating Range Parameter Description Min Max Unit tDHSB HSB to output active time when write latch not set – 25 ns tPHSB Hardware STORE pulse width 15 – ns Figure 14. Hardware STORE Cycle[49] Write Latch set ~ ~ tPHSB HSB (IN) tSTORE tHHHD ~ ~ tDELAY HSB (OUT) tLZHSB RWI Write Latch not set ~ ~ tPHSB HSB (IN) tDELAY ~ ~ HSB (OUT) HSB pin is driven HIGH to VCCQ only by internal 100 K: resistor, HSB driver is disabled SRAM is disabled as long as HSB (IN) is driven LOW. RWI Figure 15. Soft Sequence Processing[50, 51] Soft Sequence Command Address [52] Address #1 tSA Address #6 tCW tSS Soft Sequence Command Address #1 tSS Address #6 tCW CE V CC Notes 49. If an SRAM write has not taken place since the last nonvolatile cycle, no AutoStore or Hardware STORE takes place. 50. This is the amount of time it takes to take action on a soft sequence command. Vcc power must remain high to effectively register command. 51. Commands, such as STORE and RECALL, lock out I/O until the operation is complete which further increases this time. See the specific command. 52. In this datasheet, CE refers to the internal logical combination of CE1 and CE2 such that when CE1 is LOW and CE2 is HIGH, CE is LOW. Intermediate voltage levels are not permitted on any of the chip enable pins. Document Number: 001-75791 Rev. *J Page 22 of 29 CY14V116N Truth Table For SRAM Operations HSB should remain HIGH for SRAM Operations. CE1 CE2 WE OE BHE BLE H X X X X X High-Z Deselect/Power-down Standby X L X X X X High-Z Deselect/Power-down Standby L H X X H H High-Z Output disabled Active L H H L L L Data out (DQ0–DQ15) Read Active L H H L H L Data out (DQ0–DQ7); DQ8–DQ15 in High-Z Read Active L H H L L H Data out (DQ8–DQ15); DQ0–DQ7 in High-Z Read Active L H H H X X High-Z Output disabled Active L H L X L L Data in (DQ0–DQ15) Write Active L H L X H L Data in (DQ0–DQ7); DQ8–DQ15 in High-Z Write Active L H L X L H Data in (DQ8–DQ15); DQ0–DQ7 in High-Z Write Active Document Number: 001-75791 Rev. *J Inputs and Outputs Mode Power Page 23 of 29 CY14V116N Ordering Information Speed (ns) 30 Ordering Code Package Diagram CY14V116N-BZ30XI 51-85195 Package Type 165-ball FBGA Operating Range Industrial CY14V116N-BZ30XIT All parts are Pb-free. Contact your local Cypress sales representative for availability of these parts. Ordering Code Definitions CY 14 V 116 N - BZ 30 X I T Option: T = Tape and Reel; Blank = Std. Temperature Grade: I = Industrial (40 oC to + 85 oC) Pb-free Speed: 30 = 30 ns; 45 = 45 ns Package Type: BZ = 165-ball FBGA Data Bus: N = x16 Density: 116 = 16-Mbit Voltage: V = 3.0 VCC, 1.8 V VCCQ 14 = nvSRAM Company ID: CY = Cypress Document Number: 001-75791 Rev. *J Page 24 of 29 CY14V116N Package Diagram Figure 16. 165-ball FBGA (15 mm × 17 mm × 1.40 mm) Package Outline, 51-85195 51-85195 *D Document Number: 001-75791 Rev. *J Page 25 of 29 CY14V116N Acronyms Document Conventions Table 2. Acronyms Used in this Document Units of Measure Acronym Description Table 3. Units of Measure CMOS Complementary Metal Oxide Semiconductor EIA Electronic Industries Alliance °C degrees Celsius FBGA Fine-Pitch Ball Grid Array Hz hertz I/O Input/Output Kbit kilobit JESD JEDEC Standards kHz kilohertz nvSRAM nonvolatile Static Random Access Memory k kiloohm RoHS Restriction of Hazardous Substances A microampere RWI Read and Write Inhibited mA milliampere F microfarad Mbit megabit MHz megahertz s microsecond ms millisecond ns nanosecond pF picofarad V volt  ohm W watt Document Number: 001-75791 Rev. *J Symbol Unit of Measure Page 26 of 29 CY14V116N Document History Page Document Title: CY14V116N, 16-Mbit (1024K × 16) nvSRAM Document Number: 001-75791 Rev. ECN No. Submission Date Description of Change ** 3516347 02/03/2011 New data sheet. *A 3733467 09/14/2012 Updated Device Operation: Updated Sleep Mode: Added Figure 3. Updated Maximum Ratings: Removed “Ambient temperature with power applied” and its details. Added “Maximum junction temperature” and its details. Updated DC Electrical Characteristics: Added VVCAP parameter and its details. Added Note 9 and referred the same note in VVCAP parameter. Updated Capacitance: Changed maximum value of CIN and COUT parameters from 7 pF to 11.5 pF. Added Sleep Mode Characteristics. *B 3944873 03/26/2013 Removed CY14W116N, CY14W116S, CY14V116S part related information in all instances across the document. Removed “VCC = 2.375 V to 2.625 V” operating range related information in all instances across the document. Removed 25 ns speed bin related information in all instances across the document. Added 30 ns speed bin related information in all instances across the document. Removed × 32 Configuration related information in all instances across the document. Updated Features: Replaced “I/O VCCQ = 1.65 V to VCC” with “I/O VCCQ = 1.65 V to 1.95 V”. Updated DC Electrical Characteristics: Updated details corresponding to VIH, VIL, VOL, VOH parameters. Updated Capacitance (Changed maximum value of CIN and COUT parameters from 11.5 pF to 8 pF). Updated AC Test Loads and Waveforms: Updated Figure 4. *C 4260504 01/24/2014 Updated Logic Block Diagram (for more clarity). Updated Device Operation: Updated AutoStore Operation (Power-Down): Updated description (Removed “The HSB signal is monitored by the system to detect if an AutoStore cycle is in progress.”). Updated Sleep Mode: Updated Figure 3 (for more clarity). Updated DC Electrical Characteristics: Splitted ISB parameter to two rows. Updated details in “Test Conditions” column corresponding to ISB parameter (Added “tRC = 30 ns” and “tRC = 45 ns”). Retained the existing values of ISB parameter for “tRC = 30 ns”. Added values of ISB parameter for “tRC = 45 ns”. Updated Note 8. Changed minimum value of VCAP parameter from 20 F to 19.8 F. Updated AC Switching Characteristics: Updated Note 17. Updated AutoStore/Power-Up RECALL Characteristics: Updated Figure 10 (for more clarity). Updated Sleep Mode Characteristics: Changed maximum value of tZZH parameter from 20 ns to 70 ns. Updated Figure 11 (for more clarity). Completing Sunset Review. *D 4417851 06/24/2014 Updated DC Electrical Characteristics: Added Note 7 and referred the same note in ICC4 parameter. Updated maximum value of VVCAP parameter from 4.5 V to 5.0 V. Updated Capacitance: Updated maximum value of CIN and COUT parameters from 8 pF to 10 pF. Added CIO parameter and its details. Updated Thermal Resistance: Changed value of JA parameter from 22.0 C/W to 15.6 C/W corresponding to “165-ball FBGA” package. Changed value of JC parameter from 15.28 C/W to 2.9 C/W corresponding to “165-ball FBGA” package. Document Number: 001-75791 Rev. *J Page 27 of 29 CY14V116N Document History Page (continued) Document Title: CY14V116N, 16-Mbit (1024K × 16) nvSRAM Document Number: 001-75791 Rev. ECN No. Submission Date *E 4432183 07/07/2014 Description of Change Updated DC Electrical Characteristics: Changed maximum value of VCAP parameter from 120.0 F to 82.0 F. *F 4456803 07/31/2014 No technical updates. *G 4571551 11/17/2014 Updated Functional Description: Added “For a complete list of related documentation, click here.” at the end. *H 4616093 01/07/2015 Changed status from Preliminary to Final. Completing Sunset Review. *I 6093693 03/09/2018 Updated Package Diagram: spec 51-85195 – Changed revision from *C to *D. Updated to new template. *J 6681289 09/24/2019 Updated Sales page and Copyright information. Updated Ordering Information: Removed CY14V116N-BZ45XI part number. Added CY14V116N-BZ30XIT part number. Document Number: 001-75791 Rev. *J Page 28 of 29 CY14V116N Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Arm® Cortex® Microcontrollers Automotive cypress.com/arm cypress.com/automotive Clocks & Buffers Interface cypress.com/clocks cypress.com/interface Internet of Things Memory cypress.com/iot cypress.com/memory Microcontrollers cypress.com/mcu PSoC cypress.com/psoc Power Management ICs Touch Sensing USB Controllers Wireless Connectivity PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP | PSoC 6 MCU Cypress Developer Community Community | Projects | Video | Blogs | Training | Components Technical Support cypress.com/support cypress.com/pmic cypress.com/touch cypress.com/usb cypress.com/wireless © Cypress Semiconductor Corporation, 2011-2019. This document is the property of Cypress Semiconductor Corporation and its subsidiaries ("Cypress"). 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Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. Document Number: 001-75791 Rev. *J Revised September 24, 2019 Page 29 of 29