MOC119TVM

MOC119M — Photodarlington Optocoupler (No Base Connection) April 2008 MOC119M Photodarlington Optocoupler (No Base Connection) Features ■ High current transfer ratio of 300% ■ No base connection for improved noise immunity ■ Underwriters Laboratory (UL) recognized Description The MOC119M device has a gallium arsenide infrared emitting diode coupled to a silicon darlington phototransistor. File #E90700 IEC 60747-5-2 approval available as a test option ■ – add option ‘V’ (e.g., MOC119VM) Applications ■ Appliances, measuring instruments ■ I/O interface for computers ■ Programmable controllers ■ Portable electronics ■ Interfacing and coupling systems of different potentials and impedance ■ Solid state relays Schematic ANODE 1 6 N/C 6 CATHODE 2 5 COLLECTOR 1 6 1 N/C 3 4 EMITTER 6 1 ©2008 Fairchild Semiconductor Corporation MOC119M Rev. 1.0.3 www.fairchildsemi.com MOC119M — Photodarlington Optocoupler (No Base Connection) Absolute Maximum Ratings (TA = 25°C unless otherwise specified.) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol TOTAL DEVICE TSTG TOPR TSOL PD EMITTER IF VR PD DETECTOR VCEO VECO PD IC Storage Temperature Operating Temperature Parameter Value -40 to +150 -40 to +100 260 for 10 sec 250 2.94 60 3 120 1.41 30 7 150 1.76 150 Units °C °C °C mW mW/°C mA V mW mW/°C V V mW mW/°C mA Lead Solder Temperature (wave solder) Total Device Power Dissipation @ TA = 25°C Derate above 25°C DC/Average Forward Input Current Reverse Input Voltage LED Power Dissipation @ TA = 25°C Derate above 25°C Collector-Emitter Voltage Emitter-Collector Voltage Detector Power Dissipation @ TA = 25°C Derate above 25°C Continuous Collector Current ©2008 Fairchild Semiconductor Corporation MOC119M Rev. 1.0.3 www.fairchildsemi.com 2 MOC119M — Photodarlington Optocoupler (No Base Connection) Electrical Characteristics (TA = 25°C unless otherwise specified.) Individual Component Characteristics Symbol EMITTER VF CIN IR DETECTOR BVCEO BVECO ICEO Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage Collector-Emitter Dark Current IC = 100µA IE = 10µA VCE = 10V 30 7 100 V V nA Input Forward Voltage Input Capacitance Reverse Leakage Current IF = 10mA VR = 0, f = 1MHz VR = 3.0V 1.15 18 0.05 100 1.5 V pF µA Parameter Test Conditions Min. Typ.* Max. Unit Transfer Characteristics Symbol DETECTOR CTR VCE (SAT) Current Transfer Ratio Collector-Emitter Saturation Voltage Turn-on Time Turn-off Time IF = 10mA, VCE = 2V IC = 10mA, IF = 10mA 300 450 1 % V Parameter Test Conditions Min. Typ.* Max. Units SWITCHING TIMES ton toff VCE = 10V, RL = 100Ω, IF = 5mA 3.5 95 µs µs Isolation Characteristics Symbol VISO RISO CISO Characteristic Input-Output Isolation Voltage Isolation Resistance Isolation Capacitance Test Conditions f = 60Hz, t = 1 sec. VI-O = 500VDC V = 0V, f = 1MHz Min. 7500 Typ.* Max. Units Vac(pk) 1011 0.2 Ω pF *Typical values at TA = 25°C ©2008 Fairchild Semiconductor Corporation MOC119M Rev. 1.0.3 www.fairchildsemi.com 3 MOC119M — Photodarlington Optocoupler (No Base Connection) Typical Performance Curves Fig. 1 LED Forward Voltage vs. Forward Current 1.8 1.6 VCE = 5.0V TA = 25°C Normalized to IF = 10 mA Fig. 2 Normalized CTR vs. Forward Current 1.7 1.4 VF - FORWARD VOLTAGE (V) 1.6 1.2 1.5 NORMALIZED CTR 1.0 1.4 TA = -55°C 0.8 1.3 TA = 25°C 1.2 TA = 100°C 1.1 0.6 0.4 0.2 1.0 1 10 100 0.0 0 2 4 6 8 10 12 14 16 18 20 IF - LED FORWARD CURRENT (mA) IF - FORWARD CURRENT (mA) Fig. 3 Normalized CTR vs. Ambient Temperature 1.4 100 Fig. 4 Collector-Emitter Saturation Voltage vs. Collector Current VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) 1.2 IF = 5 mA TA = 25˚C 10 NORMALIZED CTR 1.0 IF = 10 mA 0.8 1 IF = 2.5 mA 0.1 0.6 IF = 20 mA 0.4 Normalized to IF = 10 mA TA = 25°C 0.01 IF = 5 mA IF = 10 mA IF = 20 mA 0.2 -60 -40 -20 0 20 40 60 80 100 0.001 0.01 0.1 1 10 TA - AMBIENT TEMPERATURE (°C) IC - COLLECTOR CURRENT (mA) Fig. 5 Dark Current vs. Ambient Temperature ICEO - COLLECTOR -EMITTER DARK CURRENT (nA) 10000 VCE = 10 V TA = 25°C 1000 100 10 1 0.1 0.01 0.001 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE (°C) ©2008 Fairchild Semiconductor Corporation MOC119M Rev. 1.0.3 www.fairchildsemi.com 4 MOC119M — Photodarlington Optocoupler (No Base Connection) Package Dimensions Through Hole 0.350 (8.89) 0.320 (8.13) Pin 1 ID Surface Mount 0.350 (8.89) 0.320 (8.13) PIN 1 ID 0.260 (6.60) 0.240 (6.10) 0.260 (6.60) 0.240 (6.10) 0.390 (9.90) 0.332 (8.43) SEATING PLANE SEATING PLANE 0.070 (1.77) 0.040 (1.02) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.320 (8.13) 0.320 (8.13) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.200 (5.08) 0.115 (2.93) 0.012 (0.30) 0.008 (0.20) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 15° 0.012 (0.30) 0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.035 (0.88) 0.006 (0.16) 0.4" Lead Spacing 0.350 (8.89) 0.320 (8.13) PIN 1 ID Recommended Pay Layout for Surface Mount Leadform 0.070 (1.78) 0.260 (6.60) 0.240 (6.10) 0.060 (1.52) 0.070 (1.77) 0.040 (1.02) SEATING PLANE 0.014 (0.36) 0.010 (0.25) 0.415 (10.54) 0.100 (2.54) 0.295 (7.49) 0.200 (5.08) 0.115 (2.93) 0.030 (0.76) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16) Note: All dimensions are in inches (millimeters). ©2008 Fairchild Semiconductor Corporation MOC119M Rev. 1.0.3 www.fairchildsemi.com 5 MOC119M — Photodarlington Optocoupler (No Base Connection) Ordering Information Suffix No Suffix S SR2 T V TV SV SR2V Example MOC119M MOC119SM MOC119SR2M MOC119TM MOC119VM MOC119TVM MOC119SVM MOC119SR2VM Surface Mount Lead Bend Option Standard Through Hole Device (50 units per tube) Surface Mount; Tape and Reel (1,000 units per reel) 0.4" Lead Spacing IEC60747-5-2 approved IEC60747-5-2 approved, 0.4" Lead Spacing IEC60747-5-2 approved, Surface Mount IEC60747-5-2 approved, Surface Mount, Tape & Reel (1,000 units per reel) Marking Information 2 1 MOC119 V 3 4 X YY 5 Q 6 Definitions 1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) One digit year code, e.g., ‘7’ Two digit work week ranging from ‘01’ to ‘53’ Assembly package code ©2008 Fairchild Semiconductor Corporation MOC119M Rev. 1.0.3 www.fairchildsemi.com 6 MOC119M — Photodarlington Optocoupler (No Base Connection) Tape Dimensions 12.0 ± 0.1 4.5 ± 0.20 2.0 ± 0.05 0.30 ± 0.05 4.0 ± 0.1 Ø1.5 MIN 1.75 ± 0.10 11.5 ± 1.0 21.0 ± 0.1 9.1 ± 0.20 24.0 ± 0.3 0.1 MAX 10.1 ± 0.20 Ø1.5 ± 0.1/-0 User Direction of Feed Note: All dimensions are in millimeters. Reflow Soldering Profile 300 280 260 240 220 200 180 160 °C 140 120 100 80 60 40 20 0 0 260°C >245°C = 42 Sec Time above 183°C = 90 Sec 1.822°C/Sec Ramp up rate 33 Sec 60 120 180 270 360 Time (s) ©2008 Fairchild Semiconductor Corporation MOC119M Rev. 1.0.3 www.fairchildsemi.com 7 MOC119M — Photodarlington Optocoupler (No Base Connection) TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. ACEx® Build it Now™ CorePLUS™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK® EZSWITCH™ * ™ ® Fairchild® Fairchild Semiconductor® FACT Quiet Series™ FACT® FAST® FastvCore™ FlashWriter® * FPS™ FRFET® Global Power ResourceSM Green FPS™ Green FPS™e-Series™ GTO™ i-Lo™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ Motion-SPM™ OPTOLOGIC® OPTOPLANAR® ® PDP-SPM™ Power220® POWEREDGE® Power-SPM™ PowerTrench® Programmable Active Droop™ QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ SMART START™ SPM® STEALTH™ SuperFET™ SuperSOT™ -3 SuperSOT™ -6 SuperSOT™ -8 SupreMOS™ SyncFET™ ® The Power Franchise® TinyBoost™ TinyBuck™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ µSerDes™ UHC® Ultra FRFET™ UniFET™ VCX™ * EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I33 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production ©2008 Fairchild Semiconductor Corporation MOC119M Rev. 1.0.3 www.fairchildsemi.com 8