| 15-81-0361 | MOLEX2[MolexElectronicsLtd.] | 15-81-0361 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-1501 | MOLEX2[MolexElectronicsLtd.] | 15-80-1501 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-1401 | MOLEX2[MolexElectronicsLtd.] | 15-80-1401 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0022282155 | MOLEX2[MolexElectronicsLtd.] | 0022282155 - 2.54mm (.100) Pitch KK® Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 15 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Kinked PC Tails - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-1061 | MOLEX2[MolexElectronicsLtd.] | 15-80-1061 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-0705 | MOLEX2[MolexElectronicsLtd.] | 15-80-0705 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-0683 | MOLEX2[MolexElectronicsLtd.] | 15-80-0683 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-0665 | MOLEX2[MolexElectronicsLtd.] | 15-80-0665 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-0663 | MOLEX2[MolexElectronicsLtd.] | 15-80-0663 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-0643 | MOLEX2[MolexElectronicsLtd.] | 15-80-0643 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 0022282147 | MOLEX2[MolexElectronicsLtd.] | 0022282147 - 2.54mm (.100) Pitch KK® Header, Breakaway, Right Angle, with Plastic Polarizing 42226-0224 - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-0601 | MOLEX2[MolexElectronicsLtd.] | 15-80-0601 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-0565 | MOLEX2[MolexElectronicsLtd.] | 15-80-0565 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0022282145 | MOLEX2[MolexElectronicsLtd.] | 0022282145 - 2.54mm (.100) Pitch KK® Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Kinked PC Tails - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-0523 | MOLEX2[MolexElectronicsLtd.] | 15-80-0523 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-0521 | MOLEX2[MolexElectronicsLtd.] | 15-80-0521 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-0501 | MOLEX2[MolexElectronicsLtd.] | 15-80-0501 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-0483 | MOLEX2[MolexElectronicsLtd.] | 15-80-0483 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-0481 | MOLEX2[MolexElectronicsLtd.] | 15-80-0481 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 15-80-0465 | MOLEX2[MolexElectronicsLtd.] | 15-80-0465 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
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