MAX8569BETT30+

19-3671; Rev 0; 5/05 KIT ATION EVALU LE B A IL A AV 200mA Step-Up Converters in 6-Pin SOT23 and TDFN The MAX8569A/MAX8569B low-quiescent-current boost regulators provide up to 200mA at output voltages up to 5.5V from a 1.5V to 5.5V input source. The built-in synchronous rectifier allows for over 90% efficiency while achieving small size and low cost by eliminating the need for an external Schottky diode. The MAX8569A provides an adjustable output while the MAX8569B is fixed at 3.0V or 3.3V. The MAX8569B features a power-on reset output (RST) to signal that the output has reached regulation. All devices connect the battery input to the output during shutdown, allowing the input battery to be used as a backup or real-time clock supply when the converter is off. Applications Medical Diagnostic Equipment Cordless Phones Digital Cameras PC Cards PDAs and Smartphones Local 3.3V or 5V Supply ♦ 1.5V to 5.5V Input Voltage Range ♦ BATT Connected to OUT in Shutdown for Backup Power ♦ Up to 95% Efficiency ♦ 7µA Typical Quiescent Current ♦ (0.5 x L x 0.780A2) / (r% x VOUT2) where L is the inductor value and r is the desired output ripple in %. A 22µF ceramic capacitor is a good starting value. The input capacitor reduces the peak current drawn from the battery and can be the same value as the output capacitor. A larger input capacitor can be used to further reduce the input ripple and improve efficiency. PC Board Layout and Grounding Careful printed circuit layout is important for minimizing ground bounce and noise. Keep the IC’s GND pin and the ground leads of the input- and output-filter capacitors less than 0.2in (5mm) apart. In addition, keep all connections to the FB and LX pins as short as possible. In particular, when using external feedback resistors, locate them as close to FB as possible. To maximize output power and efficiency and minimize output ripple voltage, use a ground plane and solder the IC’s GND directly to the ground plane. A sample layout is available in the MAX8569A/MAX8569B evaluation kit to speed designs. Chip Information PROCESS: BiCMOS where VOUT is the desired output voltage and VFB is 1.228V. Inductor Selection The control scheme of the MAX8569A/MAX8569B permits flexibility in choosing an inductor. A 10µH inductor performs well for most applications, but values from 4.7µH to 100µH can be used as well. Small inductance values typically offer smaller physical size. Output power is reduced when the inductance is large enough to prevent the maximum current limit (780mA) from being reached before the maximum on-time (5µs) expires. For maximum output current, choose L so that: VBATT(MAX) × 1µs 0.78A IOUT(MAX) = 8 < L < Selector Guide OUTPUT VOLTAGE PINPACKAGE TOP MARK Adjustable SOT23-6 ABWK MAX8569BEUT Fixed 3.3V SOT23-6 ABWL MAX8569AETT Adjustable TDFN AJN MAX8569BETT Fixed 3.3V TDFN AJO MAX8569BETT30 Fixed 3.0V TDFN AJP PART MAX8569AEUT VBATT(MIN) × 5µs 0.78A 0.78A 0.78A   ×  VBATT(MIN) − × (RNCH + RL )   2 2 VOUT _______________________________________________________________________________________ 200mA Step-Up Converters in 6-Pin SOT23 and TDFN 6, 8, &10L, DFN THIN.EPS D2 D A2 PIN 1 ID N 0.35x0.35 b PIN 1 INDEX AREA E [(N/2)-1] x e REF. E2 DETAIL A e k A1 CL CL A L L e e PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.80 mm -DRAWING NOT TO SCALE- 21-0137 G 1 2 _______________________________________________________________________________________ 9 MAX8569A/MAX8569B Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) MAX8569A/MAX8569B 200mA Step-Up Converters in 6-Pin SOT23 and TDFN Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) COMMON DIMENSIONS MIN. MAX. D 0.70 2.90 0.80 3.10 E A1 2.90 0.00 3.10 0.05 L k 0.20 0.40 0.25 MIN. A2 0.20 REF. SYMBOL A PACKAGE VARIATIONS PKG. CODE N D2 E2 e JEDEC SPEC b [(N/2)-1] x e DOWNBONDS ALLOWED T633-1 6 1.50–0.10 2.30–0.10 0.95 BSC MO229 / WEEA 0.40–0.05 1.90 REF NO T633-2 6 1.50–0.10 2.30–0.10 0.95 BSC MO229 / WEEA 0.40–0.05 1.90 REF NO T833-1 8 1.50–0.10 2.30–0.10 0.65 BSC MO229 / WEEC 0.30–0.05 1.95 REF NO T833-2 8 1.50–0.10 2.30–0.10 0.65 BSC MO229 / WEEC 0.30–0.05 1.95 REF NO T833-3 8 1.50–0.10 2.30–0.10 0.65 BSC MO229 / WEEC 0.30–0.05 1.95 REF YES T1033-1 10 1.50–0.10 2.30–0.10 0.50 BSC MO229 / WEED-3 0.25–0.05 2.00 REF NO T1433-1 14 1.70–0.10 2.30–0.10 0.40 BSC ---- 0.20–0.05 2.40 REF YES T1433-2 14 1.70–0.10 2.30–0.10 0.40 BSC ---- 0.20–0.05 2.40 REF NO PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.80 mm -DRAWING NOT TO SCALE- 10 21-0137 ______________________________________________________________________________________ G 2 2 200mA Step-Up Converters in 6-Pin SOT23 and TDFN 6LSOT.EPS Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 11 © 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc. MAX8569A/MAX8569B Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)