IM393M6FPXKLA1

IM393-M6FP CIPOS™ Tiny IPM 600V/10A IM393-M6FP Description IM393-M6FP is a 10A, 600V Integrated Power Hybrid IC with Open Emitter pins for advanced Appliance Motor Drives applications such as energy efficient fan and pumps. Infineon’s technology offers an extremely compact, high performance AC motor-driver in a single isolated package to simplify design. This advanced IPM is a combination of Infineon’s newest low VCE(on) Trench IGBT technology optimized for best trade-off between conduction and switching losses and the industry benchmark 3 phase high voltage, high speed driver (3.3V compatible) in a fully isolated thermally enhanced package. A built-in high precision temperature monitor and over-current protection feature, along with the short-circuit rated IGBTs and integrated under-voltage lockout function, deliver high level of protection and fail-safe operation. Using a single in line package with full transfer mold structure resolves isolation problems to heatsink. Features • Integrated gate drivers and bootstrap function • Temperature monitor • Protection shutdown pin • Low VCE (on) Trench IGBT technology • Under voltage lockout for all channels • Matched propagation delay for all channels • 3.3V Schmitt-triggered input logic • Cross-conduction prevention logic • Isolation 2000VRMS min and CTI > 600 • Recognized by UL (File Number : E314539) Tiny SIP IM393-M6FP Potential applications • • • • • • Washing machines Air-conditioners Refrigerators Fans Dishwashers Low power motor drives Product validation Qualified for industrial applications according to the relevant tests of JEDEC47/20/22. Table1 Part Ordering Table Base part number Package Type Standard Pack Form Quantity IM393-M6FP SIP 34x15 36 Tubes 540 Final Datasheet www.infineon.com Please read the important Notice and Warnings at the end of this document V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Table of Contents Table of Contents Description .................................................................................................................................... 1 Features ........................................................................................................................................ 1 Potential Applications .................................................................................................................... 1 Product validation ......................................................................................................................... 1 Table of Contents ........................................................................................................................... 2 1 Internal Electrical Schematic .................................................................................................. 3 2 Pin Configuration .................................................................................................................. 4 2.1 Pin Assignment ................................................................................................................................................. 5 2.2 Pin Descriptions ............................................................................................................................................... 6 3 Absolute Maximum Rating ...................................................................................................... 8 3.1 Module .............................................................................................................................................................. 8 3 .2 Inverter ............................................................................................................................................................. 8 3 .3 Control .............................................................................................................................................................. 8 4 Thermal Characteristics ......................................................................................................... 9 5 Recommended Operating Conditions ……………………………………………………………………...10 6 Static Parameters …………………………………………………………………………………………... 11 6.1 Inverter …………………………………………………………………………………………………………… 11 6 .2 Control ……………………………………………………………………………………………………………..11 7 Dynamic Parameters ............................................................................................................ 13 7.1 Inverter ........................................................................................................................................................... 13 7 .2 Control ........................................................................................................................................................ 13 8 Thermistor Characteristics .................................................................................................... 14 9 Mechanical Characteristics and Ratings .................................................................................. 15 10 Qualification Information ...................................................................................................... 16 11 Diagrams & Tables ................................................................................................................ 17 11.1 Tc Measurement Point ................................................................................................................................... 17 11.2 Input-Output Logic Table .............................................................................................................................. 17 11.3 Switching Time Definitions ........................................................................................................................... 18 12 Application Notes ................................................................................................................ 19 12.1 Typical Application Schematic ...................................................................................................................... 19 12.2 Performance Charts ....................................................................................................................................... 20 12.3 TJ vs TTH ........................................................................................................................................................... 20 12.4 –VS Immunity .................................................................................................................................................. 21 13 Package Outline ................................................................................................................... 22 Revision History ........................................................................................................................... 23 Preliminary Datasheet 2 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Internal Electrical Schematic 1 Internal Electrical Schematic (1) P (3) VS(W) / W (4) VB(W) VB3 HO3 (6) VS(V) / V VS3 VB2 (7) VB(V) HO2 (9) VS(U) / U (10) VB(U) VB1 (12) VDD VDD (13) VTH VS2 HO1 VS1 -t° (14) COM COM (15) COM VSS (16) ITRIP ITRIP (17) RFE RFE (18) HIN(U) HIN1 (19) HIN(V) HIN2 (20) HIN(W) HIN3 (21) LIN(U) LIN1 (22) LIN(V) LIN2 (23) LIN(W) LIN3 LO3 LO2 LO1 (24) N(W) (25) N(V) (26) N(U) Figure 1 Internal electrical schematic Preliminary Datasheet 3 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Pin Configuration 2 2.1 Figure 2 Pin Configuration Pin Assignment Pin configuration Preliminary Datasheet 4 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Pin Configuration Table 2 Pin Assignment Pin Name 1 (2) 3 4 (5) 6 7 (8) P N/A VS(W) / W VB(W) N/A VS(V) / V VB(V) N/A Positive bus input voltage None W-phase high side floating supply offset voltage / W-phase output W-phase high side floating supply voltage None V-phase high side floating supply offset voltage / V-phase output V-phase high side floating supply voltage None 9 VS(U) / U U-phase high side floating supply offset voltage / U-phase output 10 VB(U) (11) N/A None 12 VDD Low side control supply 13 VTH Temperature monitor 14 15 16 17 18 19 20 21 22 23 24 25 26 COM COM ITRIP RFE HIN(U) HIN(V) HIN(W) LIN(U) LIN(V) LIN(W) N(W) N(V) N(U) Preliminary Datasheet Description U-phase high side floating supply voltage Low side control negative supply Low side control negative supply Over current protection input RCIN / Fault / Enable U-phase high side gate driver input V-phase high side gate driver input W-phase high side gate driver input U-phase low side gate driver input V-phase low side gate driver input W-phase low side gate driver input W-phase low side emitter V-phase low side emitter U-phase low side emitter 5 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Pin Descriptions 2.2 Pin Descriptions VDD, COM (Low side control supply and reference HIN(U,V,W) and LIN(U,V,W) (Low side and high side control pins) VDD is the control supply and it provides power both to input logic and to output power stage. Input logic is referenced to COM ground. These pins are positive logic and they are responsible for the control of the integrated IGBT. The Schmitt-trigger input thresholds of them are such to guarantee LSTTL and CMOS compatibility down to 3.3V controller outputs. Pull-down resistor of about 4k is internally provided to pre-bias inputs during supply startup and an ESD diode is provided for pin protection purposes. Input Schmitt-trigger and noise filter provide beneficial noise rejection to short input pulses. The under-voltage circuit enables the device to operate at power on when a supply voltage of at least a typical voltage of VDDUV+ = 10.4V is present. The IC shuts down all the gate drivers power outputs, when the VDD supply voltage is below VDDUV- = 9.4V. This prevents the external power switches from critically low gate voltage levels during on-state and therefore from excessive power dissipation. The noise filter suppresses control pulses which are below the filter time TFILIN. The filter acts according to Figure 4. VB(U,V,W) and VS(U,V,W) (High side supplies) VB to VS is the high side supply voltage. The high side circuit can float with respect to COM following the external high side power device emitter voltage. TM CIPOS Schmitt-Trigger HINx LINx INPUT NOISE FILTER  4 k Figure 3 a) Due to the low power consumption, the floating driver stage is supplied by integrated bootstrap circuit. SWITCH LEVEL VIH; VIL COM The under-voltage detection operates with a rising supply threshold of typical VBSUV+ = 10.41V and a falling threshold of VBSUV- = 9.4V. Input pin structure b) tFILIN VS(U,V,W) provide a high robustness against negative voltage in respect of COM. This ensures very stable designs even under rough conditions. tFILIN HIN(X) LIN(X) HIN(X) LIN(X) N(U, V, W) (Low side emitters) high HOx LOx Figure 4 low HOx LOx The low side emitters are available for current measurements of each phase leg. It is recommended to keep the connection to pin COM as short as possible in order to avoid unnecessary inductive voltage drops. Input filter timing diagram The integrated gate drive provides additionally a shoot through prevention capability which avoids the simultaneous on-state of the high-side and low-side switch of the same inverter phase. A minimum dead time insertion of typically 275ns is also provided by driver IC, in order to reduce cross-conduction of the external power switches . Preliminary Datasheet VTH (Thermistor) A UL certified NTC is integrated in the module with one terminal of the chip connected to COM and the other to VTH. When pulled up to a rail voltage such as VDD or 3.3V by a resistor, the VTH pin provides an analog voltage signal corresponding to the temperature of the thermistor 6 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Pin Configuration RFE (RCIN / Fault / Enable) The RFE pin combines 3 functions in one pin: RCIN or RC-network based programmable fault clear timer, fault output and enable input. VRFE(t) = 3.3V * e-t/RC < VIN,TH- The RFE pin is normally connected to an RC network on the PCB per the schematic in Figure 5. Under normal operating conditions, RRCIN pulls the RFE pin to 3.3V, thus enabling all the functions in the IPM. The microcontroller can pull this pin low to disable the IPM functionality. This is is the Enable function. Consider VIN,TH- of 0.8V and RRFE_ON of 50ohm, CRCIN should be less than 4.9nF. It is also suggested to use a RRCIN of between 0.5MΩ and 2MΩ. CRCIN < 350ns / ( - ln (VIN,TH- / 3.3V) * RRFE_ON) HIN LIN Input Noise filter Input Noise filter Deadtime & Shoot-Through Prevention +3.3V To Microcontroller RFE CRCIN ITRIP Figure 5 VDD Undervoltage detection COM IM231-L6 RRCIN Typical PCB circuit connected to the RFE pin The Fault function allows the IPM to report a Fault condition to the microcontroller by pulling the RFE pin low in one of two situations. The first is an undervoltage condition on VDD and the second is when the ITRIP pin sees a voltage rising above VIT,TH+. RFE The programmable fault clear timer function provides a means of automatically re-enabling the module operation a preset amount of time (TFLT-CLR) after the fault condition has disappeared. Figure 6 shows the RFE-related circuit block diagram inside the IPM . Figure 6 ITRIP Noise filter Noise filter RFE internal circuit structure The length of TFLT-CLR can be determined by using the formula below. VS1, VS2, VS3 (High side emitter and low side collector) VRFE(t) = 3.3V * (1 – e-t/RC) These pins are motor U, V, W input pins. TFLT-CLR = -RRCIN * CRCIN * ln(1-VIN,TH+/3.3V) P (Positive bus input voltage) For example, if RRCIN is 1.2MΩ and CRCIN is 1nF, the TFLTCLR is about 1.7ms with VIN,TH+ of 2.5V. It is also important to note that CRCIN needs to be minimized in order to make sure it is fully discharged in case of over current event. The high side IGBTs are connected to the bus voltage. It is noted that the bus voltage does not exceed 450V. Since the ITRIP pin has a 350ns input filter, it is appropriate to ensure that CRCIN will be discharged below VIN,TH- by the open-drain MOSFET, after 350ns. Therefore, the max CRCIN can be calculated as: Preliminary Datasheet 7 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Absolute Maximum Rating 3 Absolute Maximum Rating 3.1 Module Table 3 Parameter Symbol Conditions Units -40 ~ 150 °C Operating junction temperature TJ Operating case temperature TC -40 ~ 125 °C Storage temperature TSTG -40 ~ 125 °C Isolation test voltage VISO 2000 V 3.2 IGBT, diode, HVIC Value AC RMS, 1 minute, 60Hz Inverter Table 4 Parameter Symbol Conditions Value Units Blocking voltage VCES IGBT, diode, HVIC 600 V DC –link supply voltage of P-N VPN Applied between P and N 450 V VPN(surge) Applied between P and N 500 V TC = 25°C, TJ < 150°C ±10 A TC = 25°C, TJ < 150°C, less than 1ms ±15 A 20 W 3 μs DC –link supply voltage (surge) of P-N Output current Peak output current IO IO(peak) Power dispassion per IGBT Ptot Short Circuit withstand time TSC 3.3 TJ < 150°C, VDC =360V, VGE = 15V Control Table 5 Parameter Symbol Logic supply voltage VDD Input voltage VIN High side floating supply voltage Preliminary Datasheet Conditions LIN, HIN, ITRIP, RFE VBS(U,V,W) 8 Value Units -0.3 ~ 20 V -0.3 ~ 20 V -0.3 ~ 20 V V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Thermal Characteristics 4 Thermal Characteristics Table 6 Parameter Symbol Conditions Single IGBT thermal resistance, junction-case Single diode thermal resistance, junction-case Preliminary Datasheet Value Units Min. Typ. Max. RTH(J-C) Low side V-phase IGBT (See Figure 6 for TC measurement point) - 5.3 6.1 °C/W RTH(J-C)D Low side V-phase diode (See Figure 6 for TC measurement point) - 6.6 7.7 °C/W 9 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Recommended Operating Conditions 5 Recommended Operating Conditions For proper operation the device should be used within the recommended conditions. All voltages are absolute referenced to COM. The VS offset is tested with all supplies biased at 15V differential. Table 7 Parameter Symbol Conditions Value Min. Typ. Max. Units Positive DC bus input voltage VDC - - 450 V Low side control supply voltage VDD 13.5 15 16.5 V High side floating supply voltage VBS 12.5 15 17.5 V Input voltage VIN 0 - 5 V LIN, HIN, ITRIP, RFE PWM carrier frequency FPWM - 20 - kHz Voltage between COM and N (including surge) VCOM -5 - 5 V DT PWIN(ON) PWIN(OFF) 1 - - µs 1 - - µs External dead time between HIN & LIN Input pulse width Preliminary Datasheet 10 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Static Parameters 6 Static Parameters 6.1 Inverter VBIAS(VDD, VBS(U,V,W))=15V, TJ=25°C unless otherwise specified Table 8 Parameter Symbol Collector-Emitter saturation voltage VCE(ON) Collector-Emitter leakage current ICES Diode forward voltage drop VF 6.2 Value Conditions Min. Typ. Max. Units IC = 5A - 1.5 1.9 V IC = 5A, TJ = 150°C - 1.7 - V VIN = 0V, VCE = 600V - 10 80 μA VIN = 0V, VCE = 600V, TJ=150°C - 80 - μA IC = 5A - 1.7 2.2 V IC = 5A, TJ = 150°C - 1.6 - V Control VBIAS(VDD, VBS(U,V,W))=15V, TJ=25ºC, unless otherwise specified. The VIN parameters are referenced to COM and are applicable to all six channels Table 9 Parameter Symbol Conditions Value Min. Typ. Max. Units Logic “1” input voltage VIN,TH+ LIN, HIN, RFE 2.5 - - V Logic “0” input voltage VDD/VBS supply under voltage, positive going threshold VDD/VBS supply under voltage, negative going threshold VIN,TH- LIN, HIN, RFE - - 0.8 V VDD,UV+, VBS,UV+ 9.6 10.4 11.2 V VDD,UV-, VBS,UV- 8.6 9.4 10.2 V VDD/VBS supply under voltage lock-out hysteresis VDDUVH, VBSUVH - 1 - V Quiescent VBS supply current IQBS - - 150 μA Quiescent VDD supply current IQDD - - 3.2 mA Offset supply leakage current Input bias current for LIN, HIN Input bias current for RFE ILK VS = 600V - - 50 μA IIN+ VIN = 3.3V - 825 1110 μA IIN,RFE+ VREF = 3.3V - 0 1 μA Input bias current for ITRIP ITRIP+ VITRIP = 3.3V - 4 16 μA ITRIP threshold voltage VITRIP 0.44 0.49 0.54 V Preliminary Datasheet 11 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Static Parameters Parameter Symbol ITRIP input hysteresis Conditions Value Units Min. Typ. Max. VITRIP,HYS - 0.07 - V Bootstrap resistance RBS - 200 - Ω RFE low on resistance RRFE - 50 100 Ω Preliminary Datasheet 12 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Dynamic Parameters 7 Dynamic Parameters 7.1 Inverter VBIAS(VDD, VBS(U,V,W))=15V, TJ=25ºC, unless otherwise specified. Table 10 Parameter Symbol Input to output turn-on propagation delay Input to output turn-off propagation delay RFE low to six switch turn-off propagation delay ITRIP to six switch turn-off propagation delay Conditions Value Units Min. Typ. Max. TON IC = 5A, VDC = 300V - - 1.15 μs TOFF IC = 5A, VDC = 300V - - 1.15 μs TEN VRFE = 5V to 0V - - 1.35 μs TITRIP IC = 5A, VDC = 300V - - 1.5 μs IGBT turn-on energy EON VDC = 300V, IC = 5A, TJ = 25°C 150°C - 170 250 - μJ IGBT turn-off energy EOFF VDC = 300V, IC = 5A, TJ = 25°C 150°C - 70 110 - μJ EREC VDC = 300V, IC = 5A, TJ = 25°C 150°C - 20 40 - μJ TJ = 150°C, IC = 20A, VP = 600V, VDC = 450V,VDD = +15V to 0V FULL SQUARE Diode reverse recovery energy Reverse Bias Safe Operating Area 7.2 RBSOA Control VBIAS(VDD, VBS(U,V,W))=15V, TJ=25ºC, unless otherwise specified. Table 11 Parameter Symbol Conditions Input filter time (HIN, LIN, ITRIP) TFILIN VIN = 0 or VIN = 5V Input filter time (RFE) TFILRFE Value Min. Typ. Max. Units - 350 - ns VRFE = 0 or VRFE = 5V 100 200 - ns ITRIP to Fault propagation delay TFLT VIN = 0 or VIN = 5V, VITRIP = 5V 400 600 800 ns Internal injected dead time TDT VIN = 0 or VIN = 5V 190 275 420 ns Matching propagation delay time (On & Off) all channels MT External dead time > 420ns Preliminary Datasheet 13 - - 50 ns V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Thermistor Characteristics 8 Thermistor Characteristics Table 12 Parameter Symbol Resistance R25 Resistance R125 B-constant B Value Conditions Units Min. Typ. Max. T = 25°C, ±5% tolerance 44.65 47 49.35 kΩ T = 125°C 1.27 1.41 1.56 kΩ 25-50°C, R2=R1e[B1/T2-1/T1)] 3989 4050 4111 K -40 - 125 °C Temperature Range Thermistor Pin Read-Out Volage, VTHERM [V] 5.0 +5V 4.5 REXT 4.0 VTHERM RTHERM 3.5 3.0 2.5 Max Typ 2.0 Min 1.5 1.0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Thermistor Temperature [ C] Figure 7 Thermistor readout vs. temperature (with 4.7kohm REXT pull-up resistor) and typical thermistor resistance values vs. temperature table (For more details, please refer to the application note ‘AN2018-13 CIPOS™ IM393-XX IPM technical description_1R0_final’) Preliminary Datasheet 14 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Mechanical Characteristics and Ratings 9 Mechanical Characteristics and Ratings Table 13 Parameter Symbol Thermal resistance, caseheatsink Comparative Tracking Index Curvature of module backside Flat, greased surface. Heatsink RTH(C-S) compound thermal conductivity 1W/mK CTI BKC Mounting torque T Weight W Figure 8 Conditions M3 screw and washer Value Units Min. Typ. Max. - 0.25 - °C/W 600 - - V 0 - 150 µm 0.6 0.7 0.8 Nm - 5.8 - g Backside curvature measurement position Preliminary Datasheet 15 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Qualification Information 10 Qualification Information Table 14 UL Certified File Number : E314539 RoHS Compliant Yes ESD Preliminary Datasheet Human body model class 2 Charged device model class C2a 16 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Diagram & Tables 11 Diagram & Tables 11.1 Tc Measurement Point Figure 9 TC measurement point 11.2 Input-Output Logic Table P Ho HIN(U, V, W) LIN(U, V, W) ITRIP RFE Figure 10 U, V, W Driver IC Lo Module block diagram Table 15 Input-output logic level table RFE ITRIP HIN(U,V,W) LIN(U,V,W) U,V,W 1 0 1 0 VDC 1 0 0 1 0 1 1 0 0 0 Off* 0 1 1 Off* 1 1 X X Off* 0 X X X Off* * Voltage depends on direction of phase current Preliminary Datasheet 17 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Diagrams & Tables 11.3 Switching Time Definitions HIN(U, V, W) LIN(U, V, W) 50% ITRIP 50% TFLT 50% RFE U, V, W 50% 50% TITRIP Figure 11 TFLT-CLR ITRIP time waveform 50% RFE TEN U, V, W Figure 12 50% Output disable timing diagram HINx LINx 2.1V 0.9V trr toff ton 10% iCx 90% 90% tf 10% vCEx tr 10% tc(on) tc(off) Figure 13 10% 10% Switching times definition Preliminary Datasheet 18 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Application Guide 12 Application Guide 12.1 Typical Application Schematic #5 (1) P #4 (3) VS(W) (4) VB(W) VB3 VS3 (7) VB(V) VB2 (9) VS(U) HO2 (10) VB(U) #3 HO3 (6) VS(V) 3-ph AC Motor 5 or 3.3V 15V #8 (12) VDD VDD (13) VTH #2 #9 VB1 (14) COM COM (15) COM VSS (16) ITRIP LO3 ITRIP (17) RFE Micro Controller HO1 VS1 -t° 5 or 3.3V VS2 RFE (18) HIN(U) (19) HIN(V) (20) HIN(W) (21) LIN(U) (22) LIN(V) (23) LIN(W) HIN1 LO2 HIN2 HIN3 LIN1 LIN2 LO1 LIN3 (24) N(W) #1 (25) N(V) (26) N(U) #6 Control GND Power GND #7 Figure 14 Typical application connection 1. Input circuit -RC filter can be used to reduce input signal noise (100Ω, 1nF) -The capacitors should be located close to CIPOS™ Tiny (to COM terminal especially). 2. Itrip circuit -To prevent a mis operation of protection function, RC filter is recommended -The capacitor must be located close to Itrip and COM terminals. 3. VTH circuit -This terminal should be pulled up to the bias voltage of 5V/3.3V through a proper resistor to define suitable voltage for temperature monitoring. -It is recommended that RC filter is placed close to the controller 4. VB-VS circuit -Capacitors for high side floating supply voltage should be placed close to VB and VS terminals. -Additional high frequency capacitors, typically 0.1µF, are strongly recommended. -Overlap of pattern to motor and pattern to bootstrap capacitors should be minimized. 5. Snubber capacitor -The wiring among CIPOS™ Tiny, snubber capacitor and shunt resistors should be short as possible. 6. Shunt resistor -SMD type shunt resistors are strongly recommended to minimize its internal stray inductance. 7. Ground pattern -Pattern overlap of power ground and signal ground should be minimized. The patterns should be connected at the common end of shunt resistors only for the same potential. 8. COM pattern -Both of the COM terminals should be connected together. 9. RFE circuit -To setup R and C parameter for fault clear time, please refer to Figure 5. -This R is also mandatory for fault out reporting function because it is open drain structure. Preliminary Datasheet 19 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Application Guide 12.2 Performance Charts 12 11 10 RMS Current [A] 9 FPWM=6kHz 8 7 6 FPWM=16kHz 5 4 3 V+ = 300V, VDD=VBS=15V, TJ≤150 C, TC≤125 C, MI=0.8, PF=0.8, Sinusoidal PWM 2 1 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Case Temperature Tc [℃] Figure 15 Maximum operating current SOA 1. This maximum operating current SOA is just one of example based on typical characteristics for this product. It can be change by each user’s actual operating conditions. 12.3 Tj vs. Tth IGBT Junction Temperature - °C 160 TJ avg = 1.24 x TTherm + 12 150 140 130 120 110 100 111 90 65 70 75 80 85 90 95 100 105 110 115 Internal Thermistor Temperature Equivalent Read Out - °C Figure 16 Typical Tj vs Tth correlation, sinusoidal modulation, VDC=300V, Iphase=5Arms, fsw=16kHz, fmod=50Hz, MI=0.8, PF=0.6 Preliminary Datasheet 20 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Application Guide 12.4 –VS Immunity Figure 17 Negative transient Vs SOA for integrated gate driver Preliminary Datasheet 21 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Package Information 13 Figure 18 Package Outline IM393-M6FP Preliminary Datasheet 22 V2.1 2022-08-16 CIPOS™ Tiny IM393-M6FP Revision History Revision History Major changes since the last revision Page or Reference Revision Date Description of changes Page 16 2022-08-16 ESD class changed Preliminary Datasheet V2.1 23 V2.1 2022-08-16 Other Trademarks All referenced product or service names and trademarks are the property of their respective owners. Edition 2022-08-16 Published by Infineon Technologies AG 81726 Munich, Germany © 2022 Infineon Technologies AG. All Rights Reserved. Do you have a question about this document? Email: erratum@infineon.com Document reference ifx1 IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office (www.infineon.com). Please note that this product is not qualified according to the AEC Q100 or AEC Q101 documents of the Automotive Electronics Council. 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