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BGT24LTR11N16E6327XTSA1

BGT24LTR11N16E6327XTSA1

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    TSNP16-9

  • 描述:

    BGT24LTR11N16E6327XTSA1

  • 数据手册
  • 价格&库存
BGT24LTR11N16E6327XTSA1 数据手册
B GT2 4LT R11 N1 6 Silicon Ge rmaniu m 24 GHz R a dar Transc ei ver MMI C Dat a She et Revision: 1.3 RF and P r otecti on D evic es Edition 2018-05-08 Published by Infineon Technologies AG 81726 Munich, Germany © 2018 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGT24LTR11N16 24GHz Radar MMIC Data Sheet Revision History: 2018-05-08 Previous Revision: Datasheet Rev. 1.1 Page Subjects (major changes since last revision) 8,9 Reference to matching structures and footprint according to AN472 8 Specification of Harmonic Suppression is limited to second harmonic only 8 Note is added to TX_ON low /high level input voltage specification Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2011-02-24 Data Sheet , 1.3 3 / 14 2018-05-08 BGT24LTR11N16 24GHz Radar MMIC List of Content, Figures and Tables Table of Content 1 1.1 Introduction ........................................................................................................................................ 5 Features ............................................................................................................................................... 5 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 Electrical Characteristics .................................................................................................................. 7 Absolute Maximum Ratings ................................................................................................................. 7 ESD Integrity ........................................................................................................................................ 7 Power Supply ....................................................................................................................................... 7 TX Section ............................................................................................................................................ 8 RX Section (Measured with TX_ON=0V) ............................................................................................. 9 Frequency Divider ................................................................................................................................ 9 Proportional to absolute temperature (PTAT) voltage source ............................................................. 9 3 Pin description ................................................................................................................................. 10 4 Physical Dimension ......................................................................................................................... 11 List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 BGT24LTR11N16 in TSNP-16-9.......................................................................................................... 5 BGT24LTR11N16 block diagram ......................................................................................................... 6 Pin-out (top view) ................................................................................................................................ 10 Package Outline (top, side and bottom view) of TSNP-16-9 ............................................................. 11 Marking Layout of TSNP-16-9 (example) .......................................................................................... 12 Soldering Footprint of TSNP-16-9 ...................................................................................................... 12 Packing Description of TSNP-16-9; ø Reel: 180 mm, Pieces / Reel: 3000, Reels / Box: 1 .............. 13 List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Table 8 Absolute maximum ratings: TA = -40 °C ... 85 °C; all voltages with respect to ground ....................... 7 ESD integrity ........................................................................................................................................ 7 Power supply characteristics: TA = -40 °C … 85 °C ............................................................................. 7 TX characteristics: TA = -40 °C ... 85 °C .............................................................................................. 8 RX characteristics: TA = -40 °C … 85 °C ............................................................................................. 9 Frequency divider characteristics: T A = -40 °C ... 85 °C ...................................................................... 9 PTAT voltage source characteristics: T A = -40 °C ... 85 °C ................................................................. 9 Pin definition and function .................................................................................................................. 10 Data Sheet , 1.3 4 / 14 2018-05-08 BGT24LTR11N16 24GHz Radar MMIC Introduction 1 Introduction 1.1 Features             24GHz transceiver MMIC Fully integrated low phase noise VCO Built in temperature compensation circuit for VCO stabilization Homodyne quadrature receiver Frequency divider Low power consumption Fully ESD protected device Single ended RF and IF terminals 200 GHz bipolar SiGe:C technology b7hf200 Single supply voltage 3.3V TSNP-16-9 plastic package Pb-free (RoHS compliant) package Figure 1 BGT24LTR11N16 in TSNP-16-9 Description The BGT24LTR11 is a Silicon Germanium Transceiver MMIC operating from 24.0 GHz up to 24.25 GHz. It is based on a 24 GHz fundamental voltage controlled oscillator (VCO). A built in voltage source delivers a VCO tuning voltage (V_PTAT) which is proportional to absolute temperature. When connected to the VCO tuning pin (V_TUNE) it compensates for the inherent frequency drift of the VCO over temperature thus stabilizing the VCO within the ISM band eliminating the need for a PLL/Microcontroller. An integrated 1:16 frequency divider also allows for external phase lock loop VCO frequency stabilization. The receiver section uses a low noise amplifier (LNA) in front of a quadrature homodyne down conversion mixer in order to provide excellent receiver sensitivity. Derived from the internal VCO signal, a RC polyphase filter (PPF) generates quadrature LO signals for the quadrature mixer. The I/Q IF outputs are available through a single ended terminal respectively. The device is manufactured in a 0.18μm SiGe:C technology offering a cutoff frequency of 200 GHz. It is packaged in a 16 pin leadless RoHs compliant TSNP package. Product Name BGT24LTR11N16 Data Sheet , 1.3 Package TSNP-16-9 5 / 14 Chip Marking T1811 LTR11 2018-05-08 BGT24LTR11N16 24GHz Radar MMIC Introduction IFI VCC IFQ Balun LNA Balun Balun Polyphase Filter VEE MPA Balun TX Balun VEE Balun 90° VEE RFIN VEE 0° TX_ON f-Div VCC_DIV DIV PTAT VTUNE R_TUNE V_PTAT VCC_PTAT VisioDocument Figure 2 BGT24LTR11N16 block diagram Data Sheet , 1.3 6 / 14 2018-05-08 BGT24LTR11N16 24GHz Radar MMIC Electrical Characteristics 2 Electrical Characteristics 2.1 Absolute Maximum Ratings Table 1 Absolute maximum ratings: TA = -40 °C ... 85 °C; all voltages with respect to ground Parameter Symbol Value Supply voltage VCC -0.3 3.6 V Supply voltage divider VCC_DIV -0.3 3.6 V Supply voltage PTAT voltage source DC voltage at RF pins VCC_PTAT -0.3 3.6 V Voltage applied to none-RF I/O pins VDC_I/O Total power dissipation P Ambient temperature range TA Storage temperature range TSTG Min. Typ. Unit Max. MMIC provides short circuit to GND for RF_IN and TX_OUT 0 VDC_RF -0.3 Note/ Test Condition VCC +0.3 V 300 mW -40 85 °C -50 125 °C Attention: Stresses exceeding the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 2.2 Table 2 ESD Integrity ESD integrity Parameter Symbol Value Min. Typ. Unit Max. 1 VESD-HBM -1 1 kV 2 VESD-CDM -500 500 V ESD robustness HBM ESD robustness CDM Note/ Test Condition 1) According to ANSI/ESDA/JEDEC JS-001 (R = 1.5kOhm, C = 100pF) for Electrostatic Discharge Sensitivity Testing, Human Body Model (HBM)-Component Level 2) According to JEDEC JESD22-C101 Field-Induced Charged Device Model (CDM), Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components Please note that this result is subject to: - lot variations within the manufacturing process as specified by Infineon - changes in the specific test setup 2.3 Table 3 Power Supply Power supply characteristics: T A = -40 °C … 85 °C Parameter Supply voltage Data Sheet , 1.3 Symbol VCC Value Unit Min. Typ. Max. 3.2 3.3 3.4 7 / 14 Note/ Test Condition V 2018-05-08 BGT24LTR11N16 24GHz Radar MMIC Electrical Characteristics Table 3 Power supply characteristics: T A = -40 °C … 85 °C Parameter Symbol Value Min. Supply current ICC Duty cycle 2.4 Table 4 Typ. Max. 45 55 1 : 1000 Pulse duration tP Unit Note/ Test Condition mA 1 1 µs TX Section TX characteristics: T A = -40 °C ... 85 °C; all parameters specified including a TX port matching structure and package footprint provided by Infineon in AN472 Parameter Symbol Value Min. Typ. 24.050 Unit Max. VCO frequency range fVCO VCO phase noise PN -55 -80 V_PTAT connected to VTUNE; 16 kOhm resistor connected from R_TUNE to GND dBc/ Hz @ 10 kHz offset @ 100 kHz offset VCO AM noise PAM -135 dBc/ Hz @ 100 kHz offset 2.5 V 2000 MHz/V VTUNE Tuning voltage to cover VCO frequency range VCO tuning sensitivity within VCO frequency range Second Harmonic Suppression Non-harmonic suppression 0.7 Non-harmonic suppression 45 24.250 Note/ Test Condition 720 GHz 25 dBc 62 dBc f>10 GHz; DDIV=16 dBc f≤10 GHz; DDIV=16 TX output power PTX TX load impedance ZTXOUT TX_ON low level input voltage (TX=OFF) VTX_ON_low TX_ON high level input voltage (TX=ON) VTX_ON_high 2 TX_ON input voltage hysteresis TX_ON input current VTX_ON_hys 50 ITX_ON -100 100 µA TX_ON switching time tTX_ON 2 ns Power up TX settling time tTX_Power_up 100ns Data Sheet , 1.3 2 6 10 dBm  50 0.8 V V Including TX port matching structure according to AN472 TX_ON pin is chip internally pulled up to VCC via typ. 98 kOhm resistor TX_ON pin is chip internally pulled up to VCC via typ. 98 kOhm resistor mV 8 / 14 Defines the time TX section requires to settle after VCC supply voltage is within specified range 2018-05-08 BGT24LTR11N16 24GHz Radar MMIC Electrical Characteristics 2.5 Table 5 RX Section (Measured with TX_ON=0V) RX characteristics: T A = -40 °C … 85 °C; all parameters specified including RX port matching structure and package footprint provided by Infineon in AN472 Parameter Symbol Value Min. RX frequency range fRX RX input impedance ZRXIN Voltage conversion gain GC SSB noise figure NFSSB Typ. 24.0 Unit Max. 24.25 GHz  50 15.5 Note/ Test Condition 20 26.5 dB 10 18 dB Including RX port matching structure according to AN472 Single sideband @ fIF = 100 kHz Input compression point IP1dB -28 Quadrat. phase imbalance P 0 24 deg -1 1 dB 1 k Single ended Unit Note/ Test Condition 8192 - 16 if VCC_PTAT = 0 V, 8192 if VCC_PTAT = 3.3 V 350 mV Peak to Peak voltage when DIV_OUT is terminated with 50 Ohm and DDIV=16 DIV_OUT is loaded with 1MOhm, 13 pF Quadrat. amplitude imbalance A IF output impedance 2.6 Table 6 ZIF Frequency Divider Frequency divider characteristics: T A = -40 °C ... 85 °C Parameter Symbol Value Min. Prescaler division ratio DDIV 60 Prescaler output “high” voltage for division ratio 8192 Prescaler output “low” voltage for division ratio 8192 VDIV8192H 2.4 Prescaler supply voltage VCC_DIV 3.2 Prescaler supply current ICC_DIV 13 Table 7 Typ. 16 Prescaler output voltage for VDIV16 division ratio 16 2.7 dBm 120 Max. V 0.8 V 3.3 3.4 V 19 25 mA VDIV8192L DIV_OUT is loaded with 1MOhm, 13 pF Proportional to absolute temperature (PTAT) voltage source PTAT voltage source characteristics: T A = -40 °C ... 85 °C Parameter Symbol Supply voltage VCC_PTAT Supply current ICC_PTAT Data Sheet , 1.3 Value Unit Min. Typ. Max. 3.2 3.3 3.4 V 1.5 2.5 mA 9 / 14 Note/ Test Condition 2018-05-08 BGT24LTR11N16 24GHz Radar MMIC Pin description PTAT voltage source characteristics: T A = -40 °C ... 85 °C Parameter Symbol Value Min. Output voltage Typ. Max. 1.3 2 Note/ Test Condition V VCC_DIV DIV_OUT IFI IFQ TX_ON Pin description 9 8 7 6 5 VEE TX 11 3 RX VEE 12 2 VEE 13 14 15 16 VCC_PTAT 4 V_PTAT 10 V_TUNE VEE R_TUNE 3 VOUT_PTAT 0.7 Unit 1 VCC Table 7 20150701_BG T24LTR11_pin _out_T1811.vsd Figure 3 Table 8 Pin-out (top view) Pin definition and function Pin Number Name Function 1 VCC Supply voltage 2 VEE Ground 3 RX Receiver RF input 4 VEE GND 5 TX_EN Output power enable 6 IFQ 7 IFI Quadrature phase down converter IF output In phase down converter IF output 8 DIV_OUT Frequency divider output 9 VCC_DIV Supply voltage of prescaler 10 VEE Ground 11 TX Tranmitter RF output 12 VEE Ground Data Sheet , 1.3 10 / 14 2018-05-08 BGT24LTR11N16 24GHz Radar MMIC Physical Dimension Table 8 Pin definition and function Pin Number Name Function 13 R_TUNE VCO operating frequency band select 14 V_TUNE VCO frequency tuning input 15 V_PTAT PTAT voltage source output 16 VCC_PTAT PTAT voltage source power supply 4 Physical Dimension Figure 4 Package Outline (top, side and bottom view) of TSNP-16-9 Data Sheet , 1.3 11 / 14 2018-05-08 BGT24LTR11N16 24GHz Radar MMIC Physical Dimension Figure 5 Marking Layout of TSNP-16-9 (example) Figure 6 Soldering Footprint of TSNP-16-9 Data Sheet , 1.3 12 / 14 2018-05-08 BGT24LTR11N16 24GHz Radar MMIC Physical Dimension Figure 7 Packing Description of TSNP-16-9; ø Reel: 180 mm, Pieces / Reel: 3000, Reels / Box: 1 Data Sheet , 1.3 13 / 14 2018-05-08 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG
BGT24LTR11N16E6327XTSA1 价格&库存

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