IRLTS2242PbF
HEXFET® Power MOSFET
VDSS
VGS
RDS(on) max
(@ VGS = -4.5V)
RDS(on) max
(@ VGS = -2.5V)
Qg (typical)
ID
(@TA = 25°C)
-20
V
D
1
6
A
D
± 12
V
32
m
D
2
5
D
55
m
G
3
4
S
12
nC
-6.9
A
Top View
TSOP-6
Applications
Battery operated DC motor inverter MOSFET
System/Load Switch
Features
Industry-Standard TSOP-6 Package
RoHS Compliant Containing no Lead, no Bromide and no Halogen
MSL1, Consumer Qualification
Base part number
Package Type
IRLTS2242TRPbF
TSOP-6
Benefits
results in Multi-Vendor Compatibility
Environmentally Friendlier
Increased Reliability
Standard Pack
Form
Quantity
Tape and Reel
3000
Orderable Part Number
IRLTS2242TRPbF
Absolute Maximum Ratings
Parameter
Max.
Units
VDS
Drain-to-Source Voltage
- 20
VGS
Gate-to-Source Voltage
± 12
ID @ TA = 25°C
Continuous Drain Current, VGS @ 4.5V
-6.9
ID @ TA = 70°C
Continuous Drain Current, VGS @ 4.5V
-5.5
IDM
Pulsed Drain Current
-55
PD @TA = 25°C
Power Dissipation
2.0
PD @TA = 70°C
Power Dissipation
1.3
Linear Derating Factor
0.02
TJ
Operating Junction and
-55 to + 150
TSTG
Storage Temperature Range
V
A
W
W/°C
°C
Notes through are on page 2
1
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IRLTS2242PbF
Static @ TJ = 25°C (unless otherwise specified)
Parameter
BVDSS
Drain-to-Source Breakdown Voltage
BVDSS/TJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
VGS(th)
IDSS
Gate Threshold Voltage
Gate Threshold Voltage Coefficient
Drain-to-Source Leakage Current
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
Pre-Vth Gate-to-Source Charge
Gate-to-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
gfs
Qg
Qgs
Qgd
RG
td(on)
tr
td(off)
tf
Ciss
Coss
Crss
Min.
-20
–––
–––
–––
-0.4
–––
–––
–––
–––
–––
8.5
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
9.4
26
45
–––
-3.8
–––
–––
–––
–––
–––
12
1.5
4.3
17
5.8
18
81
68
905
280
200
Diode Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Thermal Resistance
Min.
Typ.
Max.
–––
–––
-2.0
–––
–––
-55
–––
–––
–––
–––
41
16
-1.2
62
24
Units
Conditions
VGS = 0V, ID = -250µA
Reference to 25°C, ID = -1mA
VGS = -4.5V, ID = -6.9A
VGS = -2.5V, ID = -5.5A
VDS = VGS, ID = -10µA
VDS = -16V, VGS = 0V
VDS = -16V, VGS = 0V,TJ= 125°C
VGS = -12V
VGS = 12V
VDS = -10V, ID = -5.5A
VDS = -10V
VGS = -4.5V
ID = -5.5A
VDD = -10V, VGS = -4.5V
ID = -5.5A
RG = 6.8
VGS = 0V
VDS = -10V
ƒ = 1.0KHz
Conditions
MOSFET symbol
showing the
integral reverse
p-n junction diode.
TJ = 25°C, IS= -5.5A, VGS=0V
TJ = 25°C, IF = -5.5A, VDD = -16V
di/dt = 100A/µs
D
A
Junction-to-Ambient
G
S
V
ns
nC
Parameter
RJA
Max. Units
–––
V
––– mV/°C
32
m
55
-1.1
V
––– mV/°C
-1.0
µA
-150
-100
nA
100
–––
S
–––
nC
–––
–––
–––
ns
–––
–––
–––
–––
pF
–––
–––
Typ.
–––
Max.
62.5
Units
°C/W
Notes:
Repetitive rating; pulse width limited by max. junction temperature.
Pulse width 400µs; duty cycle 2%.
When mounted on 1 inch square PCB (FR-4). Please refer to AN-994 for more details:
http://www.irf.com/technical-info/appnotes/an-994.pdf
2
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IRLTS2242PbF
100
100
10
BOTTOM
1
-1.40V
60µs PULSE WIDTH
10
BOTTOM
-1.40V
1
60µs PULSE WIDTH
Tj = 150°C
Tj = 25°C
0.1
0.1
0.1
1
10
0.1
100
Fig 1. Typical Output Characteristics
100
1.4
RDS(on) , Drain-to-Source On Resistance
(Normalized)
-I D, Drain-to-Source Current (A)
10
Fig 2. Typical Output Characteristics
100
10
T J = 150°C
T J = 25°C
VDS = -10V
60µs PULSE WIDTH
ID = -6.9A
VGS = -4.5V
1.2
1.0
0.8
0.6
1.0
0
1
2
3
4
-60 -40 -20 0
5
Fig 3. Typical Transfer Characteristics
10000
Fig 4. Normalized On-Resistance vs. Temperature
14.0
VGS = 0V,
f = 1 MHZ
C iss = C gs + C gd, C ds SHORTED
ID= -5.5A
-V GS, Gate-to-Source Voltage (V)
C rss = C gd
C oss = C ds + C gd
Ciss
1000
20 40 60 80 100 120 140 160
T J , Junction Temperature (°C)
-V GS, Gate-to-Source Voltage (V)
C, Capacitance (pF)
1
-V DS, Drain-to-Source Voltage (V)
-V DS, Drain-to-Source Voltage (V)
Coss
Crss
100
12.0
VDS= -16V
VDS= -10V
10.0
VDS= -4.0V
8.0
6.0
4.0
2.0
0.0
1
10
100
-V DS, Drain-to-Source Voltage (V)
Fig 5. Typical Capacitance vs. Drain-to-Source Voltage
3
VGS
-10V
-4.50V
-2.50V
-2.25V
-2.00V
-1.80V
-1.55V
-1.40V
TOP
-ID, Drain-to-Source Current (A)
-ID, Drain-to-Source Current (A)
TOP
VGS
-10V
-4.50V
-2.50V
-2.25V
-2.00V
-1.80V
-1.55V
-1.40V
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0
5
10
15
20
25
30
QG Total Gate Charge (nC)
Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage
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IRLTS2242PbF
1000
ID, Drain-to-Source Current (A)
-I SD, Reverse Drain Current (A)
100
10
T J = 150°C
T J = 25°C
1
VGS = 0V
0.4
0.6
0.8
1.0
1.2
100
100µsec
10
1msec
1
10msec
0.1
0.1
1.4
1
10
100
VDS, Drain-to-Source Voltage (V)
-V SD, Source-to-Drain Voltage (V)
Fig 7. Typical Source-Drain Diode Forward Voltage
Fig 8. Maximum Safe Operating Area
1.4
-V GS(th) , Gate threshold Voltage (V)
8
-I D, Drain Current (A)
DC
Tc = 25°C
Tj = 150°C
Single Pulse
0.01
0.1
0.2
OPERATION IN THIS AREA
LIMITED BY R DS(on)
6
4
2
1.2
1.0
0.8
0.6
ID = -10µA
0.4
ID = -250µA
ID = -1.0mA
0.2
ID = -10mA
0.0
0
25
50
75
100
125
-75 -50 -25
150
0
25
50
75 100 125 150
T J , Temperature ( °C )
T A , Ambient Temperature (°C)
Fig 10. Threshold Voltage vs. Temperature
Fig 9. Maximum Drain Current vs. Case Temperature
100
Thermal Response ( Z thJA ) °C/W
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
0.01
0.001
1E-006
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
0.0001
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + TA
0.001
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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IRLTS2242PbF
70
RDS(on), Drain-to -Source On Resistance ( m)
RDS(on), Drain-to -Source On Resistance (m)
ID = -6.9A
60
50
40
TJ = 125°C
30
20
TJ = 25°C
10
0
0
2
4
6
8
10
450
400
350
Vgs = -2.5V
300
250
200
150
100
Vgs = -4.5V
50
0
12
0
10
Fig 12. On–Resistance vs. Gate Voltage
40
50
60
Fig 13. Typical On–Resistance vs. Drain Current
120
16000
ID
TOP
-1.3A
-2.0A
BOTTOM -5.5A
14000
12000
80
Power (W)
EAS , Single Pulse Avalanche Energy (mJ)
30
-I D, Drain Current (A)
-VGS, Gate -to -Source Voltage (V)
100
20
60
40
10000
8000
6000
4000
20
2000
0
25
50
75
100
125
150
Starting T J , Junction Temperature (°C)
Fig 14. Maximum Avalanche Energy vs. Drain Current
0
1E-8
1E-7
1E-6
1E-5
1E-4
1E-3
Time (sec)
Fig 15. Typical Power vs. Time
Fig 16. Diode Reverse Recovery Test Circuit for P-Channel HEXFET® Power MOSFETs
5
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IRLTS2242PbF
VDD
Fig 17a. Gate Charge Test Circuit
Fig 18a. Unclamped Inductive Test Circuit
Fig 19a. Switching Time Test Circuit
6
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Fig 17b. Gate Charge Waveform
Fig 18b. Unclamped Inductive Waveforms
Fig 19b. Switching Time Waveforms
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IRLTS2242PbF
TSOP-6 Package Outline
TSOP-6 Part Marking Information
Y = YEAR
W = WEEK
PART NUMBER
WW = (1-26) IF PRECEDED BY LAST DIGIT OF CALENDAR YEAR
YEAR
TOP
LOT
CODE
PART NUMBER CODE REFERENCE:
A = SI3443DV
B = IRF5800
C = IRF5850
D = IRF5851
E = IRF5852
F = IRF5801
G = IRF5803
H = IRF5804
I = IRF5805
J = IRF5806
K = IRF5810
N = IRF5802
DATE CODE MARKING INSTRUCTIONS
O=
P=
R=
S=
IRLTS6342TRPBF
IRFTS8342TRPBF
IRFTS9342TRPBF
Not applicable
T = IRLTS2242TRPBF
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
1
2
3
4
5
6
7
8
9
0
WORK
WEEK
W
01
02
03
04
A
B
C
D
24
25
26
X
Y
Z
WW = (27-52) IF PRECEDED BY A LETTER
YEAR
Note: A line above the work week
(as shown here) indicates Lead-Free.
Y
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
Y
A
B
C
D
E
F
G
H
J
K
WORK
WEEK
W
27
28
29
30
A
B
C
D
50
51
52
X
Y
Z
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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IRLTS2242PbF
TSOP-6 Tape and Reel Information
8mm
FEED DIRECTION
4mm
NOTES :
1. OUTLINE CONFORMS TO EIA-481 & EIA-541.
178.00
( 7.008 )
MAX.
9.90 ( .390 )
8.40 ( .331 )
NOTES:
1. CONTROLLING DIMENSION : MILLIMETER.
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
Qualifiction Information†
Consumer††
(per JEDEC JESD47F†††guidelines)
Qualification Level
Moisture Sensitivity Level
TSOP-6
MSL1
(per IPC/JEDEC J-STD-020D††)
Yes
RoHS Compliant
† Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/
†† Higher qualification ratings may be available should the user have such requirements.
Please contact your International Rectifier sales representative for further information:
http://www.irf.com/whoto-call/salesrep/
††† Applicable version of JEDEC standard at the time of product release.
Revision History
Date
11/18/2014
Comment
Updated data sheet with IR corporate template.
Updated figure 12 on page 5 for VGS from “20V” to “12V” due to error.
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA
To contact International Rectifier, please visit http://www.irf.com/whoto-call/
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IMPORTANT NOTICE
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”) .
With respect to any examples, hints or any typical
values stated herein and/or any information
regarding the application of the product, Infineon
Technologies hereby disclaims any and all
warranties and liabilities of any kind, including
without limitation warranties of non-infringement
of intellectual property rights of any third party.
In addition, any information given in this document
is subject to customer’s compliance with its
obligations stated in this document and any
applicable legal requirements, norms and
standards concerning customer’s products and any
use of the product of Infineon Technologies in
customer’s applications.
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments
to evaluate the suitability of the product for the
intended application and the completeness of the
product information given in this document with
respect to such application.
For further information on the product, technology,
delivery terms and conditions and prices please
contact your nearest Infineon Technologies office
(www.infineon.com).
WARNINGS
Due to technical requirements products may
contain dangerous substances. For information on
the types in question please contact your nearest
Infineon Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized
representatives
of
Infineon
Technologies, Infineon Technologies’ products may
not be used in any applications where a failure of
the product or any consequences of the use thereof
can reasonably be expected to result in personal
injury.