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2N5484

2N5484

  • 厂商:

    FAIRCHILD(仙童半导体)

  • 封装:

  • 描述:

    2N5484 - N-Channel RF Amplifier - Fairchild Semiconductor

  • 数据手册
  • 价格&库存
2N5484 数据手册
2N5484 / 5485 / 5486 / MMBF5484 / 5485 / 5486 2N5484 2N5485 2N5486 MMBF5484 MMBF5485 MMBF5486 G S G S TO-92 D SOT-23 Mark: 6B / 6M / 6H D NOTE: Source & Drain are interchangeable N-Channel RF Amplifier This device is designed primarily for electronic switching applications such as low On Resistance analog switching. Sourced from Process 50. Absolute Maximum Ratings* Symbol VDG VGS IGF TJ ,Tstg Drain-Gate Voltage Gate-Source Voltage Forward Gate Current TA = 25°C unless otherwise noted Parameter Value 25 - 25 10 -55 to +150 Units V V mA °C Operating and Storage Junction Temperature Range *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. NOTES: 1) These ratings are based on a maximum junction temperature of 150 degrees C. 2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. Thermal Characteristics Symbol PD RθJC RθJA TA = 25°C unless otherwise noted Characteristic Total Device Dissipation Derate above 25°C Thermal Resistance, Junction to Case Thermal Resistance, Junction to Ambient 2N5484-5486 350 2.8 125 357 Max *MMBF5484-5486 225 1.8 556 Units mW mW/°C °C/W °C/W *Device mounted on FR-4 PCB 1.6" X 1.6" X 0.06." 1997 Fairchild Semiconductor Corporation 2N5484 / 5485 / 5486 / MMBF5484 / 5485 / 5486 N-Channel RF Amplifier (continued) Electrical Characteristics Symbol Parameter TA = 25°C unless otherwise noted Test Conditions Min Typ Max Units OFF CHARACTERISTICS V(BR)GSS IGSS VGS(off) Gate-Source Breakdown Voltage Gate Reverse Current Gate-Source Cutoff Voltage IG = - 1.0 µA, VDS = 0 VGS = - 20 V, VDS = 0 VGS= - 20 V, VDS= 0, TA= 100°C 5484 VDS = 15 V, ID = 10 nA 5485 5486 - 25 - 1.0 - 0.2 - 3.0 - 4.0 - 6.0 V nA µA V V V - 0.3 - 0.5 - 2.0 ON CHARACTERISTICS IDSS Zero-Gate Voltage Drain Current* VDS = 15 V, VGS = 0 5484 5485 5486 1.0 4.0 8.0 5.0 10 20 mA mA mA SMALL SIGNAL CHARACTERISTICS gfs Forward Transfer Conductance VDS = 15 V, VGS = 0, f = 1.0 kHz 5484 5485 5486 VDS = 15 V, VGS = 0, f = 100 MHz 5484 VDS = 15 V, VGS = 0, f = 400 MHz 5485 / 5486 VDS = 15 V, VGS = 0, f = 1.0 kHz 5484 5485 5486 VDS = 15 V, VGS = 0, f = 100 MHz 5484 VDS = 15 V, VGS = 0, f = 400 MHz 5485 / 5486 VDS = 15 V, VGS = 0, f = 100 MHz 5484 VDS = 15 V, VGS = 0, f = 400 MHz 5485 5486 VDS = 15 V, VGS = 0, f = 1.0 MHz VDS = 15 V, VGS = 0, f = 1.0 MHz VDS = 15 V, VGS = 0, f = 1.0 MHz VDS= 15 V, RG = 1.0 kΩ , 5484 f = 100 MHz VDS= 15 V, RG = 1.0 kΩ , 5484 f = 400 MHz VDS= 15 V , RG = 1.0 kΩ , 5485 / 5486 f = 100 MHz VDS= 15 V, RG = 1.0 kΩ , 5485 / 5486 f = 400 MHz 3000 3500 4000 6000 7000 8000 100 1000 50 60 75 75 100 2500 3000 3500 5.0 1.0 2.0 3.0 4.0 2.0 4.0 µmhos µmhos µmhos µmhos µmhos µmhos µmhos µmhos µmhos µmhos µmhos µmhos µmhos pF pF pF dB dB dB dB Re(yis) Input Conductance gos Output Conductance Re(yos) Output Conductance Re(yfs) Forward Transconductance 5 Ciss Crss Coss NF Input Capacitance Reverse Transfer Capacitance Output Capacitance Noise Figure *Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2% 2N5484 / 5485 / 5486 / MMBF5484 / 5485 / 5486 N-Channel RF Amplifier (continued) Typical Characteristics Transfer Characteristics 20 Channel Resistance vs Temperature 1000 r DS - DRAIN ON RESISTANCE ( Ω) 500 300 200 100 V GS(OFF) = -4.5V TA = -55 C T A = +25 C O O V DS = 15V ID - DRAIN CURRENT (mA) 16 V GS(OFF) = -1.0V -2.5 V -5.0V -8.0 V 12 T A = +125O C TA = -55 C T A = +25 C T A = +125O C O O 8 50 30 20 10 4 V DS V -50 GS = 100mV =0V 150 -2.5 V 0 0 -1 -2 -3 -4 VGS- GATE-SOURCE VOLTAGE(V) -5 0 50 100 T A - AMBIENT TEMPERATURE (°C) Transconductance Characteristics gfs -- TRANSCONDUCTANCE (mmhos) 7 6 5 4 3 2 1 0 0 Common Drain-Source Characteristics I D -- DRAIN CURRENT (mA) DS TA = -55 C T A = +25 C T A = +125O C O O V = 15V 5 4 TYP V 3 T A = +25 C GS(OFF) O = -5.0V = 0V 5V .0V -0. -1 V -1.5 -2.0V TA = -55 C T A = +25 C T A = +125O C V GS(OFF) = -4.5V O O V GS -2.5V -3.0V -3.5V 2 1 -2.5 V -1 -2 -3 -4 VGS- GATE-SOURCE VOLTAGE(V) -5 -4.0V 0 0 0.2 0.4 0.6 0.8 VDS - DRAIN-SOURCE VOLTAGE(V) 1 gos -- OUTPUT CONDUCTANCE (u mhos) T A = +25 C f = 1.0 kHz 20 10 5 O V GS(OFF) = -5.5V 5.0V 10V 15V 20V gfs, I DSS @ V DS = 15 V, V r DS @ VDS= 100mV, V GS = 0 PULSE GS = 0 100 50 30 20 10 5 V DG = 5v 10 20 15 5 10 15 20 V GS(OFF) 1 0.5 = -3.5V V 0.1 0.01 0.02 GS(OFF) = -1.5V 5 10 20 10 -1 VGS(OFF) @ VGS = 15V, I D= 1nA -2 -3 -5 -7 V - GATE-SOURCE VOLTAGE(V) GS 3 2 1 - 10 0.05 0.1 0.2 0.5 1 2 I D -- DRAIN CURRENT (mA) gfs --- TRANSCONDUCTANCE ( mmhos ) I -- DRAIN CURRENT ( mA ) DSS Output Conductance vs Drain Current r DS -- DRAIN "ON" RESISTANCE ( Ω ) Transconductance Parameter Interactions 2N5484 / 5485 / 5486 / MMBF5484 / 5485 / 5486 N-Channel RF Amplifier (continued) Typical Characteristics (continued) Transconductance vs Drain Current gfs -- TRANSCONDUCTANCE (mmhos) 10 5 e n- NOISE VOLTAGE ( nV/ Noise Voltage vs Frequency V DG = 15V BW = 6.0 Hz @ f = 10 Hz, 100 Hz = 0.2 f @ f > 1.0 kHz Hz ) V GS(OFF) = - 1.5V O TA = -55 C T A = +25 C T A = +125 C O O 1 0.5 TA = -55 C V GS(OFF) T A = +25 C T A = +125 O C = - 5V V DG = 15V f = 1.0 kHz O O 10 5 I D = 0.5 mA I D = 3 mA 0.1 0.01 0.02 0.05 0.1 0.2 0.5 1 2 I D - DRAIN CURRENT (mA) 5 10 1 0.01 0.03 0.1 0.3 1 3 10 f -- FREQUENCY (kHz) 30 100 Capacitance vs Voltage 10 ) -- CAPACITANCE (pF) f = 0.1 - 1.0 MHz NF -- NOISE FIGURE (dB) 5 C is ( V DS = 15 V) 1 C rs ( V DS = 0 V) 4 5 Noise Figure Frequency V DS I D = 15V = 5.0 mA 3 R g = 1.0 k Ω O T A = +25 C 2 C is( C rs 1 0 -5 -10 -15 VGS-- GATE-SOURCE VOLTAGE(V) -20 0 10 20 30 50 100 200 300 f -- FREQUENCY (MHz) 500 1000 5 Power Dissipation vs. Ambient Temperature P D - POWER DISSIPATION (mW) 350 300 250 200 150 100 50 0 0 25 50 75 100 TEMPERATURE (ºC) 125 150 TO-92 SOT-23 2N5484 / 5485 / 5486 / MMBF5484 / 5485 / 5486 N-Channel RF Amplifier (continued) Common Source Characteristics Input Admittance Yiss -- INPUT ADMITTANCE (mmhos) 10 5 V DS = 15V V GS = 0 (CS) -- OUTPUT CONDUCTANCE (mmhos) 1 Output Admittance b OSS (x 10) g OSS 1 b iss g iss V DS = 15V V GS = 0 (CS) 100 200 300 500 f -- FREQUENCY (MHz) 700 1000 100 200 300 500 f -- FREQUENCY (MHz) 700 1000 Forward Transadmittance Yfss -- FORWARD TRANSFER (mmhos) Y rss-- REVERSE TRANSFER (mmhos) Y OSS Reverse Transadmittance 10 5 10 5 +g fss -b fss 1 - b rss 1 -g V DS = 15V V GS = 0 (CS) 100 rss ( X 0.1) V DS = 15V V GS = 0 (CS) 100 200 300 500 f -- FREQUENCY (MHz) 700 1000 200 300 500 f -- FREQUENCY (MHz) 700 1000 2N5484 / 5485 / 5486 / MMBF5484 / 5485 / 5486 N-Channel RF Amplifier (continued) Common Gate Characteristics Input Admittance Y ogs-- OUTPUT CONDUCTANCE (mmhos) Y -- INPUT ADMITTANCE (mmhos) igs 1 Output Admittance V DS = 15V V GS = 0 (CG) b OgS (x 10) g Ogs 10 5 g igs b igs V DS = 15V V GS = 0 (CG) 100 200 300 500 f -- FREQUENCY (MHz) 700 1000 1 100 200 300 500 f -- FREQUENCY (MHz) 700 1000 Forward Transadmittance Y rgs-- REVERSE TRANSFER (mmhos) Yfgs -- FORWARD TRANSFER (mmhos) 10 5 Reverse Transadmittance 1 V DS = 15V V GS = 0 (CG) g rgs +g fgs -b fgs 1 - b rgs V DS = 15V V GS = 0 (CG) 100 200 300 500 f -- FREQUENCY (MHz) 700 1000 5 100 200 300 500 f -- FREQUENCY (MHz) 700 1000 TO-92 Tape and Reel Data TO-92 Packaging Configuration: Figure 1.0 TAPE and REEL OPTION FSCINT Label sample FAIRCHILD SEMICONDUCTOR CORPORATION LOT: CBVK741B019 HTB:B QTY: 10000 See Fig 2.0 for various Reeling Styles NSID: PN2222N SPEC: D/C1: D9842 SPEC REV: QA REV: B2 FSCINT Label (FSCINT) 5 Reels per Intermediate Box F63TNR Label Customized Label 375mm x 267mm x 375mm Intermediate Box F63TNR Label sample LOT: CBVK741B019 FSID: PN222N D/C1: D9842 D/C2: QTY1: QTY2: QTY: 2000 SPEC: SPEC REV: CPN: N/F: F Customized Label (F63TNR)3 TO-92 TNR/AMMO PACKING INFROMATION Packing Reel Style A E Ammo M P Quantity 2,000 2,000 2,000 2,000 EOL code D26Z D27Z D74Z D75Z AMMO PACK OPTION See Fig 3.0 for 2 Ammo Pack Options Unit weight = 0.22 gm Reel weight with components = 1.04 kg Ammo weight with components = 1.02 kg Max quantity per intermediate box = 10,000 units FSCINT Label 327mm x 158mm x 135mm Immediate Box Customized Label 5 Ammo boxes per Intermediate Box F63TNR Label 333mm x 231mm x 183mm Intermediate Box Customized Label (TO-92) BULK PACKING INFORMATION EOL CODE J18Z J05Z NO EOL CODE DESCRIPTION TO-18 OPTION STD TO-5 OPTION STD TO-92 STANDARD STRAIGHT FOR: PKG 92, 94 (NON PROELECTRON SERIES), 96 TO-92 STANDARD STRAIGHT FOR: PKG 94 (PROELECTRON SERIES BCXXX, BFXXX, BSRXXX), 97, 98 LEADCLIP DIMENSION NO LEAD CLIP NO LEAD CLIP NO LEADCLIP QUANTITY 2.0 K / BOX 1.5 K / BOX 2.0 K / BOX BULK OPTION See Bulk Packing Information table Anti-static Bubble Sheets FSCINT Label L34Z NO LEADCLIP 2.0 K / BOX 2000 units per EO70 box for std option 114mm x 102mm x 51mm Immediate Box 5 EO70 boxes per intermediate Box 530mm x 130mm x 83mm Intermediate box Customized Label FSCINT Label 10,000 units maximum per intermediate box for std option ©2001 Fairchild Semiconductor Corporation March 2001, Rev. B1 TO-92 Tape and Reel Data, continued TO-92 Reeling Style Configuration: Figure 2.0 Machine Option “A” (H) Machine Option “E” (J) Style “A”, D26Z, D70Z (s/h) Style “E”, D27Z, D71Z (s/h) TO-92 Radial Ammo Packaging Configuration: Figure 3.0 FIRST WIRE OFF IS COLLECTOR ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON TOP FIRST WIRE OFF IS EMITTER ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON BOTTOM ORDER STYLE D74Z (M) ORDER STYLE D75Z (P) FIRST WIRE OFF IS EMITTER (ON PKG. 92) ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON BOTTOM FIRST WIRE OFF IS COLLECTOR (ON PKG. 92) ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON TOP September 1999, Rev. B TO-92 Tape and Reel Data, continued TO-92 Tape and Reel Taping Dimension Configuration: Figure 4.0 Hd P Pd b Ha H1 HO d L L1 W1 S WO W2 W t t1 P1 F1 P2 DO ITEM DESCRIPTION PO Base of Package to Lead Bend Component Height Lead Clinch Height Component Base Height Component Alignment ( side/side ) Component Alignment ( front/back ) Component Pitch Feed Hole Pitch Hole Center to First Lead Hole Center to Component Center Lead Spread Lead Thickness Cut Lead Length Taped Lead Length Taped Lead Thickness Carrier Tape Thickness SYMBOL b Ha HO H1 Pd Hd P PO P1 P2 F1/F2 d L L1 t t1 W WO W1 W2 DO S DIMENSION 0.098 (max) 0.928 (+/- 0.025) 0.630 (+/- 0.020) 0.748 (+/- 0.020) 0.040 (max) 0.031 (max) 0.500 (+/- 0.020) 0.500 (+/- 0.008) 0.150 (+0.009, -0.010) 0.247 (+/- 0.007) 0.104 (+/- 0 .010) 0.018 (+0.002, -0.003) 0.429 (max) 0.209 (+0.051, -0.052) 0.032 (+/- 0.006) 0.021 (+/- 0.006) 0.708 (+0.020, -0.019) 0.236 (+/- 0.012) 0.035 (max) 0.360 (+/- 0.025) 0.157 (+0.008, -0.007) 0.004 (max) User Direction of Feed TO-92 Reel Configuration: Figure 5.0 Carrier Tape Width Hold - down Tape Width Hold - down Tape position Feed Hole Position Sprocket Hole Diameter Lead Spring Out Note : All dimensions are in inches. ELECT ROSTATIC SEN SITIVE D EVICES D4 D1 ITEM DESCRIPTION SYSMBOL MINIMUM MAXIMUM F63TNR Label Customized Label D2 Reel Diameter Arbor Hole Diameter (Standard) (Small Hole) Core Diameter Hub Recess Inner Diameter Hub Recess Depth Flange to Flange Inner Width W1 Hub to Hub Center Width W3 Note: All dimensions are inches D1 D2 D2 D3 D4 W1 W2 W3 13.975 1.160 0.650 3.100 2.700 0.370 1.630 14.025 1.200 0.700 3.300 3.100 0.570 1.690 2.090 W2 D3 July 1999, Rev. A TO-92 Package Dimensions TO-92 (FS PKG Code 92, 94, 96) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.1977 ©2000 Fairchild Semiconductor International January 2000, Rev. B SOT-23 Tape and Reel Data SOT-23 Packaging Configuration: Figure 1. 0 Customized La bel Packaging Description: SOT-23 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a m ultilayer film (Heat Activated Adhesive in na ture) primarily composed of polyester film, adhesive layer, sealan and an t, ti-static sprayed agent. These reeled pa in stan rd option are shippe with rts da d 3,000 units per 7" or 177cm diameter reel. The reels are dark blue in color an is made of polystyrene plastic (antid static coated Othe option comes in 10,000 units per 13" ). r or 330cm diameter reel. This and s ome other options are describe in the P d ackaging Information table. These full reels are individua labele an placed inside lly dd as tanda intermediate made of recyclable corrugated rd brown pap with a Fairchil d logo printing. One pizza box er contains eight reels maximum. And thes intermed e iate boxes are placed inside a labeled shipping box which comes in different sizes depending on t e nu h mber of parts shippe d. Antistatic Cover Tape Human Readable Label Embossed Carrier Tape 3P SOT-23 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Standard (no flow code ) TNR 3,000 7" Dia 187x107x183 24,000 0.0082 0.1175 D87Z TNR 10,000 13" 343x343x64 30,000 0.0082 0.4006 3P 3P 3P SOT-23 Unit Orientation 343mm x 342mm x 64mm Intermediate box for L87Z Option Human Readable Label Human Readable Label sample H uman readable Label SOT-23 Tape Leader and Trailer Configuration: Figure 2. 0 187mm x 107mm x 183mm Intermediate Box for Stand Option ard Carrier Tape Cover Tape Components Trailer Tape 300mm minimum or 75 empt y poc kets Leader Tape 500mm minimum or 125 empty pockets ©2000 Fairchild Semiconductor International September 1999, Rev. C SOT-23 Tape and Reel Data, continued SOT-23 Embossed Carrier Tape Configuration: Figure 3.0 P0 T E1 P2 D0 D1 F E2 B0 Wc W Tc K0 P1 A0 User Direction of Feed Dimensions are in millimeter Pkg type SOT-23 (8mm) A0 3.15 +/-0.10 B0 2.77 +/-0.10 W 8.0 +/-0.3 D0 1.55 +/-0.05 D1 1.125 +/-0.125 E1 1.75 +/-0.10 E2 6.25 min F 3.50 +/-0.05 P1 4.0 +/-0.1 P0 4.0 +/-0.1 K0 1.30 +/-0.10 T 0.228 +/-0.013 Wc 5.2 +/-0.3 Tc 0.06 +/-0.02 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). 20 deg maximum Typical component cavity center line 0.5mm maximum B0 20 deg maximum component rotation 0.5mm maximum Sketch A (Side or Front Sectional View) Component Rotation A0 Sketch B (Top View) Typical component center line Sketch C (Top View) Component lateral movement SOT-23 Reel Configuration: Figure 4.0 Component Rotation W1 Measured at Hub Dim A Max Dim A max Dim N See detail AA 7" Diameter Option B Min Dim C See detail AA W3 Dim D min 13" Diameter Option W2 max Measured at Hub DETAIL AA Dimensions are in inches and millimeters Tape Size 8mm Reel Option 7" Dia Dim A 7.00 177.8 13.00 330 Dim B 0.059 1.5 0.059 1.5 Dim C 512 +0.020/-0.008 13 +0.5/-0.2 512 +0.020/-0.008 13 +0.5/-0.2 Dim D 0.795 20.2 0.795 20.2 Dim N 2.165 55 4.00 100 Dim W1 0.331 +0.059/-0.000 8.4 +1.5/0 0.331 +0.059/-0.000 8.4 +1.5/0 Dim W2 0.567 14.4 0.567 14.4 Dim W3 (LSL-USL) 0.311 – 0.429 7.9 – 10.9 0.311 – 0.429 7.9 – 10.9 8mm 13" Dia September 1999, Rev. C SOT-23 Package Dimensions SOT-23 (FS PKG Code 49) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.0082 ©2000 Fairchild Semiconductor International September 1998, Rev. A1 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DOME™ E2CMOSTM EnSignaTM FACT™ FACT Quiet Series™ FAST  DISCLAIMER FASTr™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ MICROWIRE™ OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ PowerTrench  QFET™ QS™ QT Optoelectronics™ Quiet Series™ SILENT SWITCHER  SMART START™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ UHC™ VCX™ FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. G
2N5484 价格&库存

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