IPP129N10NF2S
MOSFET
StrongIRFETTM2Power-Transistor
PG-TO220-3
tab
Features
•Optimizedforawiderangeofapplications
•N-Channel,normallevel
•100%avalanchetested
•Pb-freeleadplating;RoHScompliant
•Halogen-freeaccordingtoIEC61249-2-21
Productvalidation
QualifiedaccordingtoJEDECStandard
Drain
Pin 2, Tab
Table1KeyPerformanceParameters
Parameter
Value
Unit
VDS
100
V
RDS(on),max
12.9
mΩ
ID
52
A
Qoss
26
nC
QG
19
nC
Gate
Pin 1
Source
Pin 3
Type/OrderingCode
Package
IPP129N10NF2S
PG-TO220-3
Final Data Sheet
1
Marking
RelatedLinks
129N10NS
-
Rev.2.1,2022-06-15
StrongIRFETTM2Power-Transistor
IPP129N10NF2S
TableofContents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Final Data Sheet
2
Rev.2.1,2022-06-15
StrongIRFETTM2Power-Transistor
IPP129N10NF2S
1Maximumratings
atTA=25°C,unlessotherwisespecified
Table2Maximumratings
Parameter
Symbol
Values
Unit
Note/TestCondition
52
37
33
12
A
VGS=10V,TC=25°C
VGS=10V,TC=100°C
VGS=6V,TC=100°C
VGS=10V,TA=25°C,RthJA=40°C/W2)
-
208
A
TA=25°C
-
-
31
mJ
ID=25A,RGS=25Ω
VGS
-20
-
20
V
-
Power dissipation
Ptot
-
-
71
3.8
W
TC=25°C
TA=25°C,RthJA=40°C/W2)
Operating and storage temperature
Tj,Tstg
-55
-
175
°C
-
Unit
Note/TestCondition
Min.
Typ.
Max.
ID
-
-
ID,pulse
-
Avalanche energy, single pulse
EAS
Gate source voltage
1)
Continuous drain current
Pulsed drain current3)
4)
2Thermalcharacteristics
Table3Thermalcharacteristics
Parameter
Symbol
Thermal resistance, junction - case
Values
Min.
Typ.
Max.
RthJC
-
-
2.1
°C/W -
Thermal resistance, junction - ambient,
RthJA
6 cm² cooling area2)
-
-
40
°C/W -
Thermal resistance, junction - ambient,
RthJA
minimal footprint
-
-
62
°C/W -
1)
Rating refers to the product only with datasheet specified absolute maximum values, maintaining case temperature
as specified. For other case temperatures please refer to Diagram 2. De-rating will be required based on the actual
environmental conditions.
2)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
3)
See Diagram 3 for more detailed information
4)
See Diagram 13 for more detailed information
Final Data Sheet
3
Rev.2.1,2022-06-15
StrongIRFETTM2Power-Transistor
IPP129N10NF2S
3Electricalcharacteristics
atTj=25°C,unlessotherwisespecified
Table4Staticcharacteristics
Parameter
Symbol
Drain-source breakdown voltage
Values
Unit
Note/TestCondition
-
V
VGS=0V,ID=1mA
3
3.8
V
VDS=VGS,ID=30µA
-
0.1
10
1
100
µA
VDS=100V,VGS=0V,Tj=25°C
VDS=100V,VGS=0V,Tj=125°C
IGSS
-
10
100
nA
VGS=20V,VDS=0V
Drain-source on-state resistance1)
RDS(on)
-
11.6
14.2
12.9
16.2
mΩ
VGS=10V,ID=30A
VGS=6V,ID=15A
Gate resistance
RG
-
0.9
-
Ω
-
gfs
24
-
-
S
|VDS|≥2|ID|RDS(on)max,ID=30A
Unit
Note/TestCondition
Min.
Typ.
Max.
V(BR)DSS
100
-
Gate threshold voltage
VGS(th)
2.2
Zero gate voltage drain current
IDSS
Gate-source leakage current
2)
Transconductance
Table5Dynamiccharacteristics
Parameter
Symbol
Input capacitance
Values
Min.
Typ.
Max.
Ciss
-
1300
-
pF
VGS=0V,VDS=50V,f=1MHz
Output capacitance
Coss
-
210
-
pF
VGS=0V,VDS=50V,f=1MHz
Reverse transfer capacitance
Crss
-
10
-
pF
VGS=0V,VDS=50V,f=1MHz
Turn-on delay time
td(on)
-
8.8
-
ns
VDD=50V,VGS=10V,ID=30A,
RG,ext=1.6Ω
Rise time
tr
-
15
-
ns
VDD=50V,VGS=10V,ID=30A,
RG,ext=1.6Ω
Turn-off delay time
td(off)
-
13
-
ns
VDD=50V,VGS=10V,ID=30A,
RG,ext=1.6Ω
Fall time
tf
-
3.6
-
ns
VDD=50V,VGS=10V,ID=30A,
RG,ext=1.6Ω
Unit
Note/TestCondition
Table6Gatechargecharacteristics3)
Parameter
Symbol
Gate to source charge
Values
Min.
Typ.
Max.
Qgs
-
6.4
-
nC
VDD=50V,ID=30A,VGS=0to10V
Gate charge at threshold
Qg(th)
-
3.9
-
nC
VDD=50V,ID=30A,VGS=0to10V
Gate to drain charge
Qgd
-
4.1
-
nC
VDD=50V,ID=30A,VGS=0to10V
Switching charge
Qsw
-
6.5
-
nC
VDD=50V,ID=30A,VGS=0to10V
Gate charge total
Qg
-
19
28
nC
VDD=50V,ID=30A,VGS=0to10V
Gate plateau voltage
Vplateau
-
4.9
-
V
VDD=50V,ID=30A,VGS=0to10V
Output charge
Qoss
-
26
-
nC
VDS=50V,VGS=0V
2)
1)
RDS(on) is specified at a distance of 1.8 mm distance to the package body; mounting at a larger distance increases the overall
package resistance of approximately 0.04 mOhm/mm per leg.
2)
Defined by design. Not subject to production test.
3)
See ″Gate charge waveforms″ for parameter definition
Final Data Sheet
4
Rev.2.1,2022-06-15
StrongIRFETTM2Power-Transistor
IPP129N10NF2S
Table7Reversediode
Parameter
Symbol
Diode continuous forward current
Values
Unit
Note/TestCondition
51
A
TC=25°C
-
208
A
TC=25°C
-
0.93
1.2
V
VGS=0V,IF=30A,Tj=25°C
trr
-
26
-
ns
VR=50V,IF=30A,diF/dt=500A/µs
Qrr
-
135
-
nC
VR=50V,IF=30A,diF/dt=500A/µs
Min.
Typ.
Max.
IS
-
-
Diode pulse current
IS,pulse
-
Diode forward voltage
VSD
Reverse recovery time
Reverse recovery charge
Final Data Sheet
5
Rev.2.1,2022-06-15
StrongIRFETTM2Power-Transistor
IPP129N10NF2S
4Electricalcharacteristicsdiagrams
Diagram1:Powerdissipation
Diagram2:Draincurrent
80
60
70
50
60
40
ID[A]
Ptot[W]
50
40
30
30
20
20
10
10
0
0
25
50
75
100
125
150
0
175
0
25
50
TC[°C]
75
100
125
150
175
TC[°C]
Ptot=f(TC)
ID=f(TC);VGS≥10V
Diagram3:Safeoperatingarea
Diagram4:Max.transientthermalimpedance
3
102
10
1 µs
102
10 µs
101
single pulse
0.01
0.02
0.05
0.1
0.2
0.5
ID[A]
ZthJC[K/W]
100 µs
101
1 ms
100
DC
100
10 ms
10-1
-1
10
10-2
10-1
100
101
102
103
10-2
10-6
10-5
10-4
VDS[V]
10-2
10-1
100
tp[s]
ID=f(VDS);TC=25°C;D=0;parameter:tp
Final Data Sheet
10-3
ZthJC=f(tp);parameter:D=tp/T
6
Rev.2.1,2022-06-15
StrongIRFETTM2Power-Transistor
IPP129N10NF2S
Diagram5:Typ.outputcharacteristics
Diagram6:Typ.drain-sourceonresistance
200
35
10 V
8V
7V
175
30
150
4.5 V
5V
25
6V
RDS(on)[mΩ]
ID[A]
125
100
6V
75
7V
15
8V
10
50
25
0
20
5
5V
4.5 V
0
1
2
3
4
10 V
0
5
0
20
40
60
VDS[V]
80
ID=f(VDS),Tj=25°C;parameter:VGS
RDS(on)=f(ID),Tj=25°C;parameter:VGS
Diagram7:Typ.transfercharacteristics
Diagram8:Typ.drain-sourceonresistance
200
30
150
25
100
75
175 °C
RDS(on)[mΩ]
25 °C
125
ID[A]
120
35
175
175 °C
20
15
10
50
25 °C
5
25
0
100
ID[A]
0
1
2
3
4
5
6
7
VGS[V]
0
3
6
9
12
15
VGS[V]
ID=f(VGS),|VDS|>2|ID|RDS(on)max;parameter:Tj
Final Data Sheet
0
RDS(on)=f(VGS),ID=30A;parameter:Tj
7
Rev.2.1,2022-06-15
StrongIRFETTM2Power-Transistor
IPP129N10NF2S
Diagram9:Normalizeddrain-sourceonresistance
Diagram10:Typ.gatethresholdvoltage
2.4
4.0
3.5
3.0
300 µA
1.6
2.5
VGS(th)[V]
RDS(on)(normalizedto25°C)
2.0
1.2
2.0
30 µA
1.5
0.8
1.0
0.4
0.5
0.0
-75
-50
-25
0
25
50
75
0.0
-75
100 125 150 175 200
-50
-25
0
Tj[°C]
25
50
75
100 125 150 175 200
Tj[°C]
RDS(on)=f(Tj),ID=30A,VGS=10V
VGS(th=f(Tj),VGS=VDS;parameter:ID
Diagram11:Typ.capacitances
Diagram12:Typ.forwardcharacteristicsofreversediode
4
103
10
25 °C
175 °C
103
Ciss
102
IF[A]
C[pF]
102
Coss
101
101
Crss
100
0
20
40
60
80
100
100
0.00
0.25
0.50
VDS[V]
1.00
1.25
1.50
1.75
VSD[V]
C=f(VDS);VGS=0V;f=1MHz
Final Data Sheet
0.75
IF=f(VSD);parameter:Tj
8
Rev.2.1,2022-06-15
StrongIRFETTM2Power-Transistor
IPP129N10NF2S
Diagram13:Avalanchecharacteristics
Diagram14:Typ.gatecharge
2
10
10
20 V
50 V
80 V
8
101
VGS[V]
IAV[A]
6
25 °C
100 °C
150 °C
4
0
10
2
10-1
10-1
100
101
102
103
tAV[µs]
0
0.0
2.5
5.0
7.5
10.0
12.5
15.0
17.5
20.0
Qgate[nC]
IAS=f(tAV);RGS=25Ω;parameter:Tj,start
VGS=f(Qgate),ID=30Apulsed,Tj=25°C;parameter:VDD
Diagram15:Drain-sourcebreakdownvoltage
Diagram Gate charge waveforms
108
106
VBR(DSS)[V]
104
102
100
98
96
94
-75
-50
-25
0
25
50
75
100 125 150 175 200
Tj[°C]
VBR(DSS)=f(Tj);ID=1mA
Final Data Sheet
9
Rev.2.1,2022-06-15
StrongIRFETTM2Power-Transistor
IPP129N10NF2S
5PackageOutlines
PACKAGE - GROUP
NUMBER:
PG-TO220-3-U05
REVISION: 02
DATE: 15.12.2020
MILLIMETERS
MIN.
MAX.
4.25
4.75
1.40
1.14
2.92
2.47
0.71
0.97
1.14
1.78
0.36
0.61
14.32
15.80
8.39
9.20
11.89
12.80
9.90
10.67
8.10
8.74
2.54
3
6.00
6.70
13.00
14.40
3.56
4.06
3.90
3.54
2.94
2.54
DIMENSIONS
A
A1
A2
b
b1
c
D
D1
D2
E
E1
e
N
H
L
L1
øP
Q
Figure1OutlinePG-TO220-3,dimensionsinmm
Final Data Sheet
10
Rev.2.1,2022-06-15
StrongIRFETTM2Power-Transistor
IPP129N10NF2S
RevisionHistory
IPP129N10NF2S
Revision:2022-06-15,Rev.2.1
Previous Revision
Revision
Date
Subjects (major changes since last revision)
2.0
2020-12-18
Release of final version
2022-06-15
Skip condition "Operating and storage tempt.", update trr and Qrr, footnotes, Diagram 12
and Avalanche energy.
2.1
Trademarks
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Final Data Sheet
11
Rev.2.1,2022-06-15