ESD5V3U2U03FH6327XTSA1 数据手册
TVS Diode
Transient Voltage Suppressor Diodes
ESD5V3U2U Series
Uni-directional Ultra Low ESD / Transient Protection Diode
ESD5V3U2U-03F
ESD5V3U2U-03LRH
Data Sheet
Revision 1.3, 2013-08-16
Final
Power Management & Multimarket
Edition 2013-08-16
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2013 Infineon Technologies AG
All Rights Reserved.
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The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
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and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
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Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
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ESD5V3U2U Series
Revision History: Rev. 1.2, 2013-08-16
Page or Item
Subjects (major changes since previous revision)
Revision 1.3, 2013-08-16
4 + 16
All marking infos for TSLP-3-7 updated
Trademarks of Infineon Technologies AG
AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™,
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SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™,
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Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™
of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,
OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.
RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden
Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.
UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™
of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of
Diodes Zetex Limited.
Last Trademarks Update 2010-10-26
FinalData Sheet
3
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Uni-directional Ultra Low ESD / Transient Protection Diode
1
Uni-directional Ultra Low ESD / Transient Protection Diode
1.1
Features
•
•
•
•
•
ESD / Transient protection of High-Speed data lines exceeding
– IEC61000-4-2 (ESD): ± 20 kV (air / contact)
– IEC61000-4-4 (EFT): ±50 A (5/50 ns)
– IEC61000-4-5 (surge): ±3 A (8/20 μs)
Maximum working voltage: VRWM 5.3 V
Extremely low capacitance: down to 0.4 pF
Very low reverse current: IR < 1 nA typical
Pb-free package (RoHS compliant) and halogen free package
1.2
•
Application Examples
ESD / Transient protection of High Speed Interfaces:
– HDMI, USB 2.0/USB 3.0, DisplayPort, DVI
– Mobile HDMI Link, MDDI, MIPI.
– 10/100/1000 Ethernet, Firewire, S-ATA, etc.
1.3
Product Description
Pin 1
Pin 1
Pin 2
Pin 3
Pin 2
TSLP-3
Pin 3
Pin 3
Pin 1
Pin 2
TSFP-3
a) Pin configuration
b) Schematic diagram
PG- TSL(F)P-3-Dual_diode_A_com_PinConf_and_SchematicDiag.vst.vsd
Figure 1-1 Pin Configuration (a) and Schematic Diagram (b)
Table 1-1
Ordering information
Type
ESD5V3U2U-03F
Package
PG-TSFP-3-1
ESD5V3U2U-03LRH PG-TSLP-3-7
Configuration
Marking code
1)
Z1
1)
Z1
2 lines, uni-directional
2 lines, uni-directional
1) Or 1 line, bi-directional between pins 1 and 2, if pin 3 is not connected
FinalData Sheet
4
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Characteristics
2
Characteristics
Table 2-1
Maximum Rating at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
VESD
-20
–
20
kV
IPP
-3
–
3
A
Operating temperature range
TOP
-40
–
125
°C
Storage temperage
1) VESD according to IEC61000-4-2
2) IPP according to IEC61000-4-5
Tstg
-65
–
150
°C
ESD (air / contact) discharge
1)
Peak pulse current (tp = 8/20 μs)
2)
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the integrated circuit.
2.1
Electrical Characteristics at TA = 25 °C, unless otherwise specified
!"
"
!"
Figure 2-1 Definitions of electrical characteristics
FinalData Sheet
5
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Characteristics
Table 2-2
DC characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
Reverse working voltage VRWM
–
–
5.3
V
Breakdown voltage
VBR
6
–
–
V
IBR = 1 mA, from Pin
1/2 to Pin 3
Reverse current
IR
–
10pF), Low (