SCOPE:
MICROPROCESSOR SUPERVISORY CIRCUITS
Device Type
01
02
03
04
05
06
Generic Number
MAX690(x)/883B
MAX691(x)/883B
MAX692(x)/883B
MAX693(x)/883B
MAX694(x)/883B
MAX695(x)/883B
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:
Case Outline
Package Code
Outline Letter
Mil-Std-1835
MAXIM SMD
JA
P
GDIP1-T08 or CDIP2-T08
8 LEAD CERDIP
J08
JE
E
GDIP1-T16 or CDIP2-T16
16 LEAD CERDIP
J16
FB
X
CDFP3-F10
10 LEAD Flatpack
F10
LP
2
CQCC1-N20
20 Pin Leadless Chip
L20
Absolute Maximum Ratings
Terminal Voltage (with respect to GND)
VCC .................................................................................................................. -0.3V to +6.0V
VBATT ................................................................................................................ -0.3V to+6.0V
All other Inputs 1/ ................................................................................. -0.3V to (VOUT+0.5V)
Input Current
VCC ............................................................................................................................... 200mA
VBATT .............................................................................................................................. 50mA
GND ............................................................................................................................... 20mA
Output Current
VOUT .................................................................................................. Short-circuit protected
All other outputs ........................................................................................................... 20mA
Rate of Rise, VCC, VBATT ................................................................................................ 100V/µs
Lead Temperature (soldering, 10 seconds) ...................................................................... +300°C
Storage Temperature ......................................................................................... -65°C to +160°C
Continuous Power Dissipation ................................................................................... TA=+70°C
8 lead CERDIP(derate 8.0mW/°C above +70°C) ..................................................... 640mW
16 lead CERDIP(derate 10.0mW/°C above +70°C) ................................................. 800mW
10 lead Flatpack(derate 5.3mW/°C above +70°C) ................................................... 421mW
20 lead LCC(derate 9.1mW/°C above +70°C) ......................................................... 727mW
Junction Temperature TJ ............................................................................................ +150°C
Thermal Resistance, Junction to Case, ΘJC:
Case Outline 8 lead CERDIP..................................................................... 55°C/W
Case Outline 16 lead CERDIP................................................................... 50°C/W
Case Outline 10 lead Flatpack .................................................................. 85°C/W
Case Outline 20 leadless Chip carrier ....................................................... 20°C/W
Thermal Resistance, Junction to Ambient, ΘJA:
Case Outline 8 lead CERDIP................................................................... 125°C/W
Case Outline 16 lead CERDIP................................................................. 100°C/W
Case Outline 10 lead Flatpack ................................................................ 190°C/W
Case Outline 20 leadless Chip carrier ..................................................... 110°C/W
NOTE 1: The input voltage limits on PFI and WDI may be exceeded if the input current is less than 10mA.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of MAX690/691/692/693/694
/695/883B for /883B and SMD 5962-90711 and 5962-90712
19-2553
Page 2 of
Rev. C
8
Recommended Operating Conditions
Ambient Operating Range (TA) ............................................................... -55°C to +125°C
Supply Voltage Range (VCC) DASH 03 & 04 ............................................ +4.5V to +5.5V
Supply Voltage Range (VCC) DASH 01, 02, 05, 06 ................................. +4.75V to +5.5V
TABLE 1. ELECTRICAL TESTS:
TEST
Symbol
CONDITIONS
-55 °C ≤TA≤+125°C 2/
Unless otherwise specified
BATTERY-BACKUP SWITCHING
Operating Voltage
Range
VCC
Group A
Subgroup
Device
type
Limits
Min
Limits
Max
01,02,
05,06
4.75
5.5
1,2,3
4.5
2.0
5.5
4.25
1,2,3
03,04
01,02,
05,06
03,04
2.0
VCC-0.3
4.0
Units
V
Operating Voltage
Range
VBATT
V
Output Voltage
VOUT
IOUT=1mA
BATT
IOUT=50mA
IOUT=250µA, VCCVCC>VBATT+1V
Current
SBI
+=Discharge, -=Charge
BatteryBATT
Power-Up or Power-Down
Switchover,
SWTH
Threshold, VCC to
VBATT
BATT ON Output
BATT
ISINK=3.2mA
Voltage
ONOUT
BATT
BATT ON Output
BATT ON = VOUT
ONIOS
Short-Circuit
Current
BATT ON =0V Source Current
RESET AND WATCHDOG TIMING
Reset Voltage
RTH
Threshold
10
15
1
10
All
1
2,3
1,2,3
All
All
1,2,3
02,04,06
1,2,3
02,04,06
-0.10
-1.00
-200
+0.02
+0.02
+200
Reset Timeout
Delay
RTHH
RDEL
----------------------------
1,2,3
OSC SEL High, VCC=5V
9
10,11
9
10,11
µA
mV
0.4
V
60
mA
0.1
25
µA
01,02,
05,06
4.5
4.75
03,04
All
4.25
4.5
250
01,02
03,04
05,06
35
31
140
126
1,2,3
Reset Threshold
Hysteresis
µA
V
Electrical Characteristics of MAX690/691/692/693/694
/695/883B for /883B and SMD 5962-90711 and 5962-90712
70
78
280
310
19-2553
Page 3 of
mV
ms
Rev. C
8
TEST
Symbol
Watchdog Timeout
Period, Internal
Oscillator
WDINT
Watchdog Timeout
Period, External
Clock
CONDITIONS
2/
-55 °C ≤TA≤+125°C
Unless otherwise specified
Long Period, VCC=5V
9
10,11
Short Period, VCC=5V
9
10,11
9
10,11
Output ShortCircuit Current
WDI Input
Threshold Logic
Low
WDI Input
Threshold Logic
High
WDI Input Current
Device
type
Limits
Min
Limits
Max
Units
1.00
0.90
2.25
2.42
sec
70
62
3840
140
154
4097
ms
All
Long Period
WDEXT
Short Period
Minimum WDI
Input Pulse Width
______
RESET Output
Voltage High
______
RESET Output
Voltage Low
_________
LOWLINE Output
Voltage High
_________
LOWLINE Output
Voltage Low
____
WDO Output
Voltage High
____
WDO Output
Voltage Low
Reset Output
Voltage High
Reset Output
Voltage Low
Group A
Subgroup
9
10,11
9
10,11
1,2,3
WDIPW
VIL=0.4V, VIH=VCC(0.8)
_
RVOH
ISOURCE=1µA, VCC=5V
_
RVOL
ISINK=1.6mA, VCC=4.25V
__
LLVOH
__
LLVOL
Clock
Cycles
02,04,06
768
All
200
300
3.5
All
1025
1
ns
V
0.4
All
ISINK=800µA, VCC=4.25V
ISOURCE=1µA, VCC=5V
2,3
1,2,3
ISINK=1.6mA, VCC=4.25V
1
V
0.4
02,04,06
3.5
V
0.4
02,04,06
ISINK=800µA, VCC=4.25V
ISOURCE=1µA, VCC=5V
2,3
1,2,3
____
WDO
ISINK=1.6mA, VCC=4.25V
1
VOL
RVOH
ISINK=800µA, VCC=4.25V
ISOURCE=1µA, VCC=5V
RVOL
ISINK=1.6mA
____
WDO
02,04,06
V
0.4
All
3.5
V
VOH
0.4
02,04,06
2,3
1,2,3
V
0.4
02,04,06
3.5
1
V
0.4
02,04,06
IOS
V
2,3
ISINK=800µA
______
RESET=0V
0.4
All
1
25
µA
1,2,3
WDI
______
____ __
RESET, RESET, WDO, LL
VCC=5V
NOTE 3
VIL
WDI
VCC=5V
VIH
WDIIN
NOTE 3
02,04,06
1
1
2,3
All
1
2,3
All
WDI=VOUT
1
2,3
WDI=0V
1
2,3
3.5
4.0
V
V
50
80
µA
All
----------------------------
25
0.8
0.4
Electrical Characteristics of MAX690/691/692/693/694
/695/883B for /883B and SMD 5962-90711 and 5962-90712
-50
-80
19-2553
Page 4 of
Rev. C
8
TEST
Symbol
POWER-FAIL DETECTOR
PFI Input
PFIVTH
Threshold
PFI Input Current
PFIIIN
___
___
PFO Output
PFOVOH
Voltage High
___
___
PFOVOL
PFO Output
Voltage Low
___
___
PFOIOS
PFO Short-Circuit
Source Current
CHIP-ENABLE GATING
__
__
CE IN Thresholds
CEVIL
Logic Low
__
__
CE IN Thresholds
CEVIH
Logic High
__
__
CE INPI
CE IN Pull-Up
Current
__
__
CEVOH
CE OUT Output
Voltage High
__
CE Output Voltage
Low
__
CE Propagation
Delay
OSCILLATOR
OSC IN Input
Current Pull-Up
OSC SEL Input
Pull-Up Current
OSC IN Frequency
Range
OSC IN Frequency
with External
Capacitor
__
CEVOL
CONDITIONS
-55 °C ≤TA≤+125°C 2/
Unless otherwise specified
VCC=5V
ISOURCE=1µA, VCC=5V
ISINK=3.2mA
Device
type
Limits
Min
Limits
Max
Units
1,2,3
All
1.2
1.4
V
1,2,3
All
-25
25
nA
1,2,3
All
3.5
1
V
0.4
All
ISINK=1.6mA
___
PFI=VIH, PFO=0V
V
2,3
1,2,3
0.4
All
1.0
1
µA
25
0.8
V
02,04,06
0.4
2,3
1
3.0
02,04,06
V
2,3
ISOURCE=3.0mA,
VCC=4.75V
4.0
1,2,3
02,04,06
1,2,3
02,04,06
1.0
µA
25
VOUT-1.5
V
VOUT-0.05
ISOURCE=1µA, VCC=0V
ISINK=3.2mA
1
0.4
02,04,06
ISINK=1.6mA
___
tPDCE
Group A
Subgroup
V
2,3
9
VCC=5V
0.4
200
02,04,06
ns
10,11
300
25
µA
1
25
µA
02,04,06
0
250
kHz
02,04,06
4
OSCIIN
1,2,3
02,04,06
OSC
SELIN
OSC
INfrq
OSCIN
1,2,3
02,04,06
9,10,11
9
OSC SEL=0V
OSC SEL=0V, COSC=47pF
NOTE 4
kHz
NOTE 2: VCC=full operating range, VBATT=+2.8V.
NOTE 3: WDI is guaranteed to be in the mid-level (inactive) state if WDI is floating and VCC is in the operating
range. WDI is internally biased to 38% of VCC with an impedance of approximately 125kΩ
NOTE 4: Typical for design purposes only but not tested. Guaranteed for SMD 5962-90711 and 5962-90712.
----------------------------
Electrical Characteristics of MAX690/691/692/693/694
/695/883B for /883B and SMD 5962-90711 and 5962-90712
19-2553
Page 5 of
Rev. C
8
01
01
01
02
02
03
03
03
04
04
05
05
05
06
Package
8 pin CERDIP
10 pin Flatpack
20 pin LCC
8 pin CERDIP
20 pin LCC
8 pin CERDIP
10 pin Flatpack
20 pin LCC
8 pin CERDIP
20 pin LCC
8 pin CERDIP
10 pin Flatpack
20 pin LCC
8 pin CERDIP
ORDERING INFORMATION:
MAX690MJA/883B
MAX690MFB/883B
MAX690MLP/883B
MAX691MJA/883B
MAX691MLP/883B
MAX692MJA/883B
MAX692MFB/883B
MAX692MLP/883B
MAX693MJA/883B
MAX693MLP/883B
MAX694MJA/883B
MAX694MFB/883B
MAX694MLP/883B
MAX695MJA/883B
TERMINAL CONNECTIONS:
MAX690/692/694 MAX690/692/694
J8
F10
1
VOUT
VOUT
2
VCC
VCC
3
GND
GND
4
PFI
NC
5
____
PFI
PFO
6
WDI
____
PFO
7
______
WDI
RESET
8
VBATT
NC
9
10
______
RESET
VBATT
MAX690/692/694
L20
NC
VBATT
VOUT
VCC
GND
MAX691/693/695
J16
VBATT
VOUT
VCC
GND
BATT ON
MAX691/693
L20
NC
VBATT
VOUT
VCC
GND
NC
_________
LOWLINE
NC
NC
NC
NC
PFI
NC
____
PFO
WDI
__
CE OUT
__
CE IN
____
WDO
______
RESET
RESET
NC
PFI
13
14
____
PFO
WDI
15
NC
16
17
NC
NC
18
NC
19
______
RESET
NC
---------------------------
BATT ON
OSC IN
OSC SEL
11
12
20
SMD NUMBER
5962-9071201MPA
5962-9071201MXC
5962-9071201M2C
5962-9071101MPA
5962-9071101M2C
5962-9071202MPA
5962-9071202MXC
5962-9071202M2C
5962-9071102MPA
5962-9071102M2C
5962-9071203MPA
5962-9071203MXC
5962-9071203M2C
5962-9071103MPA
Electrical Characteristics of MAX690/691/692/693/694
/695/883B for /883B and SMD 5962-90711 and 5962-90712
_________
LOWLINE
OSC IN
OSC SEL
NC
PFI
____
PFO
WDI
__
CE OUT
NC
__
CE IN
____
WDO
______
RESET
RESET
19-2553
Page 6 of
Rev. C
8
QUALITY ASSURANCE
Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in MilStd-883.
Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:
1. Test Condition, A, B, C, or D.
2. TA = +125°C minimum.
3. Interim and final electrical test requirements shall be specified in Table 2.
Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B,
C, and D inspection.
Group A inspection:
1. Tests as specified in Table 2.
2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.
Group C and D inspections:
a. End-point electrical parameters shall be specified in Table 1.
b. Steady-state life test, Method 1005 of Mil-Std-883:
1. Test condition A, B, C, D.
2. TA = +125°C, minimum.
3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.
TABLE 2.
ELECTRICAL TEST REQUIREMENTS
Mil-Std-883 Test Requirements
Interim Electric Parameters
Method 5004
Final Electrical Parameters
Method 5005
Group A Test Requirements
Method 5005
Group C and D End-Point Electrical Parameters
Method 5005
*
Subgroups
per Method 5005, Table 1
1
1*, 2, 3, 9, 10, 11
1, 2, 3, 9, 10, 11
1
PDA applies to Subgroup 1 only.
---------------------------
Electrical Characteristics of MAX690/691/692/693/694
/695/883B for /883B and SMD 5962-90711 and 5962-90712
19-2553
Page 7 of
Rev. C
8