MC9S08SU16VFK557-FR

NXP Semiconductors Data Sheet: Technical Data Document Number: MC9S08SU16 Rev. 2, 11/2016 MC9S08SU16 16 KB Flash MC9S08SU16VFK MC9S08SU8VFK 40 MHz S08L Based Microcontroller MC9S08SU16 and MC9S08SU8 are low-cost, high-performance and high integration UHV HCS08 8-bit microcontroller units (MCU). It uses the enhanced S08L central processor unit with 3phase MOSFET pre-drivers unit which supports 3 high-side PMOSes and 3 low-side NMOSes, amplifiers for current measurement, OCP (over current protection) and OVP (over voltage protection). It is put into a 4mm x 4mm 24-pin QFN package, targeting drone electrical speed controller, low power motor control, small form cooling fan control and portable tools. Core • S08L core up to 40 MHz • Bus up to 20 MHz Memories • 16 KB program flash memory for SU16 and 8 KB program flash memory for SU8 • 768 byte SRAM, 256 B of which is unrestricted, the other 512 B is restricted during Flash erasing and programming • 8 bytes regfile System peripherals • Windowed COP with multiple clock sources (watch dog) • Inter module connection module • CRC Clocks • External clock input • 32 kHz tunable internal RC oscillator • 20 kHz low power clock Operating Characteristics 24-pin QFN (FK) 4 x 4 x 0.65 Pitch 0.5 mm Human-machine interface • 5 V input/output for logical I/O Communication interfaces • One SCI module • One I2C module supporting SMbus communications interface Analog Modules • Two 12-bit ADC with up to 8 channels • Analog comparator with up to 4 inputs and internal 6-bit DAC • High voltage GDU Timers • Two 16-bit pulse width timers (PWT) • Two programmable delay block (PDB) • One 16-bit FTM • One 16-bit modulo timer (MTIM) • One 16-bit 6-channel PWM Security and integrity modules • 64-bit unique identification number per chip • Voltage range: 4.5 to 18 V • Temperature range (ambient): -40 to 105°C NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. Ordering information Part Number Memory Maximum number of I\O's Flash (KB) SRAM (Byte) MC9S08SU16VFK 16 768 17 MC9S08SU8VFK 8 768 17 Related resources Type Description Resource Selector Guide The NXP Solution Advisor is a web-based tool that features interactive application wizards and a dynamic product selector. Solution Advisor Reference Manual The Reference Manual contains a comprehensive description of the structure and function (operation) of a device. 1 MC9S08SU16RM Data Sheet The Data Sheet includes electrical characteristics and signal connections. MC9S08SU161 Chip Errata The chip mask set Errata provides additional or corrective information xN88M2 for a particular device mask set. Package drawing Package dimensions are provided in package drawings. QFN 24-pin: 98ASA00602D 1. To find the associated resource, go to nxp.com and perform a search using this term. 2. To find the associated resource, go to nxp.com and perform a search using this term with the “x” replaced by the revision of the device you are using. Figure 1 shows the functional modules in the chip. 2 NXP Semiconductors MC9S08SU16 16 KB Flash, Rev. 2, 11/2016 BKGD CPU Memory Map Controller Background Debg Controller Interrupt Unit Clock Generation Internal Clock Source(ICS) Internal 32 kHz FLL Flash Line Buffer S08L Core S08L Bus User Flash 16 KB (SU16) 8 KB (SU8) User RAM 768 Bytes Peripheral Bus Bridge Interrupt Priority Controller Cyclic Redundancy Check (CRC) Windowed Watchdog (WCOP) Power Management Controller (PMC) Modulo Timer (MTIM) System Integration Module (SIM) Low Power Osc (LPO) Internal 20 kHz LPO Peripheral Bus Analog Signals SCI I2C IRQ FTM Ch0,1 PWT 0,1 PDB Ch0,1 Inter-Module Crossbar CMP ADC0 ADC1 + 6-bit DAC 12-bit 12-bit PWM Gate Pre-Driver Unit (GDU) Predriver + 5 CMP + 2 OPAMP Inter Module Crossbar Inputs Inter Module Crossbar Outputs Pre Driver GPIO Port A&B&C and Peripheral MUX Analog Inpus Package Pins Package Pins Motor Drive Figure 1. Functional block diagram MC9S08SU16 16 KB Flash, Rev. 2, 11/2016 3 NXP Semiconductors Table of Contents 1 Ratings.................................................................................... 5 1.1 Thermal handling ratings............................................... 5 1.2 Moisture handling ratings.............................................. 5 1.3 ESD handling ratings.....................................................5 1.4 Voltage and current operating ratings........................... 6 2 General................................................................................... 7 2.1 Nonswitching electrical specifications........................... 7 2.1.1 DC characteristics............................................. 7 2.1.2 Supply current characteristics........................... 12 2.1.3 EMC performance............................................. 14 2.2 Switching specifications.................................................15 2.2.1 Control timing.................................................... 15 2.2.2 FTM module timing............................................16 Thermal specifications...................................................17 2.3.1 Thermal operating requirements....................... 17 2.3.2 Thermal characteristics..................................... 18 3 Peripheral operating requirements and behaviors.................. 18 3.1 ICS characteristics.........................................................18 3.2 NVM specifications........................................................ 19 3.3 Analog........................................................................... 20 3.3.1 ADC characteristics...........................................20 3.3.2 CMP and 6-bit DAC electrical specifications..... 23 3.3.3 GDU characteristics.......................................... 26 3.4 Communication interfaces............................................. 29 2.3 4 NXP Semiconductors 3.4.1 Inter-Integrated Circuit Interface (I2C) timing.... 29 4 Dimensions............................................................................. 30 4.1 Obtaining package dimensions..................................... 30 5 Pinout...................................................................................... 30 5.1 Signal multiplexing and pin assignments.......................30 5.2 Pinout ........................................................................... 32 6 Part identification.....................................................................32 6.1 Description.....................................................................32 6.2 Format........................................................................... 33 6.3 Fields............................................................................. 33 6.4 Example.........................................................................33 7 Terminology and guidelines.................................................... 33 7.1 Definition: Operating requirement..................................33 7.2 Definition: Operating behavior....................................... 34 7.3 Definition: Attribute........................................................ 34 7.4 Definition: Rating........................................................... 35 7.5 Result of exceeding a rating.......................................... 35 7.6 Relationship between ratings and operating requirements..................................................................36 7.7 Guidelines for ratings and operating requirements........36 7.8 Definition: Typical value.................................................36 7.9 Typical value conditions................................................ 37 7.10 Parameter Classification................................................38 8 Revision history.......................................................................38 MC9S08SU16 16 KB Flash, Rev. 2, 11/2016 Ratings 1 Ratings 1.1 Thermal handling ratings Symbol Description Min. Max. Unit Notes TSTG Storage temperature –55 150 °C 1 TSDR Solder temperature, lead-free — 260 °C 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 1.2 Moisture handling ratings Symbol MSL Description Moisture sensitivity level Min. Max. Unit Notes — 3 — 1 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 1.3 ESD handling ratings Symbol Description Min. Max. Unit Notes VHBM Electrostatic discharge voltage, human body model -2000 +2000 V 1 VCDM Electrostatic discharge voltage, charged-device model -500 +500 V 2 Latch-up current at ambient temperature of 105°C -100 +100 mA ILAT 1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. MC9S08SU16 16 KB Flash, Rev. 2, 11/2016 5 NXP Semiconductors Ratings 1.4 Voltage and current operating ratings Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond the limits specified in below table may affect device reliability or cause permanent damage to the device. For functional operating conditions, refer to the remaining tables in this document. This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for instance, either VSS or VDDX) or the programmable pullup resistor associated with the pin is enabled. Symbol Description VDD Supply voltage drivers1 Min. Max. Unit 4.5 18 V 4.20 5.25 V — 50 mA VDDX Supply voltage to digital I/O IDDX Maximum current into VDDX VDIO Digital input voltage (except RESET or true open drain pin PTA4 and PTA5) -0.3 VDDX+0.3 V Digital input voltage (true open drain pin PTA4 and PTA5) -0.3 VDDX+0.3 V Analog2, RESET input voltage -0.3 VDDX+0.3 V Instantaneous maximum current single pin limit (applies to all port pins) -25 25 mA VAIO ID 1. See Table 2 for detail. 2. All digital I/O pins, except open-drain pin PTA4 and PTA5, are internally clamped to VSS and VDDX. PTA4 and PTA5 is only clamped to VSS. 6 NXP Semiconductors MC9S08SU16 16 KB Flash, Rev. 2, 11/2016 General 2 General 2.1 Nonswitching electrical specifications 2.1.1 DC characteristics This section includes information about power supply requirements and I/O pin characteristics. Table 1. DC characteristics Symbol C — — VOH P Descriptions Operating voltage Output high voltage P Min Typical1 Max Unit — 4.5 — 18 V All I/O pins, standard-drive strength 5 V, Iload = -5 mA VDDX - 0.8 — — V High current drive pins, high-drive strength2 5 V, Iload = -20 mA VDDX - 0.8 — — V IOHT D Output high current Max total IOH for all ports 5V — — -100 mA VOL P Output low voltage All I/O pins, standard-drive strength 5 V, Iload = 5 mA — — 0.8 V High current drive pins, high-drive strength2 5 V, Iload =20 mA — — 0.8 V P IOLT D Output low current Max total IOL for all ports 5V — — 100 mA VIH P Input high voltage All digital inputs VDDX>4.5V 0.70 × VDDX — — V VDDX>2.7V 0.75 × VDDX — — Input low voltage All digital inputs VDDX>4.5V — — 0.30 × VDDX VDDX>2.7V — — 0.35 × VDDX C VIL P C V Vhys C Input hysteresis All digital inputs — 0.06 × VDDX — — mV |IIn| P Input leakage current All input only pins (per pin) VIN = VDDX or VSS — 0.1 1 µA |IOZTOT| C Total leakage All input only and I/O VIN = VDDX combined for or VSS all inputs and Hi-Z pins — — 2 µA Table continues on the next page... MC9S08SU16 16 KB Flash, Rev. 2, 11/2016 7 NXP Semiconductors Nonswitching electrical specifications Table 1. DC characteristics (continued) Min Typical1 Max Unit — 30.0 — 50.0 kΩ PTA4 and PTA5 pin — 30.0 — 60.0 kΩ Pulldown resistors PTB3, PTB4 and PTB5 pin — 30 40 50 kΩ DC injection current5, 6, 7 Single pin limit VIN < VSS, VIN > VDDX -2 — 2 mA -5 — 25 Symbol C Descriptions RPU P Pullup resistors All digital inputs, when enabled (all I/O pins other than PTA4 and PTA5) RPU3 P Pullup resistors RPD4 P IIC D Total MCU limit, includes sum of all stressed pins CIn C Input capacitance, all pins — — — 7 pF VRAM C RAM retention voltage — 2.0 — — V 1. Typical values are measured at 25 °C. Characterized, not tested. 2. Only PTB3, PTB4, PTB5, and PTB7 are high drive pins, and support ultra-high current output. 3. The specified resistor value is the actual value internal to the device. The pullup value may appear higher when measured externally on the pin. 4. The specified resistor value is the actual value internal to the device. The pulldown value may appear higher when measured externally on the pin. 5. All functional non-supply pins, except PTA4 and PTA5, are internally clamped to VSS and VDDX. 6. Input must be current-limited to the value specified. To determine the value of the required current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use the large one. 7. Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current conditions. If the positive injection current (VIn > VDD) is higher than IDD, the injection current may flow out of VDD and could result in external power supply going out of regulation. Ensure that external VDD load will shunt current higher than maximum injection current when the MCU is not consuming power, such as no system clock is present, or clock rate is very low (which would reduce overall power consumption). Table 2. Power supply electrical characteristics Symbol VDDX Description Output voltage VDDX Min. Typical Max. Unit Run mode 4.5 V≤ VDD 4 MHz fADCK < 4 MHz Symb Min Typ1 Max RAS — — 2 — — 5 — — 5 — — 10 — — 10 0.4 — 8.0 0.4 — 4.0 8-bit mode Unit Comment kΩ External to MCU MHz — (all valid fADCK) ADC conversion clock frequency High speed (ADLPC=0) fADCK Low power (ADLPC=1) 1. Typical values assume VDDA = 5.0 V, Temp = 25°C, fADCK=1.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT Pad leakage due to input protection ZAS R AS z ADIN SIMPLIFIED CHANNEL SELECT CIRCUIT ADC SAR ENGINE R ADIN v ADIN v AS C AS R ADIN INPUT PIN R ADIN INPUT PIN R ADIN INPUT PIN C ADIN Figure 11. ADC input impedance equivalency diagram Table 12. 12-bit ADC Characteristics (VREFH = VDDA, VREFL = VSSA) Characteristic Conditions Supply current C Symb Min Typ1 Max Unit T IDDA — 133 — µA ADLPC = 1 ADLSMP = 1 Table continues on the next page... MC9S08SU16 16 KB Flash, Rev. 2, 11/2016 21 NXP Semiconductors Peripheral operating requirements and behaviors Table 12. 12-bit ADC Characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Characteristic Conditions C Symb Min Typ1 Max Unit T IDDA — 218 — µA T IDDA — 327 — µA T IDDAD — 582 990 µA ADCO = 1 Supply current ADLPC = 1 ADLSMP = 0 ADCO = 1 Supply current ADLPC = 0 ADLSMP = 1 ADCO = 1 Supply current ADLPC = 0 ADLSMP = 0 ADCO = 1 Supply current Stop, reset, module off T IDDA — 0.011 1 µA ADC asynchronous clock source High speed (ADLPC = 0) T fADACK 2 3.3 5 MHz 1.25 2 3.3 — 20 — — 40 — — 3.5 — — 23.5 — — ±5.5 — Low power (ADLPC = 1) Conversion time (including sample time) Short sample (ADLSMP = 0) Sample time Short sample (ADLSMP = 0) T tADC Long sample (ADLSMP = 1) T tADS Long sample (ADLSMP = 1) Total unadjusted Error2, 3 Differential NonLinearity3 12-bit mode T 10-bit mode T — ±1.7 ±2.0 8-bit mode T — ±0.9 ±1.0 12-bit mode T — 1.4 — 10-bit mode5 P — 0.5 — — 0.15 — — 1.4 — Zero-scale Full-scale error6 error7 DNL mode5 T 12-bit mode T 10-bit mode T — 0.5 — 8-bit mode T — 0.15 — 12-bit mode C — ±2.0 — 10-bit mode T — ±0.25 ±1.0 8-bit mode T — ±0.65 ±1.0 12-bit mode T — ±2.5 — 8-bit Integral NonLinearity3 ETUE INL EZS EFS ADCK cycles ADCK cycles LSB4 LSB4 LSB4 LSB4 LSB4 Table continues on the next page... 22 NXP Semiconductors MC9S08SU16 16 KB Flash, Rev. 2, 11/2016 Peripheral operating requirements and behaviors Table 12. 12-bit ADC Characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Min Typ1 Max T — ±0.5 ±1.0 8-bit mode T — ±0.5 ±1.0 ≤12 bit modes D EQ — — ±0.5 LSB4 Input leakage error8 all modes D EIL Temp sensor slope D m mV/°C Characteristic Quantization error Conditions C 10-bit mode -40°C– 25°C Symb 25°C– 125°C Temp sensor voltage 25°C D VTEMP25 IIn * RAS Unit mV — 3.266 — — 3.638 — — 1.36 — V 1. Typical values assume VDDX = 5.0 V, VDD ≥ 5.3 V, Temp = 25°C, fADCK=1.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2. Includes quantization. 3. To get better ADC performance: For the application case of VDD